05-08-1976

BGA Package
36-Lead (6.25mm × 6.25mm × 2.22mm)
(Reference LTC DWG # 05-08-1976 Rev Ø)
A1
A
ccc Z
Z
6
A2
aaa Z
SEE NOTES
DETAIL A
5
4
3
2
7
1
A
PIN “A1”
CORNER
C
D
SUBSTRATE
aaa Z
// bbb Z
X
Y
D
H1
H2
E
B
b
b1
MOLD
CAP
4
PIN 1
F
E
e
F
DETAIL B
e
b
Øb (36 PLACES)
PACKAGE TOP VIEW
ddd M Z X Y
eee M Z
SEE NOTES
G
DETAIL B
PACKAGE SIDE VIEW
3
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
2.5
1.5
0.5
0.5
1.5
2.5
0.000
DIMENSIONS
2.5
0.40 ±0.025 Ø 36x
1.5
0.5
0.000
0.5
1.5
2.5
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
2.02
0.30
1.72
0.45
0.35
0.27
1.45
NOM
2.22
0.40
1.82
0.50
0.40
6.25
6.25
1.00
5.00
5.00
0.32
1.50
MAX
2.42
0.50
1.92
0.55
0.45
0.37
1.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 36
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 36 0314 REV Ø