05-08-1911

LGA Package
56-Lead (11.25mm × 9.00mm × 4.32mm)
(Reference LTC DWG# 05-08-1911 Rev A)
SEE NOTES
DETAIL A
aaa Z
E
Y
A
X
7
G
SEE NOTES
PIN 1
3
A
PIN “A1”
CORNER
B
4
b
MOLD
CAP
D
C
D
SUBSTRATE
F
E
H1
H2
G
Z
// bbb Z
aaa Z
H
DETAIL B
7
PACKAGE TOP VIEW
Øb (56 PLACES)
DETAIL B
PACKAGE SIDE VIEW
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.810
2.540
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.270
0.3175
0.3175
1.270
2.540
0.000
eee S X Y
3.810
F
e
4.445
3
LAND DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
SUGGESTED PCB LAYOUT
TOP VIEW
5. PRIMARY DATUM -Z- IS SEATING PLANE
DIMENSIONS
4.1275
4.7625
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
MIN
4.22
0.60
0.27
3.95
NOM
4.32
0.63
11.25
9.00
1.27
8.89
7.62
0.32
4.00
MAX
4.42
0.66
0.37
4.05
0.15
0.10
0.05
TOTAL NUMBER OF LGA PADS: 56
NOTES
6. THE TOTAL NUMBER OF PADS: 56
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 56 0213 REV A