WR Package 72-Lead QFN (10mm × 10mm) (Reference LTC DWG # 05-08-1930 Rev A) 0°–14° (×4) 0.65 REF 10.50 ±0.05 6.00 ±0.15 MAX 1.0mm 0.02 8.90 ±0.05 8.50 REF (4 SIDES) 0.20 REF 6.00 ±0.15 0.50 DETAIL A 0.25 ±0.05 0.50 BSC 0.8 ±0.05 0.60 MAX RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.10 M C A B 0.0.5 M C 0.15 C 10.00 BSC B 9.75 BSC B 0.60 MAX b 0.25 ±0.05 DETAIL B 0.5 ±0.1 6.00 ±0.15 55 72 54 1 PIN 1 10.00 9.75 BSC BSC 6.00 ±0.15 37 0.15 C 18 36 R0.300 TYP C 0.50 BSC 19 DETAIL B WR72 0213 REV A DETAIL A 0.10 C 0.10 C NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 2. DIMENSION “b” APPLIES TO METALIZED TERMINAL AND IS MEASURED BETWEEN 0.15mm AND 0.30mm FROM THE TERMINAL TIP. IF THE TERMINAL HAS OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE DIMENSION B SHOULD NOT BE MEASURED IN THAT RADIUS AREA 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 5. DRAWING NOT TO SCALE COMPONENT LTCXXXXXX SEATING PLANE PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION