BGA Package 36-Lead (6.25mm × 6.25mm × 2.22mm) (Reference LTC DWG # 05-08-1976 Rev Ø) A1 A ccc Z Z 6 A2 aaa Z SEE NOTES DETAIL A 5 4 3 2 7 1 A PIN “A1” CORNER C D SUBSTRATE aaa Z // bbb Z X Y D H1 H2 E B b b1 MOLD CAP 4 PIN 1 F E e F DETAIL B e b Øb (36 PLACES) PACKAGE TOP VIEW ddd M Z X Y eee M Z SEE NOTES G DETAIL B PACKAGE SIDE VIEW 3 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A 2.5 1.5 0.5 0.5 1.5 2.5 0.000 DIMENSIONS 2.5 0.40 ±0.025 Ø 36x 1.5 0.5 0.000 0.5 1.5 2.5 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 2.02 0.30 1.72 0.45 0.35 0.27 1.45 NOM 2.22 0.40 1.82 0.50 0.40 6.25 6.25 1.00 5.00 5.00 0.32 1.50 MAX 2.42 0.50 1.92 0.55 0.45 0.37 1.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 36 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 36 0314 REV Ø