aaa Z BGA Package 140-Lead (11.25mm × 9.00mm × 2.72mm) (Reference LTC DWG # 05-08-1849 Rev B) A Y E 7 e A2 aaa Z SEE NOTES E1 Z b PIN 1 A DETAIL A B PIN “A1” CORNER C A1 4 b ccc Z D E F b1 MOLD CAP D G D1 H SUBSTRATE J 0.27 – 0.37 // bbb Z 1.95 – 2.05 K L DETAIL B M N e P Øb (140 PLACES) ddd M Z X Y eee M Z X PACKAGE TOP VIEW 10 SEE NOTES DETAIL B PACKAGE SIDE VIEW 8 7 6 5 4 3 2 1 PACKAGE BOTTOM VIEW 3 3.600 2.800 2.000 1.200 0.000 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 0.400 0.400 1.200 2.000 2.800 3.600 9 2. ALL DIMENSIONS ARE IN MILLIMETERS DETAIL A 5.200 0.4 Ø 140x 3.600 2.800 2.000 1.200 0.400 0.000 1.200 2.000 2.800 3.600 4.400 5.200 SUGGESTED PCB LAYOUT TOP VIEW BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DIMENSIONS 4.400 0.400 3 SYMBOL A A1 A2 b b1 D E e D1 E1 aaa bbb ccc ddd eee MIN 2.57 0.35 2.22 0.45 0.35 NOM 2.72 0.40 2.32 0.50 0.40 11.25 9.0 0.80 10.40 7.2 MAX 2.87 0.45 2.42 0.55 0.45 0.15 0.10 0.12 0.15 0.08 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TOTAL NUMBER OF BALLS: 140 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 140 1112 REV B