BGA Package 71-Lead (15mm × 9.00mm × 3.42mm) (Reference LTC DWG # 05-08-1885 Rev A) A aaa Z E Y Z A2 X SEE NOTES DETAIL A SEE NOTES 7 6 5 4 3 2 7 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z 4 C D b b1 MOLD CAP E SUBSTRATE D G Z // bbb Z F F H1 H2 H DETAIL B J e Øb (71 PLACES) K ddd M Z X Y eee M Z L aaa Z e PACKAGE TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 3.810 0.000 DETAIL B PACKAGE SIDE VIEW 0.630 ±0.025 Ø 71x b G 4.765 5.395 SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.71 0.60 0.27 2.45 DIMENSIONS 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 NOM 3.42 0.60 2.82 0.78 0.63 15.0 9.0 1.27 12.7 7.62 0.32 2.50 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE MAX 3.62 0.70 2.92 0.85 0.66 0.37 2.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 71 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 71 1212 REV A