BGA Package 77-Lead (15.00mm × 9.00mm × 5.01mm) (Reference LTC DWG# 05-08-1900 Rev D) A aaa Z E Y Z A2 X SEE NOTES DETAIL A 7 G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 C b1 MOLD CAP b D E SUBSTRATE D F G Z // bbb Z F H1 H2 DETAIL B H J e Øb (77 PLACES) K ddd M Z X Y eee M Z L aaa Z 7 PACKAGE TOP VIEW 3.810 2.540 DETAIL A 1.270 0.3175 0.3175 1.270 2.540 3.810 0.000 DETAIL B PACKAGE SIDE VIEW 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.81 0.50 4.31 0.60 0.60 0.36 3.95 5 4 3 2 1 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS 6.350 0.630 ±0.025 Ø 77x 6 NOM 5.01 0.60 4.41 0.75 0.63 15.00 9.00 1.27 12.70 7.62 0.41 4.00 MAX 5.21 0.70 4.51 0.90 0.66 0.46 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 77 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 77 0113 REV D