REEL TAPING SPECIFICATIONS FOR SURFACE MOUNT DEVICES - D2-PAK P P0 d P1 E F W B A T c D D1 D2 W1 Fig.: Configuration of DIP REEL TAPING ITEM Carrier width SYMBOL A SPECIFICATIONS (mm) 10.8 0.1 SPECIFICATIONS (inch) 0.425 0.004 Carrier length B 16.13 0.1 0.635 0.004 Carrier depth C 5.21 0.1 0.205 0.004 Sprocket hole d 1.5 + 0.1/-0 Reel outside diameter D 329.5 Reel inner diameter D1 104.95 2.0 4.132 0.079 Feed hole diameter D2 13.11 0.2 0.516 0.008 Sprocket hole position E 1.75 0.1 0.069 0.004 Punch hole position F 11.5 0.1 0.453 0.004 Punch hole pitch P 16.0 0.1 0.630 0.004 Sprocket hole pitch P0 4.0 0.1 0.156 0.004 Embossment center P1 2.0 0.1 0.079 0.004 Tape width W Reel width W1 Tape thickness T 2.0 24.0+0.3/-0.1 24.44 0.059+0.004/-0 12.974 0.079 0.945+0.012/-0.004 1.0 0.356 0.013 0.962 0.014 0.039 0.0005 Note : Devices are packed in accordance with EIA stand RS-481-A and specifications listed above. Available only for D2-PAK devices. Visit http:// www.rectron.com for complete datasheets E10