Product Folder Sample & Buy Tools & Software Technical Documents Support & Community AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 AM3517, AM3505 Sitara™ Processors 1 Device Summary 1.1 Features 1 • AM3517/05 Sitara Processor: – MPU Subsystem • 600-MHz Sitara ARM Cortex®-A8 Core • NEON™ SIMD Coprocessor and Vector Floating-Point (FP) Coprocessor – Memory Interfaces: • 166-MHz 16- and 32-Bit mDDR/DDR2 Interface with 1GB of Total Addressable Space • Up to 83 MHz General-Purpose Memory Interface Supporting 16-Bit-Wide Multiplexed Address/Data Bus • 64KB of SRAM • 3 Removable Media Interfaces [MMC/SD/SDIO] – IO Voltage: • mDDR/DDR2 IOs: 1.8V • Other IOs: 1.8V and 3.3V – Core Voltage: 1.2V – Commercial and Extended Temperature Grade (operating restrictions apply) – 16-Bit Video Input Port Capable of Capturing HD Video – HD Resolution Display Subsystem – Serial Communication • High-End CAN Controller • 10/100 Mbit Ethernet MAC • USB OTG Subsystem with Standard DP/DM Interface [HS/FS/LS] • Multiport USB Host Subsystem [HS/FS/LS] – 12-Pin ULPI or 6-, 4-, or 3-Pin Serial Interface • Four Master and Slave Multichannel Serial Port Interface (McSPI) Ports • Five Multichannel Buffered Serial Ports (McBSPs) – 512-Byte Transmit and Receive Buffer (McBSP1/3/4/5) – 5-KB Transmit and Receive Buffer (McBSP2) – SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations – 128-Channel Transmit and Receive Mode – Direct Interface to I2S and PCM Device and TDM Buses • HDQ/1-Wire Interface • • • • • • 4 UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes) • 3 Master and Slave High-Speed InterIntegrated Circuit (I2C) Controllers • Twelve 32-bit General-Purpose Timers • One 32-bit Watchdog Timer • One 32-bit 32-kHz Sync Timer • Up to 186 General-Purpose I/O (GPIO) Pins Display Subsystem – Parallel Digital Output – Up to 24-Bit RGB – Supports Up to 2 LCD Panels – Support for Remote Frame Buffer Interface (RFBI) LCD Panels – Two 10-Bit Digital-to-Analog Converters (DACs) Supporting • Composite NTSC/PAL Video • Luma/Chroma Separate Video (S-Video) – Rotation of 90, 180, and 270 Degrees – Resize Images From 1/4x to 8x – Color Space Converter – 8-Bit Alpha Blending Video Processing Front End (VPFE) 16-Bit Video Input Port – RAW Data Interface – 75-MHz Maximum Pixel Clock – Supports REC656/CCIR656 Standard – Supports YCbCr422 Format (8-Bit or 16-Bit with Discrete Horizontal and Vertical Sync Signals) – Generates Optical Black Clamping Signals – Built-in Digital Clamping and Black Level Compensation – 10-Bit to 8-Bit A-law Compression Hardware – Supports up to 16K Pixels (Image Size) in Horizontal and Vertical Directions System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority) Comprehensive Power, Reset, and Clock Management ARM Cortex-A8 Memory Architecture – ARMv7 Architecture – In-Order, Dual-Issue, Superscalar Microprocessor Core – ARM NEON Multimedia Architecture – Over 2x Performance of ARMv6 SIMD 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com – Supports Both Integer and Floating-Point SIMD – Jazelle® RCT Execution Environment Architecture – Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer and 8Entry Return Stack – Embedded Trace Macrocell [ETM] Support for Noninvasive Debug – 16KB of Instruction Cache (4-Way SetAssociative) – 16KB of Data Cache (4-Way Set-Associative) – 256KB of L2 Cache • PowerVR SGX™ Graphics Accelerator (AM3517 Only) – Tile-Based Architecture Delivering up to 10 MPoly/sec – Universal Scalable Shader Engine: Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality – Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0 – Fine-Grained Task Switching, Load Balancing, and Power Management – Programmable, High-Quality Image Anti-Aliasing • Endianess – ARM Instructions – Little Endian – ARM Data – Configurable • SDRC Memory Controller 1.2 • • • • • • 2 • • • • – 16- and 32-Bit Memory Controller with 1GB of Total Address Space – Double Data Rate (DDR2) SDRAM, Mobile Double Data Rate (mDDR)SDRAM – SDRAM Memory Scheduler (SMS) and Rotation Engine General Purpose Memory Controller (GPMC) – 16-Bit-Wide Multiplexed Address/Data Bus – Up to 8 Chip-Select Pins with 128MB of Address Space per Chip-Select Pin – Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM and Pseudo-SRAM – Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth) – Nonmultiplexed Address/Data Mode (Limited 2KB Address Space) Test Interfaces – IEEE-1149.1 (JTAG) Boundary-Scan Compatible – Embedded Trace Macro Interface (ETM) 65-nm CMOS Technology Packages: – 491-Pin BGA (17 x 17, 0.65-mm Pitch) [ZCN Suffix] with Via Channel™ Array Technology – 484-Pin PBGA (23 x 23, 1-mm Pitch) [ZER Suffix] Applications Single-Board Computers Industrial and Home Automation Digital Signage Point of Service Portable Media Player Portable Industrial • • • • • • Transportation Navigation Smart White Goods Digital TV Digital Video Camera Gaming Device Summary Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 1.3 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Description AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications. The processor can support other applications, including: • Single-board computers • Home and industrial automation • Human machine Interface The device supports high-level operating systems (OSs), such as: • Linux® • Windows® CE • Android™ The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX graphics accelerator (AM3517 device only) subsystem for 3D graphics acceleration to support display and gaming effects • Display subsystem with several features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. • High-performance interconnects provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals. The device also offers a comprehensive clock-management scheme. AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package. This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor. Device Information (1) PART NUMBER PACKAGE BODY SIZE NFBGA (491) 17.10 mm x 17.10 mm AM3505 BGA (484) 23.20 mm x 23.20 mm AM3517 NFBGA (491) 17.10 mm x 17.10 mm AM3517 BGA (484) 23.20 mm x 23.20 mm AM3505 (1) For more information, see Section 8, Mechanical Packaging and Orderable Information. Device Summary Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 3 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 1.4 www.ti.com Functional Block Diagram Figure 1-1 shows the functional block diagram of the AM3517/05 Sitara ARM microprocessor. LCD Panel MPU Subsystem ARM CortexA8TM Core 16K/16K L1$ Parallel POWERVR TM SGX Graphics Accelerator (AM3517 only) L2$ 256K 64 64 HECC 32 32 32 Channel System DMA 32 CVBS or S-Video Analog DAC 64 HS/FS/ LS USB Host Dual Output 3-Layer Display Processor (1xGraphics, 2xVideo) Temporal Dithering SDTV → QCIF Support 32 USB PHY USB OTG Controller 32 32 Async EMAC USB transceivers / device ports [3] VPFE 64 L3 Interconnect Network-Hierarchial, Performance, and Power Driven 32 64K On-Chip RAM 64 132K On-Chip BOOT ROM SMS: SDRAM Memory Scheduler/ Rotation EMIF Controller DDR PHY External DDR2/ mDDR 32 32 32 L4 Interconnect GPMC: General Purpose Memory Controller NAND/NOR/ FLASH, SRAM Peripherals: 4xUART, 3xHigh-Speed I2C, 5xMcBSP (2x with Sidetone/Audio Buffer) 4xMcSPI, 186xGPIO, 3xHigh-Speed MMC/SDIO, HDQ/1 Wire, 12xGPTimers, 1xWDT, 32K Sync Timer System Controls PRCM External Peripherals Interfaces Emulation Debug: ETM, JTAG SPRS550-006 Figure 1-1. AM3517/05 Functional Block Diagram 4 Device Summary Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table of Contents 1 2 3 Device Summary ......................................... 1 5.8 Power-up and Power-down 1.1 Features .............................................. 1 5.9 Clock Specifications ................................. 92 1.2 Applications ........................................... 2 5.10 Video DAC Specifications .......................... 100 1.3 Description ............................................ 3 1.4 Functional Block Diagram ............................ 4 5 90 Timing Requirements and Switching Characteristics ........................................ 107 Revision History ......................................... 6 Device Comparison ..................................... 7 6.1 Timing Test Conditions ............................ 107 6.2 Interface Clock Specifications ........................ 7 3.2 ZCN and ZER Package Differences ................. 7 Terminal Configuration and Functions .............. 8 4.1 Pin Assignments ...................................... 8 4.2 Ball Characteristics .................................. 17 4.3 Multiplexing Characteristics ......................... 51 4.4 Signal Description ................................... 57 Specifications ........................................... 80 5.1 Absolute Maximum Ratings ......................... 80 5.2 Handling Ratings .................................... 81 5.3 Recommended Operating Conditions ............... 82 5.4 Power Consumption Summary...................... 84 5.5 Electrical Characteristics ............................ 85 5.6 Thermal Characteristics ............................. 86 5.7 Core Voltage Decoupling ........................... 88 6.3 Timing Parameters................................. 108 6.4 External Memory Interfaces ........................ 109 6.5 Video Interfaces .................................... 151 6.6 Serial Communications Interfaces ................. 156 6.7 Removable Media Interfaces 6.8 Test Interfaces ..................................... 211 3.1 4 6 ......................... Device Features Comparison 7 8 ..................... ...................... 107 197 Device and Documentation Support .............. 215 7.1 Device Support..................................... 215 7.2 Documentation Support ............................ 216 7.3 Related Links 7.4 Community Resources............................. 217 7.5 Trademarks ........................................ 217 7.6 Electrostatic Discharge Caution ...................................... ................... 217 217 Mechanical Packaging and Orderable Information ............................................. 218 8.1 Package Option Addendum ........................ 218 Table of Contents Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 5 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. This data manual revision history table highlights the technical and major format changes made from Revision E to Revision F. SEE ADDITIONS/MODIFICATIONS/DELETIONS Description: Added Device Information table Section 3 Device Comparison: Added Section 3, Device Comparison Added Section 3.1, Device Features Comparison Moved Section 3.2, ZCN and ZER Package Differences to Section 3, Device Comparison Section 4 Terminal Configuration and Functions: Changed title from Terminal Description to Terminal Configuration and Functions Section 4.4.9 Signal Description: Added pin N22 to VDDS row of the ZCN package in Table 4-27, Power Supplies Description. Section 5 Specifications: Changed title from Electrical Characteristics to Specifications Extracted handling ratings from Table 5-1, Absolute Maximum Ratings Over Operating Junction Temperature Range and added Table 5-2, Handling Ratings Moved Section 5.9, Clock Specifications to Section 5, Specifications Moved Section 5.10, Video DAC Specifications toSection 5, Specifications Section 5.4 Power Consumption Summary: Moved Table 5-4, Estimated Power Consumption at Ball Level to its own section. Section 5.5 Electrical Characteristics: Changed title from DC Electrical Characteristics to Electrical Characteristics Section 5.6 Thermal Characteristics: Changed title from Package Thermal Resistance to Thermal Characteristics Moved section from Package Characteristics to separate section Added θJA, θJC, θJB values to tables (Table 5-6 and Table 5-7) for ZCN and ZER package thermal resistance characteristics. Section 7 Device and Documentation Support Changed title Package Characteristics to Device and Documentation Support Changed title Device and Development Support - Support Tool Nomenclature to Section 7.1.2, Device Nomenclature Added Section 7.1.1, Development Support Changed title Related Documentation From Texas Instruments to Section 7.2.1, Related Documentation Moved section Related Documentation to Section 7.2.1, Related Documentation Section 8 Mechanical Packaging and Orderable Information Changed title Mechanical Data to Mechanical Packaging and Orderable Information 6 Revision History Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 3 Device Comparison 3.1 Device Features Comparison Table 3-1. Device Features Comparison 3.2 FEATURE AM3505 AM3517 PowerVR SGX Graphics Accelerator No Yes ZCN and ZER Package Differences Table 3-2 lists the ZER and ZCN package differences on the device. Table 3-2. ZCN and ZER Package Differences FEATURE ZCN PACKAGE ZER PACKAGE Pin Assignments For ZCN package pin assignments, see Section 4, Terminal Configuration and Functions For ZER package pin assignments, see Section 4, Terminal Configuration and Functions Video Interfaces TV Out available TV Out not available Device Comparison Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 7 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 4 Terminal Configuration and Functions 4.1 4.1.1 Pin Assignments Pin Map (Top View) The following illustrations show the top views of the 484-pin [ZER] and 491-pin [ZCN] package pin assignments in four quadrants (A, B, C, and D). Note: A pin with an NC designator indicates No Connection. For proper device operation, these pins must be left unconnected. 8 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 25 24 23 22 21 AE VSS DSS_ACBIAS DSS_PCLK ETK_D15 ETK_D12 AD DSS_DATA1 DSS_DATA0 DSS_VSYNC DSS_HSYNC AC DSS_DATA4 DSS_DATA3 DSS_DATA2 AB DSS_DATA6 DSS_DATA5 AA DSS_DATA9 Y W DSS_DATA8 20 19 18 17 16 15 14 ETK_D8 ETK_D5 ETK_CTL MCSPI2_ CS1 MCSPI1_ CS3 MCSPI1_ CS2 MCSPI1_ CLK AE ETK_D13 ETK_D9 ETK_D6 ETK_D0 ETK_CLK MCSPI2_ CLK MCSPI1_ SIMO MCSPI1_ CS1 AD ETK_D14 ETK_D10 ETK_D1 MCSPI2_ SIMO MCSPI1_ SOMI AC ETK_D7 ETK_D2 MCSPI2_ SOMI MCSPI1_CS0 AB UART1_TX ETK_D3 MCSPI2_ CS0 VDDS_ DPLL_MPU _USBHOST AA UART1_RTS ETK_D4 VDDSHV VDDSHV Y VDDS VDDSHV VDDSHV W ETK_D11 DSS_DATA7 DSS_DATA13 DSS_DATA12 DSS_DATA11 DSS_DATA10 UART1_CTS DSS_DATA18 DSS_DATA17 DSS_DATA16 DSS_DATA15 DSS_DATA14 UART1_RX V DSS_DATA20 DSS_DATA19 U JTAG_TCK JTAG_NTRST DSS_ DATA23 T JTAG_EMU0 JTAG_TDO JTAG_TDI R MCBSP1_ CLKR P MCBSP_ CLKS MCBSP1_ FSX MCBSP1_ DR N SYS_ CLKOUT1 MCBSP1_ CLKX VSS M SYS_ CLKOUT2 SYS_ CLKREQ 25 24 VSS DSS_ DATA21 DSS_ DATA22 JTAG_TMS _TMSC JTAG_RTCK MCBSP1_ FSR VDDS NC 22 21 VDD_CORE VSS V VDD_CORE VDD_CORE VSS U VSS T VDDSHV VSS VSS VDDSHV VDDSHV VDD_CORE VDD_CORE VDD_CORE VDD_CORE VSS VSS VSS R VSS VSS VSS VSS P VSS N M VDDSHV VDDSHV VSS VDDS_DPLL_ PER_CORE VDDSHV VSS VDD_CORE 23 VDD_CORE VDDS JTAG_ EMU1 MCBSP1_ DX VSS 20 19 VSS VSS 18 17 VSS VSS VSS 16 15 14 Figure 4-1. ZCN Pin Map [Quadrant A] Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 9 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 13 12 www.ti.com 10 11 9 8 7 6 5 3 4 2 1 AE MMC2_ DAT7 MMC2_ DAT3 MMC2_ CMD MMC1_ DAT7 MMC1_ DAT2 RMII_50MHZ _CLK RMII_TXD1 RMII_MDIO _DATA CCDC_ DATA4 CCDC_ DATA1 CCDC_ WEN CCDC_ HD VSS AE AD MMC2_ DAT6 MMC2_ DAT2 MMC2_CLK MMC1_ DAT6 MMC1_ DAT1 RMII_TXEN RMII_TXD0 RMII_MDIO _CLK CCDC_ DATA3 CCDC_ DATA0 CCDC_ VD CCDC_ PCLK CCDC_ FIELD AD MMC2_ DAT1 MMC1_ DAT5 MMC1_ DAT0 RMII_RXER CCDC_ DATA7 SYS_ BOOT6 AC MMC2_ DAT0 MMC1_ DAT4 MMC1_ CMD RMII_CRS_ DV CCDC_ DATA6 SYS_ BOOT4 AB MMC1_ DAT3 MMC1_CLK SYS_ BOOT1 AA AC AB AA MMC2_ DAT5 MMC2_ DAT4 VDDS_SRAM CAP_VDD_ _MPU SRAM_MPU CCDC_ DATA2 SYS_ BOOT8 SYS_ BOOT5 SYS_ BOOT3 RMII_RXD1 RMII_RXD0 CCDC_ DATA5 SYS_ BOOT0 SYS _NRES WARM SYS_NIRQ Y I2C2_SDA I2C2_SCL W HECC1_ TXD RESERVED V RESERVED GPMC_ WAIT3 U GPMC_ WAIT0 GPMC_ NWP GPMC_ NBE1 T GPMC_ NWE GPMC_ NOE GPMC_NADV _ALE R UART3_TX _IRTX UART3_RX _IRRX P VDDSHV VDDSHV VDDSHV VDDS W VDDSHV VDDSHV VDDSHV VDDSHV V VSS VSS VDD_CORE VDD_CORE VSS VSS U VSS VSS VDD_CORE VSS VSS T VSS VSS VDD_CORE VDD_CORE VDDSHV VDDSHV GPMC_ WAIT2 GPMC_ WAIT1 R VSS VSS VSS VSS VDD_CORE VDD_CORE VDDSHV VDDSHV VDDS GPMC_NBE0 _CLE P VSS VSS VSS VSS VSS VSS N VSS VSS VSS VSS VDDSHV VDDSHV GPMC_ NCS6 GPMC_ NCS7 M VSS VSS VSS VDDSHV VDDSHV VDDSHV GPMC_ NCS2 GPMC_ NCS3 7 6 5 4 3 13 12 VSS VDD_CORE VSS 10 11 VSS 9 8 VDDSHV VDDSHV I2C3_SDA I2C1_SDA I2C3_SCL I2C1_SCL SYS_ BOOT2 SYS _NRES PWRON Y VDDSHV SYS_ BOOT7 HECC1_ RXD UART3_RTS UART3_CTS GPMC_CLK _SD _RCTX GPMC_ NCS4 2 GPMC_ NCS5 N M 1 Figure 4-2. ZCN Pin Map [Quadrant B] 10 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 25 24 23 22 L HDQ_ SIO NC NC NC K SYS_ XTALIN SYS_32K NC J VSSOSC H SYS_ XTALOUT TV_ OUT2 G USB0_ID USB0_ VBUS F USB0_DP USB0_DM VDDA3P3V _USBPHY E USB0_ DRVVBUS UART2 _TX UART2_RX D C B A MCBSP2_ FSX MCBSP2_ CLKX 25 NC TV_ OUT1 NC VSSA_DAC VDDA_DAC VDDA1P8V _USBPHY VSS CAP_ VDDA1P2LDO _USBPHY MCBSP3_ DR MCBSP3_ CLKX 24 MCBSP4_ DR 23 19 18 17 16 15 14 VDDSOSC VDDSHV VDD_CORE VSS VSS VSS VSS L VDDSHV VDD_CORE VDD_CORE VSS K VSS VSS VDD_CORE VDD_CORE VSS J VDDSHV VDDSHV VDDS VDD_CORE VSS H VDDS VDDS VDDS G NC VDDS VREFSSTL F SDRC_NCAS E TV_VFB1 TV_VREF NC VSS UART2_RTS VDDS_SRAM CAP_VDD_ _CORE_BG SRAM_CORE SDRC_D4 MCBSP3_ FSX MCBSP4_ CLKX 20 UART2_CTS MCBSP2_ DX MCBSP2_DR MCBSP3_DX VSS TV_VFB2 21 MCBSP4_ DX MCBSP4_ FSX SDRC_D2 SDRC_D5 SDRC_D9 SDRC_D11 SDRC_CKE0 D SDRC_DM0 SDRC_D3 SDRC_D6 SDRC_D10 SDRC_D12 SDRC_NRAS C SDRC_ D0 SDRC_ DQS0P SDRC_ DM1 SDRC_ NWE B SDRC_ D15 SDRC_ NCS1 A 15 14 SDRC_ D1 SDRC_ DQS0N 21 20 22 SDRC_ D7 SDRC_ STRBEN0 19 SDRC_ D8 SDRC_ DQS1P SDRC_ STRBEN _DLY0 SDRC_ DQS1N 18 17 SDRC_ D13 SDRC_ D14 16 Figure 4-3. ZCN Pin Map [Quadrant C] Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 11 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 L K J 13 12 11 VSS VSS VSS VSS VSS www.ti.com 10 9 8 7 VSS VDD_CORE VDD_CORE VSS VDD_CORE VDD_CORE VSS VSS VSS VDD_CORE VDD_CORE VSS VDDS VDDSHV G VDDS VDDS VDDS VDDS F VDDS VDDS VDDS VDDS GPMC_A4 E SDRC_ NCS0 SDRC_ A4 SDRC_ A9 SDRC_DM2 SDRC_D19 D SDRC_BA2 SDRC_A3 SDRC_A8 SDRC_A14 SDRC_D18 C SDRC_BA1 SDRC_A2 SDRC_A7 SDRC_ ODT A SDRC_CLK 13 DDR_ PADREF VDDSHV VDDSHV GPMC_D7 VDDSHV VSS SDRC_ NCLK 5 4 3 VDD_CORE VDD_CORE VSS H B 6 GPMC_A10 GPMC_D0 GPMC_A5 GPMC_D12 GPMC_D8 SDRC_D23 1 GPMC_ NCS0 GPMC_ NCS1 L GPMC_D15 K GPMC_D10 GPMC_D11 J GPMC_D5 GPMC_D6 H GPMC_D3 GPMC_D4 G GPMC_D13 GPMC_D14 GPMC_D9 GPMC_D1 GPMC_D2 GPMC_A6 GPMC_A7 GPMC_A8 GPMC_A9 F GPMC_A1 GPMC_A2 GPMC_A3 E SCRC_D29 SDRC_DM3 D SDRC_D27 SDRC_D28 SDRC_D31 C SDRC_D26 SDRC_ DQS3N SDRC_D30 B SDRC_D25 SDRC_ DQS3P VSS A 3 2 1 SDRC_D21 SDRC_D20 2 SDRC_A1 SDRC_A6 SDRC_A11 SDRC_ A13 SDRC_ D17 SDRC_ DQS2N SDRC_D22 SDRC_24 SDRC_BA0 SDRC_A0 SDRC_A5 SDRC_ A10 SDRC_ A12 SDRC_ D16 SDRC_ DQS2P SDRC_ STRBEN1 SDRC_ STRBEN _DLY1 12 11 10 9 8 7 6 5 4 Figure 4-4. ZCN Pin Map [Quadrant D] 12 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 A B C D E 22 VSS DSS_PCLK UART1_TX ETK_D8 ETK_D10 21 VDDSHV DSS_HSYNC UART1_RTS ETK_D9 20 DSS_DATA0 DSS_VSYNC UART1_RX ETK_D13 19 DSS_DATA1 DSS_ACBIAS UART1_CTS 18 DSS_DATA2 DSS_DATA3 17 DSS_DATA4 DSS_DATA8 16 DSS_DATA13 DSS_DATA7 15 F G H ETK_D1 ETK_CLK MCSPI2_ SOMI ETK_D7 ETK_D5 ETK_CTL ETK_D11 ETK_D2 ETK_D0 ETK_D14 ETK_D4 ETK_D6 ETK_D3 DSS_DATA5 ETK_D15 ETK_D12 VDDSHV VSS DSS_DATA9 DSS_DATA6 MCSPI2_CLK MCSPI1_CLK L VDDSHV 22 MMC2_DAT3 MMC2_DAT6 21 MCSPI1_CS1 MMC2_DAT0 MMC2_DAT5 20 MCSPI2_CS1 MCSPI1_CS2 MCSPI1_SIMO MMC2_DAT1 19 MCSPI2_CS0 MCSPI1_CS3 MCSPI2_ SIMO VDDSHV MCSPI1_ SOMI MCSPI1_CS0 MMC2_DAT4 VSS VDDSHV VDDS_DPLL_ MPU_ USBHOST VDDS_ SRAM_MPU 17 VDD_CORE VSS VDDS 16 VDD_CORE VSS 15 18 VDDSHV VSS VSS VDDS VSS VSS DSS_DATA16 DSS_DATA15 DSS_DATA19 DSS_DATA14 VDDSHV VSS VDDS VSS 14 DSS_DATA17 DSS_DATA23 DSS_DATA22 DSS_DATA12 JTAG_TCK VDDSHV VSS VSS VDD_CORE VSS VDD_CORE 14 13 DSS_DATA20 DSS_DATA21 DSS_DATA18 JTAG_NTRST JTAG_EMU0 VSS VDDSHV VSS VSS VDD_CORE VSS 13 VDDSHV VSS VDD_CORE VSS VDD_CORE 12 H J K L 12 DSS_DATA10 DSS_DATA11 JTAG_TMS_ TMSC JTAG_TDI JTAG_RTCK A B C JTAG_TDO D JTAG_EMU1 E VDDSHV F VDDSHV K J G VSS Figure 4-5. ZER Pin Map [Quadrant A] Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 13 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 M 22 VSS N www.ti.com P R MMC1_DAT4 MMC1_CLK RMII_RXER RMII_ 50MHZ_CLK T U RMII_ MDIO_CLK CCDC_ DATA4 CCDC_ DATA0 RMII_ CRS_DV RMII_ MDIO_DATA CCDC_ DATA2 CCDC_WEN CCDC_ DATA6 CCDC_ DATA1 MMC2_CLK MMC1_CMD MMC1_DAT0 20 MMC2_CMD MMC1_DAT1 MMC1_DAT3 RMII_TXD1 RMII_RXD1 CCDC_ DATA5 19 MMC2_DAT7 MMC1_DAT5 MMC1_DAT2 RMII_TXEN RMII_RXD0 CCDC_ DATA7 18 MMC2_DAT2 MMC1_DAT6 MMC1_DAT7 17 CAP_VDD _SRAM_MPU 16 VSS W RMII_TXD0 21 VDDSHV V VSS VDDSHV VSS VDDSHV VSS VDDSHV VSS VDDSHV VDD_CORE VSS VDDS VSS VDDSHV VSS VDDSHV 15 VDD_CORE VSS 14 VSS VDD_CORE VSS VDD_CORE VSS 13 VDD_CORE VSS VDD_CORE VSS VDDSHV VSS 12 VSS VDD_CORE VSS VDD_CORE VSS VDDSHV M N P R T U VSS VDDSHV CCDC_ DATA3 Y CCDC_VD AA VDDSHV CCDC_HD CCDC_FIELD AB VSS CCDC_ PCLK SYS_BOOT8 SYS_BOOT7 SYS_BOOT1 SYS_BOOT6 SYS_BOOT5 SYS_BOOT3 SYS_BOOT0 22 21 20 19 SYS_NRE SWARM SYS_NRES PWRON SYS_NIRQ 18 I2C3_SDA I2C2_SCL I2C1_SCL I2C1_SDA 17 I2C3_SCL I2C2_SDA GPMC_ WAIT1 HECC1_RXD 16 RESERVED UART3_CTS GPMC_NBE1 GPMC_NWE HECC1_TXD _RCTX 15 GPMC_ GPMC_NOE NADV_ALE 14 UART3_RX GPMC_CLK _IRRX 13 SYS_BOOT4 SYS_BOOT2 VDDSHV RESERVED GPMC_ WAIT3 GPMC_NWP GPMC_ WAIT0 UART3_RTS _SD GPMC_ WAIT2 UART3_TX _IRTX GPMC_NCS3 GPMC_NCS5 GPMC_NCS2 GPMC_NCS6 V W Y AA VSS 12 AB Figure 4-6. ZER Pin Map [Quadrant B] 14 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 A 11 VSS B C D E MCBSP1 _CLKR MCBSP1_FSX MCBSP1_FSR MCBSP_CLKS SYS_ CLKOUT2 F G H VSS VSS VSS NC VDDSHV VSS VDD_CORE VDDS_ DPLL_PER _CORE J K L VDD_CORE VSS 11 VDD_CORE 10 10 SYS_XTALIN VSSOSC MCBSP1_DX NC 9 SYS_ XTALOUT HDQ_SIO MCBSP1_DR NC SYS_ CLKOUT1 NC VDDSOSC VSS VSS VDD_CORE VSS 9 8 SYS_32K SYS_CLKREQ MCBSP1 _CLKX NC NC NC VDDSHV VSS VDD_CORE VSS VDD_CORE 8 7 USB0_ DRVVBUS USB0_ID USB0_VBUS VDDA1P8V _USBPHY CAP_VDDA1 P2LDO_ USBPHY VDDA3P3V _USBPHY VSS VSS NC VDDS VSS 7 6 USB0_DP USB0_DM UART2_RX UART2_TX VSS VSS NC VSS VDDS 6 5 UART2_CTS UART2_RTS MCBSP2_DR MCBSP2 _CLKX MCBSP2_FSX VDDS VSS VDDS VREFSSTL 5 4 MCBSP3_FSX MCBSP3_DR MCBSP3_DX MCBSP3 _CLKX MCBSP2_DX SDRC_DM0 SDRC_D11 3 2 1 MCBSP4 _CLKX VSS VDDS_SRAM CAP_VDD_ _CORE_BG SRAM_CORE SDRC_BA2 SDRC_BA1 SDRC_D12 SDRC_NCS0 SDRC_NCS1 SDRC_BA0 4 SDRC_D10 SDRC_D14 SDRC_CKE0 SDRC_NCAS 3 MCBSP4_DR SDRC_D2 SDRC_D1 SDRC_D0 SDRC_D4 SDRC_D9 MCBSP4_DX MCBSP4_FSX SDRC_D3 SDRC_D5 SDRC_DQS0P SDRC_ STRBEN0 SDRC_D8 SDRC_DQS1P SDRC_DM1 SDRC_NWE SDRC_NCLK 2 SDRC_D13 SDRC_DQS1N SDRC_D15 SDRC_NRAS SDRC_CLK 1 K L VSS VDDSHV SDRC_D6 SDRC_D7 SDRC_DQS0N A B C D E SDRC_ STRBEN _DLY0 F G H J Figure 4-7. ZER Pin Map [Quadrant C] Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 15 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com M N P 11 VDD_CORE VSS VDD_CORE 10 VSS VDD_CORE 9 VDD_CORE 8 T U V VSS VDDSHV VSS GPMC_NCS7 GPMC_ NBE0_CLE GPMC_NCS1 GPMC_NCS4 VDDSHV 11 VSS VDD_CORE VSS VDDSHV GPMC_D14 GPMC_D8 GPMC_NCS0 GPMC_D12 GPMC_D10 10 VSS VDD_CORE VSS VDDSHV VSS GPMC_D15 GPMC_D11 GPMC_D13 GPMC_D3 GPMC_D9 9 VSS VDD_CORE VSS VDD_CORE VSS VDDSHV VDDSHV GPMC_D7 GPMC_D4 GPMC_D5 GPMC_D6 8 7 VDD_CORE VSS VDD_CORE VSS VDDS VSS VDDSHV GPMC_D1 GPMC_D0 GPMC_A9 7 6 VSS VDDS VSS VDDS VSS VDDS VSS GPMC_A8 GPMC_A10 GPMC_A7 GPMC_A6 6 5 SDRC_A2 VDDS VDDS VSS VDDS VSS SDRC_D22 GPMC_A1 GPMC_A2 GPMC_A4 GPMC_A5 5 4 SDRC_A1 SDRC_A5 SDRC_A9 SDRC_A13 SDRC_DM2 SDRC_D18 SDRC_D19 SDRC_D25 SDRC_D27 SDRC_D30 GPMC_A3 4 3 SDRC_A0 SDRC_A3 SDRC_A6 SDRC_A12 SDRC_D16 SDRC_D17 SDRC_D23 SDRC_D24 SDRC_D26 SDRC_D29 SDRC_DM3 3 2 DDR_ PADREF SDRC_A7 SDRC_A11 SDRC_ DQS2N SDRC_D21 SDRC_ STRBEN _DLY1 SDRC_ DQS3N SDRC_D28 SDRC_D31 2 1 VSS VDDS SDRC_ DQS2P SDRC_ D20 SDRC_ STRBEN1 SDRC_ DQS3P VDDS VSS 1 M N W Y SDRC_A4 SDRC_A8 P R SDRC_A10 R SDRC_A14 SDRC_ ODT T U W GPMC_D2 V Y AA AA AB AB Figure 4-8. ZER Pin Map [Quadrant D] 16 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.2 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Ball Characteristics Table 4-1 and Table 4-2 describe the terminal characteristics and the signals multiplexed on each pin for the ZCN/ZER packages. The following list describes the table column headers. 1. BALL LOCATION: Ball number(s) on the bottom side associated with each signal(s) on the bottom. 2. PIN NAME: Names of signals multiplexed on each ball (also notice that the name of the pin is the signal name in mode 0). Note: The Ball Characteristics table does not take into account subsystem pin multiplexing options. Subsystem pin multiplexing options are described in Section 4.4, Signal Description. 3. MODE: Multiplexing mode number. (a) Mode 0 is the primary mode; this means that when mode 0 is set, the function mapped on the pin corresponds to the name of the pin. There is always a function mapped on the primary mode. Notice that primary mode is not necessarily the default mode. Note: The default mode is the mode which is automatically configured on release of the internal GLOBAL_PWRON reset; also see the RESET REL. MODE column. (b) Modes 1 to 7 are possible modes for alternate functions. On each pin, some modes are effectively used for alternate functions, while some modes are not used and do not correspond to a functional configuration. 4. TYPE: Signal direction – I = Input – O = Output – I/O = Input/Output – D = Open drain – DS = Differential – A = Analog Note: In the safe_mode, the buffer is configured in high-impedance. 5. BALL RESET STATE: The state of the terminal at reset (power up). – 0: The buffer drives VOL (pulldown/pullup resistor not activated) 0(PD): The buffer drives VOL with an active pulldown resistor. – 1: The buffer drives VOH (pulldown/pullup resistor not activated) 1(PU): The buffer drives VOH with an active pullup resistor. – Z: High-impedance – L: High-impedance with an active pulldown resistor – H: High-impedance with an active pullup resistor 6. BALL RESET REL. STATE: The state of the terminal at reset release. – 0: The buffer drives VOL (pulldown/pullup resistor not activated) 0(PD): The buffer drives VOL with an active pulldown resistor. – 1: The buffer drives VOH (pulldown/pullup resistor not activated) 1(PU): The buffer drives VOH with an active pullup resistor. – Z: High-impedance – L: High-impedance with an active pulldown resistor – H : High-impedance with an active pullup resistor 7. RESET REL. MODE: This mode is automatically configured on release of the internal GLOBAL_PWRON reset. 8. POWER: The voltage supply that powers the terminal’s I/O buffers. 9. VOLTAGE: Supply voltage for associated pin. 10. HYS: Indicates if the input buffer is with hysteresis. 11. LOAD: Load capacitance of the associated output buffer. 12. PULL U/D - TYPE: Denotes the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled via software. Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 17 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 13. IO CELL: IO cell information. Note: Configuring two pins to the same input signal is not supported as it can yield unexpected results. This can be easily prevented with the proper software configuration. Table 4-1. Ball Characteristics (ZCN Pkg.) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] B21 sdrc_d0 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A21 sdrc_d1 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D20 sdrc_d2 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C20 sdrc_d3 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS E19 sdrc_d4 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D19 sdrc_d5 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C19 sdrc_d6 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B19 sdrc_d7 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B18 sdrc_d8 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D17 sdrc_d9 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C17 sdrc_d10 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D16 sdrc_d11 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C16 sdrc_d12 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B16 sdrc_d13 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A16 sdrc_d14 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A15 sdrc_d15 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A7 sdrc_d16 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B7 sdrc_d17 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D7 sdrc_d18 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS E7 sdrc_d19 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C6 sdrc_d20 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D6 sdrc_d21 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B5 sdrc_d22 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C5 sdrc_d23 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B4 sdrc_d24 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A3 sdrc_d25 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B3 sdrc_d26 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C3 sdrc_d27 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C2 sdrc_d28 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D2 sdrc_d29 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS B1 sdrc_d30 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C1 sdrc_d31 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS A12 sdrc_ba0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS C13 sdrc_ba1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS D13 sdrc_ba2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A11 sdrc_a0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B11 sdrc_a1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS C11 sdrc_a2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS D11 sdrc_a3 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E11 sdrc_a4 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A10 sdrc_a5 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B10 sdrc_a6 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS C10 sdrc_a7 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS D10 sdrc_a8 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E10 sdrc_a9 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A9 sdrc_a10 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B9 sdrc_a11 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A8 sdrc_a12 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B8 sdrc_a13 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS 18 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] D8 sdrc_a14 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E13 sdrc_ncs0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A14 sdrc_ncs1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS A13 sdrc_clk 0 O L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS B13 sdrc_nclk 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS D14 sdrc_cke0 0 O L PD 7 VDDS 1.8V Yes 8 PU/ PD LVCMOS sdrc_cke0_s 7 afe L C14 sdrc_nras 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E14 sdrc_ncas 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B14 sdrc_nwe 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS C21 sdrc_dm0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B15 sdrc_dm1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E8 sdrc_dm2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS D1 sdrc_dm3 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS B20 sdrc_dqs0p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS B17 sdrc_dqs1p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS A6 sdrc_dqs2p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS A2 sdrc_dqs3p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS A20 sdrc_dqs0n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS A17 sdrc_dqs1n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS B6 sdrc_dqs2n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS B2 sdrc_dqs3n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS C8 sdrc_odt 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS A19 sdrc_strben0 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS A18 sdrc_strben_ 0 dly0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS A5 sdrc_strben1 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS A4 sdrc_strben_ 0 dly1 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS B12 ddr_padref 0 A VDDS 1.8V E3 gpmc_a1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_34 4 IO safe_mode 7 gpmc_a2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_35 4 IO safe_mode 7 gpmc_a3 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_36 4 IO safe_mode 7 gpmc_a4 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_37 4 IO safe_mode 7 gpmc_a5 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_38 4 IO safe_mode 7 gpmc_a6 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_39 4 IO safe_mode 7 gpmc_a7 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_40 4 IO safe_mode 7 gpmc_a8 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_41 4 IO safe_mode 7 gpmc_a9 0 H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS E2 E1 F7 F6 F4 F3 F2 F1 O Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 19 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] sys_ ndmareq2 1 I gpio_42 4 IO safe_mode 7 gpmc_a10 0 O sys_ ndmareq3 1 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_43 4 IO safe_mode 7 G5 gpmc_d0 0 G4 gpmc_d1 0 IO H PU 0 VDDSHV 1.8V/3.3V 30 PU/ PD LVCMOS IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD G3 gpmc_d2 LVCMOS 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD G2 LVCMOS gpmc_d3 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS G1 gpmc_d4 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H2 gpmc_d5 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H1 gpmc_d6 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS J5 gpmc_d7 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS J4 gpmc_d8 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_44 4 IO gpmc_d9 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_45 4 IO gpmc_d10 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_46 4 IO gpmc_d11 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_47 4 IO gpmc_d12 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_48 4 IO gpmc_d13 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_49 4 IO gpmc_d14 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_50 4 IO gpmc_d15 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_51 4 IO L2 gpmc_ncs0 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 NA LVCMOS L1 gpmc_ncs1 0 O H Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_52 4 IO gpmc_ncs2 H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS G6 J3 J2 J1 K4 K3 K2 K1 M4 M3 M2 20 0 O gpt9_pwm_e 2 vt IO gpio_53 4 IO safe_mode 7 gpmc_ncs3 0 O sys_ ndmareq0 1 I gpt10_pwm_ 2 evt IO gpio_54 4 IO safe_mode 7 gpmc_ncs4 0 O sys_ ndmareq1 1 I gpt9_pwm_e 3 vt IO gpio_55 4 IO safe_mode 7 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] M1 gpmc_ncs5 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS sys_ ndmareq2 1 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS N5 gpt10_pwm_ 3 evt IO gpio_56 4 IO safe_mode 7 gpmc_ncs6 0 O sys_ ndmareq3 1 I gpt11_pwm_ 3 evt IO gpio_57 4 IO safe_mode 7 gpmc_ncs7 0 O gpmc_io_dir 1 O gpt8_pwm_e 3 vt IO gpio_58 4 IO safe_mode 7 gpmc_clk 0 O gpio_59 4 IO R1 gpmc_nadv_ 0 ale O L Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS R2 gpmc_noe 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS R3 gpmc_nwe 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS R4 gpmc_nbe0_ 0 cle O L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_60 4 IO gpmc_nbe1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_61 4 IO safe_mode 7 gpmc_nwp 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_62 4 IO T3 gpmc_wait0 0 I H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS T4 gpmc_wait1 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS uart4_tx 1 O gpio_63 4 IO safe_mode 7 gpmc_wait2 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS uart4_rx 1 I gpio_64 4 IO safe_mode 7 gpmc_wait3 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS sys_ ndmareq1 1 I uart3_cts_rct 2 x I gpio_65 4 IO safe_mode 7 dss_pclk 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_66 4 IO hw_dbg12 5 O safe_mode 7 dss_hsync 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_67 4 IO hw_dbg13 5 O safe_mode 7 N4 N1 T1 T2 T5 U1 AE23 AD22 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 21 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] AD23 dss_vsync 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_68 4 IO safe_mode 7 dss_acbias 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_69 4 IO safe_mode 7 dss_data0 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS uart1_cts 2 I gpio_70 4 IO safe_mode 7 dss_data1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS uart1_rts 2 O gpio_71 4 IO safe_mode 7 dss_data2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_72 4 IO safe_mode 7 dss_data3 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_73 4 IO safe_mode 7 dss_data4 0 L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS AE24 AD24 AD25 AC23 AC24 AC25 AB24 AB25 AA23 AA24 AA25 Y22 Y23 Y24 22 O uart3_rx_ irrx 2 I gpio_74 4 IO safe_mode 7 dss_data5 0 O uart3_tx_ irtx 2 O gpio_75 4 IO safe_mode 7 dss_data6 0 O uart1_tx 2 O gpio_76 4 IO hw_dbg14 5 O safe_mode 7 dss_data7 0 O uart1_rx 2 I gpio_77 4 IO hw_dbg15 5 O safe_mode 7 dss_data8 0 O gpio_78 4 IO hw_dbg16 5 O safe_mode 7 dss_data9 0 O gpio_79 4 IO hw_dbg17 5 O safe_mode 7 dss_data10 0 O gpio_80 4 IO safe_mode 7 dss_data11 0 O gpio_81 4 IO safe_mode 7 dss_data12 0 O gpio_82 4 IO safe_mode 7 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] Y25 dss_data13 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_83 4 IO safe_mode 7 dss_data14 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_84 4 IO safe_mode 7 dss_data15 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_85 4 IO safe_mode 7 dss_data16 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_86 4 IO safe_mode 7 dss_data17 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_87 4 IO safe_mode 7 dss_data18 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS mcspi3_clk 2 IO dss_data4 3 O gpio_88 4 IO safe_mode 7 dss_data19 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS mcspi3_ simo 2 IO dss_data3 3 O gpio_89 4 IO safe_mode 7 dss_data20 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS mcspi3_ somi 2 IO dss_data2 3 O gpio_90 4 IO safe_mode 7 dss_data21 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS mcspi3_cs0 2 IO dss_data1 3 O gpio_91 4 IO safe_mode 7 dss_data22 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS mcspi3_cs1 2 O dss_data0 3 O gpio_92 4 IO safe_mode 7 dss_data23 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS dss_data5 3 O gpio_93 4 IO safe_mode 7 H24 tv_out2 0 O 0 VDDA_DAC 1.8V NA 10-bit DAC K21 tv_out1 0 O 0 VDDA_DAC 1.8V NA 10-bit DAC K20 tv_vfb1 0 O Z NA 0 VDDA_DAC 1.8V NA 10-bit DAC H23 tv_vfb2 0 O Z NA 0 VDDA_DAC 1.8V NA 10-bit DAC H20 tv_vref 0 I Z NA 0 VDDA_DAC 1.8V NA 10-bit DAC AD2 ccdc_pclk 0 IO L PD 7 VDDSHV 1.8V/3.3V PU/ PD LVCMOS gpio_94 4 IO hw_dbg0 5 O safe_mode 7 W21 W22 W23 W24 W25 V24 V25 U21 U22 U23 Yes 15 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 23 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] AD1 ccdc_field 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS ccdc_data8 1 I uart4_tx 2 O i2c3_scl 3 IOD gpio_95 4 IO hw_dbg1 5 O safe_mode 7 ccdc_ hd 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS uart4_rts 2 O gpio_96 4 IO safe_mode 7 ccdc_vd 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS uart4_cts 2 I gpio_97 4 IO hw_dbg2 5 O safe_mode 7 ccdc_wen 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS ccdc_data9 1 I uart4_rx 2 I gpio_98 4 IO hw_dbg3 5 O safe_mode 7 ccdc_data0 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS i2c3_sda 3 IOD gpio_99 4 I safe_mode 7 ccdc_data1 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS gpio_100 4 I safe_mode 7 ccdc_data2 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS gpio_101 4 IO hw_dbg4 5 O safe_mode 7 ccdc_data3 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS gpio_102 4 IO hw_dbg5 5 O safe_mode 7 ccdc_data4 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS gpio_103 4 IO hw_dbg6 5 O safe_mode 7 ccdc_data5 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS gpio_104 4 IO hw_dbg7 5 O safe_mode 7 ccdc_data6 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS gpio_105 4 IO safe_mode 7 ccdc_data7 0 I L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS gpio_106 4 IO safe_mode 7 H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/PD LVCMOS AE2 AD3 AE3 AD4 AE4 AC5 AD5 AE5 Y6 AB6 AC6 AE6 24 rmii_mdio_da 0 ta IO ccdc_data8 1 I gpio_107 4 IO Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] AD6 Y7 AA7 AB7 AC7 AD7 AE7 AD8 AE8 D25 C25 B25 D24 AA9 PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] safe_mode rmii_mdio_cl 0 k 7 O H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/PD LVCMOS ccdc_data9 1 I gpio_108 4 IO safe_mode 7 rmii_rxd0 H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V 25 PU/PD LVCMOS 25 PU/ PD LVCMOS 0 I ccdc_data10 1 I gpio_109 4 IO hw_dbg8 5 O safe_mode 7 rmii_rxd1 0 I ccdc_data11 1 I gpio_110 4 IO hw_dbg9 5 O safe_mode 7 rmii_crs_dv 0 I ccdc_data12 1 I gpio_111 4 IO safe_mode 7 rmii_rxer 0 I ccdc_data13 1 I gpio_167 4 IO hw_dbg10 5 O safe_mode 7 rmii_txd0 0 O ccdc_ data14 1 I gpio_126 4 IO hw_dbg11 5 O safe_mode 7 rmii_txd1 0 O ccdc_data15 1 I gpio_112 4 I safe_mode 7 rmii_txen 0 O gpio_113 4 I safe_mode 7 rmii_50mhz_ 0 clk I gpio_114 4 I safe_mode 7 mcbsp2_fsx 0 IO gpio_116 4 IO safe_mode 7 mcbsp2_ clkx 0 IO gpio_117 4 IO safe_mode 7 mcbsp2_dr 0 I gpio_118 4 IO safe_mode 7 mcbsp2_dx 0 IO gpio_119 4 IO safe_mode 7 mmc1_clk 0 O gpio_120 4 IO NA H PU 7 VDDSHV 1.8V/3.3V NA L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 25 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] AB9 AC9 AD9 AE9 AA10 AB10 AC10 AD10 AE10 AD11 AE11 AB12 AC12 AD12 26 PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] safe_mode 7 mmc1_cmd gpio_121 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 4 IO safe_mode 7 mmc1_dat0 0 IO mcspi2_clk 1 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_122 4 IO safe_mode 7 mmc1_dat1 L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 0 IO mcspi2_simo 1 IO gpio_123 4 IO safe_mode 7 mmc1_dat2 0 IO mcspi2_somi 1 IO gpio_124 4 IO safe_mode 7 mmc1_dat3 0 IO mcspi2_cs0 1 O gpio_125 4 IO safe_mode 7 mmc1_dat4 0 IO gpio_126 4 IO safe_mode 7 mmc1_dat5 0 IO gpio_127 4 IO safe_mode 7 mmc1_dat6 0 IO gpio_128 4 IO safe_mode 7 mmc1_dat7 0 IO gpio_129 4 IO safe_mode 7 mmc2_clk 0 O mcspi3_clk 1 IO uart4_cts 2 I gpio_130 4 IO safe_mode 7 mmc2_ cmd 0 IO mcspi3_ simo 1 IO uart4_rts 2 O gpio_131 4 IO safe_mode 7 mmc2_ dat0 0 IO mcspi3_ somi 1 IO uart4_tx 2 O gpio_132 4 IO safe_mode 7 mmc2_ dat1 0 IO uart4_rx 2 I gpio_133 4 IO safe_mode 7 mmc2_ dat2 0 IO mcspi3_cs1 O 1 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] AE12 AB13 AC13 PIN NAME [2] MODE [3] TYPE [4] gpio_134 4 IO safe_mode 7 mmc2_ dat3 0 IO mcspi3_cs0 1 IO gpio_135 4 IO safe_mode 7 mmc2_ dat4 0 IO mmc2_dir_da 1 t0 O mmc3_dat0 3 IO gpio_136 4 IO safe_mode 7 mmc2_ dat5 0 IO mmc2_dir_da 1 t1 O mmc3_dat1 3 IO gpio_137 4 IO mm_fsusb3_r 6 xdp IO safe_mode AD13 AE13 B24 C24 A24 C23 F20 F19 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 7 mmc2_ dat6 0 IO mmc2_dir_ cmd 1 O mmc3_dat2 3 IO gpio_138 4 IO safe_mode 7 mmc2_ dat7 0 IO mmc2_ clkin 1 I mmc3_dat3 3 IO gpio_139 4 IO mm_fsusb3_r 6 xdm IO safe_mode 7 mcbsp3_dx 0 IO uart2_cts 1 I gpio_140 4 IO safe_mode 7 mcbsp3_dr 0 I uart2_rts 1 O gpio_141 4 IO safe_mode 7 mcbsp3_ clkx 0 IO uart2_tx 1 O gpio_142 4 IO safe_mode 7 mcbsp3_fsx 0 IO uart2_rx 1 I gpio_143 4 IO safe_mode 7 uart2_cts 0 I mcbsp3_dx 1 IO gpt9_pwm_e 2 vt IO gpio_144 4 IO safe_mode 7 uart2_rts 0 O Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 27 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] E24 E23 AA19 Y19 Y20 W20 B23 A23 B22 A22 PIN NAME [2] MODE [3] TYPE [4] mcbsp3_dr 1 I gpt10_pwm_ 2 evt IO gpio_145 4 IO safe_mode 7 uart2_tx 0 O mcbsp3_ clkx 1 IO gpt11_pwm _evt 2 IO gpio_146 4 IO safe_mode 7 uart2_rx 0 I mcbsp3_fsx 1 IO gpt8_pwm_e 2 vt IO gpio_147 4 IO safe_mode 7 uart1_tx 0 O gpio_148 4 IO safe_mode 7 uart1_rts 0 O gpio_149 4 IO safe_mode 7 uart1_cts 0 I gpio_150 4 IO safe_mode 7 uart1_rx 0 I mcbsp1_ clkr 2 I mcspi4_clk 3 IO gpio_151 4 IO safe_mode 7 mcbsp4_ clkx 0 IO gpio_152 4 IO mm_fsusb3_t 6 xse0 IO safe_mode 7 mcbsp4_dr 0 I gpio_153 4 IO mm_fsusb3_r 6 xrcv IO safe_mode 7 mcbsp4_dx 0 IO gpio_154 4 IO mm_fsusb3_t 6 xdat IO safe_mode 7 mcbsp4_fsx 0 IO gpio_155 4 IO mm_fsusb3_t 6 xen_ n IO safe_mode R25 P21 28 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 7 mcbsp1_ clkr 0 IO mcspi4_clk 1 IO gpio_156 4 IO safe_mode 7 mcbsp1_fsr 0 IO Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] P22 P23 P25 P24 N24 N2 N3 P1 P2 F25 F24 PIN NAME [2] MODE [3] TYPE [4] gpio_157 4 IO safe_mode 7 mcbsp1_dx 0 IO mcspi4_ simo 1 IO mcbsp3_dx 2 IO gpio_158 4 IO safe_mode 7 mcbsp1_dr 0 I mcspi4_ somi 1 IO mcbsp3_dr 2 I gpio_159 4 IO safe_mode 7 mcbsp_clks 0 I gpio_160 4 IO uart1_cts 5 I safe_mode 7 mcbsp1_fsx 0 IO mcspi4_cs0 1 IO mcbsp3_fsx 2 IO gpio_161 4 IO safe_mode 7 mcbsp1_ clkx 0 IO mcbsp3_ clkx 2 IO gpio_162 4 IO safe_mode 7 uart3_cts_ rctx 0 IO gpio_163 4 IO safe_mode 7 uart3_rts_ sd 0 O gpio_164 4 IO safe_mode 7 uart3_rx_ irrx 0 I gpio_165 4 IO safe_mode 7 uart3_tx_ irtx 0 O gpio_166 4 IO safe_mode 7 usb0_dp 0 IO uart3_tx_ irtx 1 O usb0_dm IO 0 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 5.0V Yes PU/ PD USB_PHY 5.0V Yes PU/ PD USB_PHY uart3_rx_ irrx 1 I G24 usb0_vbus 0 A VDDA3P3V_ 3.3V USBPHY Yes PU/ PD USB_PHY G25 usb0_id 0 A VDDA3P3V_ 3.3V USBPHY Yes PU/ PD USB_PHY E25 usb0_drvvbu 0 s O uart3_tx_ irtx 2 O gpio_125 4 IO safe_mode 7 hecc1_ txd 0 V2 O uart3_rx_ irrx 2 I gpio_130 IO 4 L PD 7 VDDSHV 1.8V/3.3V H PU 7 VDDSHV 1.8V/3.3V 30 Yes 24 LVCMOS PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 29 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] V3 PIN NAME [2] MODE [3] safe_mode 7 hecc1_ rxd 0 TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] I H PU 7 VDDSHV 1.8V/3.3V Yes 24 PU/ PD LVCMOS uart3_rts_ sd 2 O gpio_131 4 IO safe_mode 7 V4 i2c1_scl 0 IOD H PU 0 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain V5 i2c1_ sda 0 IOD H PU 0 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain W1 i2c2_scl 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_168 4 IO safe_mode 7 i2c2_sda 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_183 4 IO safe_mode 7 i2c3_scl 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_184 4 IO safe_mode 7 i2c3_sda 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_185 4 IO safe_mode 7 hdq_sio 0 IO H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD LVCMOS sys_altclk 1 I i2c2_sccbe 2 O i2c3_sccbe 3 O gpio_170 4 IO safe_mode 7 mcspi1_clk 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat4 1 IO gpio_171 4 IO safe_mode 7 mcspi1_ simo 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat5 1 IO gpio_172 4 IO safe_mode 7 mcspi1_ somi 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat6 1 IO gpio_173 4 IO safe_mode 7 mcspi1_cs0 0 IO H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat7 1 IO gpio_174 4 IO safe_mode 7 mcspi1_cs1 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc3_cmd 3 IO gpio_175 4 IO safe_mode 7 mcspi1_cs2 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc3_clk 3 O gpio_176 4 IO safe_mode 7 mcspi1_cs3 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS hsusb2_ data2 3 IO gpio_177 4 IO W2 W4 W5 L25 AE14 AD15 AC15 AB15 AD14 AE15 AE16 30 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] mm_fsusb2_t 5 xdat AD16 AC16 AB16 AA16 AE17 TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 30 IO safe_mode 7 mcspi2_clk 0 IO hsusb2_ data7 3 IO gpio_178 4 IO safe_mode 7 mcspi2_ simo 0 IO gpt9_pwm_e 1 vt IO hsusb2_ data4 3 IO gpio_179 4 IO safe_mode 7 mcspi2_ somi 0 IO gpt10_pwm_ 1 evt IO hsusb2_ data5 3 IO gpio_180 4 IO safe_mode 7 mcspi2_cs0 0 IO gpt11_pwm_ 1 evt IO hsusb2_ data6 3 IO gpio_181 4 IO safe_mode 7 mcspi2_cs1 0 O gpt8_pwm_e 1 vt IO hsusb2_ data3 3 IO gpio_182 4 IO mm_fsusb2_t 5 xen_ n IO safe_mode 7 K24 sys_32k 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes PU/ PD LVCMOS K25 sys_xtalin 0 I Z Z 0 VDDSOSC 1.8V NA PU/ PD LVCMOS H25 sys_xtalout 0 O Z Z 0 VDDSOSC 1.8V NA PU/ PD LVCMOS M24 sys_clkreq 0 IO L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_1 4 IO sys_nirq 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_0 4 IO Y1 safe_mode 7 Y2 sys_ nrespwron 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Y3 sys_ nreswarm 0 IO L PD 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_30 4 IO sys_boot0 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_2 4 IO sys_boot1 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_3 4 IO sys_boot2 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_4 4 IO Y4 AA1 AA2 Open Drain Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 31 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] PIN NAME [2] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] AA3 sys_boot3 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_5 4 IO sys_boot4 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AB1 AB2 mmc2_dir_da 1 t2 O gpio_6 4 IO sys_boot5 0 I mmc2_dir_da 1 t3 O gpio_7 4 IO sys_boot6 0 I gpio_8 4 IO AC2 sys_boot7 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/PD LVCMOS AC3 sys_boot8 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/PD LVCMOS N25 sys_clkout1 0 O H PD 0/7 (1) VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_10 4 IO safe_mode 7 sys_clkout2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 10 PU/ PD LVCMOS gpio_186 4 IO AC1 M25 safe_mode 7 U24 jtag_ntrst 0 I L PD 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS U25 jtag_tck 0 I L PD 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS T21 jtag_rtck 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS T22 jtag_tms_tms 0 c IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS T23 jtag_tdi 0 I H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS T24 jtag_tdo 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS T25 jtag_emu0 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_11 4 IO jtag_emu1 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_31 4 IO etk_clk 0 O H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS mcbsp5_ clkx 1 IO mmc3_clk 2 O hsusb1_stp 3 O gpio_12 4 IO etk_ctl 0 O H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS mmc3_cmd 2 IO hsusb1_clk 3 O gpio_13 4 IO mm_fsusb1_r 5 xdp IO etk_d0 0 O H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS mcspi3_ simo 1 IO mmc3_dat4 2 IO hsusb1_ data0 3 IO gpio_14 H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS R24 AD17 AE18 AD18 AC18 (1) 32 4 IO mm_fsusb1_r 5 xrcv IO etk_d1 0 O mcspi3_ somi 1 IO hsusb1_ data1 3 IO Mux0 if sys_boot6 is pulled down (clock master). Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] AB18 AA18 Y18 AE19 AD19 AB19 AE20 AD20 AC20 AB20 PIN NAME [2] MODE [3] TYPE [4] gpio_15 4 IO mm_fsusb1_t 5 xse0 IO etk_d2 0 O mcspi3_cs0 1 IO hsusb1_ data2 3 IO gpio_16 4 IO mm_fsusb1_t 5 xdat IO etk_d3 0 O mcspi3_clk 1 IO mmc3_dat3 2 IO hsusb1_ data7 3 IO gpio_17 4 IO etk_d4 0 O mcbsp5_dr 1 I mmc3_dat0 2 IO hsusb1_ data4 3 IO gpio_18 4 IO etk_d5 0 O mcbsp5_fsx 1 IO mmc3_dat1 2 IO hsusb1_ data5 3 IO gpio_19 4 IO etk_d6 0 O mcbsp5_dx 1 IO mmc3_dat2 2 IO hsusb1_ data6 3 IO gpio_20 4 IO etk_d7 0 O mcspi3_cs1 1 O mmc3_dat7 2 IO hsusb1_ data3 3 IO gpio_21 4 IO mm_fsusb1_t 5 xen_n IO etk_d8 0 O mmc3_dat6 2 IO hsusb1_dir 3 I gpio_22 4 IO etk_d9 0 O mmc3_dat5 2 IO hsusb1_nxt 3 I gpio_23 4 IO mm_fsusb1_r 5 xdm IO etk_d10 0 O uart1_rx 2 I hsusb2_clk 3 O gpio_24 4 IO etk_d11 0 O mcspi3_clk 1 IO BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 33 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] AE21 AD21 AC21 AE22 PIN NAME [2] MODE [3] TYPE [4] hsusb2_stp 3 O gpio_25 4 IO mm_fsusb2_r 5 xdp IO etk_d12 0 O hsusb2_dir 3 I gpio_26 4 IO etk_d13 0 O hsusb2_nxt 3 I gpio_27 4 IO mm_fsusb2_r 5 xdm IO etk_d14 0 O hsusb2_ data0 3 IO gpio_28 4 IO mm_fsusb2_r 5 xrcv IO etk_d15 0 O hsusb2_ data1 3 IO gpio_29 4 IO mm_fsusb2_t 5 xse0 IO BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS V16, V15, VDD_CORE 0 V11, V10, U16, U15, U11, U10, T18, T17, T9, T8, R18, R17, R9, R8, M18, L18, L9, L8, K18, K17, K9, K8, J16, J15, J11, J10, H15, H11, H10 PWR 1.2V AA13 VDDS_SRA M_MPU 0 PWR 1.8V E17 VDDS_SRA 0 M_CORE_B G PWR 1.8V AA12 CAP_VDD_S 0 RAM_MPU PWR 1.2V E16 CAP_VDD_S 0 RAM_CORE PWR 1.2V AA15 VDDS_DPLL 0 _MPU_USB HOST PWR 1.8V N20 VDDS_DPLL 0 _PER_CORE PWR 1.8V H21 VDDA_DAC 0 PWR 1.8V F23 VDDA3P3V_ 0 USBPHY PWR 3.3V G22 VDDA1P8V_ 0 USBPHY PWR 1.8V F22 CAP_VDDA1 0 P2LDO_USB PHY PWR 1.2V 34 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-1. Ball Characteristics (ZCN Pkg.) (continued) BALL LOCATION [1] MODE [3] TYPE [4] Y16, Y15, VDDSHV Y13, Y12, Y10, W16, W15, W13, W12,W10, W9, W6, V7, V6, U19, T20, T19, T7, T6, R7, R6, P20, P19, N19, N7, N6, M7, M6, M5, L19, K19, K7, K6, K5, J7, H18, H17 0 PWR 1.8V/3.3V Y9, W18, VDDS U20, R5, N22, H16, H8, G17, G16, G14, G13, G11, G10, G8, F16, F13, F11, F10, F8 0 PWR 1.8V F14 VREFSSTL 0 I L20 VDDSOSC 0 PWR 1.8V J25 VSSOSC O GND 1.8V AE25, AE1, VSS V18, V17, V14, V13, V12, V9, V8, U18, U17, U14, U13, U12, U9, U8, T14, T13, T12, R16, R15, R14, R13, R12, R11, R10, P18, P17, P16, P15, P14, P13, P12, P11, P10, P9, P8, N18, N17, N14, N13, N12, N9, N8, M17, M16, M15, M14, M13,M12, M11, M10, M9, M8, L17, L16, L15, L14, L13, L12, L11, L10, K14, K13, K12, J18, J17, J14, J13, J12, J9, J8, H14, H13, H12, H9, A25, A1, N23, G20, G21 0 GND H22 VSSA_DAC 0 GND L24, L23, L22, L21, K23, K22, H19, N21,F17 NC (2) U2 (3) Reserved V1 (3) Reserved (2) (3) PIN NAME [2] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] "NC" indicates "No Connect". For proper device operation, these pins must be left unconnected. For proper device operation, this pin must be pulled up to VDDSHV via a 10k-Ω resistor. Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 35 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] E3 sdrc_d0 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D3 sdrc_d1 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C3 sdrc_d2 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C2 sdrc_d3 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS F3 sdrc_d4 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D2 sdrc_d5 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS C1 sdrc_d6 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS D1 sdrc_d7 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS G2 sdrc_d8 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS G3 sdrc_d9 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS H3 sdrc_d10 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS G4 sdrc_d11 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS H4 sdrc_d12 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS G1 sdrc_d13 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS J3 sdrc_d14 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS J1 sdrc_d15 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS T3 sdrc_d16 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS U3 sdrc_d17 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS U4 sdrc_d18 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS V4 sdrc_d19 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS V1 sdrc_d20 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS V2 sdrc_d21 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS V5 sdrc_d22 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS V3 sdrc_d23 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS W3 sdrc_d24 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS W4 sdrc_d25 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS Y3 sdrc_d26 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS Y4 sdrc_d27 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS AA2 sdrc_d28 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS AA3 sdrc_d29 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS AA4 sdrc_d30 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS AB2 sdrc_d31 0 IO L Z 0 VDDS 1.8V Yes 4 PU/ PD LVCMOS L4 sdrc_ba0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS K5 sdrc_ba1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS J5 sdrc_ba2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS M3 sdrc_a0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS M4 sdrc_a1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS M5 sdrc_a2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS N3 sdrc_a3 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS N2 sdrc_a4 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS N4 sdrc_a5 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS P3 sdrc_a6 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS P2 sdrc_a7 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS P1 sdrc_a8 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS P4 sdrc_a9 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS R1 sdrc_a10 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS R2 sdrc_a11 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS R3 sdrc_a12 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS R4 sdrc_a13 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS T2 sdrc_a14 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS J4 sdrc_ncs0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS K4 sdrc_ncs1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS L1 sdrc_clk 0 O L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS L2 sdrc_nclk 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS 36 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] K3 0 O L PD 7 VDDS 1.8V Yes 8 PU/ PD LVCMOS sdrc_cke0 sdrc_cke0_s 7 afe I K1 sdrc_nras 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS L3 sdrc_ncas 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS K2 sdrc_nwe 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS F4 sdrc_dm0 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS J2 sdrc_dm1 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS T4 sdrc_dm2 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS AB3 sdrc_dm3 0 O L Z 0 VDDS 1.8V No 8 PU/ PD LVCMOS E2 sdrc_dqs0p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS H2 sdrc_dqs1p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS U1 sdrc_dqs2p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS Y1 sdrc_dqs3p 0 IO L Z 0 VDDS 1.8V Yes 8 PU/ PD LVCMOS E1 sdrc_dqs0n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS H1 sdrc_dqs1n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS U2 sdrc_dqs2n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS Y2 sdrc_dqs3n 0 IO L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS T1 sdrc_odt 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS F2 sdrc_strben0 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS F1 sdrc_strben_ 0 dly0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS W1 sdrc_strben1 0 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS W2 sdrc_strben_ 0 dly1 L Z 0 VDDS 1.8V 8 PU/ PD LVCMOS W5 gpmc_a1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_34 4 IO gpmc_a2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_35 4 IO gpmc_a3 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_36 4 IO gpmc_a4 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_37 4 IO gpmc_a5 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_38 4 IO gpmc_a6 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_39 4 IO gpmc_a7 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_40 4 IO gpmc_a8 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_41 4 IO gpmc_a9 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS sys_ ndmareq2 1 I gpio_42 4 IO gpmc_a10 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS sys_ ndmareq3 1 I Y5 AB4 AA5 AB5 AB6 AA6 W6 AB7 Y6 gpio_43 4 IO AA7 gpmc_d0 0 IO H PU 0 VDDSHV 1.8V/3.3V 30 PU/ PD LVCMOS Y7 gpmc_d1 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS W7 gpmc_d2 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AA9 gpmc_d3 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Y8 gpmc_d4 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AA8 gpmc_d5 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AB8 gpmc_d6 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS W8 gpmc_d7 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 37 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] W10 gpmc_d8 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_44 4 IO gpmc_d9 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_45 4 IO gpmc_d10 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_46 4 IO gpmc_d11 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_47 4 IO gpmc_d12 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_48 4 IO gpmc_d13 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_49 4 IO gpmc_d14 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_50 4 IO gpmc_d15 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_51 4 IO Y10 gpmc_ncs0 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 NA LVCMOS Y11 gpmc_ncs1 0 O H Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_52 4 IO gpmc_ncs2 H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AB9 AB10 W9 AA10 Y9 V10 V9 Y12 V12 AA11 W12 AA12 0 O gpt9_pwm_e 2 vt IO gpio_53 4 IO gpmc_ncs3 0 O sys_ ndmareq0 1 I gpt10_pwm_ 2 evt IO gpio_54 4 IO gpmc_ncs4 0 O sys_ ndmareq1 1 I gpt9_pwm_e 3 vt IO gpio_55 4 IO gpmc_ncs5 0 O sys_ ndmareq2 1 I gpt10_pwm_ 3 evt IO gpio_56 4 IO gpmc_ncs6 0 O sys_ ndmareq3 1 I gpt11_pwm_ 3 evt IO gpio_57 4 IO gpmc_ncs7 0 O gpmc_io_dir 1 O gpt8_pwm_e 3 vt IO gpio_58 4 IO gpmc_clk 0 O gpio_59 4 IO AA14 gpmc_nadv_ 0 ale O L Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS AB14 gpmc_noe 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS AA15 gpmc_nwe 0 O H Z 0 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS V11 AB13 38 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] gpmc_nbe0_ 0 cle O L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_60 4 IO gpmc_nbe1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_61 4 IO gpmc_nwp 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_62 4 IO V13 gpmc_wait0 0 I H PU 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS AA16 gpmc_wait1 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS uart4_tx 1 O gpio_63 4 IO gpmc_wait2 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS uart4_rx 1 I gpio_64 4 IO gpmc_wait3 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS sys_ ndmareq1 1 I uart3_cts_rct 2 x I gpio_65 4 IO dss_pclk 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_66 4 IO hw_dbg12 5 O dss_hsync 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_67 4 IO hw_dbg13 5 O dss_vsync 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_68 4 IO dss_acbias 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_69 4 IO dss_data0 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS uart1_cts 2 I gpio_70 4 IO dss_data1 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS uart1_rts 2 O gpio_71 4 IO dss_data2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_72 4 IO dss_data3 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_73 4 IO dss_data4 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS W11 Y15 W14 Y14 V14 B22 B21 B20 B19 A20 A19 A18 B18 A17 C18 D17 B16 B17 MODE [3] uart3_rx_irrx 2 I gpio_74 4 IO dss_data5 0 O uart3_tx_irtx 2 O gpio_75 4 IO dss_data6 0 O uart1_tx 2 O gpio_76 4 IO hw_dbg14 5 O dss_data7 0 O uart1_rx 2 I gpio_77 4 IO hw_dbg15 5 O dss_data8 0 O gpio_78 4 IO Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 39 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] C17 C16 D16 D14 A16 D15 B15 A15 A14 C13 C15 A13 B13 C14 B14 AB21 AA21 Y21 40 MODE [3] TYPE [4] hw_dbg16 5 O dss_data9 0 O gpio_79 4 IO hw_dbg17 5 O dss_data10 0 O gpio_80 4 IO dss_data11 0 O gpio_81 4 IO dss_data12 0 O gpio_82 4 IO dss_data13 0 O gpio_83 4 IO dss_data14 0 O gpio_84 4 IO dss_data15 0 O gpio_85 4 IO dss_data16 0 O gpio_86 4 IO dss_data17 0 O gpio_87 4 IO dss_data18 0 O mcspi3_clk 2 IO dss_data4 3 O gpio_88 4 IO dss_data19 0 O mcspi3_ simo 2 IO dss_data3 3 O gpio_89 4 IO dss_data20 0 O mcspi3_ somi 2 IO dss_data2 3 O gpio_90 4 IO dss_data21 0 O mcspi3_cs0 2 IO dss_data1 3 O gpio_91 4 IO dss_data22 0 O mcspi3_cs1 2 O gpio_92 4 IO dss_data23 0 O dss_data5 3 O gpio_93 4 IO ccdc_pclk 0 IO gpio_94 4 IO hw_dbg0 5 O ccdc_field 0 IO ccdc_data8 1 I uart4_tx 2 O i2c3_scl 3 IO gpio_95 4 IO hw_dbg1 5 O ccdc_ hd 0 IO uart4_rts 2 O BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] Y22 W21 W22 W20 V21 V19 V22 U20 V20 U19 U21 U22 T19 T20 T21 R22 MODE [3] TYPE [4] gpio_96 4 IO ccdc_vd 0 IO uart4_cts 2 I gpio_97 4 IO hw_dbg2 5 O ccdc_wen 0 IO ccdc_data9 1 I uart4_rx 2 I gpio_98 4 IO hw_dbg3 5 O ccdc_data0 0 I i2c3_sda 3 IO gpio_99 4 I ccdc_data1 0 I gpio_100 4 I ccdc_data2 0 I gpio_101 4 IO hw_dbg4 5 O ccdc_data3 0 I gpio_102 4 IO hw_dbg5 5 O ccdc_data4 0 I gpio_103 4 IO hw_dbg6 5 O ccdc_data5 0 I gpio_104 4 IO hw_dbg7 5 O ccdc_data6 0 I gpio_105 4 IO ccdc_data7 0 I gpio_106 4 IO rmii_mdio_da 0 ta IO ccdc_data8 1 I gpio_107 4 IO rmii_mdio_clk 0 O ccdc_data9 1 I gpio_108 4 IO rmii_rxd0 0 I ccdc_data10 1 I gpio_109 4 IO hw_dbg8 5 O rmii_rxd1 0 I ccdc_data11 1 I gpio_110 4 IO hw_dbg9 5 O rmii_crs_dv 0 I ccdc_data12 1 I gpio_111 4 IO rmii_rxer 0 I ccdc_data13 1 I gpio_167 4 IO hw_dbg10 5 O BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 15 PU/PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V 25 PU/PD LVCMOS 8 Yes 8 H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 41 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] T22 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 25 PU/PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V 25 PU/PD LVCMOS 25 PU/ PD LVCMOS R20 R19 R21 E5 D5 C5 E4 P22 N21 P21 N20 P19 P20 N22 N19 N18 P18 M21 M20 K20 42 rmii_txd0 ccdc_ data14 1 I gpio_126 4 IO hw_dbg11 5 O rmii_txd1 0 O ccdc_data15 1 I gpio_112 4 I rmii_txen 0 O gpio_113 4 I rmii_50mhz_ 0 clk I gpio_114 4 I mcbsp2_fsx 0 IO gpio_116 4 IO mcbsp2_ clkx 0 IO gpio_117 4 IO mcbsp2_dr 0 I gpio_118 4 IO mcbsp2_dx 0 IO gpio_119 4 IO mmc1_clk 0 O gpio_120 4 IO mmc1_cmd 0 IO gpio_121 4 IO mmc1_dat0 0 IO mcspi2_clk 1 IO gpio_122 4 IO mmc1_dat1 0 IO mcspi2_simo 1 IO gpio_123 4 IO mmc1_dat2 0 IO mcspi2_somi 1 IO gpio_124 4 IO mmc1_dat3 0 IO mcspi2_cs0 1 O gpio_125 4 IO mmc1_dat4 0 IO gpio_126 4 IO mmc1_dat5 0 IO gpio_127 4 IO mmc1_dat6 0 IO gpio_128 4 IO mmc1_dat7 0 IO gpio_129 4 IO mmc2_clk 0 O mcspi3_clk 1 IO uart4_cts 2 I gpio_130 4 IO mmc2_ cmd 0 IO mcspi3_ simo 1 IO uart4_rts 2 O gpio_131 4 IO mmc2_ dat0 0 IO mcspi3_ somi IO 1 NA H PU 7 VDDSHV 1.8V/3.3V L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V No 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS NA Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] L19 M18 K21 L18 L20 L21 M19 C4 B4 D4 A4 A5 B5 D6 MODE [3] TYPE [4] uart4_tx 2 O gpio_132 4 IO mmc2_ dat1 0 IO uart4_rx 2 I gpio_133 4 IO mmc2_ dat2 0 IO mcspi3_cs1 1 O gpio_134 4 IO mmc2_ dat3 0 IO mcspi3_cs0 1 IO gpio_135 4 IO mmc2_ dat4 0 IO mmc2_dir_da 1 t0 O mmc3_dat0 3 IO gpio_136 4 IO mmc2_ dat5 0 IO mmc2_dir_da 1 t1 O mmc3_dat1 3 IO gpio_137 4 IO mm_fsusb3_r 6 xdp IO mmc2_ dat6 0 IO mmc2_dir_c md 1 O mmc3_dat2 3 IO gpio_138 4 IO mmc2_ dat7 0 IO mmc2_clkin 1 I mmc3_dat3 3 IO gpio_139 4 IO mm_fsusb3_r 6 xdm IO mcbsp3_dx 0 IO uart2_cts 1 I gpio_140 4 IO mcbsp3_dr 0 I uart2_rts 1 O gpio_141 4 IO mcbsp3_ clkx 0 IO uart2_tx 1 O gpio_142 4 IO mcbsp3_fsx 0 IO uart2_rx 1 I gpio_143 4 IO uart2_cts 0 I mcbsp3_dx 1 IO gpt9_pwm_e 2 vt IO gpio_144 4 IO uart2_rts 0 O mcbsp3_dr 1 I gpt10_pwm_ 2 evt IO gpio_145 4 IO uart2_tx 0 O BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 43 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] C6 C22 C21 C19 C20 A3 B3 A2 B2 B11 D11 C10 C9 E11 C11 C8 44 MODE [3] TYPE [4] mcbsp3_clkx 1 IO gpt11_pwm _evt 2 IO gpio_146 4 IO uart2_rx 0 I mcbsp3_fsx 1 IO gpt8_pwm_e 2 vt IO gpio_147 4 IO uart1_tx 0 O gpio_148 4 IO uart1_rts 0 O gpio_149 4 IO uart1_cts 0 I gpio_150 4 IO uart1_rx 0 I mcbsp1_ clkr 2 I mcspi4_clk 3 IO gpio_151 4 IO mcbsp4_ clkx 0 IO gpio_152 4 IO mm_fsusb3_t 6 xse0 IO mcbsp4_dr 0 I gpio_153 4 IO mm_fsusb3_r 6 xrcv IO mcbsp4_dx 0 IO gpio_154 4 IO mm_fsusb3_t 6 xdat IO mcbsp4_fsx 0 IO gpio_155 4 IO mm_fsusb3_t 6 xen_n IO mcbsp1_ clkr 0 IO mcspi4_clk 1 IO gpio_156 4 IO mcbsp1_fsr 0 IO gpio_157 4 IO mcbsp1_dx 0 IO mcspi4_ simo 1 IO mcbsp3_dx 2 I gpio_158 4 IO mcbsp1_dr 0 I mcspi4_ somi 1 IO mcbsp3_dr 2 I gpio_159 4 IO mcbsp_clks 0 I gpio_160 4 IO uart1_cts 5 I mcbsp1_fsx 0 IO mcspi4_cs0 1 IO mcbsp3_fsx 2 IO gpio_161 4 IO mcbsp1_ clkx 0 IO BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] W15 W13 AA13 MODE [3] TYPE [4] mcbsp3_clkx 2 IO gpio_162 4 IO uart3_cts_rct 0 x IO gpio_163 4 IO uart3_rts_sd 0 O gpio_164 IO 4 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS uart3_rx_irrx 0 I gpio_165 4 IO uart3_tx_irtx 0 O gpio_166 4 IO A6 usb0_dp 0 IO 5.0V Yes PU/ PD LVCMOS B6 usb0_dm 0 IO 5.0V Yes PU/ PD LVCMOS C7 usb0_vbus 0 A VDDA3P3V_ 3.3V USBPHY Yes PU/ PD LVCMOS B7 usb0_id 0 A VDDA3P3V_ 3.3V USBPHY Yes PU/ PD LVCMOS A7 usb0_drvvbu 0 s O uart3_tx_irtx 2 O gpio_125 4 IO hecc1_ txd 0 O Y13 AB15 AB16 uart3_rx_irrx 2 I gpio_130 4 IO hecc1_ rxd 0 I uart3_rts_sd 2 O L PD 7 VDDSHV 1.8V/3.3V 30 H PU 7 VDDSHV 1.8V/3.3V Yes 24 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 24 PU/ PD LVCMOS gpio_131 4 IO AA17 i2c1_scl 0 IOD H PU 0 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain AB17 i2c1_ sda 0 IOD H PU 0 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain Y17 i2c2_scl 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_168 4 IO i2c2_sda 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_183 4 IO i2c3_scl 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_184 4 IO i2c3_sda 0 IOD H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD Open Drain gpio_185 4 IO hdq_sio 0 IO H PU 7 VDDSHV 1.8V/3.3V Yes 40 PU/ PD LVCMOS sys_altclk 1 I i2c2_sccbe 2 O i2c3_sccbe 3 O gpio_170 4 IO mcspi1_clk 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat4 1 IO gpio_171 4 IO mcspi1_ simo 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat5 1 IO gpio_172 4 IO mcspi1_ somi 0 IO L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat6 1 IO gpio_173 4 IO mcspi1_cs0 0 IO H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS mmc2_dat7 1 IO gpio_174 4 IO mcspi1_cs1 0 O H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Y16 W16 W17 B9 K22 K19 J18 K18 J20 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 45 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] J19 J21 J22 H20 H22 H21 H19 MODE [3] TYPE [4] mmc3_cmd 3 IO gpio_175 4 IO mcspi1_cs2 0 O mmc3_clk 3 O gpio_176 4 IO mcspi1_cs3 0 O hsusb2_ data2 3 IO gpio_177 4 IO mm_fsusb2_t 5 xdat IO mcspi2_clk 0 IO hsusb2_ data7 3 IO gpio_178 4 IO mcspi2_ simo 0 IO gpt9_pwm_e 1 vt IO hsusb2_ data4 3 IO gpio_179 4 IO mcspi2_ somi 0 IO gpt10_pwm_ 1 evt IO hsusb2_ data5 3 IO gpio_180 4 IO mcspi2_cs0 0 IO gpt11_pwm_ 1 evt IO hsusb2_ data6 3 IO gpio_181 4 IO mcspi2_cs1 0 O gpt8_pwm_e 1 vt IO hsusb2_ data3 3 IO gpio_182 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS L PD 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS 30 4 IO mm_fsusb2_t 5 xen_n IO A8 sys_32k 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes PU/ PD LVCMOS A10 sys_xtalin 0 I Z Z 0 VDDSOSC 1.8V NA PU/ PD LVCMOS A9 sys_xtalout 0 O Z Z 0 VDDSOSC 1.8V NA PU/ PD LVCMOS B8 sys_clkreq 0 IO L Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_1 4 IO sys_nirq 0 I H PU 7 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_0 4 IO AA18 sys_ nrespwron 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Y18 sys_ nreswarm 0 IO L PD 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_30 4 IO sys_boot0 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_2 4 IO sys_boot1 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_3 4 IO sys_boot2 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_4 4 IO AB18 AB19 AB20 W18 46 Open Drain Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] AA19 sys_boot3 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_5 4 IO sys_boot4 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS V18 Y19 mmc2_dir_da 1 t2 O gpio_6 4 IO sys_boot5 0 I mmc2_dir_da 1 t3 O gpio_7 4 IO sys_boot6 0 I gpio_8 4 IO AA20 sys_boot7 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/PD LVCMOS Y20 sys_boot8 0 I Z Z 0 VDDSHV 1.8V/3.3V Yes 30 PU/PD LVCMOS E9 sys_clkout1 0 O H PD 0/7 (1) VDDSHV 1.8V/3.3V Yes 30 PU/ PD LVCMOS gpio_10 4 IO sys_clkout2 0 O L PD 7 VDDSHV 1.8V/3.3V Yes 10 PU/ PD LVCMOS gpio_186 4 IO D13 jtag_ntrst 0 I L PD 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS E14 jtag_tck 0 I L PD 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS C12 jtag_rtck 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS A12 jtag_tms_tms 0 c IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS B12 jtag_tdi 0 I H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS D12 jtag_tdo 0 O L Z 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS E13 jtag_emu0 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_11 4 IO jtag_emu1 0 IO H PU 0 VDDSHV 1.8V/3.3V Yes 20 PU/ PD LVCMOS gpio_31 4 IO etk_clk H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS W19 E10 E12 G22 G21 G20 F22 (1) 0 O mcbsp5_ clkx 1 IO mmc3_clk 2 O hsusb1_stp 3 O gpio_12 4 IO etk_ctl 0 O mmc3_cmd 2 IO hsusb1_clk 3 O gpio_13 4 IO mm_fsusb1_r 5 xdp IO etk_d0 0 O mcspi3_ simo 1 IO mmc3_dat4 2 IO hsusb1_ data0 3 IO gpio_14 4 IO mm_fsusb1_r 5 xrcv IO etk_d1 0 O mcspi3_ somi 1 IO hsusb1_ data1 3 IO gpio_15 4 IO mm_fsusb1_t 5 xse0 IO Mux0 if sys_boot6 is pulled down (clock master). Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 47 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] F20 etk_d2 0 O H PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS mcspi3_cs0 1 IO hsusb1_ data2 3 IO gpio_16 L PU 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS G19 E19 F21 F19 E21 D22 D21 E22 E20 48 4 IO mm_fsusb1_t 5 xdat IO etk_d3 0 O mcspi3_clk 1 IO mmc3_dat3 2 IO hsusb1_ data7 3 IO gpio_17 4 IO etk_d4 0 O mcbsp5_dr 1 I mmc3_dat0 2 IO hsusb1_ data4 3 IO gpio_18 4 IO etk_d5 0 O mcbsp5_fsx 1 IO mmc3_dat1 2 IO hsusb1_ data5 3 IO gpio_19 4 IO etk_d6 0 O mcbsp5_dx 1 IO mmc3_dat2 2 IO hsusb1_ data6 3 IO gpio_20 4 IO etk_d7 0 O mcspi3_cs1 1 O mmc3_dat7 2 IO hsusb1_ data3 3 IO gpio_21 4 IO mm_fsusb1_t 5 xen_n IO etk_d8 0 O mmc3_dat6 2 IO hsusb1_dir 3 I gpio_22 4 IO etk_d9 0 O mmc3_dat5 2 IO hsusb1_nxt 3 I gpio_23 4 IO mm_fsusb1_r 5 xdm IO etk_d10 0 O uart1_rx 2 I hsusb2_clk 3 O gpio_24 4 IO etk_d11 0 O mcspi3_clk 1 IO hsusb2_stp 3 O gpio_25 4 IO Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] E18 D20 D19 D18 M2 MODE [3] TYPE [4] mm_fsusb2_r 5 xdp IO etk_d12 0 O hsusb2_dir 3 I gpio_26 4 IO etk_d13 0 O hsusb2_nxt 3 I gpio_27 4 IO mm_fsusb2_r 5 xdm IO etk_d14 0 O hsusb2_ data0 3 IO gpio_28 4 IO mm_fsusb2_r 5 xrcv IO etk_d15 0 O hsusb2_ data1 3 IO gpio_29 4 IO mm_fsusb2_t 5 xse0 IO ddr_padref A 0 BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS L PD 4 VDDSHV 1.8V/3.3V Yes 9, 25 PU/ PD LVCMOS VDDS 1.8V J8, J10, VDD_CORE 0 J12, J14, J16, K9, K11, K13, K15, L8, L10, L12, L14, M7, M9, M11, M13, M15, N8, N10, N12, N14, P7, P9, P11, P13, P15, R8, R10, R12, R14 PWR 1.2V L17 VDDS_SRA M_MPU 0 PWR 1.8V J6 VDDS_SRA M_CORE_B G 0 PWR 1.8V M17 CAP_VDD_S 0 RAM_MPU PWR 1.2V K6 CAP_VDD_S 0 RAM_CORE PWR 1.2V K17 VDDS_DPLL 0 _MPU_USBH OST PWR 1.8V F11 VDDS_DPLL 0 _PER_CORE PWR 1.8V F7 VDDA3P3V_ 0 USBPHY PWR 3.3V D7 VDDA1P8V_ 0 USBPHY PWR 1.8V E7 CAP_VDDA1 0 P2LDO_USB PHY PWR 1.2V Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 49 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-2. Ball Characteristics (ZER Pkg.) (continued) BALL PIN NAME LOCATION [2] [1] MODE [3] TYPE [4] A21, B1, E15, E17, F12, F14, F18, G10, G12, G13, G8, G17, H18, J17, L22, N16, P17, R16, R18, T9, T11, T13, T17, U8, U10, U12, U14, U16, U18, V7, V8, V17, AA22, AB11 0 PWR 1.8V/3.3V F5, F16, VDDS G15, H5, K7, L6, L16, N1, N5, N6, P5, R6, T5, T7, T15, U6, AA1 0 PWR 1.8V L5 VREFSSTL 0 I .5 * VDDS G9 VDDSOSC O PWR 1.8V A1, A11, VSS A22, E6, E16, F6, F13, F15, F17, G5, G7, G11, G14, G16, G18, H6, H7, H8, H9, H10, H11, H12, H13, H14, H15, H16, H17, J9, J11, J13, J15, K8, K10, K12, K14, K16, L7, L9, L11, L13, L15, M1, M6, M8, M10, M12, M14, M16, M22, N7, N9, N11, N13, N15, N17, P6, P8, P10, P12, P14, P16, R5, R7, R9, R11, R13, R15, R17, T6, T8, T10, T12, T14, T16, T18, U5, U7, U9, U11, U13, U15, U17, V6, AB1, AB12, AB22 0 GND B10 0 GND VDDSHV VSSOSC BALL RESET STATE [5] BALL RESET REL. POWER [8] RESET REL. MODE [7] STATE [6] VOLTAGE [9] HYS [10] LOAD (pF) [11] PULL U/D TYPE [12] IO CELL [13] D8, D9, NC (2) D10, E8, F8, F9, F10, J7, G6 V15 Reserved (3) V16 Reserved (3) (2) (3) 50 "NC" indicates "No Connect". For proper device operation, these pins must be left unconnected. For proper device operation, this pin must be pulled up via a 10k-Ω resistor. Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.3 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Multiplexing Characteristics Table 4-3 provides descriptions of the AM3517/05 pin multiplexing on the ZCN and ZER packages. Table 4-3. Multiplexing Characteristics ZER ZCN BALL NO BALL NO MODE 0 E3 B21 sdrc_d0 D3 A21 sdrc_d1 C3 D20 sdrc_d2 C2 C20 sdrc_d3 F3 E19 sdrc_d4 D2 D19 sdrc_d5 C1 C19 sdrc_d6 D1 B19 sdrc_d7 G2 B18 sdrc_d8 G3 D17 sdrc_d9 H3 C17 sdrc_d10 G4 D16 sdrc_d11 H4 C16 sdrc_d12 G1 B16 sdrc_d13 J3 A16 sdrc_d14 J1 A15 sdrc_d15 T3 A7 sdrc_d16 U3 B7 sdrc_d17 U4 D7 sdrc_d18 V4 E7 sdrc_d19 V1 C6 sdrc_d20 V2 D6 sdrc_d21 V5 B5 sdrc_d22 V3 C5 sdrc_d23 W3 B4 sdrc_d24 W4 A3 sdrc_d25 Y3 B3 sdrc_d26 Y4 C3 sdrc_d27 AA2 C2 sdrc_d28 AA3 D2 sdrc_d29 AA4 B1 sdrc_d30 AB2 C1 sdrc_d31 L4 A12 sdrc_ba0 K5 C13 sdrc_ba1 J5 D13 sdrc_ba2 M3 A11 sdrc_a0 M4 B11 sdrc_a1 M5 C11 sdrc_a2 N3 D11 sdrc_a3 N2 E11 sdrc_a4 N4 A10 sdrc_a5 P3 B10 sdrc_a6 P2 C10 sdrc_a7 P1 D10 sdrc_a8 P4 E10 sdrc_a9 R1 A9 sdrc_a10 R2 B9 sdrc_a11 R3 A8 sdrc_a12 R4 B8 sdrc_a13 T2 D8 sdrc_a14 J4 E13 sdrc_ncs0 MODE 1 MODE 2 MODE 3 MODE 4 MODE 5 MODE 6 MODE 7 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 51 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-3. Multiplexing Characteristics (continued) ZER ZCN MODE 0 K4 A14 sdrc_ncs1 L1 A13 sdrc_clk L2 B13 sdrc_nclk K3 D14 sdrc_cke0 K1 C14 sdrc_nras L3 E14 sdrc_ncas K2 B14 sdrc_nwe F4 C21 sdrc_dm0 J2 B15 sdrc_dm1 T4 E8 sdrc_dm2 AB3 D1 sdrc_dm3 E2 B20 sdrc_dqs0p H2 B17 sdrc_dqs1p U1 A6 sdrc_dqs2p Y1 A2 sdrc_dqs3p E1 A20 sdrc_dqs0n H1 A17 sdrc_dqs1n U2 B6 sdrc_dqs2n Y2 B2 sdrc_dqs3n T1 C8 sdrc_odt F2 A19 sdrc_strben0 F1 A18 sdrc_strben_dly0 W1 A5 sdrc_strben1 W2 A4 sdrc_strben_dly1 W5 E3 gpmc_a1 gpio_34 safe_mode Y5 E2 gpmc_a2 gpio_35 safe_mode AB4 E1 gpmc_a3 gpio_36 safe_mode AA5 F7 gpmc_a4 gpio_37 safe_mode AB5 F6 gpmc_a5 gpio_38 safe_mode AB6 F4 gpmc_a6 gpio_39 safe_mode AA6 F3 gpmc_a7 gpio_40 safe_mode W6 F2 gpmc_a8 gpio_41 safe_mode AB7 F1 gpmc_a9 sys_ndmareq2 gpio_42 safe_mode Y6 G6 gpmc_a10 sys_ndmareq3 gpio_43 safe_mode AA7 G5 gpmc_d0 Y7 G4 gpmc_d1 W7 G3 gpmc_d2 AA9 G2 gpmc_d3 Y8 G1 gpmc_d4 AA8 H2 gpmc_d5 AB8 H1 gpmc_d6 W8 J5 gpmc_d7 W10 J4 gpmc_d8 gpio_44 AB9 J3 gpmc_d9 gpio_45 AB10 J2 gpmc_d10 gpio_46 W9 J1 gpmc_d11 gpio_47 AA10 K4 gpmc_d12 gpio_48 Y9 K3 gpmc_d13 gpio_49 V10 K2 gpmc_d14 gpio_50 V9 K1 gpmc_d15 gpio_51 Y10 L2 gpmc_ncs0 Y11 L1 gpmc_ncs1 Y12 M4 gpmc_ncs2 V12 M3 gpmc_ncs3 sys_ndmareq0 AA11 M2 gpmc_ncs4 sys_ndmareq1 W12 M1 gpmc_ncs5 sys_ndmareq2 52 MODE 1 MODE 2 MODE 3 MODE 4 MODE 5 MODE 6 MODE 7 sdrc_cke0_safe gpio_52 gpt9_pwm_evt gpio_53 safe_mode gpt10_pwm_evt gpio_54 safe_mode gpt9_pwm_evt gpio_55 safe_mode gpt10_pwm_evt gpio_56 safe_mode Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-3. Multiplexing Characteristics (continued) ZER ZCN MODE 0 MODE 1 MODE 3 MODE 4 AA12 N5 gpmc_ncs6 sys_ndmareq3 MODE 2 gpt11_pwm_evt gpio_57 MODE 5 MODE 6 MODE 7 safe_mode V11 N4 gpmc_ncs7 gpmc_io_dir gpt8_pwm_evt gpio_58 safe_mode AB13 N1 gpmc_clk AA14 R1 gpmc_nadv_ale AB14 R2 gpmc_noe AA15 R3 gpmc_nwe W11 R4 gpmc_nbe0_cle gpio_60 Y15 T1 gpmc_nbe1 gpio_61 W14 T2 gpmc_nwp gpio_62 V13 T3 gpmc_wait0 AA16 T4 gpmc_wait1 uart4_tx gpio_63 safe_mode Y14 T5 gpmc_wait2 uart4_rx gpio_64 safe_mode V14 U1 gpmc_wait3 sys_ndmareq1 B22 AE23 dss_pclk gpio_66 hw_dbg12 safe_mode B21 AD22 dss_hsync gpio_67 hw_dbg13 safe_mode B20 AD23 dss_vsync gpio_68 safe_mode B19 AE24 dss_acbias gpio_69 safe_mode A20 AD24 dss_data0 uart1_cts gpio_70 safe_mode A19 AD25 dss_data1 uart1_rts gpio_71 safe_mode A18 AC23 dss_data2 gpio_72 safe_mode B18 AC24 dss_data3 gpio_73 safe_mode A17 AC25 dss_data4 uart3_rx_irrx gpio_74 safe_mode C18 AB24 dss_data5 uart3_tx_irtx gpio_75 D17 AB25 dss_data6 uart1_tx gpio_76 hw_dbg14 safe_mode B16 AA23 dss_data7 uart1_rx gpio_77 hw_dbg15 safe_mode B17 AA24 dss_data8 gpio_78 hw_dbg16 safe_mode C17 AA25 dss_data9 gpio_79 hw_dbg17 safe_mode C16 Y22 dss_data10 gpio_80 safe_mode D16 Y23 dss_data11 gpio_81 safe_mode D14 Y24 dss_data12 gpio_82 safe_mode A16 Y25 dss_data13 gpio_83 safe_mode D15 W21 dss_data14 gpio_84 safe_mode B15 W22 dss_data15 gpio_85 safe_mode A15 W23 dss_data16 gpio_86 safe_mode A14 W24 dss_data17 gpio_87 safe_mode C13 W25 dss_data18 mcspi3_clk dss_data4 gpio_88 safe_mode C15 V24 dss_data19 mcspi3_simo dss_data3 gpio_89 safe_mode A13 V25 dss_data20 mcspi3_somi dss_data2 gpio_90 safe_mode B13 U21 dss_data21 mcspi3_cs0 dss_data1 gpio_91 safe_mode C14 U22 dss_data22 mcspi3_cs1 dss_data0 gpio_92 safe_mode B14 U23 dss_data23 dss_data5 gpio_93 safe_mode NA K20 tv_vfb1 NA K21 tv_out1 NA H23 tv_vfb2 NA H24 tv_out2 NA H20 tv_vref AB21 AD2 ccdc_pclk AA21 AD1 ccdc_field Y21 AE2 ccdc_hd uart4_rts gpio_96 Y22 AD3 ccdc_vd uart4_cts gpio_97 hw_dbg2 safe_mode W21 AE3 ccdc_wen uart4_rx gpio_98 hw_dbg3 safe_mode W22 AD4 ccdc_data0 W20 AE4 ccdc_data1 gpio_100 V21 AC5 ccdc_data2 gpio_101 hw_dbg4 safe_mode V19 AD5 ccdc_data3 gpio_102 hw_dbg5 safe_mode V22 AE5 ccdc_data4 gpio_103 hw_dbg6 safe_mode gpio_59 ccdc_data8 ccdc_data9 uart3_cts_rctx uart4_tx safe_mode gpio_65 i2c3_scl i2c3_sda safe_mode safe_mode gpio_94 hw_dbg0 safe_mode gpio_95 hw_dbg1 safe_mode safe_mode gpio_99 safe_mode safe_mode Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 53 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-3. Multiplexing Characteristics (continued) ZER ZCN MODE 0 MODE 4 MODE 5 U20 Y6 ccdc_data5 MODE 1 MODE 2 gpio_104 hw_dbg7 V20 AB6 ccdc_data6 gpio_105 safe_mode U19 AC6 ccdc_data7 gpio_106 safe_mode U21 AE6 rmii_mdio_data ccdc_data8 gpio_107 safe_mode U22 AD6 rmii_mdio_clk ccdc_data9 gpio_108 T19 Y7 rmii_rxd0 ccdc_data10 gpio_109 hw_dbg8 safe_mode T20 AA7 rmii_rxd1 ccdc_data11 gpio_110 hw_dbg9 safe_mode T21 AB7 rmii_crs_dv ccdc_data12 gpio_111 R22 AC7 rmii_rxer ccdc_data13 gpio_167 hw_dbg10 safe_mode T22 AD7 rmii_txd0 ccdc_data14 gpio_126 hw_dbg11 safe_mode R20 AE7 rmii_txd1 ccdc_data15 gpio_112 safe_mode R19 AD8 rmii_txen gpio_113 safe_mode R21 AE8 rmii_50mhz_clk gpio_114 safe_mode E5 D25 mcbsp2_fsx gpio_116 safe_mode D5 C25 mcbsp2_clkx gpio_117 safe_mode C5 B25 mcbsp2_dr gpio_118 safe_mode E4 D24 mcbsp2_dx gpio_119 safe_mode P22 AA9 mmc1_clk gpio_120 safe_mode N21 AB9 mmc1_cmd gpio_121 safe_mode P21 AC9 mmc1_dat0 mcspi2_clk gpio_122 safe_mode N20 AD9 mmc1_dat1 mcspi2_simo gpio_123 safe_mode P19 AE9 mmc1_dat2 mcspi2_somi gpio_124 safe_mode P20 AA10 mmc1_dat3 mcspi2_cs0 gpio_125 safe_mode N22 AB10 mmc1_dat4 gpio_126 safe_mode N19 AC10 mmc1_dat5 gpio_127 safe_mode N18 AD10 mmc1_dat6 gpio_128 safe_mode P18 AE10 mmc1_dat7 gpio_129 safe_mode M21 AD11 mmc2_clk mcspi3_clk uart4_cts gpio_130 safe_mode M20 AE11 mmc2_cmd mcspi3_simo uart4_rts gpio_131 safe_mode K20 AB12 mmc2_dat0 mcspi3_somi uart4_tx gpio_132 safe_mode L19 AC12 mmc2_dat1 uart4_rx gpio_133 safe_mode M18 AD12 mmc2_dat2 mcspi3_cs1 gpio_134 safe_mode K21 AE12 mmc2_dat3 mcspi3_cs0 gpio_135 safe_mode L18 AB13 mmc2_dat4 mmc2_dir_dat0 mmc3_dat0 gpio_136 safe_mode L20 AC13 mmc2_dat5 mmc2_dir_dat1 mmc3_dat1 gpio_137 mm_fsusb3_rxdp safe_mode L21 AD13 mmc2_dat6 mmc2_dir_cmd mmc3_dat2 gpio_138 safe_mode M19 AE13 mmc2_dat7 mmc2_clkin mmc3_dat3 gpio_139 mm_fsusb3_rxdm safe_mode C4 B24 mcbsp3_dx uart2_cts gpio_140 safe_mode B4 C24 mcbsp3_dr uart2_rts gpio_141 safe_mode D4 A24 mcbsp3_clkx uart2_tx gpio_142 safe_mode A4 C23 mcbsp3_fsx uart2_rx gpio_143 safe_mode A5 F20 uart2_cts mcbsp3_dx gpt9_pwm_evt gpio_144 safe_mode B5 F19 uart2_rts mcbsp3_dr gpt10_pwm_evt gpio_145 safe_mode D6 E24 uart2_tx mcbsp3_clkx gpt11_pwm_evt gpio_146 safe_mode C6 E23 uart2_rx mcbsp3_fsx gpt8_pwm_evt gpio_147 safe_mode C22 AA19 uart1_tx gpio_148 safe_mode C21 Y19 uart1_rts gpio_149 safe_mode C19 Y20 uart1_cts gpio_150 safe_mode C20 W20 uart1_rx A3 B23 B3 A2 MODE 7 safe_mode safe_mode safe_mode safe_mode mcbsp4_clkx gpio_152 mm_fsusb3_txse safe_mode 0 A23 mcbsp4_dr gpio_153 mm_fsusb3_rxrcv safe_mode B22 mcbsp4_dx gpio_154 mm_fsusb3_txdat safe_mode B2 A22 mcbsp4_fsx gpio_155 mm_fsusb3_txen safe_mode _n B11 R25 mcbsp1_clkr gpio_156 safe_mode D11 P21 mcbsp1_fsr gpio_157 safe_mode mcspi4_clk mcspi4_clk MODE 6 gpio_151 54 mcbsp1_clkr MODE 3 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-3. Multiplexing Characteristics (continued) ZER ZCN MODE 0 MODE 1 MODE 2 C10 P22 mcbsp1_dx mcspi4_simo mcbsp3_dx MODE 3 MODE 4 gpio_158 C9 P23 mcbsp1_dr mcspi4_somi mcbsp3_dr gpio_159 E11 P25 mcbsp_clks C11 P24 mcbsp1_fsx C8 N24 mcbsp1_clkx W15 N2 W13 gpio_160 mcspi4_cs0 MODE 5 MODE 6 MODE 7 safe_mode safe_mode uart1_cts safe_mode mcbsp3_fsx gpio_161 safe_mode mcbsp3_clkx gpio_162 safe_mode uart3_cts_rctx gpio_163 safe_mode N3 uart3_rts_sd gpio_164 safe_mode AA13 P1 uart3_rx_irrx gpio_165 safe_mode Y13 P2 uart3_tx_irtx gpio_166 A6 F25 usb0_dp (1) uart3_tx_irtx B6 F24 usb0_dm (1) uart3_rx_irrx C7 G24 usb0_vbus B7 G25 usb0_id A7 E25 usb0_drvvbus uart3_tx_irtx gpio_125 safe_mode AB15 V2 hecc1_txd uart3_rx_irrx gpio_130 safe_mode AB16 V3 hecc1_rxd uart3_rts_sd gpio_131 safe_mode AA17 V4 i2c1_scl AB17 V5 i2c1_sda Y17 W1 i2c2_scl gpio_168 safe_mode Y16 W2 i2c2_sda gpio_183 safe_mode W16 W4 i2c3_scl gpio_184 safe_mode W17 W5 i2c3_sda gpio_185 safe_mode B9 L25 hdq_sio sys_altclk gpio_170 safe_mode K22 AE14 mcspi1_clk mmc2_dat4 gpio_171 safe_mode K19 AD15 mcspi1_simo mmc2_dat5 gpio_172 safe_mode J18 AC15 mcspi1_somi mmc2_dat6 gpio_173 safe_mode K18 AB15 mcspi1_cs0 mmc2_dat7 gpio_174 safe_mode J20 AD14 mcspi1_cs1 mmc3_cmd gpio_175 safe_mode J19 AE15 mcspi1_cs2 mmc3_clk gpio_176 J21 AE16 mcspi1_cs3 hsusb2_data2 gpio_177 J22 AD16 mcspi2_clk hsusb2_data7 gpio_178 safe_mode H20 AC16 mcspi2_simo gpt9_pwm_evt hsusb2_data4 gpio_179 safe_mode H22 AB16 mcspi2_somi gpt10_pwm_evt hsusb2_data5 gpio_180 safe_mode H21 AA16 mcspi2_cs0 gpt11_pwm_evt hsusb2_data6 gpio_181 H19 AE17 mcspi2_cs1 gpt8_pwm_evt hsusb2_data3 gpio_182 AB18 Y1 sys_nirq gpio_0 safe_mode E10 M25 sys_clkout2 gpio_186 safe_mode G22 AD17 etk_clk G21 AE18 etk_ctl G20 AD18 etk_d0 mcspi3_simo F22 AC18 etk_d1 mcspi3_somi F20 AB18 etk_d2 mcspi3_cs0 G19 AA18 etk_d3 mcspi3_clk mmc3_dat3 E19 Y18 etk_d4 mcbsp5_dr F21 AE19 etk_d5 F19 AD19 E21 i2c2_sccbe safe_mode mm_fsusb2_txdat safe_mode safe_mode mm_fsusb2_txen _n safe_mode mmc3_clk hsusb1_stp gpio_12 mmc3_cmd hsusb1_clk gpio_13 mm_fsusb1_rxdp hw_dbg1 mmc3_dat4 hsusb1_data0 gpio_14 mm_fsusb1_rxrcv hw_dbg2 hsusb1_data1 gpio_15 mm_fsusb1_txse 0 hw_dbg3 hsusb1_data2 gpio_16 mm_fsusb1_txdat hw_dbg4 hsusb1_data7 gpio_17 hw_dbg5 mmc3_dat0 hsusb1_data4 gpio_18 hw_dbg6 mcbsp5_fsx mmc3_dat1 hsusb1_data5 gpio_19 hw_dbg7 etk_d6 mcbsp5_dx mmc3_dat2 hsusb1_data6 gpio_20 AB19 etk_d7 mcspi3_cs1 mmc3_dat7 hsusb1_data3 gpio_21 D22 AE20 etk_d8 mmc3_dat6 hsusb1_dir gpio_22 D21 AD20 etk_d9 mmc3_dat5 hsusb1_nxt gpio_23 E22 AC20 etk_d10 uart1_rx hsusb2_clk gpio_24 E20 AB20 etk_d11 hsusb2_stp gpio_25 E18 AE21 etk_d12 hsusb2_dir gpio_26 D20 AD21 etk_d13 hsusb2_nxt gpio_27 (1) mcbsp5_clkx i2c3_sccbe mcspi3_clk hw_dbg0 hw_dbg8 mm_fsusb1_txen _n hw_dbg9 hw_dbg10 mm_fsusb1_rxdm hw_dbg11 hw_dbg12 mm_fsusb2_rxdp hw_dbg13 hw_dbg14 mm_fsusb2_rxdm hw_dbg15 This mux selection is controlled by CONTROL_DEVCONF2 register. Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 55 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-3. Multiplexing Characteristics (continued) ZER ZCN MODE 0 MODE 3 MODE 4 MODE 5 D19 AC21 etk_d14 hsusb2_data0 gpio_28 mm_fsusb2_rxrcv hw_dbg16 D18 AE22 etk_d15 hsusb2_data1 gpio_29 mm_fsusb2_txse 0 hw_dbg17 A8 K24 sys_32k A10 K25 sys_xtalin A9 H25 sys_xtalout B8 M24 sys_clkreq AA18 Y2 sys_nrespwron Y18 Y3 sys_nreswarm gpio_30 AB19 Y4 sys_boot0 gpio_2 AB20 AA1 sys_boot1 gpio_3 W18 AA2 sys_boot2 gpio_4 AA19 AA3 sys_boot3 V18 AB1 sys_boot4 mmc2_dir_dat2 gpio_6 Y19 AB2 sys_boot5 mmc2_dir_dat3 gpio_7 W19 AC1 sys_boot6 AA20 AC2 sys_boot7 Y20 AC3 sys_boot8 E9 N25 sys_clkout1 D13 U24 jtag_ntrst E14 U25 jtag_tck C12 T21 jtag_rtck A12 T22 jtag_tms_tmsc B12 T23 jtag_tdi D12 T24 jtag_tdo E13 T25 jtag_emu0 gpio_11 E12 R24 jtag_emu1 gpio_31 M2 B12 ddr_padref 56 MODE 1 MODE 2 MODE 6 MODE 7 gpio_1 gpio_5 gpio_8 gpio_10 Terminal Configuration and Functions safe_mode Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.4 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Signal Description Many signals are available on multiple pins according to the software configuration of the pin multiplexing options. 1. SIGNAL NAME: The signal name 2. DESCRIPTION: Description of the signal 3. TYPE: Type = Ball type for this specific function: – I = Input – O = Output – Z = High-impedance – D = Open Drain – DS = Differential – A = Analog 4. BALL: Associated ball location 5. SUBSYSTEM PIN MULTIPLEXING: Contains a list of the pin multiplexing options at the module/subsystem level. The pin function is selected at the module/system level. Note: The Subsystem Multiplexing Signals are not described in Table 4-1 and Table 4-2. 4.4.1 External Memory Interfaces Table 4-4. External Memory Interfaces - GPMC Signals Description SIGNAL NAME[1] DESCRIPTION[2] TYPE[3] ZCN BALL[4] ZER BALL[4] SUBSYSTEM PIN MULTIPLEXING [5] gpmc_a1 GPMC Address bit 1 O E3/G5 W5/AA7 gpmc_a17 gpmc_a2 GPMC Address bit 2 O E2/G4 Y5/Y7 gpmc_a18 gpmc_a3 GPMC Address bit 3 O E1/G3 AB4/W7 gpmc_a19 gpmc_a4 GPMC Address bit 4 O F7/G2 AA5/AA9 gpmc_a20 gpmc_a5 GPMC Address bit 5 O F6/G1 AB5/Y8 gpmc_a21 gpmc_a6 GPMC Address bit 6 O F4/H2 AB6/AA8 gpmc_a22 gpmc_a7 GPMC Address bit 7 O F3/H1 AA6/AB8 gpmc_a23 gpmc_a8 GPMC Address bit 8 O F2/J5 W6/W8 gpmc_a24 gpmc_a9 GPMC Address bit 9 O F1/J4 AB7/W10 gpmc_a25 gpmc_a10 GPMC Address bit 10 O G6/J3 Y6/AB9 gpmc_a26 gpmc_a11 GPMC Address bit 11 O multiplexed on gpmc_d10 J2 AB10 gpmc_a12 GPMC Address bit12 multiplexed on gpmc_d11 O J1 W9 gpmc_a13 GPMC Address bit13 multiplexed on gpmc_d12 O K4 AA10 gpmc_a14 GPMC Address bit 14multiplexed on gpmc_d13 O K3 Y9 gpmc_a15 GPMC Address bit15 multiplexed on gpmc_d14 O K2 V10 gpmc_a16 GPMC Address bit16 multiplexed on gpmc_d15 O K1 V9 gpmc_a17 GPMC Address bit17 multiplexed on gpmc_a1 O E3 W5 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 57 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-4. External Memory Interfaces - GPMC Signals Description (continued) SIGNAL NAME[1] DESCRIPTION[2] TYPE[3] ZCN BALL[4] ZER BALL[4] gpmc_a18 GPMC Address bit18 multiplexed on gpmc_a2 O E2 Y5 gpmc_a19 GPMC Address bit19 multiplexed on gpmc_a3 O E1 AB4 gpmc_a20 GPMC Address bit20 multiplexed on gpmc_a4 O F7 AA5 gpmc_a21 GPMC Address bit21 multiplexed on gpmc_a5 O F6 AB5 gpmc_a22 GPMC Address bit22 multiplexed on gpmc_a6 O F4 AB6 gpmc_a23 GPMC Address bit23 multiplexed on gpmc_a7 O F3 AA6 gpmc_a24 GPMC Address bit24 multiplexed on gpmc_a8 O F2 W6 gpmc_a25 GPMC Address bit25 multiplexed on gpmc_a9 O F1 AB7 gpmc_a26 GPMC Address bit26 multiplexed on gpmc_a10 O G6 Y6 gpmc_d0 GPMC Data bit 0 IO G5 AA7 gpmc_a1/gpmc_d0 gpmc_d1 GPMC Data bit 1 IO G4 Y7 gpmc_a2/gpmc_d1 gpmc_d2 GPMC Data bit 2 IO G3 W7 gpmc_a3/gpmc_d2 gpmc_d3 GPMC Data bit 3 IO G2 AA9 gpmc_a4/gpmc_d3 gpmc_d4 GPMC Data bit 4 IO G1 Y8 gpmc_a5/gpmc_d4 gpmc_d5 GPMC Data bit 5 IO H2 AA8 gpmc_a6/gpmc_d5 gpmc_d6 GPMC Data bit 6 IO H1 AB8 gpmc_a7/gpmc_d6 gpmc_d7 GPMC Data bit 7 IO J5 W8 gpmc_a8/gpmc_d7 gpmc_d8 GPMC Data bit 8 IO J4 W10 gpmc_a9/gpmc_d8 gpmc_d9 GPMC Data bit 9 IO J3 AB9 gpmc_a10/gpmc_d9 gpmc_d10 GPMC Data bit 10 IO J2 AB10 gpmc_a11/gpmc_d10 gpmc_d11 GPMC Data bit 11 IO J1 W9 gpmc_a12/gpmc_d11 gpmc_d12 GPMC Data bit 12 IO K4 AA10 gpmc_a13/gpmc_d12 gpmc_d13 GPMC Data bit 13 IO K3 Y9 gpmc_a14/gpmc_d13 gpmc_d14 GPMC Data bit 14 IO K2 V10 gpmc_a15/gpmc_d14 gpmc_d15 GPMC Data bit 15 IO K1 V9 gpmc_a16/gpmc_d15 gpmc_ncs0 GPMC Chip Select 0 O L2 Y10 gpmc_ncs1 GPMC Chip Select 1 O L1 Y11 gpmc_ncs2 GPMC Chip Select 2 O M4 Y12 gpmc_ncs3 GPMC Chip Select 3 O M3 V12 gpmc_ncs4 GPMC Chip Select 4 O M2 AA11 gpmc_ncs5 GPMC Chip Select 5 O M1 W12 gpmc_ncs6 GPMC Chip Select 6 O N5 AA12 gpmc_ncs7 GPMC Chip Select 7 O N4 V11 gpmc_clk GPMC clock O N1 AB13 58 Terminal Configuration and Functions SUBSYSTEM PIN MULTIPLEXING [5] Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-4. External Memory Interfaces - GPMC Signals Description (continued) SIGNAL NAME[1] DESCRIPTION[2] TYPE[3] ZCN BALL[4] ZER BALL[4] gpmc_nadv_ale Address Valid or Address Latch Enable O R1 AA14 gpmc_noe Output Enable O R2 AB14 gpmc_nwe Write Enable O R3 AA15 gpmc_nbe0_cle Lower Byte Enable. Also used for Command Latch Enable O R4 W11 gpmc_nbe1 Upper Byte Enable O T1 Y15 gpmc_nwp Flash Write Protect O T2 W14 gpmc_wait0 External indication of wait I T3 V13 gpmc_wait1 External indication of wait I T4 AA16 gpmc_wait2 External indication of wait I T5 Y14 gpmc_wait3 External indication of wait I U1 V14 SUBSYSTEM PIN MULTIPLEXING [5] Table 4-5. External Memory Interfaces - SDRC Signals Description SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] sdrc_d0 SDRAM data bit 0 IO B21 E3 sdrc_d1 SDRAM data bit 1 IO A21 D3 sdrc_d2 SDRAM data bit2 IO D20 C3 sdrc_d3 SDRAM data bit 3 IO C20 C2 sdrc_d4 SDRAM data bit 4 IO E19 F3 sdrc_d5 SDRAM data bit 5 IO D19 D2 sdrc_d6 SDRAM data bit 6 IO C19 C1 sdrc_d7 SDRAM data bit 7 IO B19 D1 sdrc_d8 SDRAM data bit 8 IO B18 G2 sdrc_d9 SDRAM data bit 9 IO D17 G3 sdrc_d10 SDRAM data bit 10 IO C17 H3 sdrc_d11 SDRAM data bit 11 IO D16 G4 sdrc_d12 SDRAM data bit 12 IO C16 H4 sdrc_d13 SDRAM data bit 13 IO B16 G1 sdrc_d14 SDRAM data bit 14 IO A16 J3 sdrc_d15 SDRAM data bit 15 IO A15 J1 sdrc_d16 SDRAM data bit 16 IO A7 T3 sdrc_d17 SDRAM data bit 17 IO B7 U3 sdrc_d18 SDRAM data bit 18 IO D7 U4 sdrc_d19 SDRAM data bit 19 IO E7 V4 sdrc_d20 SDRAM data bit 20 IO C6 V1 sdrc_d21 SDRAM data bit 21 IO D6 V2 sdrc_d22 SDRAM data bit 22 IO B5 V5 sdrc_d23 SDRAM data bit 23 IO C5 V3 sdrc_d24 SDRAM data bit 24 IO B4 W3 sdrc_d25 SDRAM data bit 25 IO A3 W4 sdrc_d26 SDRAM data bit 26 IO B3 Y3 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 59 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-5. External Memory Interfaces - SDRC Signals Description (continued) SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] sdrc_d27 SDRAM data bit 27 IO C3 Y4 sdrc_d28 SDRAM data bit 28 IO C2 AA2 sdrc_d29 SDRAM data bit 29 IO D2 AA3 sdrc_d30 SDRAM data bit 30 IO B1 AA4 sdrc_d31 SDRAM data bit 31 IO C1 AB2 sdrc_ba0 SDRAM bank select 0 O A12 L4 sdrc_ba1 SDRAM bank select 1 O C13 K5 sdrc_ba2 SDRAM bank select 2 O D13 J5 sdrc_a0 SDRAM address bit 0 O A11 M3 sdrc_a1 SDRAM address bit 1 O B11 M4 sdrc_a2 SDRAM address bit 2 O C11 M5 sdrc_a3 SDRAM address bit 3 O D11 N3 sdrc_a4 SDRAM address bit 4 O E11 N2 sdrc_a5 SDRAM address bit 5 O A10 N4 sdrc_a6 SDRAM address bit 6 O B10 P3 sdrc_a7 SDRAM address bit 7 O C10 P2 sdrc_a8 SDRAM address bit 8 O D10 P1 sdrc_a9 SDRAM address bit 9 O E10 P4 sdrc_a10 SDRAM address bit 10 O A9 R1 sdrc_a11 SDRAM address bit 11 O B9 R2 sdrc_a12 SDRAM address bit 12 O A8 R3 sdrc_a13 SDRAM address bit 13 O B8 R4 sdrc_a14 SDRAM address bit 14 O D8 T2 sdrc_ncs0 Chip select 0 O E13 J4 sdrc_ncs1 Chip select 1 O A14 K4 sdrc_clk Clock O A13 L1 sdrc_nclk Clock Invert O B13 L2 sdrc_cke0 Clock Enable 0 O D14 K3 sdrc_nras SDRAM Row Access O C14 K1 sdrc_ncas SDRAM column address strobe O E14 L3 sdrc_nwe SDRAM write enable O B14 K2 sdrc_dm0 Data Mask 0 O C21 F4 sdrc_dm1 Data Mask 1 O B15 J2 sdrc_dm2 Data Mask 2 O E8 T4 sdrc_dm3 Data Mask 3 O D1 AB3 sdrc_strben0 PCB layout trace loop 0 pin 0 A A19 F2 sdrc_strben_dly0 PCB layout trace loop 0 pin 1 A A18 F1 sdrc_strben1 PCB layout trace loop 1 pin 0 A A5 W1 sdrc_strben_dly1 PCB layout trace loop 1 pin 1 A A4 W2 sdrc_odt On-die termination output for sdrc_ncs0 only O C8 T1 sdrc_dqs0p Data Strobe 0 IO B20 E2 sdrc_dqs0n Data Strobe 0 IO A20 E1 sdrc_dqs1p Data Strobe 1 IO B17 H2 60 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-5. External Memory Interfaces - SDRC Signals Description (continued) SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] sdrc_dqs1n Data Strobe 1 IO A17 H1 sdrc_dqs2p Data Strobe 2 IO A6 U1 sdrc_dqs2n Data Strobe 2 IO B6 U2 sdrc_dqs3p Data Strobe 3 IO A2 Y1 sdrc_dqs3n Data Strobe 3 IO B2 Y2 ddr_padref Impedance control for DDR2 output. This pin must be connected to ground via a 50-ohm (± 2%) resistor. A B12 M2 VREFSSTL VREFSSTL is .5 * VDDS = 0.9V for DDR data PHY0 reference voltage input IO F14 L5 4.4.2 Video Interfaces Table 4-6. Video Interfaces - CCDC Signals Description SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] SYSTEM MUX MODE (1) ccdc_pclk CCDC pixel clock IO AD2 AB21 mode0 ccdc_field CCDC field ID signal IO AD1 AA21 mode0 ccdc_hd CCDC horizontal sync IO AE2 Y21 mode0 ccdc_vd CCDC vertical sync IO AD3 Y22 mode0 ccdc_wen CCDC write enable I AE3 W21 mode0 ccdc_data0 CCDC data bit 0 I AD4 W22 mode0 ccdc_data1 CCDC data bit 1 I AE4 W20 mode0 ccdc_data2 CCDC data bit 2 I AC5 V21 mode0 ccdc_data3 CCDC data bit 3 I AD5 V19 mode0 ccdc_data4 CCDC data bit 4 I AE5 V22 mode0 ccdc_data5 CCDC data bit 5 I Y6 U20 mode0 ccdc_data6 CCDC data bit 6 I AB6 V20 mode0 ccdc_data7 CCDC data bit 7 I AC6 U19 mode0 ccdc_data8 CCDC data bit 8 I AE6 U21 mode1 ccdc_data9 CCDC data bit 9 I AD6 U22 mode1 ccdc_data10 CCDC data bit 10 I Y7 T19 mode1 ccdc_data11 CCDC data bit 11 I AA7 T20 mode1 ccdc_data12 CCDC data bit 12 I AB7 T21 mode1 ccdc_data13 CCDC data bit 13 I AC7 R22 mode1 ccdc_data14 CCDC data bit 14 I AD7 T22 mode1 ccdc_data15 CCDC data bit 15 I AE7 R20 mode1 (1) See Multiplexing Characteristics table for more information. Table 4-7. Video Interfaces - DSS Signals Description SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] dss_pclk LCD Pixel Clock O AE23 B22 dss_hsync LCD Horizontal Synchronization O AD22 B21 dss_vsync LCD Vertical Synchronization O AD23 B20 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 61 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-7. Video Interfaces - DSS Signals Description (continued) SIGNAL NAME[1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] dss_acbias AC bias control (STN) or pixel data enable (TFT) output O AE24 B19 dss_data0 LCD Pixel Data bit 0 IO AD24 A20 dss_data1 LCD Pixel Data bit 1 IO AD25 A19 dss_data2 LCD Pixel Data bit 2 IO AC23 A18 dss_data3 LCD Pixel Data bit 3 IO AC24 B18 dss_data4 LCD Pixel Data bit 4 IO AC25 A17 dss_data5 LCD Pixel Data bit 5 IO AB24 C18 dss_data6 LCD Pixel Data bit 6 IO AB25 D17 dss_data7 LCD Pixel Data bit 7 IO AA23 B16 dss_data8 LCD Pixel Data bit 8 IO AA24 B17 dss_data9 LCD Pixel Data bit 9 IO AA25 C17 dss_data10 LCD Pixel Data bit 10 IO Y22 C16 dss_data11 LCD Pixel Data bit 11 IO Y23 D16 dss_data12 LCD Pixel Data bit 12 IO Y24 D14 dss_data13 LCD Pixel Data bit 13 IO Y25 A16 dss_data14 LCD Pixel Data bit 14 IO W21 D15 dss_data15 LCD Pixel Data bit 15 IO W22 B15 dss_data16 LCD Pixel Data bit 16 IO W23 A15 dss_data17 LCD Pixel Data bit 17 IO W24 A14 dss_data18 LCD Pixel Data bit 18 IO W25 C13 dss_data19 LCD Pixel Data bit 19 IO V24 C15 dss_data20 LCD Pixel Data bit 20 O V25 A13 dss_data21 LCD Pixel Data bit 21 O U21 B13 dss_data22 LCD Pixel Data bit 22 O U22 C14 dss_data23 LCD Pixel Data bit 23 O U23 B14 Table 4-8. Video Interfaces – RFBI Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] SUBSYSTEM PIN MULTIPLEXING [5] rfbi_a0 RFBI command/data control O AE24 B19 dss_acbias rfbi_cs0 1st LCD chip select O AD22 B21 dss_hsync rfbi_da0 RFBI data bus 0 IO AD24 A20 dss_data0 rfbi_da1 RFBI data bus 1 IO AD25 A19 dss_data1 rfbi_da2 RFBI data bus 2 IO AC23 A18 dss_data2 rfbi_da3 RFBI data bus 3 IO AC24 B18 dss_data3 rfbi_da4 RFBI data bus 4 IO AC25 A17 dss_data4 rfbi_da5 RFBI data bus 5 IO AB24 C18 dss_data5 rfbi_da6 RFBI data bus 6 IO AB25 D17 dss_data6 rfbi_da7 RFBI data bus 7 IO AA23 B16 dss_data7 rfbi_da8 RFBI data bus 8 IO AA24 B17 dss_data8 rfbi_da9 RFBI data bus 9 IO AA25 C17 dss_data9 rfbi_da10 RFBI data bus 10 IO Y22 C16 dss_data10 rfbi_da11 RFBI data bus 11 IO Y23 D16 dss_data11 rfbi_da12 RFBI data bus 12 IO Y24 D14 dss_data12 rfbi_da13 RFBI data bus 13 IO Y25 A16 dss_data13 62 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-8. Video Interfaces – RFBI Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] SUBSYSTEM PIN MULTIPLEXING [5] rfbi_da14 RFBI data bus 14 IO W21 D15 dss_data14 rfbi_da15 RFBI data bus 15 IO W22 B15 dss_data15 rfbi_rd Read enable for RFBI O AE23 B22 dss_pclk rfbi_wr Write Enable for RFBI AD23 B20 dss_vsync rfbi_te_vsync0 tearing effect removal I and Vsync input from 1st LCD W23 A15 dss_data16 rfbi_hsync0 Hsync for 1st LCD I W24 A14 dss_data17 rfbi_te_vsync1 tearing effect removal I and Vsync input from 2nd LCD W25 C13 dss_data18 rfbi_hsync1 Hsync for 2nd LCD I V24 C15 dss_data19 rfbi_cs1 2nd LCD chip select O V25 A13 dss_data20 O Table 4-9. Video Interfaces – TV Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] tv_out1 TV analog output Composite: tv_out1 O K21 NA tv_out2 TV analog output SVIDEO: tv_out2 O H24 NA tv_vfb1 tv_vfb1: Feedback through external resistor to composite O K20 NA tv_vfb2 tv_vfb2: Feedback through external resistor to S-VIDEO O H23 NA tv_vref External capacitor I H20 NA 4.4.3 Serial Communication Interfaces Table 4-10. HDQ Signals Description SIGNAL NAME [1] DESCRIPTION [2] hdq_sio Bidirectional HDQ 1-Wire IO control and data Interface. Output is open drain. TYPE [3] ZCN BALL [4] ZER BALL [4] L25 B9 Table 4-11. Serial Communication Interfaces – I2C Signals Description (I2C1) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] i2c1_scl I2C Master Serial clock. Output is open drain. IOD V4 AA17 i2c1_sda I2C Serial Bidirectional Data. Output is open drain. IOD V5 AB17 Table 4-12. Serial Communication Interfaces - I2C Signals Description (I2C2) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] i2c2_scl I2C Master Serial clock. Output is open drain. IOD W1 Y17 i2c2_sda I2C Serial Bidirectional Data. Output is open drain. IOD W2 Y16 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 63 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-13. Serial Communication Interfaces - I2C Signals Description (I2C3) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] i2c3_scl I2C Master Serial clock. Output is open drain. IOD W4 W16 i2c3_sda I2C Serial Bidirectional Data. Output is open drain. IOD W5 W17 Table 4-14. Serial Communication Interfaces – McBSP LP Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] MULTICHANNEL BUFFERED SERIAL PORT (McBSP LP 1) mcbsp1_dr Received serial data I P23 C9 mcbsp1_clkr Receive Clock IO R25 B11 mcbsp1_fsr Receive frame synchronization IO P21 D11 mcbsp1_dx Transmitted serial data IO P22 C10 mcbsp1_clkx Transmit clock IO N24 C8 mcbsp1_fsx Transmit frame synchronization IO P24 C11 mcbsp_clks External clock input (shared by McBSP1, 2, 3, 4, and 5) I P25 E11 MULTICHANNEL BUFFERED SERIAL PORT (McBSP LP 2) mcbsp2_dr Received serial data I B25 C5 mcbsp2_dx Transmitted serial data IO D24 E4 mcbsp2_clkx Combined serial clock IO C25 D5 mcbsp2_fsx Combined frame synchronization IO D25 E5 MULTICHANNEL BUFFERED SERIAL PORT (McBSP LP 3) mcbsp3_dr Received serial data I C24 B4 mcbsp3_dx Transmitted serial data IO B24 C4 mcbsp3_clkx Combined serial clock IO A24 D4 mcbsp3_fsx Combined frame synchronization IO C23 A4 MULTICHANNEL BUFFERED SERIAL PORT (McBSP LP 4) mcbsp4_dr Received serial data I A23 B3 mcbsp4_dx Transmitted serial data IO B22 A2 mcbsp4_clkx Combined serial clock IO B23 A3 mcbsp4_fsx Combined frame synchronization IO A22 B2 MULTICHANNEL BUFFERED SERIAL PORT (McBSP LP 5) mcbsp5_dr Received serial data I Y18 E19 mcbsp5_dx Transmitted serial data IO AD19 F19 mcbsp5_clkx Combined serial clock IO AD17 G22 mcbsp5_fsx Combined frame synchronization IO AE19 F21 Table 4-15. Serial Communication Interfaces – McSPI Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] AE14 K22 MULTICHANNEL SERIAL PORT INTERFACE (McSPI1) mcspi1_clk 64 SPI Clock IO Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-15. Serial Communication Interfaces – McSPI Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] ZCN BALL [4] ZER BALL [4] mcspi1_simo Slave data in, master data IO out TYPE [3] AD15 K19 mcspi1_somi Slave data out, master data in IO AC15 J18 mcspi1_cs0 SPI Enable 0, polarity configured by software IO AB15 K18 mcspi1_cs1 SPI Enable 1, polarity configured by software O AD14 J20 mcspi1_cs2 SPI Enable 2, polarity configured by software O AE15 J19 mcspi1_cs3 SPI Enable 3, polarity configured by software O AE16 J21 MULTICHANNEL SERIAL PORT INTERFACE (McSPI2) mcspi2_clk SPI Clock IO AD16,AC9 J22 mcspi2_simo Slave data in, master data IO out AC16,AD9 H20 mcspi2_somi Slave data out, master data in IO AB16,AE9 H22 mcspi2_cs0 SPI Enable 0, polarity configured by software IO AA16,AA10 H21 mcspi2_cs1 SPI Enable 1, polarity configured by software O AE17 H19 MULTICHANNEL SERIAL PORT INTERFACE (McSPI3) mcspi3_clk SPI Clock IO W25,AD11,AA18 C13, M21, G19, E20 mcspi3_simo Slave data in, master data IO out V24,AE11,AD18 C15, M20, G20 mcspi3_somi Slave data out, master data in IO V25, AB12, AC18 A13, K20, F22 mcspi3_cs0 SPI Enable 0, polarity configured by software IO U21,AE12,AB18 B13, K21, F20 mcspi3_cs1 SPI Enable 1, polarity configured by software O U22, AD12, AB19 C14, M18, E21 MULTICHANNEL SERIAL PORT INTERFACE (McSPI4) mcspi4_clk SPI Clock W20, R25 C20, B11 mcspi4_simo Slave data in, master data IO out IO P22 C10 mcspi4_somi Slave data out, master data in IO P23 C9 mcspi4_cs0 SPI Enable 0, polarity configured by software IO P24 C11 Table 4-16. Serial Communication Interfaces – HECC Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] hecc1_txd Transmit serial data pin O V2 AB15 hecc1_rxd Receive serial data pin I V3 AB16 Table 4-17. Serial Communication Interfaces – EMAC (RMII) Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] rmii_mdio_data Management data I/O IO AE6 U21 rmii_mdio_clk Management data clock O AD6 U22 rmii_rxd0 EMAC receive data pin 0 I Y7 T19 rmii_rxd1 EMAC receive data pin 1 I AA7 T20 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 65 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-17. Serial Communication Interfaces – EMAC (RMII) Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] rmii_crs_dv EMAC carrier sense/receive data valid I AB7 T21 rmii_rxer EMAC receive error I AC7 R22 rmii_txd0 EMAC transmit data pin 0 O AD7 T22 rmii_txd1 EMAC transmit data pin 1 O AE7 R20 rmii_txen EMAC transmit enable O AD8 R19 rmii_50mhz_clk EMAC RMII 50 MHz clock I AE8 R21 Table 4-18. Serial Communication Interfaces – UARTs Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART1) uart1_cts UART1 Clear To Send I AD24,Y20,P25 C19,A20,E11 uart1_rts UART1 Request To Send O AD25,Y19 C21,A19 uart1_rx UART1 Receive data I AA23,W20,AC20 C20,B16,E22 uart1_tx UART1 Transmit data O AB25,AA19 C22,D17 UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART2) uart2_cts UART2 Clear To Send I B24,F20 A5,C4 uart2_rts UART2 Request To Send O C24,F19 B5,B4 uart2_rx UART2 Receive data I C23,E23 C6,A4 uart2_tx UART2 Transmit data O A24,E24 D6,D4 UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART3) / IrDA uart3_cts_rctx UART3 Clear To Send (input), Remote TX (output) IO U1,N2 W15,V14 uart3_rts_sd UART3 Request To Send , IR enable O N3,V3 W13AB16 uart3_rx_irrx UART3 Receive data , IR and Remote RX I AC25,P1,F25,V2 AA13,A17,A6,AB15 uart3_tx_irtx UART3 Transmit data , IR TX O AB24,P2,F24,E25 Y13,C18,B6,A7 UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART4) uart4_cts UART4 Clear To Send I AD3,AD11 Y22,M21 uart4_rts UART4 Request To Send O AE2,AE11 Y21,M20 uart4_rx UART4 Receive data I T5,AE3,AC12 Y14,W21,L19 uart4_tx UART4 Transmit data O T4,AD1,AB12 AA16,AA21,K20 Table 4-19. Serial Communication Interfaces – USB Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] UNIVERSAL SERIAL BUS INTERFACE (USB0) usb0_dp USB D+ (differential signal A pair) F25 A6 usb0_dm USB D- (differential signal pair) A F24 B6 usb0_drvvbus Digital output to control external supply O E25 A7 usb0_id USB operating mode identification pin A G25 B7 66 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-19. Serial Communication Interfaces – USB Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] ZCN BALL [4] ZER BALL [4] usb0_vbus For host or device mode A operation, tie the VBUS/USB power signal to the USB connector. When used in OTG mode operation, tie VBUS to the external charge pump and to the VBUS signal on the USB connector. TYPE [3] G24 C7 mm_fsusb3_rxdm Vminus receive data (not used in 3- or 4-pin configurations) IO AE13 M19 mm_fsusb3_rxdp Vplus receive data (not used in 3- or 4-pin configurations) IO AC13 L20 mm_fsusb3_rxrcv Differential receiver signal input (not used in 3-pin mode) IO A23 B3 mm_fsusb3_txse0 Single-ended zero. Used as VM in 4-pin VP_VM mode. IO B23 A3 mm_fsusb3_txdat USB data. Used as VP in 4-pin VP_VM mode. IO B22 A2 mm_fsusb3_txen_n Transmit enable IO A22 B2 mm_fsusb2_rxdm Vminus receive data (not used in 3- or 4-pin configurations) IO AD21 D20 mm_fsusb2_rxdp Vplus receive data (not used in 3- or 4-pin configurations) IO AB20 E20 mm_fsusb2_rxrcv Differential receiver signal input (not used in 3-pin mode) IO AC21 D19 mm_fsusb2_txse0 Single-ended zero. Used as VM in 4-pin VP_VM mode. IO AE22 D18 mm_fsusb2_txdat USB data. Used as VP in 4-pin VP_VM mode. IO AE16 J21 mm_fsusb2_txen_n Transmit enable IO AE17 H19 mm_fsusb1_rxdm Vminus receive data (not used in 3- or 4-pin configurations) IO AD20 D21 mm_fsusb1_rxdp Vplus receive data (not used in 3- or 4-pin configurations) IO AE18 G21 mm_fsusb1_rxrcv Differential receiver signal input (not used in 3-pin mode) IO AD18 G20 mm_fsusb1_txse0 Single-ended zero. Used as VM in 4-pin VP_VM mode. IO AC18 F22 mm_fsusb1_txdat USB data. Used as VP in 4-pin VP_VM mode. IO AB18 F20 mm_fsusb1_txen_n Transmit enable IO AB19 E21 MM_FSUSB3 MM_FSUSB2 MM_FSUSB1 HSUSB2 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 67 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-19. Serial Communication Interfaces – USB Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] hsusb2_clk Dedicated for external transceiver 60-MHz clock input from PHY O AC20 E22 hsusb2_stp Dedicated for external transceiver Stop signal O AB20 E20 hsusb2_dir Dedicated for external transceiver Data direction control from PHY I AE21 E18 hsusb2_nxt Dedicated for external transceiver Next signal from PHY I AD21 D20 hsusb2_data0 Dedicated for external transceiver Bidirectional data bus IO AC21 D19 hsusb2_data1 Dedicated for external transceiver Bidirectional data bus IO AE22 D18 hsusb2_data2 Dedicated for external transceiver Bidirectional data bus IO AE16 J21 hsusb2_data3 Dedicated for external transceiver Bidirectional data bus IO AE17 H19 hsusb2_data4 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation. AC16 H20 hsusb2_data5 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation. AB16 H22 hsusb2_data6 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation. AA16 H21 hsusb2_data7 Dedicated for external transceiver Bidirectional data bus IO AD16 J22 hsusb1_clk Dedicated for external transceiver 60-MHz clock input from PHY O AE18 G21 hsusb1_stp Dedicated for external transceiver Stop signal O AD17 G22 hsusb1_dir Dedicated for external transceiver Data direction control from PHY I AE20 D22 hsusb1_nxt Dedicated for external transceiver Next signal from PHY I AD20 D21 hsusb1_data0 Dedicated for external transceiver Bidirectional data bus IO AD18 G20 hsusb1_data1 Dedicated for external transceiver Bidirectional data bus IO AC18 F22 hsusb1_data2 Dedicated for external transceiver Bidirectional data bus IO AB18 F20 HSUSB1 68 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-19. Serial Communication Interfaces – USB Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] hsusb1_data3 Dedicated for external transceiver Bidirectional data bus IO AB19 E21 hsusb1_data4 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation Y18 E19 hsusb1_data5 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation AE19 F21 hsusb1_data6 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation AD19 F19 hsusb1_data7 Dedicated for external IO transceiver Bidirectional data bus additional signals for 12-pin ULPI operation AA18 G19 4.4.4 Removable Media Interfaces Table 4-20. Removable Media Interfaces – MMC/SDIO Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] MULTIMEDIA MEMORY CARD (MMC1) / SECURE DIGITAL IO (SDIO1) mmc1_clk MMC/SD Output Clock O AA9 P22 mmc1_cmd MMC/SD command signal IO AB9 N21 mmc1_dat0 MMC/SD Card Data bit 0 / IO SPI Serial Input AC9 P21 mmc1_dat1 MMC/SD Card Data bit 1 IO AD9 N20 mmc1_dat2 MMC/SD Card Data bit 2 IO AE9 P19 mmc1_dat3 MMC/SD Card Data bit 3 IO AA10 P20 mmc1_dat4 MMC/SD Card Data bit 4 IO AB10 N22 mmc1_dat5 MMC/SD Card Data bit 5 IO AC10 N19 mmc1_dat6 MMC/SD Card Data bit 6 IO AD10 N18 mmc1_dat7 MMC/SD Card Data bit 7 IO AE10 P18 MULTIMEDIA MEMORY CARD (MMC2) / SECURE DIGITAL IO (SDIO2) mmc2_clk MMC/SD Output Clock O AD11 M21 mmc2_dir_dat0 Direction control for DAT0 signal case an external transceiver used O AB13 L18 mmc2_dir_dat1 Direction control for DAT1 O and DAT3 signals case an external transceiver used AC13 L20 mmc2_dir_dat2 Direction control for DAT2 signal case an external transceiver used O AB1 V18 mmc2_dir_dat3 Direction control for DAT4, O DAT5, DAT6, and DAT7 signals case an external transceiver used AB2 Y19 mmc2_clkin MMC/SD input clock I AE13 NA mmc2_dat0 MMC/SD Card Data bit 0 IO AB12 K20 mmc2_dat1 MMC/SD Card Data bit 1 IO AC12 L19 mmc2_dat2 MMC/SD Card Data bit 2 IO AD12 M18 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 69 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-20. Removable Media Interfaces – MMC/SDIO Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] mmc2_dat3 MMC/SD Card Data bit 3 IO AE12 K21 mmc2_dat4 MMC/SD Card Data bit 4 IO AB13 L18 mmc2_dat5 MMC/SD Card Data bit 5 IO AC13 L20 mmc2_dat6 MMC/SD Card Data bit 6 IO AD13 L21 mmc2_dat7 MMC/SD Card Data bit 7 IO AE13 M19 mmc2_dir_cmd Direction control for CMD signal case an external transceiver is used O AD13 NA mmc2_cmd MMC/SD command signal IO AE11 M20 MULTIMEDIA MEMORY CARD (MMC3) / SECURE DIGITAL IO (SDIO3) mmc3_clk MMC/SD Output Clock O AE15,AD17 J19,G22 mmc3_cmd MMC/SD command signal IO AD14,AE18 J20,G21 mmc3_dat0 MMC/SD Card Data bit 0 / IO SPI Serial Input AB13,Y18 E19,L18 mmc3_dat1 MMC/SD Card Data bit 1 IO AC13,AE19 L20,F21 mmc3_dat2 MMC/SD Card Data bit 2 IO AD13,AD19 L21,F19 mmc3_dat3 MMC/SD Card Data bit 3 IO AE13,AA18 M19,G19 mmc3_dat4 MMC/SD Card Data bit 4 IO AD18 G20 mmc3_dat5 MMC/SD Card Data bit 5 IO AD20 D21 mmc3_dat6 MMC/SD Card Data bit 6 IO AE20 D22 mmc3_dat7 MMC/SD Card Data bit 7 IO AB19 E21 70 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.4.5 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Test Interfaces Table 4-21. Test Interfaces – ETK Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] etk_ctl ETK trace ctl O AE18 G21 etk_clk ETK trace clock O AD17 G22 etk_d0 ETK data 0 O AD18 G20 etk_d1 ETK data 1 O AC18 F22 etk_d2 ETK data 2 O AB18 F20 etk_d3 ETK data 3 O AA18 G19 etk_d4 ETK data 4 O Y18 E19 etk_d5 ETK data 5 O AE19 F21 etk_d6 ETK data 6 O AD19 F19 etk_d7 ETK data 7 O AB19 E21 etk_d8 ETK data 8 O AE20 D22 etk_d9 ETK data 9 O AD20 D21 etk_d10 ETK data 10 O AC20 E22 etk_d11 ETK data 11 O AB20 E20 etk_d12 ETK data 12 O AE21 E18 etk_d13 ETK data 13 O AD21 D20 etk_d14 ETK data 14 O AC21 D19 etk_d15 ETK data 15 O AE22 D18 Table 4-22. Test Interfaces – JTAG Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] jtag_ntrst Test Reset I U24 D13 jtag_tck Test Clock I U25 E14 jtag_rtck ARM Clock Emulation O T21 C12 jtag_tms_tmsc Test Mode Select IO T22 A12 jtag_tdi Test Data Input I T23 B12 jtag_tdo Test Data Output O T24 D12 jtag_emu0 Test emulation 0 IO T25 E13 jtag_emu1 Test emulation 1 IO R24 E12 Table 4-23. Test Interfaces – HWDBG Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] hw_dbg0 Debug signal 0 O AD2,AD17 G22 hw_dbg1 Debug signal 1 O AD1,AE18 G21 hw_dbg2 Debug signal 2 O AD3,AD18 G20 hw_dbg3 Debug signal 3 O AE3,AC18 F22 hw_dbg4 Debug signal 4 O AC5,AB18 F20 hw_dbg5 Debug signal 5 O AD5,AA18 G19 hw_dbg6 Debug signal 6 O Y18,AE5 E19 hw_dbg7 Debug signal 7 O Y6,AE19 F21 hw_dbg8 Debug signal 8 O Y7,AD19 F19 hw_dbg9 Debug signal 9 O AA7,AB19 E21 hw_dbg10 Debug signal 10 O AC7,AE20 D22 hw_dbg11 Debug signal 11 O AD7,AD20 D21 hw_dbg12 Debug signal 12 O AE23,AC20 E22 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 71 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-23. Test Interfaces – HWDBG Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] hw_dbg13 Debug signal 13 O AD22,AB20 E20 hw_dbg14 Debug signal 14 O AB25,AE21 E18 hw_dbg15 Debug signal 15 O AA23,AD21 D20 hw_dbg16 Debug signal 16 O AA24,AC21 D19 hw_dbg17 Debug signal 17 O AA25,AE22 D18 4.4.6 Miscellaneous Table 4-24. Miscellaneous – GP Timer Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] gpt8_pwm_evt PWM or event for GP timer 8 IO N4,E23,AE17 V11,C6,H19 gpt9_pwm_evt PWM or event for GP timer 9 IO M4,M2,F20,AC16 Y12,AA11,A5,H20 gpt10_pwm_evt PWM or event for GP timer 10 IO M3,M1,F19,AB16 V12,W12,B5,H22 gpt11_pwm_evt PWM or event for GP timer 11 IO N5,E24,AA16 AA12,D6,H21 72 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.4.7 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 General-Purpose IOs Table 4-25. General-Purpose IOs Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] gpio_0 General-purpose IO 0 IO Y1 AB18 gpio_1 General-purpose IO 1 IO M24 B8 gpio_2 General-purpose IO 2 IO Y4 AB19 gpio_3 General-purpose IO 3 IO AA1 AB20 gpio_4 General-purpose IO 4 IO AA2 W18 gpio_5 General-purpose IO 5 IO AA3 AA19 gpio_6 General-purpose IO 6 IO AB1 V18 gpio_7 General-purpose IO 7 IO AB2 Y19 gpio_8 General-purpose IO 8 IO AC1 W19 gpio_10 General-purpose IO 10 IO N25 E9 gpio_11 General-purpose IO 11 IO T25 E13 gpio_12 General-purpose IO 12 IO AD17 G22 gpio_13 General-purpose IO 13 IO AE18 G21 gpio_14 General-purpose IO 14 IO AD18 G20 gpio_15 General-purpose IO 15 IO AC18 F22 gpio_16 General-purpose IO 16 IO AB18 F20 gpio_17 General-purpose IO 17 IO AA18 G19 gpio_18 General-purpose IO 18 IO Y18 E19 gpio_19 General-purpose IO 19 IO AE19 F21 gpio_20 General-purpose IO 20 IO AD19 F19 gpio_21 General-purpose IO 21 IO AB19 E21 gpio_22 General-purpose IO 22 IO AE20 D22 gpio_23 General-purpose IO 23 IO AD20 D21 gpio_24 General-purpose IO 24 IO AC20 E22 gpio_25 General-purpose IO 25 IO AB20 E20 gpio_26 General-purpose IO 26 IO AE21 E18 gpio_27 General-purpose IO 27 IO AD21 D20 gpio_28 General-purpose IO 28 IO AC21 D19 gpio_29 General-purpose IO 29 IO AE22 D18 gpio_30 General-purpose IO 30 IO Y3 Y18 gpio_31 General-purpose IO 31 IO R24 E12 gpio_34 General-purpose IO 34 IO E3 W5 gpio_35 General-purpose IO 35 IO E2 Y5 gpio_36 General-purpose IO 36 IO E1 AB4 gpio_37 General-purpose IO 37 IO F7 AA5 gpio_38 General-purpose IO 38 IO F6 AB5 gpio_39 General-purpose IO 39 IO F4 AB6 gpio_40 General-purpose IO 40 IO F3 AA6 gpio_41 General-purpose IO 41 IO F2 W6 gpio_42 General-purpose IO 42 IO F1 AB7 gpio_43 General-purpose IO 43 IO G6 Y6 gpio_44 General-purpose IO 44 IO J4 W10 gpio_45 General-purpose IO 45 IO J3 AB9 gpio_46 General-purpose IO 46 IO J2 AB10 gpio_47 General-purpose IO 47 IO J1 W9 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 73 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-25. General-Purpose IOs Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] gpio_48 General-purpose IO 48 IO K4 AA10 gpio_49 General-purpose IO 49 IO K3 Y9 gpio_50 General-purpose IO 50 IO K2 V10 gpio_51 General-purpose IO 51 IO K1 V9 gpio_52 General-purpose IO 52 IO L1 Y11 gpio_53 General-purpose IO 53 IO M4 Y12 gpio_54 General-purpose IO 54 IO M3 V12 gpio_55 General-purpose IO 55 IO M2 AA11 gpio_56 General-purpose IO 56 IO M1 W12 gpio_57 General-purpose IO 57 IO N5 AA12 gpio_58 General-purpose IO 58 IO N4 V11 gpio_59 General-purpose IO 59 IO N1 AB13 gpio_60 General-purpose IO 60 IO R4 W11 gpio_61 General-purpose IO 61 IO T1 Y15 gpio_62 General-purpose IO 62 IO T2 W14 gpio_63 General-purpose IO 63 IO T4 AA16 gpio_64 General-purpose IO 64 IO T5 Y14 gpio_65 General-purpose IO 65 IO U1 V14 gpio_66 General-purpose IO 66 IO AE23 B22 gpio_67 General-purpose IO 67 IO AD22 B21 gpio_68 General-purpose IO 68 IO AD23 B20 gpio_69 General-purpose IO 69 IO AE24 B19 gpio_70 General-purpose IO 70 IO AD24 A20 gpio_71 General-purpose IO 71 IO AD25 A19 gpio_72 General-purpose IO 72 IO AC23 A18 gpio_73 General-purpose IO 73 IO AC24 B18 gpio_74 General-purpose IO 74 IO AC25 A17 gpio_75 General-purpose IO 75 IO AB24 C18 gpio_76 General-purpose IO 76 IO AB25 D17 gpio_77 General-purpose IO 77 IO AA23 B16 gpio_78 General-purpose IO 78 IO AA24 B17 gpio_79 General-purpose IO 79 IO AA25 C17 gpio_80 General-purpose IO 80 IO Y22 C16 gpio_81 General-purpose IO 81 IO Y23 D16 gpio_82 General-purpose IO 82 IO Y24 D14 gpio_83 General-purpose IO 83 IO Y25 A16 gpio_84 General-purpose IO 84 IO W21 D15 gpio_85 General-purpose IO 85 IO W22 B15 gpio_86 General-purpose IO 86 IO W23 A15 gpio_87 General-purpose IO 87 IO W24 A14 gpio_88 General-purpose IO 88 IO W25 C13 gpio_89 General-purpose IO 89 IO V24 C15 gpio_90 General-purpose IO 90 IO V25 A13 gpio_91 General-purpose IO 91 IO U21 B13 gpio_92 General-purpose IO 92 IO U22 C14 gpio_93 General-purpose IO 93 IO U23 B14 gpio_94 General-purpose IO 94 IO AD2 AB21 74 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-25. General-Purpose IOs Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] gpio_95 General-purpose IO 95 IO AD1 AA21 gpio_96 General-purpose IO 96 IO AE2 Y21 gpio_97 General-purpose IO 97 IO AD3 Y22 gpio_98 General-purpose IO 98 IO AE3 W21 gpio_99 General-purpose IO 99 I AD4 W22 gpio_100 General-purpose IO 100 I AE4 W20 gpio_101 General-purpose IO 101 IO AC5 V21 gpio_102 General-purpose IO 102 IO AD5 V19 gpio_103 General-purpose IO 103 IO AE5 V22 gpio_104 General-purpose IO 104 IO Y6 U20 gpio_105 General-purpose IO 105 IO AB6 V20 gpio_106 General-purpose IO 106 IO AC6 U19 gpio_107 General-purpose IO 107 IO AE6 U21 gpio_108 General-purpose IO 108 IO AD6 U22 gpio_109 General-purpose IO 109 IO Y7 T19 gpio_110 General-purpose IO 110 IO AA7 T20 gpio_111 General-purpose IO 111 IO AB7 T21 gpio_112 General-purpose IO 112 I AE7 R20 gpio_113 General-purpose IO 113 I AD8 R19 gpio_114 General-purpose IO 114 I AE8 R21 gpio_116 General-purpose IO 116 IO D25 E5 gpio_117 General-purpose IO 117 IO C25 D5 gpio_118 General-purpose IO 118 IO B25 C5 gpio_119 General-purpose IO 119 IO D24 E4 gpio_120 General-purpose IO 120 IO AA9 P22 gpio_121 General-purpose IO 121 IO AB9 N21 gpio_122 General-purpose IO 122 IO AC9 P21 gpio_123 General-purpose IO 123 IO AD9 N20 gpio_124 General-purpose IO 124 IO AE9 P19 gpio_125 General-purpose IO 125 IO E25, AA10 A7, P20 gpio_126 General-purpose IO 126 IO AB10, AD7 N22, T22 gpio_127 General-purpose IO 127 IO AC10 N19 gpio_128 General-purpose IO 128 IO AD10 N18 gpio_129 General-purpose IO 129 IO AE10 P18 gpio_130 General-purpose IO 130 IO V2, AD11 M21, AB15 gpio_131 General-purpose IO 131 IO V3, AE11 M20, AB16 gpio_132 General-purpose IO 132 IO AB12 K20 gpio_133 General-purpose IO 133 IO AC12 L19 gpio_134 General-purpose IO 134 IO AD12 M18 gpio_135 General-purpose IO 135 IO AE12 K21 gpio_136 General-purpose IO 136 IO AB13 L18 gpio_137 General-purpose IO 137 IO AC13 L20 gpio_138 General-purpose IO 138 IO AD13 L21 gpio_139 General-purpose IO 139 IO AE13 M19 gpio_140 General-purpose IO 140 IO B24 C4 gpio_141 General-purpose IO 141 IO C24 B4 gpio_142 General-purpose IO 142 IO A24 D4 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 75 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 4-25. General-Purpose IOs Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] gpio_143 General-purpose IO 143 IO C23 A4 gpio_144 General-purpose IO 144 IO F20 A5 gpio_145 General-purpose IO 145 IO F19 B5 gpio_146 General-purpose IO 146 IO E24 D6 gpio_147 General-purpose IO 147 IO E23 C6 gpio_148 General-purpose IO 148 IO AA19 C22 gpio_149 General-purpose IO 149 IO Y19 C21 gpio_150 General-purpose IO 150 IO Y20 C19 gpio_151 General-purpose IO 151 IO W20 C20 gpio_152 General-purpose IO 152 IO B23 A3 gpio_153 General-purpose IO 153 IO A23 B3 gpio_154 General-purpose IO 154 IO B22 A2 gpio_155 General-purpose IO 155 IO A22 B2 gpio_156 General-purpose IO 156 IO R25 B11 gpio_157 General-purpose IO 157 IO P21 D11 gpio_158 General-purpose IO 158 IO P22 C10 gpio_159 General-purpose IO 159 IO P23 C9 gpio_160 General-purpose IO 160 IO P25 E11 gpio_161 General-purpose IO 161 IO P24 C11 gpio_162 General-purpose IO 162 IO N24 C8 gpio_163 General-purpose IO 163 IO N2 W15 gpio_164 General-purpose IO 164 IO N3 W13 gpio_165 General-purpose IO 165 IO P1 AA13 gpio_166 General-purpose IO 166 IO P2 Y13 gpio_167 General-purpose IO 167 IO AC7 R22 gpio_168 General-purpose IO 168 IO W1 Y17 gpio_170 General-purpose IO 170 IO L25 B9 gpio_171 General-purpose IO 171 IO AE14 K22 gpio_172 General-purpose IO 172 IO AD15 K19 gpio_173 General-purpose IO 173 IO AC15 J18 gpio_174 General-purpose IO 174 IO AB15 K18 gpio_175 General-purpose IO 175 IO AD14 J20 gpio_176 General-purpose IO 176 IO AE15 J19 gpio_177 General-purpose IO 177 IO AE16 J21 gpio_178 General-purpose IO 178 IO AD16 J22 gpio_179 General-purpose IO 179 IO AC16 H20 gpio_180 General-purpose IO 180 IO AB16 H22 gpio_181 General-purpose IO 181 IO AA16 H21 gpio_182 General-purpose IO 182 IO AE17 H19 gpio_183 General-purpose IO 183 IO W2 Y16 gpio_184 General-purpose IO 184 IO W4 W16 gpio_185 General-purpose IO 185 IO W5 W17 gpio_186 General-purpose IO 186 IO M25 E10 76 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 4.4.8 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 System and Miscellaneous Terminals Table 4-26. System and Miscellaneous Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCN BALL [4] ZER BALL [4] sys_32k 32-kHz clock input I K24 A8 sys_xtalin Main input clock. Oscillator input I K25 A10 sys_xtalout Output of oscillator O H25 A9 sys_altclk Alternate clock source selectable for GPTIMERs (maximum 54 MHz), USB (48 MHz) , or NTSC/PAL (54 MHz) I L25 B9 sys_clkreq Request from device for system clock (open source type) IO M24 B8 sys_clkout1 Configurable output clock1 O N25 E9 sys_clkout2 Configurable output clock2 O M25 E10 sys_boot0 Boot configuration mode bit 0 I Y4 AB19 sys_boot1 Boot configuration mode bit 1 I AA1 AB20 sys_boot2 Boot configuration mode bit 2 I AA2 W18 sys_boot3 Boot configuration mode bit 3 I AA3 AA19 sys_boot4 Boot configuration mode bit 4 I AB1 V18 sys_boot5 Boot configuration mode bit 5 I AB2 Y19 sys_boot6 Boot configuration mode bit 6 I AC1 W19 sys_boot7 Boot configuration mode bit 7 I AC2 AA20 sys_boot8 Boot configuration mode bit 8 I AC3 Y20 sys_nrespwron Power On Reset I Y2 AA18 sys_nreswarm Warm Boot Reset (open drain output) IOD Y3 Y18 sys_nirq External FIQ input I Y1 AB18 sys_ndmareq0 External DMA request 0 (system expansion). Level (active low) or edge (falling) selectable. I M3 V12 sys_ndmareq1 External DMA request 1 (system expansion). Level (active low) or edge (falling) selectable. I M2,U1 AA11,V14 sys_ndmareq2 External DMA request 2 (system expansion). Level (active low) or edge (falling) selectable. I F1,M1 W12,AB7 sys_ndmareq3 External DMA request 3 (system expansion). Level (active low) or edge (falling) selectable. I G6,N5 AA12,V6 Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 77 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 4.4.9 www.ti.com Power Supplies Table 4-27. Power Supplies Description BALL (ZCN Pkg.) [4] BALL (ZER Pkg.) [4] 1.2-V core and oscillator macros power supply. V16, V15, V11, V10, U16, U15, U11, U10, T18, T17, T9, T8, R18, R17, R9, R8, M18, L18, L9, L8, K18, K17, K9, K8, J16, J15, J11, J10, H15, H11, H10 J8,J10, J12, J14, J16, K9, K11, K13, K15, L8, L10, L12, L14, M7, M9, M11, M13, M15, N8, N10, N12, N14, P7, P9, P11, P13, P15, R8, R10, R12, R14 VSS Core and I/O common ground. AE25, AE1, V18, V17, V14, V13, V12, V9, V8, U18, U17, U14, U13, U12, U9, U8, T14, T13, T12, R16, R15, R14, R13, R12, R11, R10, P18, P17, P16, P15, P14, P13, P12, P11, P10, P9, P8, N18, N17, N14, N13, N12, N9, N8, M17, M16, M15, M14, M13,M12, M11, M10, M9, M8, L17, L16, L15, L14, L13, L12, L11, L10, K14, K13, K12, J18, J17, J14, J13, J12, J9, J8, H14, H13, H12, H9, A25, A1, N23, G20, G21 A1, A11,A22, E6, E16, F6, F13, F15, F17, G5, G7, G11, G14, G16, G18, H6, H7, H8, H9, H10, H11, H12, H13, H14, H15, H16, H17, J9, J11, J13, J15, K8, K10, K12, K14, K16, L7, L9, L11, L13, L15, M1, M6, M8, M10, M12, M14, M16, M22, N7, N9, N11, N13, N15, N17, P6, P8, P10, P12, P14, P16, R5, R7, R9, R11, R13, R15, R17, T6, T8, T10, T12, T14, T16, T18, U5, U7, U9, U11, U13, U15, U17, V6, AB1, AB12, AB22 VDDS_SRAM_MPU 1.8-V MPU SLDO analog power supply. AA13 L17 VDDS_SRAM_CORE_BG 1.8-V Core SLDO and VDDA of BandGap analog power supply. E17 J6 CAP_VDD_SRAM_MPU 1.2-V SRAMOUT for MPU SLDO. For proper device operation, connect to a 1μF decoupling capacitor. AA12 M17 CAP_VDD_SRAM_CORE 1.2-V SRAMOUT for Core SLDO. For proper device operation, connect to a 1μF decoupling capacitor. E16 K6 VDDS_DPLL_MPU_USBH OST 1.8-V MPUSS DPLL and USBHOST DPLL analog power supply. AA15 K17 VDDS_DPLL_PER_CORE 1.8-V DPLL and HSDIVIDER/ CORE and HSDIVIDER analog power supply. N20 F11 VDDA_DAC 1.8-V DAC analog power supply. H21 NA VSSA_DAC DAC analog ground. H22 NA VDDA3P3V_USBPHY 3.3-V USB transceiver analog power supply. F23 F7 VDDA1P8V_USBPHY 1.8-V USB transceiver power supply. G22 D7 CAP_VDDA1P2LDO_USB PHY Output of the 1.2-V internal LDO. For proper device operation, connect a 0.22uF capacitor between this pin and VSSA. F22 E7 SIGNAL NAME[1] VDD_CORE 78 DESCRIPTION[2] Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 4-27. Power Supplies Description (continued) SIGNAL NAME[1] DESCRIPTION[2] BALL (ZCN Pkg.) [4] BALL (ZER Pkg.) [4] 1.8/3.3-V power supply. Y16, Y15, Y13, Y12, Y10, W16, W15, W13, W12,W10, W9, W6, V7, V6, U19, T20, T19, T7, T6, R7, R6, P20, P19, N19, N7, N6, M7, M6, M5, L19, K19, K7, K6, K5, J7, H18, H17 A21, B1,E15, E17, F12, F14, F18, G10, G12, G13, G8, G17, H18, J17, L22, N16, P17, R16, R18, T9, T11, T13, T17, U8, U10, U12, U14, U16, U18, V7, V8, V17, AA22, AB11 VDDS 1.8-V power supply. Y9, W18, U20, R5, N22, H16, H8, G17, G16, G14, G13, G11, G10, G8, F16, F13, F11, F10, F8 F5, F16, G15, H5, K7, L6, L16, N1, N5, N6, P5, R6, T5, T7, T15, U6, AA1 VDDSOSC 1.8-V oscillator power supply. L20 G9 VSSOSC Oscillator ground. J25 B10 VDDSHV Terminal Configuration and Functions Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 79 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings Table 5-1 specifies the absolute maximum ratings over the operating junction temperature range of commercial and extended temperature devices. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Notes: • Logic functions and parameter values are not assured out of the range specified in the recommended operating conditions. Table 5-1. Absolute Maximum Ratings Over Operating Junction Temperature Range MIN MAX UNIT VDD_CORE Supply voltage range for core macros PARAMETER -0.5 1.6 V VDDS Second supply voltage range for 1.8-V I/O macros -0.5 2.25 V VDDSHV Supply voltage range for 1.8/3.3V I/O macros -0.5 3.8 V VDDS_SRAM_MPU Analog Supply voltage range for 1.8-V MPU SLDO -0.5 2.25 V VDDS_SRAM_CORE_BG Analog Supply voltage range for 1.8-V Core SLDO and VDDA of BandGap -0.5 2.25 V VDDS_DPLL_MPU_USBHOST Analog power supply for 1.8-V MPUSS DPLL and USBHOST DPLL -0.5 2.1 V VDDS_DPLL_PER_CORE Analog power supply for 1.8-V DPLL and HSDIVIDER/ CORE and HSDIVIDER -0.5 2.1 V VDDA_DAC Analog Power Supply for 1.8-V DAC -0.5 2.43 V VDDA3P3V_USBPHY Analog power supply for 3.3-V USB transceiver -0.5 3.6 V VDDA1P8V_USBPHY Power Supply for 1.8-V USB transceiver -0.5 2.0 V VDDSOSC Power Supply for 1.8-V oscillator -0.5 2.1 V Oscillator input (sys_xtalin) -0.3 VDDSOSC + 0.3 VDDS 1.8-V I/O macros -0.3 VDDS + 0.3 Dual-voltage LVCMOS inputs, VDDSHV = 1.8 V -0.3 VDDSHV + 0.3 -0.3 3.8 Voltage range at Dual-voltage LVCMOS inputs, VDDSHV PAD = 3.3 V VPAD USB VBUS pin (usb0_vbus) 5.5 USB 5V Tolerant IOs (usb0_dp, usb0_dm, usb0_id) 5.25 IIOI Current-pulse injection on each I/O pin (1) Iclamp Clamp current for an input or output (1) 80 -20 V 200 mA 20 mA Each device is tested with I/O pin injection of 200 mA with a stress voltage of 1.5 times maximum vdd at room temperature. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 5.2 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Handling Ratings Table 5-2. Handling Ratings PARAMETER HBM (human body model) VESD ESD stress voltage (1) Tstg Storage temperature range (1) (2) (3) MIN (2) MAX >1000 CDM (charged device model) (3) V >500 -65 UNIT 150 °C Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device. The level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Actual performance of the device may exceed the value listed above. The level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Actual performance of the device may exceed the value listed above. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 81 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.3 www.ti.com Recommended Operating Conditions All AM3517/05 modules are used under the operating conditions contained in Table 5-3. Note: Logic functions and parameter values are not assured if the device is operated out of the range specified in the recommended operating conditions. Table 5-3. Recommended Operating Conditions PARAMETER DESCRIPTION MIN NOM MAX UNIT VDD_CORE Core and oscillator macros power supply 1.152 1.20 1.248 V 24.00 mVpp 1.89 V 50.00 mVpp 1.89 V 50.00 mVpp 1.89 V 35.00 mVpp 1.89 V 35.00 mVpp 1.89 V 30.00 mVpp Noise (peak-peak) VDDS_SRAM_ MPU MPU SRAM LDO analog power supply VDDS_SRAM_ CORE_BG Core SRAM LDO and BandGap analog power supply 1.71 1.80 Noise (peak-peak) 1.71 1.80 Noise (peak-peak) VDDS_DPLL_ MPU_ USBHOST MPU and USBHOST DPLL analog power supply 1.71 VDDS_DPLL_ PER_CORE Peripherals and Core DPLLs analog power supply 1.71 VDDA_DAC DAC analog power supply 1.80 Noise (peak-peak) 1.80 Noise (peak-peak) 1.71 1.80 Noise (peak-peak) VSSA_DAC DAC analog ground VDDA3P3V_ USBPHY Analog power supply for 3.3-V USB transceiver VDDA1P8V_ USBPHY Power Supply for 1.8-V USB transceiver VDDSHV 3.3-/1.8-V power supply 1.8-V power supply Operating junction temperature range (2) 82 1.71 1.80 Noise (peak-peak) Tj (1) 3.30 Noise (peak-peak) VDDS Device Operating Life Power-On Hours (POH) (1) 0.00 3.14 500 MHz ARM Clock Freq. 600 MHz ARM Clock Freq. V 3.47 V 70.00 mVpp 1.89 V 50.00 mVpp 1.8 V Mode 1.71 1.80 1.89 V 3.3 V Mode 3.14 3.30 3.47 V 1.71 1.80 1.89 V Commercial Temperature 0 90 °C Extended Temperature -40 105 °C < 90°C TJ 100K 90 - 105 °C TJ 100K < 90°C TJ 100K 90 - 105 °C TJ 50K (2) hrs. The POH information is provided solely for your convenience and does not extend or modify the warranty provided under TI’s standard terms and conditions for TI semiconductor products. Maximum lifetime will be 100k Power On Hours as long as no more than 50k is greater than 90°C. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Figure 5-1 shows the power domains: vdds_dpll_mpu_usbhost DLL/DCDL BandGap vdds BCK MEM LDO in 1.8 V out 1.2 V VDDS vddshv VDDSHV LDO3 1.0 V/1.2 V MPU DPLL_MPU LDO in 1.8 V out 1.2 V vdd_core Core DPLL_CORE SRAM 1 LDO 0 V/1.0 V/1.2 V SRAM1 ARRAY LDO tv_ref HSDIVIDER (for capacitor) vdds_dpll_per_core SRAM 2 LDO 0 V/1.0 V/1.2 V vdda_dac SRAM2 ARRAY cap_vdd_sram_core Dual Video DAC LDO in 1.8 V out 1.2 V Periph1 DPLL4 LDO vss HSDIVIDER vssa_dac LDO in 1.8 V out 1.2 V Periph2 DPLL5 vdd_core domain Device 030-003 Figure 5-1. AM3517/05 Voltage Domains Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 83 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.4 www.ti.com Power Consumption Summary The supply voltages and power consumption estimates are detailed in Table 5-4. Table 5-4. Estimated Power Consumption at Ball Level SIGNAL NAME VDD_CORE MAX CURRENT (mA) DESCRIPTION 1.2-V core and oscillator macros power supply AM3517 1500 mA AM3505 1400 mA VDDS_SRAM_MPU 1.8-V MPU SLDO analog power supply 40 mA VDDS_SRAM_CORE_BG 1.8-V Core SLDO and VDDA of BandGap analog power supply 40 mA VDDS_DPLL_MPU_USBHOST 1.8-V MPUSS DPLL and USBHOST DPLL analog power supply 25 mA VDDS_DPLL_PER_CORE 1.8-V DPLL and HSDIVIDER/ CORE and HSDIVIDER analog power supply 25 mA VDDA_DAC 1.8-V DAC analog power supply 65 mA VDDA3P3V_USBPHY 3.3-V USB transceiver analog power supply 10 mA VDDA1P8V_USBPHY 1.8-V USB transceiver power supply 50 mA VDDSHV 3.3-/1.8-V power supply 300 mA VDDS 1.8-V power supply 200 mA VDDSOSC 1.8-V oscillator power supply 20 mA 84 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 5.5 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Electrical Characteristics Table 5-5 summarizes the DC electrical characteristics. Table 5-5. DC Electrical Characteristics PARAMETER MIN NOM MAX UNIT LVCMOS Pin Buffers VIH High-level input voltage VIL VDDSHV = 1.8 V Low-level input voltage VOH High-level output voltage VOL Low-level output voltage II Input current for dual voltage IO pins (1) 0.65 x VDDSHV. VDDSHV = 3.3 V(1) 2 sys_xtalin 0.8 x VDDSOSC V VDDSHV = 1.8 V(1) 0.35 x VDDSHV VDDSHV = 3.3 V(1) 0.8 sys_xtalin 0.2 x VDDSOSC VDDSHV = 1.8 V(1) IOH = -2 mA VDDSHV 0.45 VDDSHV = 3.3 V(1) IOH = -2 mA 2.4 V V VDDSHV = 1.8 V(1) IOL = 2 mA 0.45 VDDSHV = 3.3 V(1) IOL = 2 mA 0.4 V VI = Vss to VDDSHV Input pins with pull disabled -9 9 VI = Vss to VDDSHV Input pins with 100 µA pull-up enabled -310 -70 VI = Vss to VDDSHV Input pins with 100 µA pull-down enabled 75 270 Input current for DDR2/mDDR 1.8V IO pins VI = Vss to VDDSHV Input pins with 100 µA pull-down enabled 77 286 IOZ Off-state output current VO = VDDSHV or 0V Pull disabled -20 20 µA IOH High-level output current (dual-voltage LVCMOS IOs) -2 mA IOL Low-level output current (dual-voltage LVCMOS IOs) 2 mA tT Input transition time (rise time, tR or fall time, tF evaluated between 10% and 90% at PAD) VDDSHV = 1.8 Normal mode V(1) High-speed mode 10 ns VDDSHV = 3.3 Normal mode V(1) High-speed mode 10 Capacitan ce µA 3 3 Input capacitance (dual-voltage LVCMOS I/Os) 3 pF Output capacitance (dual-voltage LVCMOS I/Os) 3 pF Complex IO Dedicated to USB : USB0_DM and USB0_DP VIH High-level input voltage Low/Full speed 2.0 V High speed (2) VIL VOH (1) (2) Low-level input voltage High-level output voltage Low/Full speed 0.8 High speed (2) V Low/Full speed 2.8 VDDA3P3V_ USBPHY V High speed 360 440 mV These IO specifications apply to the dual-voltage IOs only and do not apply to the DDR2/mDDR interfaces. DDR2/mDDR IOs are 1.8V IOs and adhere to the JESD79-2A standard. These parameters must adhere to the requirements defined in section 7.1.7.2 of Universal Serial Bus Specifications revision 2.0. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 85 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 5-5. DC Electrical Characteristics (continued) PARAMETER VOL MIN Low-level output voltage 5.6 NOM MAX UNIT Low/Full speed 0.0 0.3 V High speed -10 10 mV Thermal Characteristics Table 5-6 and Table 5-7 provide the thermal resistance characteristics for the recommended package types used on the AM3517/05. Table 5-6. Package Thermal Resistance Characteristics [ZCN Package] DESCRIPTION ΘJC Junction-to-case (1S0P) (3) NA 2.6 ΘJB Junction-to-board (2S2P) (3) NA 10.1 ΘJA Junction-to-free air (2S2P) (3) 0.0 24.1 1.0 18.7 2.0 17.5 3.0 16.8 0.0 0.05 1.0 0.2 2.0 0.2 3.0 0.3 0.0 10.0 1.0 10.3 2.0 10.2 3.0 10.1 Junction-to-package top (2S2P) (3) ΨJT ΨJB (1) (2) (3) AIR FLOW (m/s) (1) ZCN (°C/W) (2) NAME Junction-to-board (2S2P) (3) m/s = meters per second. °C/W = degrees celsius per watt. The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area Array Surface Mount Package Thermal Measurements). Table 5-7. Package Thermal Resistance Characteristics [ZER] (1) AIR FLOW (m/s) (2) ZER (°C/W) (3) Junction-to-case (2S2P) (4) NA 6 ΘJB Junction-to-board (2S2P) (4) NA 6 ΘJA Junction-to-free air (2S2P) (4) 0.0 15.8 1.0 12.0 2.0 11.1 3.0 10.8 0.0 3.3 1.0 3.7 2.0 3.5 3.0 3.5 NAME DESCRIPTION ΘJC ΨJT (1) (2) (3) (4) 86 Junction-to-package top (2S2P) (4) Package thermal resistance characteristics for ZER support only 2S2P. m/s = meters per second. °C/W = degrees celsius per watt. The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area Array Surface Mount Package Thermal Measurements). Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 5-7. Package Thermal Resistance Characteristics [ZER](1) (continued) NAME DESCRIPTION ΨJB Junction-to-board (2S2P) (4) AIR FLOW (m/s) (2) ZER (°C/W) (3) 0.0 6.0 1.0 6.1 2.0 5.8 3.0 5.7 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 87 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.7 www.ti.com Core Voltage Decoupling For module performance, decoupling capacitors are required to suppress the switching noise generated by high frequency and to stabilize the supply voltage. A decoupling capacitor is most effective when it is close to the device because this minimizes the inductance of the circuit board wiring and interconnects. Table 5-8 summarizes the power supplies decoupling characteristics. Table 5-8. Core Voltage Decoupling Characteristics PARAMETER Cvdd_core (1) MIN TYP MAX UNIT 50 100 120 nF Ccap_vdd_sram_core 100 nF Cvdds_dpll_mpu_usbhost 100 nF Cvdds_dpll_per_core 100 nF Cvdda_dac 100 nF Cvdd_sram_core 100 nF Cvdd_sram_core_bg 100 nF Cvdds_sram_mpu 100 nF Cvddshv 100 nF Cvdda3p3v_usbphy 100 nF Cvdda1p8v_usbphy 100 nF (1) 88 1 capacitor per 2 to 4 balls Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Figure 5-2 shows an example of power supply decoupling. Device vdda_dac Cvdda_dac vdds_sram_mpu vdda_dac vssa_dac vdds_sram_mpu Cvdds_sram_mpu Video DAC SRAM_LDO1 cap_vdd_sram_mpu Ccap_vdd_sram_mpu vdds_sram_core_bg vdds_sram_core_bg Cvdds_sram_core_bg SRAM_LDO2 WKUP_LDO vdd_sram_core vdd_sram_core Cvdd_sram_core cap_vdd_sram _core Ccap_vdd_sram_core BG DPLL_MPU vdds_dpll_mpu _usbhost vdds_dpll_mpu_usbhost Cvdds_dpll_mpu_usbhost DPLL_CORE DPLL5 vdds_dpll_per_core vdds_dpll_per_core Cvdds_dpll_per_core DPLL4 Vdd_core Core vdd_core MPU Cvdd_core VSS 030-004 (1) (2) Decoupling capacitors must be placed as closed as possible to the power ball. Choose the ground located closest to the power pin for each decoupling capacitor. Place the decoupling capacitor Ci in a group of 1, 2, or 3 balls; the total must be equal to the decoupling requirement. In case you interconnect powers, first insert the decoupling capacitor and then interconnect the powers. The decoupling capacitor value depends on the board characteristics. Figure 5-2. Power Supply Decoupling Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 89 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.8 www.ti.com Power-up and Power-down This section provides the timing requirements for the AM3517/05 hardware signals. 5.8.1 Power-up Sequence The following steps give an example of power-up sequence supported by the AM3517/05. 1. IO 1.8V supply (VDDS), Band-gap and LDO supplies (VDDS_SRAM_CORE_BG, VDDS_SRAM_MPU) and oscillator supply (VDDSOSC) should come up first to a stable state. 2. IO 3.3V (VDDSHV) supply should be ramped up next to a stable state. 3. Core (VDD_CORE) supply follows next to a stable state. 4. All the PLL supplies (VDDS_DPLL_PER_CORE, VDDS_DPLL_MPU_USBHOST) and 1.8 V complex IO supplies (VDDA_DAC, VDDA1P8V_USBPHY) should be ramped up next to a stable state. 5. Finally, 3.3 V complex IO (VDDA_3P3V_USBPHY) should be ramped up. 6. sys_nrespwron must be held low at the time the power supplies are ramped up till the time the sys_32k and sys_xtalin clocks are stable. Note: In VDDSHV 1.8 V operation mode, VDDSHV can be grouped and powered up together with VDDS, VDDS_SRAM_CORE_BG, VDDS_SRAM_MPU and VDDSOSC. 90 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Figure 5-3 shows the power-up sequence. VDDS, VDDS_SRAM_CORE_BG VDDS_SRAM_MPU, VDDSOSC VDDSHV 1.8V 3.3V 1.2V VDD_CORE sys_nrespwron sys_32k sys_xtalin VDDS_DPLL_PER_CORE , VDDS_DPLL_MPU_USBHOST, VDDA_DAC, VDDA1P8V_USBPHY 1.8V 3.3V VDDA3P3V_USBPHY Figure 5-3. Power-up Sequence Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 91 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.8.2 www.ti.com Power-down Sequence The AM3517/05 device proceeds with the power-down sequence shown below. The following steps give an example of the power-down sequence supported by the AM3517/05 device. 1. Reset AM3517/05 device. 2. Stop all signals driven to AM3517/05. 3. Option 1: Power down all domains simutaneously. 4. Option 2: If all domains cannot be powered down simultaneously, follow the below sequence: (a) Power off all complex I/O domains (b) Power off core domain (VDD_CORE) (c) Power off all PLL domains (VDDS_DPLL_MPU_USBHOST and VDDS_DPLL_PER_CORE) (d) Power off all SRAM LDOs (e) Power off all standard I/O domains (VDDS and VDDSHV) 5.9 Clock Specifications The AM3517/05 device has three external input clocks, a low frequency (sys_32k), a high frequency (sys_xtalin), and an optional (sys_altclk). The AM3517/05 device has two configurable output clocks, sys_clkout1 and sys_clkout2. Figure 5-4 shows the interface to the external clock sources and clock outputs. Microprocessor sys_32k Power IC Alternate Clock Source Selectable (54, 48 MHz or other [up to 59 MHz]) sys_altclk rmii_50mhz_clk Ethernet input 50-MHz clock sys_clkout1 To Peripherals (From OSC_CLK: 26 MHz) sys_clkout2 To Peripherals (From OSC_CLK: 26 MHz, core_clk [DPLL, up to 166 MHz], DPLL-96 MHZ or DPLL-54 MHz outputs with a divider of 1, 2, 4, 8, or 16) sys_xtalout To Quartz (Oscillator output) or Unconnected From Quartz (Oscillator input), Square Clock, or Crystal sys_xtalin sys_clkreq Clock Request. To Square Clock Source or from Peripherals sys_xtalout sys_xtalout Oscillator is Used Unconnected Oscillator is Bypassed sys_xtalin sys_clkreq GPin sys_xtalin sys_clkreq Square Clock Source Figure 5-4. Clock Interface The AM3517/05 device operation requires the following three input clocks: 92 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com • • • SPRS550F – OCTOBER 2009 – REVISED JULY 2014 The 32-kHz clock can be generated using one of the following options and can be selected via the sys_boot7 pin. See Figure 5-5. – External: Supplied by an oscillator on the sys_32k pin. – Internal: 32-kHz clock generation using a fixed divider on the HS system clock (26MHz). The system alternative clock can be used (through the sys_altclk pin) to provide alternative 48 or 54 MHz or other clock source (up to 54 MHz). The system clock input (26 MHz) is used to generate the main source clock of the AM3517/05 device. It supplies the DPLLs as well as several AM3517/05 modules. The system clock input can be connected to either: – A crystal oscillator clock managed by sys_xtalin and sys_xtalout. In this case, the sys_clkreq is used as an input (GPIN). – A CMOS digital clock through the sys_xtalin pin. In this case, the sys_clkreq is used as an output to request the external system clock. 0 Sys_32k Sys_32k_in 1 32.5 kHz Fixed Divider /800 Sys_clk= 26 MHz Sys_xtalin Sys_xtalout 0 Latch Sys_boot7 1 JTAG Overrides for DFT 1 Sys_clk PowerOn Reset Figure 5-5. 32-kHz Clock Generation The AM3517/05 outputs externally two clocks: • sys_clkout1 can output the oscillator clock (26 MHz) at any time. • sys_clkout2 can output the oscillator clock, core_clk, 96 MHz or 54 MHz. It can be divided by 2, 4, 8, or 16 and its off state polarity is programmable. 5.9.1 Oscillator The sys_xtalin (26 MHz) oscillator provides the primary reference clock for the device. The on-chip oscillator requires an external crystal connected across the sys_xtalin and sys_xtalout pins, along with two load capacitors, as shown in Figure 4-3. The external crystal load capacitors must be connected only to the oscillator ground pin (VSSOSC). Do not connect to board ground (VSS). Note: If an external oscillator is to be used, the external oscillator clock signal should be connected to the sys_xtalin pin with a 1.8V amplitude. The sys_xtalout should be left unconnected and the VSSOSC signal should be connected to board ground (VSS). Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 93 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com sys_xtalin sys_xtalout VSSOSC Crystal 26 MHz C1 A. B. C2 Oscillator components (Crystal, C1, C2) must be located close to the AM35x package. Parasitic capacitance to the printed circuit board (PCB) ground and other signals should be minimized to reduce noise coupled into the oscillator. The VSSOSC terminal provides a Kelvin ground reference for the external crystal components. External crystal component grounds should only be connected to the VSSOSC terminal and should not be connected to the PCB ground plane. C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components (excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1*C2)/(C1+C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus any mutual capacitance (Cpkg + CPCB) seen across the AM3517/05 sys_xtalin and sys_xtalout signals. For recommended values of crystal circuit components, see Table 5-9. Figure 5-6. AM3517/05 Oscillator Connections Table 5-9. Crystal Electrical Characteristics PARAMETER MIN TYP MAX UNIT Oscillation frequency 26 MHz Crystal ESR 50 Ω Frequency stability +/- 50 ppm Parallel Load Capacitance (C1 and C2) 20 pF Shunt Capacitance 5 pF 5.9.2 Input Clock Specifications The clock system accepts three input clock sources: • 32-kHz digital CMOS clock • Crystal oscillator clock or CMOS digital clock (26 MHz) • Alternate clock (48 or 54 MHz, or other up to 54 MHz) Table 5-10. 26-MHz SYS_CLK Input Clock Timing Requirements PARAMETER DESCRIPTION f(xtalin) Frequency, sys_xtalin tw(xtalin) Duty Cycle, sys_xtalin 45 55 % tj(xtalin) Jitter, sys_xtalin -1 1 % tt(xtalin) Transition time, sys_xtalin 5 ns 94 MIN TYP MAX 26 Specifications UNIT MHz Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 5-11 and Table 5-12 detail the electrical characteristics and input requirements of the 32-kHz input clock. Table 5-11. 32-kHz Input Clock Source Electrical Characteristics PARAMET ER DESCRIPTION f Frequency, sys_32k Ci Input capacitance Ri MIN TYP MAX UNIT 32.768 Input resistance kHz 0.25 0.45 pF 6 GΩ 10 Table 5-12. 32-kHz Input Clock Source Timing Requirements (1) PARAMETE R DESCRIPTION MIN TYP MAX UNIT 1 / tc(32k) Frequency, sys_32k tR(32k) Rise transition time, sys_32k tF(32k) Fall transition time, sys_32k 20 ns tJ(32k) Frequency stability, sys_32k +/-200 ppm (1) 32 kHz 20 ns See Electrical Characteristics for Standard LVCMOS IOs part for sys_32k VIH/VIL parameters. Table 5-13 and Table 5-14 detail the electrical characteristics and input requirements of the 48- or 54-MHz input clock. Table 5-13. 48-MHz, 54-MHz, or up to 59-MHz Input Clock Source Electrical Characteristics NAME DESCRIPTION f Frequency , sys_altclk Ci Input capacitance Ri Input resistance MIN MAX 48, 54, or up to 59 0.25 UNIT MHz 0.74 pF 106 GΩ Table 5-14. 48-MHz, 54-MHz, or up to 59-MHz Input Clock Source Timing Requirements (1) PARAMETER DESCRIPTION MIN MAX UNIT 1 / tc(sys_altclk) Frequency, sys_altclk tw(sys_altclk) Duty cycle 45 60 % tj(sys_altclk) Jitter -1 1 % tr(sys_altclk) Rise transition time 10 ns tf(sys_altclk) Fall transition time 10 ns ft(sys_altclk) Frequency tolerance 50 ppm (1) (2) 48, 54, or up to 59 (2) -50 MHz Peak-to-peak jitter is defined as the difference between the maximum and the minimum output periods on a statistical population of 300 period samples. The sinusoidal noise is added on top of the vdds supply voltage. See Section 5, Electrical Characteristics, for sys_altclk VIH/VIL parameters. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 95 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.9.3 www.ti.com Output Clock Specifications Two output clocks (pin sys_clkout1 and pin sys_clkout2) are available: • sys_clkout1 can output the oscillator clock (26 MHz) at any time. It can be controlled by software or externally using sys_clkreq control. When the device is in the off state, the sys_clkreq can be asserted to enable the oscillator and activate the sys_clkout1 without waking up the device. The off state polarity of sys_clkout1 is programmable. • sys_clkout2 can output sys_clk (26 MHz), core_clk (core DPLL output), APLL-96 MHz, or APLL-54 MHz. It can be divided by 2, 4, 8, or 16 and its off state polarity is programmable. This output is active only when the core domain is active. Table 5-15 summarizes the sys_clkout1 output clock electrical characteristics. Table 5-15. SYS_CLKOUT1 Output Clock Electrical Characteristics NAME DESCRIPTION f Frequency CI Load capacitance (1) (1) MIN TYP MAX UNIT 26 MHz f(max) = 38.4 MHz 70 pF f(max) = 26 MHz 125 The load capacitance is adapted to a frequency. Table 5-16 details the sys_clkout1 output clock timing characteristics. Table 5-16. SYS_CLKOUT1 Output Clock Switching Characteristics NAME DESCRIPTION MIN f 1 / CO0 Frequency CO1 tw(CLKOUT1) Pulse duration, sys_clkout1 low or high CO2 tR(CLKOUT1) CO3 tF(CLKOUT1) (1) TYP MAX UNIT 26 MHz 0.40 * tc(CLKOUT1) 0.60 * tc(CLKOUT1) ns Rise time, sys_clkout1 (1) 3.31 ns Fall time, sys_clkout1 (1) 3.31 ns With a load capacitance of 25 pF. CO0 CO1 CO1 sys_clkout1 030-014 Figure 5-7. SYS_CLKOUT1 System Output Clock Table 5-17 summarizes the sys_clkout2 output clock electrical characteristics. Table 5-17. SYS_CLKOUT2 Output Clock Electrical Characteristics NAME DESCRIPTION f Frequency, sys_clkout2 CL Load capacitance (2) (1) (2) 96 MIN TYP 2 8 (1) f(max) = 166 MHz MAX UNIT 166 MHz 12 pF The maximum frequency supported is core_clk/2 MHz. The load capacitance is adapted to a frequency. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 5-18 details the sys_clkout2 output clock timing characteristics. Table 5-18. SYS_CLKOUT2 Output Clock Switching Characteristics NAME DESCRIPTION MIN f 1 / CO0 Frequency CO1 tw(CLKOUT2) Pulse duration, sys_clkout2 low or high CO2 tR(CLKOUT2) Rise time, sys_clkout2 (1) CO3 (1) tF(CLKOUT2) Fall time, sys_clkout2 TYP 0.40 * tc(CLKOUT2) MAX UNIT 166 MHz 0.60 * tc(CLKOUT2) ns 3.7 ns 4.3 ns (1) With a load capacitance of 25 pF. CO0 CO1 CO1 sys_clkout2 030-015 Figure 5-8. SYS_CLKOUT2 System Output Clock Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 97 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.9.4 www.ti.com DPLL Specifications The AM3517/05 integrates four DPLLs. The PRM and CM drive them. The four main DPLLs are: • DPLL1 (MPU) • DPLL3 (Core) • DPLL4 (Peripherals) • DPLL5 (Second Peripherals DPLL) Figure 5-9 shows the DPLL implementation. Device VDDS_DPLL_MPU_USBHOST Power Rail DPLL1 DPLL3 DPLL4 DPLL5 VDDS_DPLL_PER_CORE 030-016 Figure 5-9. DPLL Implementation 5.9.4.1 Digital Phase-Locked Loop (DPLL) The DPLL provides all interface clocks and some functional clocks (such as the processor clocks) of the AM3517/05 device. DPLL1 gets an always-on clock used to produce the synthesized clock. They get a high-speed bypass clock used to switch the DPLL output clock on this high-speed clock during bypass mode. The high-speed bypass clock is an L3 divided clock (programmable by 1 or 2) that saves DPLL processor power consumption when the processor does not need to run faster than the L3 clock speed, or optimizes performance during frequency scaling. Each DPLL synthesized frequency is set by programming M (multiplier) and N (divider) factors. In addition, all DPLL outputs can be controlled by an independent divider (M2 to M6). The clock generating DPLLs of the AM3517/05 device have following features: • Independent power domain per DPLL • Controlled by clock-manager (CM) • Fed with always-on system clock with independent gating control per DPLL • Analog part supplied through dedicated power supply (1.8 V) and an embedded LDO to get rid of 1MHz noise • Up to four independent output dividers for simultaneous generation of multiple clock frequencies 98 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.9.4.1.1 DPLL1 (MPU) DPLL1 is located in the MPU subsystem and supplies all clocks of the subsystem. All MPU subsystem clocks are internally generated in the subsystem. When the core domain is on, it can use the DPLL3 (CORE DPLL) output as a high-frequency bypass input clock. 5.9.4.1.2 DPLL3 (CORE) DPLL3 supplies all interface clocks and also a few module functional clocks. It can be also source of the emulation trace clock. It is located in the core domain area. All interface clocks and a few module functional clocks are generated in the CM. When the core domain is on, it can be used as a bypass input to DPLL1. 5.9.4.1.3 DPLL4 (Peripherals) DPLL4 generates clocks for the peripherals. It supplies five clock sources: 96-MHz functional clocks to subsystems and peripherals, 54 MHz to TV DAC, display functional clock, camera sensor clock, and emulation trace clock. It is located in the core domain area. All interface clocks and few module functional clocks are generated in the CM. Its outputs to the DSS, PER, and EMU domains are propagated with always-on clock trees. 5.9.4.1.4 DPLL5 (Second peripherals DPLL) DPLL5 supplies the 120-MHz functional clock to the CM. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 99 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.9.4.2 www.ti.com DPLL Noise Isolation The DPLL requires dedicated power supply pins to isolate the core analog circuit from the switching noise generated by the core logic that can cause jitter on the clock output signal. Guard rings are added to the cell to isolate it from substrate noise injection. The vdd supplies are the most sensitive to noise; decoupling capacitance is recommended below the supply rails. The maximum input noise level allowed is 30 mVPP for frequencies below 1 MHz. Figure 5-10 shows an example of a noise filter. Noise Filter VDDS_DPLL_MPU_USBHOST DPLL_MPU DPLL_CORE C DLL Noise Filter VDDS_DPLL_PER_CORE DPLL5 C DPLL4 030-017 Figure 5-10. DPLL Noise Filter Table 5-19 specifies the noise filter requirements. Table 5-19. DPLL Noise Filter Requirements NAME MIN Filtering capacitor TYP 100 MAX UNIT nF (1) The capacitors must be inserted between power and ground as close as possible. (2) This circuit is provided only as an example. (3) The filter must be located as close as possible to the device. (4) No filtering required if noise is below 10 mVPP. 5.10 Video DAC Specifications A dual-display interface equips the AM3517/05 processor. This display subsystem provides the necessary control signals to interface the memory frame buffer directly to the external displays (TV-set). Two (one per channel) 10-bit current steering DACs are inserted between the DSS and the TV set to generate the video analog signal. One of the video DACs also includes TV detection and power-down mode. Figure 511 shows the AM3517/05 DAC architecture. 100 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Device TV DCT DIN1[9:0] ROUT1 tv_vfb1 TVOUT BUFFER Video DAC 1 tv_out1 DSS tv_vfb2 TVOUT TVOUT BUFFER BUFFER Video DAC 2 ROUT2 DIN2[9:0] tv_out2 vdda_dac V_ref vssa_dac tv_vref CBG 030-018 Figure 5-11. Video DAC Architecture The following paragraphs detail the 10-bit DAC interface pinout, static and dynamic specifications, and noise requirements. The operating conditions and absolute maximum ratings are detailed in Table 5-21 and Table 5-23. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 101 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 5.10.1 Interface Description Table 5-20 summarizes the external pins of the video DAC. Table 5-20. External Pins of 10-bit Video DAC PIN NAME I/O DESCRIPTION tv_out1 O TV analog output composite DAC1 video output. An external resistor is connected between this node and tv_vfb1. The nominal value of ROUT1 is 1650 . Finally, note that this is the output node that drives the load (75 ). tv_out2 O TV analog output S-VIDEO DAC2 video output. An external resistor is connected between this node and tv_vfb2. The nominal value of ROUT2 is 1650 . Finally, note that this is the output node that drives the load (75 ). tv_vref I Reference output voltage from internal bandgap A decoupling capacitor (CBG) needs to be connected for optimum performance. tv_vfb1 O Amplifier feedback node Amplifier feedback node. An external resistor is connected between this node and tv_out1. The nominal value of ROUT1 is 1650 (1%). tv_vfb2 O Amplifier feedback node Amplifier feedback node. An external resistor is connected between this node and tv_out2. The nominal value of ROUT2 is 1650 (1%). 102 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.10.2 Electrical Specifications Over Recommended Operating Conditions (TMIN to TMAX, vdda_dac = 1.8 V, ROUT1/2 = 1650Ω , RLOAD = 75Ω , unless otherwise noted) Table 5-21. DAC Static Electrical Specification PARAMETER R CONDITIONS/ASSUMPTIONS MIN Resolution TYP MAX UNIT 10 Bits DC ACCURACY INL (1) Integral nonlinearity 1 1 LSB DNL (2) Differential nonlinearity 1 1 LSB ANALOG OUTPUT - Full-scale output voltage - Output offset voltage RLOAD = 75Ω 0,7 0.88 1 - Output offset voltage drift - Gain error RVOUT Output impedance 67.5 75 82.5 VREF Reference voltage range 0.525 0.55 0.575 - Reference noise density RSET Full-scale current adjust resistor V 50 mV 20 17 mV/C 19 % FS REFERENCE PSRR Reference PSRR (3) 100-kHz reference noise bandwidth 129 3700 (Up to 6 MHz) V 4000 4200 40 dB POWER CONSUMPTION Ivdda-up Analog Supply Current (4) 2 channels, no load 8 mA - Analog supply driving a 75- load (RMS) 2 channels 50 mA Ivdda-up (peak) Peak analog supply current: Lasts less than 1 ns 60 mA Ivdd-up Digital supply current (5) Measured at fCLK = 54 MHz, fOUT = 2 MHz sine wave, vdd = 1.3 V 2 mA Ivdd-up (peak) Peak digital supply current (6) Lasts less than 1 ns 2.5 mA Ivdda-down Analog power at power-down T = 30C, vdda = 1.8 V 1.5 mA Ivdd-down Digital power at power-down T = 30C, vdd = 1.3 V 1 mA (1) (2) (3) (4) (5) (6) The INL is measured at the output of the DAC (accessible at an external pin during bypass mode). The DNL is measured at the output of the DAC (accessible at an external pin during bypass mode). Assuming a capacitor of 0.1 F at the tv_ref node. The analog supply current Ivdda is directly proportional to the full-scale output current IFS and is insensitive to fCLK The digital supply current IVDD is dependent on the digital input waveform, the DAC update rate fCLK, and the digital supply VDD. The peak digital supply current occurs at full-scale transition for duration less than 1 ns. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 103 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com (TMIN to TMAX, vdda_dac = 1.8 V, ROUT1/2 = 1650 , RLOAD = 75 , unless otherwise noted) Table 5-22. Video DAC Dynamic Electrical Specification PARAMETER (1) fCLK CONDITIONS/ASSUMPTIONS MIN TYP MAX Equal to input clock frequency Clock jitter rms clock jitter required in order to assure 10bit accuracy Attenuation at 5.1 MHz Corner frequency for signal 0.1 Attenuation at 54 MHz (1) Image frequency 25 tST Output settling time Time from the start of the output transition to output within 1 LSB of final value. 85 ns tRout Output rise time Measured from 10% to 90% of full-scale transition 25 ns tFout Output fall time Measured from 10% to 90% of full-scale transition 25 ns BW Signal bandwidth 6 MHz Differential gain (2) 1.5% Differential phase (2) 54 UNIT Output update rate MHz 40 ps 0.5 1.5 dB 30 33 dB 1 deg. SFDR Within bandwidth fCLK = 54 MHz, fOUT = 1 MHz 45 dB SNR Signal-to-noise ratio 1 kHz to 6 MHz bandwidth fCLK = 54 MHz, fOUT = 1 MHz 55 (3) dB PSRR Power supply rejection ratio Up to 6 MHz 20 (4) Crosstalk Between the two video channels (1) (2) (3) (4) 104 50 dB 40 dB For internal input clock information, For more information, see the Device Display Interface Subsystem Reference Guide [SPRUFV2]. The differential gain and phase value is for dc coupling. Note that there is degradation for the ac coupling. The SNR value is for dc coupling. Note that there is a 6-dB degradation for ac coupling. The PSSR value is for dc coupling. Note that there is a 10-dB degradation for ac coupling. Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 5.10.3 Analog Supply (vdda_dac) Noise Requirements In order to assure 10-bit accuracy of the DAC analog output, the analog supply vdda_dac has to meet the noise requirements stated in this section. The DAC Power Supply Rejection Ratio is defined as the relative variation of the full-scale output current divided by the supply variation. Thus, it is expressed in percentage of Full-Scale Range (FSR) per volt of DI OUT I OUTFS VAC 100 × supply variation as shown in the following equation: PSRRDAC = % FSR V Depending on frequency, the PSRR is defined in Table 5-23. Table 5-23. Video DAC Power Supply Rejection Ratio Supply Noise Frequency PSRR % FSR/V 0 to 100 kHz 1 > 100 kHz The rejection decreases 20 dB/dec. Example: at 1 MHz the PSRR is 10% of FSR/V A graphic representation is shown in Figure 5-12. PSRR (% FSR/V) First pole of DAC output load 10 1 f 100 kHz 1 MHz 030-019 Figure 5-12. Video DAC Power Supply Rejection Ratio To ensure that the DAC SFDR specification is met, the PSRR values and the clock jitter requirements translate to the following limits on vdda_dac (for the Video DAC). The maximum peak-to-peak noise on vdda (ripple) is defined in Table 5-24: Table 5-24. Video DAC Maximum Peak-to-Peak Noise on vdda_dac Tone Frequency Maximum Peak-to-Peak Noise on vdda_dac 0 to 100 kHz < 30 mVpp > 100 kHz Decreases 20 dB/dec. Example: at 1 MHz the maximum is 3 mVpp The maximum noise spectral density (white noise) is defined in Table 5-25: Table 5-25. Video DAC Maximum Noise Spectral Density Supply Noise Bandwidth Maximum Supply Noise Density 0 to 100 kHz < 20 V / Hz > 100 kHz Decreases 20 dB/dec. Example: at 1 MHz the maximum noise density is 2 / Hz Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 105 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Because the DAC PSRR deteriorates at a rate of 20 dB/dec after 100 kHz, it is highly recommended to have vdda_dac low pass filtered (proper decoupling) (see the illustrated application: Section 5.10.4, External Component Value Choice). 5.10.4 External Component Value Choice The full-scale output voltage VOUTMAX is regulated by the reference amplifier, and is set by an internal resistor RSET. IOUTMAX can be expressed as: IOUTMAX = IREF /8 * (63 + 15/16) (1) Where: VREF = 0.5V IREF = VREF/RSET (2) (3) The output current IOUT appearing at DAC output is a function of both the input code and IOUTMAX and can be expressed as: IOUT = (DAC_CODE/1023) * IOUTMAX (4) Where: DAC_CODE = 0 to 1023 is the DAC input code in decimal. (5) The output voltage is: VOUT = IOUT *N* RCABLE (6) Where: (N = amplifier gain = 21) RCABLEΩ (cable typical impedance) (7) (8) The TV-out buffer requires a per channel external resistors: ROUT1/2. The equation below can be used to select different resistor values (if necessary): ROUT = (N+1) RCABLE = 1650Ω (9) Recommended parameter values are: Table 5-26. Video DAC Recommended External Components Values Recommended Value UNIT CBG 100 nF ROUT1/2 1650 Ω In order to limit the reference noise bandwidth and to suppress transients on VREF, it is necessary to connect a large decoupling capacitor ©BG) between the tv_vref and vssa_dac pins. 106 Specifications Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6 Timing Requirements and Switching Characteristics Note: The timing data shown is preliminary data and is subject to change in future revisions. 6.1 Timing Test Conditions All timing requirements and switching characteristics are valid over the recommended operating conditions of Table 5-3, unless otherwise specified. 6.2 6.2.1 Interface Clock Specifications Interface Clock Terminology The Interface clock is used at the system level to sequence the data and/or control transfers accordingly with the interface protocol. 6.2.2 Interface Clock Frequency The two interface clock characteristics are: • The maximum clock frequency • The maximum operating frequency The interface clock frequency documented in this document is the maximum clock frequency, which corresponds to the maximum frequency programmable on this output clock. This frequency defines the maximum limit supported by the AM3517/05 IC and does not take into account any system consideration (PCB, peripherals). The system designer will have to consider these system considerations and AM3517/05 IC timings characteristics as well, to define properly the maximum operating frequency, which corresponds to the maximum frequency supported to transfer the data on this interface. 6.2.3 Clock Jitter Specifications Jitter is a phase noise, which may alter different characteristics of a clock signal. The jitter specified in this document is the time difference between the typical cycle period and the actual cycle period affected by noise sources on the clock. The cycle (or period) jitter terminology identifies this type of jitter. Cycle (or Period) Jitter Tn-1 Tn Tn+1 Max. Cycle Jitter = Max (Ti) Min. Cycle Jitter = Min (Ti) Jitter Standard Deviation (or rms Jitter) = Standard Deviation (Ti) 030-020 Figure 6-1. Cycle (or Period) Jitter Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 107 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.2.4 www.ti.com Clock Duty Cycle Error The maximum duty cycle error is the difference between the absolute value of the maximum high-level pulse duration or the maximum low-level pulse duration and the typical pulse duration value: • Maximum pulse duration = typical pulse duration + maximum duty cycle error • Minimum pulse duration = typical pulse duration - maximum duty cycle error 6.3 Timing Parameters The timing parameter symbols used in the timing requirement and switching characteristic tables are created in accordance with JEDEC Standard 100. To shorten the symbols, some pin names and other related terminologies have been abbreviated as follows: Table 6-1. Timing Parameters LOWERCASE SUBSCRIPTS 108 Symbols Parameter c Cycle time (period) d Delay time dis Disable time en Enable time h Hold time su Setup time START Start bit t Transition time v Valid time w Pulse duration (width) X Unknown, changing, or dont care level H High L Low V Valid IV Invalid AE Active Edge FE First Edge LE Last Edge Z High impedance Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.4 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 External Memory Interfaces The AM3517/05 processor includes the following external memory interfaces: • General-purpose memory controller (GPMC) • SDRAM controller (SDRC) 6.4.1 General-Purpose Memory Controller (GPMC) The GPMC is the AM3517/05 unified memory controller used to interface external memory devices such as: • Asynchronous SRAM-like memories and ASIC devices • Asynchronous page mode and synchronous burst NOR flash • NAND flash 6.4.1.1 GPMC/NOR Flash Interface Synchronous Timing Table 6-2 through Table 6-4 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-2. GPMC/NOR Flash Synchronous Mode Timing Conditions TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT MIN MAX Input Conditions tR Input signal rise time 0.3 1.8 ns tF Input signal fall time 0.3 1.8 ns Output Conditions CLOAD Output load capacitance 30 pF Table 6-3. GPMC/NOR Flash Interface Timing Requirements Synchronous Mode NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX F12 tsu(DV-CLKH) Setup time, read gpmc_d[15:0] valid before gpmc_clk high 2.021 ns F13 th(CLKH-DV) Hold time, gpmc_d[15:0] valid after gpmc_clk high 3.403 ns F21 tsu(WAITV-CLKH) Setup time, gpmc_waitx (1) valid before gpmc_clk high 3.782 ns F22 th(CLKH-WAITV) Hold Time, gpmc_waitx (1) valid after gpmc_clk high 3.343 ns (1) Wait monitoring support is limited to a WaitMonitoringTime value > 0. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 109 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-4. GPMC/NOR Flash Interface Switching Characteristics Synchronous Mode NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX F0 tc(CLK) Cycle time (1), output clock gpmc_clk period 10 F1 tw(CLKH) Typical pulse duration, output clock gpmc_clk high 0.5 P (2) 0.5 P (2) ns F1 tw(CLKL) Typical pulse duration, output clock gpmc_clk low 0.5 P (2) 0.5 P (2) ns tdc(CLK) Duty cycle error, output clk gpmc_clk tj(CLK) Jitter standard deviation (3), output clock gpmc_clk tR(CLK) tF(CLK) tR(DO) Rise time, output data -500 ns 500 ps 33.30 ps Rise time, output clock gpmc_clk 1.6 ns Fall time, output clock gpmc_clk 1.6 ns 2 ns tF(DO) Fall time, output data 2 ns F2 td(CLKH-nCSV) Delay time, gpmc_clk rising edge to gpmc_ncsx (4) transition F (5) - 1.9 F (5) + 3.3 ns F3 td(CLKH-nCSIV) Delay time, gpmc_clk rising edge to gpmc_ncsx (4) invalid E (6) - 1.9 E (6) + 3.3 ns F4 td(ADDV-CLK) Delay time, address bus valid to gpmc_clk first edge B (7) - 4.1 B (7) + 2.1 ns F5 td(CLKH-ADDIV) Delay time, gpmc_clk rising edge to gpmc_a[16:1] invalid F6 td(nBEV-CLK) Delay time, gpmc_nbe0_cle, gpmc_nbe1 valid to gpmc_clk first edge B (7) - 1.37 B (7) + 2.1 ns F7 td(CLKH-nBEIV) Delay time, gpmc_clk rising edge to gpmc_nbe0_cle, gpmc_nbe1 invalid D (8) - 2.1 D (8) + 1.1 ns (1) (2) (3) (4) (5) (6) (7) (8) 110 -2.103 ns Related to the gpmc_clk output clock maximum and minimum frequencies programmable in the I/F module by setting the GPMC_CONFIG1_CSx configuration register bit field GpmcFCLKDivider. P = gpmc_clk period The jitter probability density can be approximated by a Gaussian function. In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. For nCS falling edge (CS activated): • Case GpmcFCLKDivider = 0: • F = 0.5 * CSExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • F = 0.5 * CSExtraDelay * GPMC_FCLK if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and CSOnTime are even) • F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • F = 0.5 * CSExtraDelay * GPMC_FCLK if ((CSOnTime - ClkActivationTime) is a multiple of 3) • F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 1) is a multiple of 3) • F = (2 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 2) is a multiple of 3) For single read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst write: E = (CSWrOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK B = ClkActivationTime * GPMC_FCLK For single read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst write: D = (WrCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-4. GPMC/NOR Flash Interface Switching Characteristics Synchronous Mode (continued) NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX F8 td(CLKH-nADV) Delay time, gpmc_clk rising edge to gpmc_nadv_ale transition G (9) - 1.9 G (9) + 4.1 ns F9 td(CLKH-nADVIV) Delay time, gpmc_clk rising edge to gpmc_nadv_ale invalid D (8) - 1.9 D (8) + 4.1 ns F10 td(CLKH-nOE) Delay time, gpmc_clk rising edge to gpmc_noe transition H (10) - 2.1 H (10) + 2.1 ns F11 td(CLKH-nOEIV) Delay time, gpcm rising edge to gpmc_noe invalid E (6) - 2.1 E (6) + 2.1 ns (9) For ADV falling edge (ADV activated): • Case GpmcFCLKDivider = 0: • G = 0.5 * ADVExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and ADVOnTime are even) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVOnTime - ClkActivationTime) is a multiple of 3) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime - ClkActivationTime - 1) is a multiple of 3) • G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime --ClkActivationTime - 2) is a multiple of 3) For ADV rising edge (ADV deactivated) in Reading mode: • Case GpmcFCLKDivider = 0: • G = 0.5 * ADVExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and ADVRdOffTime are even) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime) is a multiple of 3) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime --ClkActivationTime --1) is a multiple of 3) • G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime --ClkActivationTime - 2) is a multiple of 3) For ADV rising edge (ADV deactivated) in Writing mode: • Case GpmcFCLKDivider = 0: • G = 0.5 * ADVExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and ADVWrOffTime are even) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime) is a multiple of 3) • G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 1) is a multiple of 3) • G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 2) is a multiple of 3) (10) For OE falling edge (OE activated) / IO DIR rising edge (Data Bus input direction): • Case GpmcFCLKDivider = 0: • H = 0.5 * OEExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • H = 0.5 * OEExtraDelay * GPMC_FCLK if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and OEOnTime are even) • H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOnTime - ClkActivationTime) is a multiple of 3) • H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 1) is a multiple of 3) • H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 2) is a multiple of 3) For OE rising edge (OE deactivated): • GpmcFCLKDivider = 0: • H = 0.5 * OEExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • H = 0.5 * OEExtraDelay * GPMC_FC if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and OEOffTime are even) • H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOffTime - ClkActivationTime) is a multiple of 3) • H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 1) is a multiple of 3) • H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 2) is a multiple of 3) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 111 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-4. GPMC/NOR Flash Interface Switching Characteristics Synchronous Mode (continued) NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX F14 td(CLKH-nWE) Delay time, gpmc_clk rising edge to gpmc_nwe transition I (11) - 1.9 I (11) + 4.1 ns F15 td(CLKH-Data) Delay time, gpmc_clk rising edge to data bus transition J (12) - 2.1 J (12) + 1.1 ns F17 td(CLKH-nBE) Delay time, gpmc_clk rising edge to gpmc_nbex_cle transition J (12) - 2.1 J (12) + 1.1 ns F18 tW(nCSV) Pulse duration, gpmc_ncsx (4) low Read A (13) ns Write A (13) ns Pulse duration, gpmc_nbe0_cle, gpmc_nbe1 low Read C (14) ns Write C (14) ns Pulse duration, gpmc_nadv_ale low Read K (15) ns Write K (15) F19 F20 tW(nBEV) tW(nADVV) ns F23 td(CLKH-IODIR) Delay time, gpmc_clk rising edge to gpmc_io_dir high (IN direction) H (10) - 2.1 H (10) + 4.1 ns F24 td(CLKH-IODIRIV) Delay time, gpmc_clk rising edge to gpmc_io_dir low (OUT direction) M (16) - 2.1 M (16) + 4.1 ns (11) For WE falling edge (WE activated): • Case GpmcFCLKDivider = 0: • I = 0.5 * WEExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and WEOnTime are even) • I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOnTime - ClkActivationTime) is a multiple of 3) • I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime --ClkActivationTime - 1) is a multiple of 3) • I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime - ClkActivationTime - 2) is a multiple of 3) (12) (13) (14) (15) (16) 112 For WE rising edge (WE deactivated): • Case GpmcFCLKDivider = 0: • I = 0.5 * WEExtraDelay * GPMC_FCLK • Case GpmcFCLKDivider = 1: • I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and WEOffTime are even) • I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise • Case GpmcFCLKDivider = 2: • I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOffTime - ClkActivationTime) is a multiple of 3) • I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 1) is a multiple of 3) • I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 2) is a multiple of 3) J = GPMC_FCLK period For single read: A = (CSRdOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK period For burst read: A = (CSRdOffTime - CSOnTime + (n 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period For burst write: A = (CSWrOffTime - CSOnTime + (n 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period with n being the page burst access number. For single read: C = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK For burst read: C = (RdCycleTime + (n 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst write: C = (WrCycleTime + (n 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK with n being the page burst access number. For read: K = (ADVRdOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK For write: K = (ADVWrOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK M = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK Above M parameter expression is given as one example of GPMC programming. IO DIR signal will go from IN to OUT after both RdCycleTime and BusTurnAround completion. Behavior of IO direction signal does depend on kind of successive Read/Write accesses performed to Memory and multiplexed or non-multiplexed memory addressing scheme, bus keeping feature enabled or not. IO DIR behavior is automatically handled by GPMC controller. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 F1 F1 F0 gpmc_clk F3 F2 F18 gpmc_ncsx F4 gpmc_a[10:1] Valid Address F7 F6 F19 gpmc_nbe0_cle F19 gpmc_nbe1 F6 F8 F8 F20 F9 gpmc_nadv_ale F10 F11 gpmc_noe F13 F12 D0 gpmc_d[15:0] gpmc_waitx F23 gpmc_io_dir OUT F24 IN OUT 030-021 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-2. GPMC/NOR Flash Synchronous Single Read (GpmcFCLKDivider = 0) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 113 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com F1 F0 F1 gpmc_clk F2 F3 gpmc_ncsx F4 Valid Address gpmc_a[10:1] F6 F7 gpmc_nbe0_cle F7 gpmc_nbe1 F6 F8 F8 F9 gpmc_nadv_ale F10 F11 gpmc_noe F13 F13 F12 D0 gpmc_d[15:0] F21 F12 D1 D2 D3 F22 gpmc_waitx F24 F23 gpmc_io_dir OUT IN OUT 030-022 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-3. GPMC/NOR Flash Synchronous Burst Read 4x16-bit (GpmcFCLKDivider = 0) 114 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 F1 F1 F0 gpmc_clk F2 F3 gpmc_ncsx F4 Valid Address gpmc_a[10:1] F17 F6 F17 F17 gpmc_nbe0_cle F17 F17 F17 gpmc_nbe1 F6 F8 F8 F9 gpmc_nadv_ale F14 F14 gpmc_nwe F15 gpmc_d[15:0] D0 D1 F15 D2 F15 D3 gpmc_waitx gpmc_io_dir OUT 030-023 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-4. GPMC/NOR Flash Synchronous Burst Write (GpmcFCLKDivider = 0) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 115 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com F1 F0 F1 gpmc_clk F3 F2 gpmc_ncsx F7 F6 Valid gpmc_nbe0_cle F6 F7 Valid gpmc_nbe1 F4 Address (MSB) gpmc_a[26:17] F12 F5 F4 gpmc_a[16:1]_d[15:0] Address (LSB) F8 F13 D0 D1 F12 D2 F8 D3 F9 gpmc_nadv_ale F10 F11 gpmc_noe gpmc_waitx F24 F23 gpmc_io_dir OUT IN OUT 030-024 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-5. GPMC/Multiplexed NOR Flash Synchronous Burst Read 116 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 F1 F1 F0 gpmc_clk F2 F3 gpmc_ncsx F4 gpmc_a[26:17] Address (MSB) F17 F6 F17 F17 gpmc_nbe0_cle F17 F17 F17 gpmc_nbe1 F6 F8 F8 F9 gpmc_nadv_ale F14 F14 gpmc_nwe F15 gpmc_d[15:0] Address (LSB) D0 D1 F15 F15 D2 D3 gpmc_waitx OUT gpmc_io_dir 030-025 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-6. GPMC/Multiplexed NOR Flash Synchronous Burst Write 6.4.1.2 GPMC/NOR Flash Interface Asynchronous Timing Table 6-5 through Table 6-8 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-5. GPMC/NOR Flash Asynchronous Mode Timing Conditions TIMING CONDITION PARAMETER VALUE UNIT Input Conditions tR Input signal rise time 1.8 ns tF Input signal fall time 1.8 ns Output load capacitance 30 pF Output Conditions CLOAD Table 6-6. GPMC/NOR Flash Interface Asynchronous Timing – Internal Parameters (1) NO. PARAMETER 1.8V,3.3V MIN FI1 Maximum output data generation delay from internal functional clock FI2 Maximum input data capture delay by internal functional clock FI3 FI4 (2) UNIT MAX 6.5 ns 4 ns Maximum device select generation delay from internal functional clock 6.5 ns Maximum address generation delay from internal functional clock 6.5 ns FI5 Maximum address valid generation delay from internal functional clock 6.5 ns FI6 Maximum byte enable generation delay from internal functional clock 6.5 ns (1) (2) The internal parameters table must be used to calculate Data Access Time stored in the corresponding CS register bit field. Internal parameters are referred to the GPMC functional internal clock which is not provided externally. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 117 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-6. GPMC/NOR Flash Interface Asynchronous Timing – Internal Parameters(1) (2) (continued) NO. PARAMETER 1.8V,3.3V MIN UNIT MAX FI7 Maximum output enable generation delay from internal functional clock 6.5 ns FI8 Maximum write enable generation delay from internal functional clock 6.5 ns FI9 Maximum functional clock skew 100 ps Table 6-7. GPMC/NOR Flash Interface Timing Requirements – Asynchronous Mode NO. PARAMETER 1.8V,3.3V MIN FA5 (1) UNIT MAX tacc(DAT) Data maximum access time H (2) GPMC_FCLK cycles (3) tacc1-pgmode(DAT) Page mode successive data maximum access time P (4) GPMC_FCLK cycles FA21 (5) tacc2-pgmode(DAT) Page mode first data maximum access time H (2) GPMC_FCLK cycles FA20 (1) (2) (3) (4) (5) The FA5 parameter provides the amount of time required to internally sample input Data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input Data is internally sampled by active functional clock edge. FA5 value must be stored inside the AccessTime register bit field. H = AccessTime * (TimeParaGranularity + 1) The FA20 parameter provides amount of time required to internally sample successive input Page Data. It is expressed in number of GPMC functional clock cycles. After each access to input Page Data, next input Page Data is internally sampled by active functional clock edge after FA20 functional clock cycles. The FA20 value must be stored in the PageBurstAccessTime register bit field. P = PageBurstAccessTime * (TimeParaGranularity + 1) The FA21 parameter shows amount of time required to internally sample first input Page Data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, First input Page Data is internally sampled by active functional clock edge. FA21 value must be stored inside the AccessTime register bit field. Table 6-8. GPMC/NOR Flash Interface Switching Characteristics – Asynchronous Mode NO. PARAMETER 1.8V/ 3.3V MIN FA0 FA1 FA3 UNIT MAX tR(DO) Rise time, output data 2.0 ns tF(DO) Fall time, output data 2.0 ns tW(nBEV) Pulse duration, gpmc_nbe0_cle, gpmc_nbe1 valid time Read N(12) ns Write N(12) ns Pulse duration, gpmc_ncsx(13) v low Read A(1) ns Write A(1) ns Delay time, gpmc_ncsx(13) valid to gpmc_nadv_ale invalid Read B(2) – 0.2 B(2) + 2.0 ns Write B(2) – 0.2 B(2) + 2.0 ns tW(nCSV) td(nCSV-nADVIV) FA4 td(nCSV-nOEIV) Delay time, gpmc_ncsx(13) valid to gpmc_noe invalid (Single read) C(3) – 0.2 C(3) + 2.0 ns FA9 td(AV-nCSV) Delay time, address bus valid to gpmc_ncsx(13) valid J(9) – 0.2 J(9) + 2.0 ns FA10 td(nBEV-nCSV) Delay time, gpmc_nbe0_cle, gpmc_nbe1 valid to gpmc_ncsx(13) valid J(9) – 0.2 J(9) + 2.0 ns FA12 td(nCSV-nADVV) Delay time, gpmc_ncsx(13) valid to gpmc_nadv_ale valid K(10) – 0.2 K(10) + 2.0 ns FA13 td(nCSV-nOEV) Delay time, gpmc_ncsx(13) valid to gpmc_noe valid L(11) – 0.2 L(11) + 2.0 ns FA14 td(nCSV-IODIR) Delay time, gpmc_ncsx(13) valid to gpmc_io_dir high L(11) – 0.2 L(11) + 2.0 ns FA15 td(nCSV-IODIR) Delay time, gpmc_ncsx(13) valid to gpmc_io_dir low M(14) – 0.2 M(14) + 2.0 ns FA16 tw(AIV) Address invalid duration between 2 successive R/W accesses 118 G(7) ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-8. GPMC/NOR Flash Interface Switching Characteristics – Asynchronous Mode (continued) NO. PARAMETER 1.8V/ 3.3V UNIT MIN MAX I(8) – 0.2 I(8) + 2.0 FA18 td(nCSV-nOEIV) Delay time, gpmc_ncsx(13) valid to gpmc_noe invalid (Burst read) FA20 tw(AV) Pulse duration, address valid – 2nd, 3rd, and 4th accesses FA25 td(nCSV-nWEV) Delay time, gpmc_ncsx(13) valid to gpmc_nwe valid E(5) – 0.2 E(5) + 2.0 ns FA27 td(nCSV-nWEIV) Delay time, gpmc_ncsx(13) valid to gpmc_nwe invalid F(6) – 0.2 F(6) + 2.0 ns FA28 td(nWEV-DV) Delay time, gpmc_ new valid to data bus valid 2.0 ns FA29 td(DV-nCSV) Delay time, data bus valid to gpmc_ncsx(13) valid J(9) + 2.0 ns FA37 td(nOEV-AIV) Delay time, gpmc_noe valid to gpmc_a[16:1]_d[15:0] address phase end 2.0 ns D(4) J(9) – 0.2 ns ns (1) For single read: A = (CSRdOffTime – CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK For single write: A = (CSWrOffTime – CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst read: A = (CSRdOffTime – CSOnTime + (n – 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst write: A = (CSWrOffTime – CSOnTime + (n – 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK with n being the page burst access number (2) For reading: B = ((ADVRdOffTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay – CSExtraDelay)) * GPMC_FCLK For writing: B = ((ADVWrOffTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay – CSExtraDelay)) * GPMC_FCLK (3) C = ((OEOffTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay – CSExtraDelay)) * GPMC_FCLK (4) D = PageBurstAccessTime * (TimeParaGranularity + 1) * GPMC_FCLK (5) E = ((WEOnTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay – CSExtraDelay)) * GPMC_FCLK (6) F = ((WEOffTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay – CSExtraDelay)) * GPMC_FCLK (7) G = Cycle2CycleDelay * GPMC_FCLK (8) I = ((OEOffTime + (n – 1) * PageBurstAccessTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay – CSExtraDelay)) * GPMC_FCLK (9) J = (CSOnTime * (TimeParaGranularity + 1) + 0.5 * CSExtraDelay) * GPMC_FCLK (10) K = ((ADVOnTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay – CSExtraDelay)) * GPMC_FCLK (11) L = ((OEOnTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay – CSExtraDelay)) * GPMC_FCLK (12) For single read: N = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK For single write: N = WrCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK For burst read: N = (RdCycleTime + (n – 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK For burst write: N = (WrCycleTime + (n – 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK (13) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. (14) M = ((RdCycleTime - CSOnTime) * (TimeParaGranularity + 1) - 0.5 * CSExtraDelay) * GPMC_FCLK Above M parameter expression is given as one example of GPMC programming. IO DIR signal will go from IN to OUT after both RdCycleTime and BusTurnAround completion. Behavior of IO direction signal does depend on kind of successive Read/Write accesses performed to Memory and multiplexed or non-multiplexed memory addressing scheme, bus keeping feature enabled or not. IO DIR behavior is automatically handled by GPMC controller. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 119 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com GPMC_FCLK gpmc_clk FA5 FA1 gpmc_ncsx FA9 gpmc_a[10:1] Valid Address FA0 FA10 gpmc_nbe0_cle Valid FA0 gpmc_nbe1 Valid FA10 FA3 FA12 gpmc_nadv_ale FA4 FA13 gpmc_noe gpmc_d[15:0] Data IN 0 Data IN 0 gpmc_waitx FA14 gpmc_io_dir FA15 OUT IN OUT 030-026 Figure 6-7. GPMC/NOR Flash – Asynchronous Read – Single Word Timing(1) (2) (3) (1) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. (2) FA5 parameter provides amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bit field. (3) GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. 120 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 GPMC_FCLK gpmc_clk FA5 FA5 FA1 FA1 gpmc_ncsx FA16 FA9 FA9 gpmc_a[10:1] Address 0 Address 1 FA0 FA0 FA10 FA10 gpmc_nbe0_cle Valid gpmc_nbe1 Valid FA0 FA0 Valid Valid FA10 FA10 FA3 FA3 FA12 FA12 gpmc_nadv_ale FA4 FA4 FA13 FA13 gpmc_noe gpmc_d[15:0] Data Upper gpmc_waitx FA15 gpmc_io_dir FA14 OUT IN FA14 OUT FA15 IN 030-027 Figure 6-8. GPMC/NOR Flash – Asynchronous Read – 32-bit Timing(1) (2) (3) (1) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. (2) FA5 parameter provides amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bit field. (3) GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 121 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com GPMC_FCLK gpmc_clk FA21 FA20 FA20 FA20 FA1 gpmc_ncsx FA9 Add0 gpmc_a[10:1] Add1 Add2 Add3 D0 D1 D2 Add4 FA0 FA10 gpmc_nbe0_cle FA0 FA10 gpmc_nbe1 FA12 gpmc_nadv_ale FA18 FA13 gpmc_noe gpmc_d[15:0] D3 D3 gpmc_waitx FA15 gpmc_io_dir OUT FA14 IN OUT 030-028 Figure 6-9. GPMC/NOR Flash – Asynchronous Read – Page Mode 4x16-bit Timing(1) (2) (3) (4) (1) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. (2) FA21 parameter provides amount of time required to internally sample first input page data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data is internally sampled by active functional clock edge. FA21 value must be stored inside AccessTime register bit field. (3) FA20 parameter provides amount of time required to internally sample successive input page data. It is expressed in number of GPMC functional clock cycles. After each access to input page data, next input page data is internally sampled by active functional clock edge after FA20 functional clock cycles. FA20 is also the duration of address phases for successive input page data (excluding first input page data). FA20 value must be stored in PageBurstAccessTime register bit field. (4) GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. 122 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 gpmc_fclk gpmc_clk FA1 gpmc_ncsx FA9 Valid Address gpmc_a[10:1] FA0 FA10 gpmc_nbe0_cle FA0 FA10 gpmc_nbe1 FA3 FA12 gpmc_nadv_ale FA27 FA25 gpmc_nwe FA29 gpmc_d[15:0] Data OUT gpmc_waitx gpmc_io_dir OUT 030-029 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-10. GPMC/NOR Flash – Asynchronous Write – Single Word Timing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 123 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com GPMC_FCLK gpmc_clk FA1 FA5 gpmc_ncsx FA9 gpmc_a[26:17] Address (MSB) FA0 FA10 gpmc_nbe0_cle Valid FA0 FA10 gpmc_nbe1 Valid FA3 FA12 gpmc_nadv_ale FA4 FA13 gpmc_noe FA29 gpmc_a[16:1]_d[15:0] FA37 Address (LSB) FA14 gpmc_io_dir Data IN Data IN FA15 OUT IN OUT gpmc_waitx 030-030 Figure 6-11. GPMC/Multiplexed NOR Flash – Asynchronous Read – Single Word Timing(1) (2) (3) (1) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. (2) FA5 parameter provides amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bit field. (3) GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. 124 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 gpmc_fclk gpmc_clk FA1 gpmc_ncsx FA9 gpmc_a[26:17] Address (MSB) FA0 FA10 gpmc_nbe0_cle FA0 FA10 gpmc_nbe1 FA3 FA12 gpmc_nadv_ale FA27 FA25 gpmc_nwe FA29 gpmc_a[16:1]_d[15:0] FA28 Valid Address (LSB) Data OUT gpmc_waitx gpmc_io_dir OUT 030-031 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0, 1, 2, or 3. Figure 6-12. GPMC/Multiplexed NOR Flash – Asynchronous Write – Single Word Timing 6.4.1.3 GPMC/NAND Flash Interface Timing Table 6-9 through Table 6-12 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-9. GPMC/NAND Flash Asynchronous Mode Timing Conditions TIMING CONDITION PARAMETER 1.8V, 3.3V MIN UNIT MAX Input Conditions tR Input signal rise time 1.8 tF Input signal fall time 1.8 CLOAD Output load capacitance Copyright © 2009–2014, Texas Instruments Incorporated 30 ns ns pF Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 125 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-10. GPMC/NAND Flash Interface Asynchronous Timing Internal Parameters (1) NO. PARAMETER 1.8V, 3.3V MIN GNFI1 Maximum output data generation delay from internal functional clock GNFI2 Maximum input data capture delay by internal functional clock GNFI3 GNFI4 (2) UNIT MAX 6.5 ns 4 ns Maximum device select generation delay from internal functional clock 6.5 ns Maximum address latch enable generation delay from internal functional clock 6.5 ns GNFI5 Maximum command latch enable generation delay from internal functional clock 6.5 ns GNFI6 Maximum output enable generation delay from internal functional clock 6.5 ns GNFI7 Maximum write enable generation delay from internal functional clock 6.5 ns GNFI8 Maximum functional clock skew 100 ps (1) (2) Internal parameters table must be used to calculate data access time stored in the corresponding CS register bit field. Internal parameters are referred to the GPMC functional internal clock which is not provided externally. Table 6-11. GPMC/NAND Flash Interface Timing Requirements NO. PARAMETER 1.8V, 3.3V MIN GNF12 (1) (1) (2) tacc(DAT) UNIT MAX J (2) Data maximum access time GPMC_FCLK cycles The GNF12 parameter provides the amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of the read cycle and after GNF12 functional clock cycles, input data is internally sampled by the active functional clock edge. The GNF12 value must be stored inside AccessTime register bit field. J = AccessTime * (TimeParaGranularity + 1) Table 6-12. GPMC/NAND Flash Interface Switching Characteristics NO. PARAMETER 1.8V, 3.3V MIN tR(DO) Rise time, output data UNIT MAX 2.0 ns 2.0 ns tF(DO) Fall time, output data GNF0 tw(nWEV) Pulse duration, gpmc_nwe valid time GNF1 td(nCSV-nWEV) Delay time, gpmc_ncsx(13) valid to gpmc_nwe valid B(2) - 0.2 B(2) + 2.0 ns GNF2 tw(CLEH-nWEV) Delay time, gpmc_nbe0_cle high to gpmc_nwe valid C(3) - 0.2 C(3) + 2.0 ns GNF3 tw(nWEV-DV) Delay time, gpmc_d[15:0] valid to gpmc_nwe valid D(4) - 0.2 D(4) + 2.0 ns GNF4 tw(nWEIV-DIV) Delay time, gpmc_nwe invalid to gpmc_d[15:0] invalid E(5) - 0.2 E(5) + 2.0 ns GNF5 tw(nWEIV-CLEIV) Delay time, gpmc_nwe invalid to gpmc_nbe0_cle invalid F(6) - 0.2 F(6) + 2.0 ns GNF6 tw(nWEIV-nCSIV) Delay time, gpmc_nwe invalid to gpmc_ncsx(13) invalid G(7) - 0.2 G(7) + 2.0 ns GNF7 tw(ALEH-nWEV) Delay time, gpmc_nadv_ale High to gpmc_nwe valid C(3) - 0.2 C(3) + 2.0 ns GNF8 tw(nWEIV-ALEIV) Delay time, gpmc_nwe invalid to gpmc_nadv_ale invalid F(6) - 0.2 F(6) + 2.0 ns GNF9 tc(nWE) Cycle time, Write cycle time GNF10 td(nCSV-nOEV) Delay time, gpmc_ncsx(13) valid to gpmc_noe valid GNF13 tw(nOEV) Pulse duration, gpmc_noe valid time K(10) ns GN F14 tc(nOE) Cycle time, Read cycle time L(11) ns 126 A(1) ns H(8) I(9) - 0.2 ns I(9) + 2.0 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-12. GPMC/NAND Flash Interface Switching Characteristics (continued) NO. GNF15 PARAMETER tw(nOEIV-nCSIV) 1.8V, 3.3V Delay time, gpmc_noe invalid to gpmc_ncsx(13) invalid UNIT MIN MAX M(12) - 0.2 M(12) + 2.0 ns (1) A = (WEOffTime – WEOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK (2) B = ((WEOnTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay – CSExtraDelay)) * GPMC_FCLK (3) C = ((WEOnTime – ADVOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay – ADVExtraDelay)) * GPMC_FCLK (4) D = (WEOnTime * (TimeParaGranularity + 1) + 0.5 * WEExtraDelay ) * GPMC_FCLK (5) E = (WrCycleTime – WEOffTime * (TimeParaGranularity + 1) – 0.5 * WEExtraDelay ) * GPMC_FCLK (6) F = (ADVWrOffTime – WEOffTime * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay – WEExtraDelay ) * GPMC_FCLK (7) G = (CSWrOffTime – WEOffTime * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay – WEExtraDelay ) * GPMC_FCLK (8) H = WrCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK (9) I = ((OEOnTime – CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay – CSExtraDelay)) * GPMC_FCLK (10) K = (OEOffTime – OEOnTime) * (1 + TimeParaGranularity) * GPMC_FCLK (11) L = RdCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK (12) M = (CSRdOffTime – OEOffTime * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay – OEExtraDelay ) * GPMC_FCLK (13) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. GPMC_FCLK GNF1 GNF6 GNF2 GNF5 gpmc_ncsx gpmc_nbe0_cle gpmc_nadv_ale gpmc_noe GNF0 gpmc_nwe GNF3 GNF4 Command gpmc_a[16:1]_d[15:0] 030-032 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. Figure 6-13. GPMC/NAND Flash – Command Latch Cycle Timing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 127 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com GPMC_FCLK GNF1 GNF6 GNF7 GNF8 gpmc_ncsx gpmc_nbe0_cle gpmc_nadv_ale gpmc_noe GNF9 GNF0 gpmc_nwe GNF3 GNF4 gpmc_a[16:1]_d[15:0] Address 030-033 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. Figure 6-14. GPMC/NAND Flash – Address Latch Cycle Timing GPMC_FCLK GNF12 GNF10 GNF15 gpmc_ncsx gpmc_nbe0_cle gpmc_nadv_ale GNF14 GNF13 gpmc_noe gpmc_a[16:1]_d[15:0] DATA gpmc_waitx 030-034 Figure 6-15. GPMC/NAND Flash – Data Read Cycle Timing(1) (2) (3) (1) The GNF12 parameter provides amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after GNF12 functional clock cycles, input data is internally sampled by active functional clock edge. The GNF12 value must be stored inside AccessTime register bit field. (2) GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. (3) In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0 ,1, 2, or 3. 128 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 GPMC_FCLK GNF1 GNF6 gpmc_ncsx gpmc_nbe0_cle gpmc_nadv_ale gpmc_noe GNF9 GNF0 gpmc_nwe GNF3 gpmc_a[16:1]_d[15:0] GNF4 DATA 030-035 In gpmc_ncsx, x is equal to 0, 1, 2, 3, 4, 5, 6, or 7. In gpmc_waitx, x is equal to 0 or 1. Figure 6-16. GPMC/NAND Flash – Data Write Cycle Timing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 129 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2 www.ti.com SDRAM Controller (SDRC) The SDRC is a dedicated interface to DDR2/LPDDR1 SDRAM that performs the following functions: • Buffering of input image data from sensors or video sources • Intermediate buffering for processing/resizing of image data in the VPFE • Numerous OSD display buffers • Intermediate buffering for large raw Bayer data image files while performing image processing functions • Buffering for intermediate data while performing video encode and decode functions • Storage of executable code for the ARM The main features of the controller are: • Open Core Protocol 2.2 (OCP) compliant [7]. • Supports JEDEC standard compliant DDR2 [2] and LPDDR1 [4] devices. – SDRAM address range over 2 chip selects. – Supports following data bus widths: OCP Data Bus Width SDRAM Data Bus Width 64 and 128-Bit 16, 32, and 64-Bit – Supports following CAS latencies: SDRAM Type CAS Latencies DDR2 2, 3, 4, 5, and 6 LPDDR1 2 and 3 – Supports following number of internal banks: SDRAM Type Internal Banks DDR2 1, 2, 4, and 8 LPDDR1 1, 2, and 4 – Supports 256, 512, 1024, and 2048-word page sizes. – Supports following burst lengths: – – – – – – – – – – – – 130 SDRAM Type Burst Length DDR2 8 (4 not supported) LPDDR1 8 (2 and 4 not supported) Supports sequential burst type. SDRAM auto initialization from reset or configuration change. Supports Bank Interleaving across both the chip selects. Supports Clock Stop mode for LPDDR1 for low power. Supports Self Refresh and Precharge Power-Down modes for low power. Supports Partial Array Self Refresh and Temperature Controlled Self Refresh modes for low power in LPDDR1. Temperature Controlled Self Refresh is only supported for mobile SDRAM having on-chip temperature sensor. Supports ODT on DDR2. Supports prioritized refresh. Programmable SDRAM refresh rate and backlog counter. Programmable SDRAM timing parameters. Supports only little endian. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.4.2.1 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 LPDDR Interface This section provides the timing specification for the LPDDR interface as a PCB design and manufacturing specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. These rules, when followed, result in a reliable LPDDR memory system without the need for a complex timing closure process. For more information regarding guidelines for using this LPDDR specification, see the Understanding TI's PCB Routing Rule-Based DDR Timing Specification Application Report (SPRAAV0). 6.4.2.1.1 LPDDR Interface Schematic Figure 6-17 and Figure 6-18 show the LPDDR interface schematics for a LPDDR memory system. The 1 x16 LPDDR system schematic is identical to Figure 6-17 except that the high word LPDDR device is deleted. Microprocessor LPDDR sdrc_d0 T DQ0 sdrc_d7 sdrc_dm0 sdrc_dqs0p sdrc_d8 T DQ7 LDM LDQS DQ8 sdrc_d15 sdrc_dm1 sdrc_dqs1p T T T T T T LPDDR sdrc_d16 T DQ0 sdrc_d23 sdrc_dm2 sdrc_dqs2p sdrc_d24 T DQ7 LDM LDQS DQ8 sdrc_d31 sdrc_dm3 sdrc_dqs3p sdrc_ba0 sdrc_ba1 sdrc_a0 T T T T T T T T T sdrc_a14 sdrc_ncs0 T sdrc_ncas sdrc_nras sdrc_nwe sdrc_cke0 T sdrc_clk sdrc_nclk T T T T T T DQ15 UDM UDQS DQ15 UDM UDQS BA0 BA1 A0 BA0 BA1 A0 A14 CS A14 CS CAS RAS WE CKE CAS RAS WE CKE CK CK CK CK Figure 6-17. AM3517/05 LPDDR High Level Schematic (x16 memories) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 131 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com LPDDR Microprocessor sdrc_d0 T DQ0 sdrc_d7 sdrc_dm0 sdrc_dqs0 sdrc_d8 T DQ7 DM0 DQS0 DQ8 sdrc_d15 sdrc_dm1 sdrc_dqs1 T T DQ15 DM1 DQS1 sdrc_d16 T DQ16 sdrc_d23 sdrc_dm2 sdrc_dqs2 sdrc_d24 T DQ23 DM2 DQS2 DQ24 sdrc_d31 sdrc_dm3 sdrc_dqs3 sdrc_ba0 sdrc_ba1 sdrc_a0 T sdrc_a14 sdrc_ncs0 sdrc_ncs1 sdrc_ncas sdrc_nras sdrc_nwe sdrc_cke0 sdrc_cke1 sdrc_clk sdrc_nclk T T T T T T T T T T T T T DQ31 DM3 DQS3 BA0 BA1 A0 A14 CS T N/C T CAS RAS WE CKE T T T N/C T CK CK T Figure 6-18. AM3517/05 LPDDR High Level Schematic (x32 memory) 6.4.2.1.2 Compatible JEDEC LPDDR Devices Table 6-13 lists the parameters of the JEDEC LPDDR devices that are compatible with this interface. Generally, the LPDDR interface is compatible with x16 and x32 LPDDR333 speed grade LPDDR devices. Table 6-13. Compatible JEDEC LPDDR Devices NO. PARAMETER MIN 1 JEDEC LPDDR Device Speed Grade LPDDR333 2 JEDEC LPDDR Device Bit Width 16 32 Bits 3 JEDEC LPDDR Device Count 1 2 Devices 4 JEDEC LPDDR Device Ball Count 60 90 Balls (1) (2) 132 MAX UNIT NOTES See Note (1) See Note (2) Higher LPDDR speed grades operating at the specified speeds are supported due to inherent JEDEC LPDDR backwards compatibility. 1 x16 LPDDR device is used for 16 bit LPDDR memory system. 1x32 or 2x16 LPDDR devices are used for a 32-bit LPDDR memory system. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2.1.3 PCB Stackup The minimum stackup required for routing the microprocessor is a six layer stack as listed in Table 6-14. Additional layers may be added to the PCB stack up to accommodate other circuity or to reduce the size of the PCB footprint. Table 6-14. Minimum PCB Stack Up LAYER TYPE DESCRIPTION 1 Signal Top Routing Mostly Horizontal 2 Plane Ground 3 Plane Power 4 Signal Internal Routing 5 Plane Ground 6 Signal Bottom Routing Mostly Vertical Table 6-15. PCB Stack Up Specifications NO. PARAMETER MIN 1 PCB Routing/Plane Layers 6 2 Signal Routing Layers 3 3 Full ground layers under LPDDR routing region 2 4 Number of ground plane cuts allowed within LPDDR routing region 5 Number of ground reference planes required for each LPDDR routing 1 layer 6 Number of layers between LPDDR routing layer and reference ground 0 plane 7 PCB Routing Feature Size 4 Mils 8 PCB Trace Width w 4 Mils 9 PCB BGA escape via pad size 18 Mils 10 PCB BGA escape via hole size 8 Mils 11 Device BGA Pad Size See Note (1) 12 LPDDR Device BGA Pad Size See Note (2) 13 Single Ended Impedance, ZO 50 14 Impedance Control Z-5 (1) (2) (3) TYP MAX UNIT NOTES 0 1 0 Z 75 Ω Z+5 Ω See Note (3) Please see the Flip Chip Ball Grid Array Package Reference Guide (SPRU811) for device BGA pad size. Please see the LPDDR device manufacturer documentation for the LPDDR device BGA pad size. Z is the nominal singled ended impedance selected for the PCB specified by item 12. 6.4.2.1.4 Placement Figure 6-19 shows the required placement for the microprocessor as well as the LPDDR devices. The dimensions for Figure 6-19 are defined in Table 6-16. The placement does not restrict the side of the PCB that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For 1x16 and 1x32 LPDDR memory systems, the second LPDDR device is omitted from the placement. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 133 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com X Y OFFSET LPDDR Device Y Y OFFSET LPDDR Controller A1 Microprocessor A1 Recommended LPDDR Device Orientation Figure 6-19. AM3517/05 and LPDDR Device Placement Table 6-16. Placement Specifications NO. (1) (2) (3) (4) (5) MAX UNIT 1 PARAMETER X 1440 Mils See Notes (1), (2) 2 Y 1030 Mils See Notes (1), (2) 3 Y Offset 4 LPDDR Keepout Region 5 Clearance from non-LPDDR signal to LPDDR Keepout Region MIN 525 Mils NOTES See Notes (1) (2) (3) , , See Note (4) 4 w See Note (5) See Figure 6-19 for dimension definitions. Measurements from center of device to center of LPDDR device. For 16 bit memory systems it is recommended that Y Offset be as small as possible. LPDDR keepout region to encompass entire LPDDR routing area. Non-LPDDR signals allowed within LPDDR keepout region provided they are separated from LPDDR routing layers by a ground plane. 6.4.2.1.5 LPDDR Keep Out Region The region of the PCB used for the LPDDR circuitry must be isolated from other signals. The LPDDR keep out region is defined for this purpose and is shown in Figure 6-20. The size of this region varies with the placement and LPDDR routing. Additional clearances required for the keep out region are listed in Table 6-16. 134 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 LPDDR Controller A1 LPDDR Device A1 Region should encompass all LPDDR circuitry and varies depending on placement. Non-LPDDR signals should not be routed on the LPDDR signal layers within the LPDDR keep out region. Non-LPDDR signals may be routed in the region provided they are routed on layers separated from LPDDR signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this region. In addition, the 1.8 V power plane should cover the entire keep out region. Figure 6-20. LPDDR Keepout Region 6.4.2.1.6 Net Classes Table 6-17 lists the clock net classes for the LPDDR interface. Table 6-18 lists the signal net classes, and associated clock net classes, for the signals in the LPDDR interface. These net classes are used for the termination and routing rules that follow. Table 6-17. Clock Net Class Definitions CLOCK NET CLASS PIN NAMES CK sdrc_clk/sdrc_nclk DQS0 sdrc_dqs0 DQS1 sdrc_dqs1 DQS2 sdrc_dqs2 DQS3 sdrc_dqs3 Table 6-18. Signal Net Class Definitions CLOCK NET CLASS ASSOCIATED CLOCK NET CLASS PIN NAMES ADDR_CTRL CK sdrc_ba, sdrc_a, sdrc_ncs0, sdrc_ncas, sdrc_nras, sdrc_nwe, sdrc_cke0 DQ0 DQS0 sdrc_d, sdrc_dm0 DQ1 DQS1 sdrc_d, sdrc_dm1 DQ2 DQS2 sdrc_d, sdrc_dm2 DQ3 DQS3 sdrc_d, sdrc_dm3 6.4.2.1.7 LPDDR Signal Termination No terminations of any kind are required in order to meet signal integrity and overshoot requirements. Serial terminators are permitted, if desired, to reduce EMI risk; however, serial terminations are the only type permitted. Table 6-19 lists the specifications for the series terminators. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 135 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-19. LPDDR Signal Terminations NO. PARAMETER MIN 1 CK Net Class 0 2 ADDR_CTRL Net Class 0 3 Data Byte Net Classes (DQS0-DQS3, DQ0-DQ3) 0 (1) (2) (3) TYP MAX UNIT NOTES 10 Ω See Note (1) 22 Zo Ω See Notes (1), (2), (3) 22 Zo Ω See Notes (1), (2), (3) Only series termination is permitted, parallel or SST specifically disallowed. Terminator values larger than typical only recommended to address EMI issues. Termination value should be uniform across net class. 6.4.2.1.8 LPDDR CK and ADDR_CTRL Routing Figure 6-21 shows the topology of the routing for the CK and ADDR_CTRL net classes. The route is a balanced T as it is intended that the length of segments B and C be equal. In addition, the length of A should be maximized. T C A LPDDR Controller B A1 Microprocessor A1 Figure 6-21. CK and ADDR_CTRL Routing and Topology Table 6-20. CK and ADDR_CTRL Routing Specification NO. PARAMETER 1 Center to Center CK-CK spacing MIN TYP MAX 2w UNIT NOTES 2 CK A to B/A to C Skew Length Mismatch 25 Mils See Note (1) 3 CK B to C Skew Length Mismatch 25 Mils 4 Center to Center CK to other LPDDR trace spacing 4w 5 CK/ADDR_CTRL nominal trace length CACLM-50 6 See Note (2) See Note (3) CACLM+50 Mils ADDR_CTRL to CK Skew Length Mismatch 100 Mils 7 ADDR_CTRL to ADDR_CTRL Skew Length Mismatch 100 Mils 8 Center to Center ADDR_CTRL to other LPDDR trace 4w spacing 4w See Note (2) 9 Center to Center ADDR_CTRL to other ADDR_CTRL 3w trace spacing 3w See Note (2) 10 ADDR_CTRL A to B/A to C Skew Length Mismatch 100 Mils 11 ADDR_CTRL B to C Skew Length Mismatch 100 Mils (1) (2) (3) 136 CACLM See Note (1) Series terminator, if used, should be located closest to device. Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Figure 6-22 shows the topology and routing for the DQS and DQ net classes; the routes are point to point. Skew matching across bytes is not needed nor recommended. T E0 T E1 LPDDR Controller A1 Microprocessor T A1 E2 T E3 Figure 6-22. DQS and DQ Routing and Topology Table 6-21. DQS and DQ Routing Specification (1) NO. PARAMETER 2 DQS E Skew Length Mismatch 3 Center to Center DQS to other LPDDR trace spacing 4w 4 DQS/DQ nominal trace length DQLM - 50 5 6 7 Center to Center DQ to other LPDDR trace spacing 4w See Note (2) 8 Center to Center DQ to other DQ trace spacing 3w See Note (2), (4) 9 DQ E Skew Length Mismatch (1) (2) (3) (4) MIN TYP MAX UNIT 25 Mils NOTES See Note (2) DQLM DQLM + 50 Mils DQ to DQS Skew Length Mismatch 100 Mils DQ to DQ Skew Length Mismatch 100 Mils 100 See Note (3) Mils Series terminator, if used, should be located closest to LPDDR. Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. DQLM is the longest Manhattan distance of the DQS and DQ net classes. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 137 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2.2 www.ti.com DDR2 Interface This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need for a complex timing closure process. For more information regarding guidelines for using this DDR2 specification, Understanding TI's PCB Routing Rule-Based DDR2 Timing Specification (SPRAAV0). 6.4.2.2.1 DDR2 Interface Schematic Figure 6-23 shows the DDR2 interface schematic for a dual-memory DDR2 system. The single-memory system is shown in Figure 6-24. Pin numbers for the AM3517/05 can be obtained from the pin description section. 6.4.2.2.2 Compatible JEDEC DDR2 Devices Table 6-22 lists the parameters of the JEDEC DDR2 devices that are compatible with this interface. Generally, the DDR2 interface is compatible with x16 or x32 DDR2 speed grade DDR2-333 devices. Table 6-22. Compatible JEDEC DDR2 Devices No. (1) (2) (3) 138 Parameter Min Max 1 JEDEC DDR2 Device Speed Grade 2 JEDEC DDR2 Device Bit Width 3 JEDEC DDR2 Device Count 1 2 4 JEDEC DDR2 Device Ball Count 84 92 Unit x16 x32 Notes See Note (1) Devices See Note (2) Balls See Note (3) DDR2-333 MHz Bits Higher DDR2 speed grades operating at the specified speeds are supported due to inherent JEDEC DDR2 backwards compatibility. Device count indicates number of dies. If a package contains 2 dies, that is the maximum number of devices that can be connected. 92 ball devices retained for legacy support. New designs should use 84 ball DDR2 devices. Electrically, the 92 and 84 ball DDR2 devices are the same. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2.2.3 PCB Stackup The minimum stackup required for routing the AM3517/05 is a six-layer stack as listed in Table 6-23. Additional layers may be added to the PCB stack up to accommodate other circuitry or to reduce the size of the PCB footprint. Table 6-23. Minimum PCB Stack Up Layer Type Description 1 Signal Top Routing Mostly Horizontal 2 Plane Ground 3 Plane Power 4 Signal Internal Routing 5 Plane Ground 6 Signal Bottom Routing Mostly Vertical Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 139 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Complete stack up specifications are provided in Table 6-24. Microprocessor SDRC_D0 T SDRC_D7 T DQ7 SDRC_DM0 SDRC_DQS0P SDRC_DQS0N SDRC_D8 T T LDM LDQS LDQS# LQ8 T T SDRC_D15 SDRC_DM1 SDRC_DQS1P SDRC_DQS1N SDRC_STRBEN0 DQ0 T LQ15 T T T UDM UDQS UDQS# T Length = avg DQS0-1 length+CLK SDRC_STRBEN_DLY0 x16 DDR2 SDRC_D16 T DQ0 SDRC_D23 T DQ7 SDRC_DM2 SDRC_DQS2P SDRC_DQS2N T LDM LDQS LDQS# SDRC_D24 T DQ8 SDRC_D31 T DQ15 T UDM UDQS UDQS# SDRC_DM3 SDRC_DQS3P SDRC_DQS3N SDRC_STRBEN1 T T T T T Length = avg DQS2-3 length+CLK SDRC_STRBEN_DLY1 SDRC_BA0 SDRC_BA1 SDRC_BA2 T T T BA0 BA1 BA2* BA0 BA1 BA2* SDRC_A0 T A0 A0 SDRC_A14 T A14* A14* SDRC_nCS0 SDRC_nCS1 SDRC_nCAS SDRC_nRAS SDRC_nWE SDRC_nCKE0 SDRC_CLK SDRC_nCLK T T T T CS1 CS2* CAS# RAS# WE# CS1 CS2* CAS# RAS# WE# CLK CLK# CLK CLK# SDRC_ODT T ODT* ODT* VREF VREF T T T T VREFSSTL DDR_PADREF 50 0.1µF(A) 0.1µF(A) (A) 0.1µF Vio1.8 0.1µF 0.1µF 1K Ω 1% 1K Ω 1% 1% A. See VREF Routing and Topology figure for information on capacitor placement. Figure 6-23. DDR2 Dual-Memory High Level Schematic 140 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Microprocessor DDR2 SDRC_D0 T DQ0 SDRC_D7 T DQ7 SDRC_DM0 SDRC_DQS0P SDRC_DQS0N SDRC_D8 T T T T DM0 DQS0 DQS0# DQ8 SDRC_D15 T DQ15 SDRC_DM1 SDRC_DQS1P SDRC_DQS1N SDRC_STRBEN0 T T T DM1 DQS1 DQS1# T Length = avg D0-D15 length+CLK SDRC_STRBEN_DLY0 SDRC_D16 T DQ16 SDRC_D23 T DQ23 SDRC_DM2 SDRC_DQS2P SDRC_DQS2N T T T DM2 DQS2 DQS2# SDRC_D24 T DQ24 SDRC_D31 T DQ31 SDRC_DM3 SDRC_DQS3P SDRC_DQS3N SDRC_STRBEN1 T T T DM3 DQS3 DQS3# T Length = avg D16-D31 length+CLK SDRC_STRBEN_DLY1 SDRC_BA0 SDRC_BA1 SDRC_BA2 T T T BA0 BA1 BA2* SDRC_A0 T A0 SDRC_A14 T A14* SDRC_nCS0 SDRC_nCS1 SDRC_nCAS SDRC_nRAS SDRC_nWE SDRC_nCKE0 SDRC_CLK SDRC_nCLK T T T T T T T T CS1 CS2* CAS# RAS# WE# CKE CLK CLK# SDRC_ODT0 T ODT* VREFSSTL DDR_PADREF Vio1.8 0.1µF 1K Ω 1% 0.1µF 1K Ω 1% VREF 0.1µF (A) 0.1µF (A) 0.1µF (A) 50 1% A. See VREF Routing and Topology figure for information on capacitor placement. Figure 6-24. DDR2 Single-Memory High Level Schematic Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 141 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-24. PCB Stack Up Specifications No. Parameter Min Typ Max Unit 1 PCB Routing/Plane Layers 6 2 Signal Routing Layers 3 3 Full ground layers under DDR2 routing Region 2 4 Number of ground plane cuts allowed within DDR routing region 5 Number of ground reference planes required for each DDR2 routing layer 6 Number of layers between DDR2 routing layer and ground plane 7 PCB Routing Feature Size 4 Mils 8 PCB Trace Width w 4 Mils 9 PCB BGA escape via pad size 20 Mils 10 PCB BGA escape via hole size 10 Mils 11 AM3517/05 BGA pad size 12 12 DDR2 Device BGA pad size 13 Single Ended Impedance, Zo 14 Impedance Control (1) (2) (3) Notes 0 1 0 50 Z-5 Z 75 Ω Z+5 Ω See Note (1) See Note (2) See Note (3) The recommended pad size is 0.3 mm per IPC-7351 specification. Please refer to IPC standard IPC-7351 or manufacturer's recommendations for correct BGA pad size. Z is the nominal singled ended impedance selected for the PCB specified by item 12. 6.4.2.2.4 Placement Figure 6-24 shows the required placement for the DDR2 devices. The dimensions for Figure 6-25 are defined in Table 6-25. The placement does not restrict the side of the PCB that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the placement. X Y OFFSET Y DDR2 Device Y OFFSET DDR2 Controller A1 Microprocessor A1 Recommended DDR2 Device Orientation Figure 6-25. DDR2 Device Placement 142 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-25. Placement Specifications No. 1 Parameter Min X 2 Y 3 Y Offset 4 DDR2 Keepout Region 5 Clearance from non-DDR2 signal to DDR2 Keepout Region (1) (2) (3) (4) (5) Max Unit 1750 Mils Notes See Notes (1) (2) , 1280 Mils See Notes (1) (2) 650 Mils See Notes (1) (2) 4 , . (3) w See Note (4) See Note (5) , See Figure 6-23 for dimension definitions. Measurements from center of AM3517/05 device to center of DDR2 device. For single memory systems it is recommended that Y Offset be as small as possible. DDR2 Keepout region to encompass entire DDR2 routing area Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane. 6.4.2.2.5 DDR2 Keep Out Region The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keep out region is defined for this purpose and is shown in Figure 6-26. The size of this region varies with the placement and DDR routing. Additional clearances required for the keep out region are listed in Table 625. DDR2 Device DDR2 Controller A1 A1 Region should encompass all DDR2 circuitry and varies depending on placement. Non-DDR2 signals should not be routed on the DDR signal layers within the DDR2 keep out region. Non-DDR2 signals may be routed in the region provided they are routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this region. In addition, the 1.8 V power plane should cover the entire keep out region. Figure 6-26. DDR2 Keepout Region 6.4.2.2.6 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry. Table 6-26 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the AM3517/05 and DDR2 interfaces. Additional bulk bypass capacitance may be needed for other circuitry. Table 6-26. Bulk Bypass Capacitors No. (1) Parameter 1 VDDS Bulk Bypass Capacitor Count 2 VDDS Bulk Bypass Total Capacitance Min Unit Notes 3 Max Devices See Note 30 uF (1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed (HS) bypass caps. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 143 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-26. Bulk Bypass Capacitors (continued) No. Parameter 3 DDR#1 Bulk Bypass Capacitor Count 4 DDR#1 Bulk Bypass Total Capacitance 5 DDR#2 Bulk Bypass Capacitor Count 6 DDR#2 Bulk Bypass Total Capacitance (2) 144 Min 1 Max Unit Notes Devices See Note (1) 22 uF 1 Devices See Notes (1) (2) , 22 uF See Note (2) Only used on dual-memory systems Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2.2.7 High-Speed Bypass Capacitors High-speed (HS) bypass capacitors are critical for proper DDR2 interface operation. It is particularly important to minimize the parasitic series inductance of the HS bypass cap, AM3517/05 DDR2 power, and AM3517/05 DDR2 ground connections. Table 6-27 contains the specification for the HS bypass capacitors as well as for the power connections on the PCB. 6.4.2.2.8 Net Classes Table 6-28 lists the clock net classes for the DDR2 interface. Table 6-29 lists the signal net classes, and associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the termination and routing rules that follow. Table 6-27. High-Speed Bypass Capacitors No. Parameter Min 1 HS Bypass Capacitor Package Size 2 Distance from HS bypass capacitor to device being bypassed 3 Number of connection vias for each HS bypass capacitor 2 4 Trace length from bypass capacitor contact to connection via 1 5 Number of connection vias for each DDR2 device power or ground balls 1 6 Trace length from DDR2 device power ball to connection via 7 VDDS HS Bypass Capacitor Count 20 8 VDDS HS Bypass Capacitor Total Capacitance 1.2 9 DDR#1 HS Bypass Capacitor Count 10 DDR#1 HS Bypass Capacitor Total Capacitance 11 DDR#2 HS Bypass Capacitor Count 12 DDR#2 HS Bypass Capacitor Total Capacitance (1) (2) (3) (4) Max Unit 0402 10 Mils 250 0.4 8 0.4 See Note (2) See Note (3) See Note (3) Mils Vias 35 8 (1) Mils Vias 30 Notes See Note Mils Devices μF Devices μF Devices μF See Notes (3) (4) , See Note (4) LxW, 10 mil units, i.e., a 0402 is a 40x20 mil surface mount capacitor An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. These devices should be placed as close as possible to the device being bypassed. Only used on dual-memory systems Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 145 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-28. Clock Net Class Definitions Clock Net Class AM3517/05 Device Pin Names CK sdrc_clk/sdrc_nclk DQS0 sdrc_dqs0p /sdrc_dqs0n DQS1 sdrc_dqs1p /sdrc_dqs1n DQS2 sdrc_dqs2p/sdrc_dqs2n DQS3 sdrc_dqs3p/sdrc_dqs3n Table 6-29. Signal Net Class Definitions Clock Net Class ADDR_CTRL Associated Clock Net Class AM3517/05 Device Pin Names CK sdrc_ba[2:0], sdrc_ncs1, sdrc_a[14:0], sdrc_ncs0 , sdrc_ncas, sdrc_nras, sdrc_nwe, sdrc_cke0 DQ0 DQS0 sdrc_d[7:0], sdrc_dm0 DQ1 DQS1 sdrc_d[15:8], sdrc_dm1 DQ2 DQS2 sdrc_d[23:16],sdrc_dm2 DQ3 DQS3 sdrc_d[31:24],sdrc_dm3 SDRC_STRBEN0 CK,DQS0,DQS1 sdrc_strben0, sdrc_strben_dly0 SDRC_STRBEN1 CK,DQS2,DQS3 sdrc_strben1, sdrc_strben_dly1 6.4.2.2.9 DDR2 Signal Termination No terminations of any kind are required in order to meet signal integrity and overshoot requirements. Serial terminators are permitted, if desired, to reduce EMI risk; however, serial terminations are the only type permitted. Table 6-30 lists the specifications for the series terminators. Table 6-30. DDR2 Signal Terminations No. Parameter Min Unit Notes Ω See Note (1) 22 Zo Ω See Notes (2) (3) , (1) 0 22 Zo Ω See Notes (2) (3) , (1) 0 10 Zo Ω See Notes (2) (3) , (1) CLK Net Class 0 2 ADDR_CTRL Net Class 0 3 Data Byte Net Classes (DQS0-DQS1, D0-D31) 4 SDRC_STRBENx Net Class (SDRC_STRBENx) 146 Max 10 1 (1) (2) (3) Typ , , , Only series termination is permitted, parallel or SST specifically disallowed. Terminator values larger than typical only recommended to address EMI issues. Termination value should be uniform across net class. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.4.2.2.10 VREF Routing VREF is used as a reference by the input buffers of the DDR2 memories as well as the AM3517/05. VREF is intended to be half of the DDR2 power supply voltage and should be created using a resistive divider as shown in Figure 6-23. Other methods of creating VREF are not recommended. Figure 6-27 shows the layout guidelines for VREF. VREF Bypass Capacitor DDR2 Device A1 VREF Nominal Minimum Trace Width is 20 Mils Microprocessor A1 Neck down to minimum in BGA escape regions is acceptable. Narrowing to accomodate via congestion for short distances is also acceptable. Best performance is obtained if the width of VREF is maximized. Figure 6-27. VREF Routing and Topology 6.4.2.2.11 DDR2 CLK and ADDR_CTRL Routing Figure 6-28 shows the topology of the routing for the CLK and ADDR_CTRL net classes. The route is a balanced T as it is intended that the length of segments B and C be equal. In addition, the length of A should be maximized. T C A DDR2 Controller B A1 Microprocessor A1 Figure 6-28. CLK and ADDR_CTRL Routing and Topology Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 147 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-31. CLK and ADDR_CTRL Routing Specification No Parameter Min Typ (1) Max Unit Notes 25 Mils See Note (1) 25 Mils See Note (3) See Note (4) 4w See Note (3) 3w See Note (3) See Note (1) 1 Center to center DQS-DQSN spacing 2w 2 CK differential pair Skew Length Mismatch (2) 3 CLKB to CLKC Skew Length Mismatch 4 Center to center CLK to other DDR2 trace spacing 5 CK/ADDR_CTRL nominal trace length 6 7 8 Center to center ADDR_CTRL to other DDR2 trace spacing 9 Center to center ADDR_CTRL to other ADDR_CTRL trace spacing 10 ADDR_CTRL A to B, ADDR_CTRL A to C, Skew Length Mismatch 100 Mils 11 ADDR_CTRL B to C Skew Length Mismatch 100 Mils (1) (2) (3) (4) 4w CACLM-50 CACLM CACLM+50 Mils ADDR_CTRL to CLK Skew Length Mismatch 100 Mils ADDR_CTRL to ADDR_CTRL Skew Length Mismatch 100 Mils Series terminator, if used, should be located closest to AM3517/05. Differential impedance should be 100-ohms. Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. CACLM is the longest Manhattan distance of the CLK and ADDR_CTRL net classes. Figure 6-29 shows the topology and routing for the DQS and Dx net classes; the routes are point to point. Skew matching across bytes is not needed nor recommended. T T E0 E1 DDR2 Controller A1 Microprocessor T A1 E2 T E3 Figure 6-29. DQS and Dx Routing and Topology 148 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-32. DQS and Dx Routing Specification (1) No. (1) (2) (3) (4) (5) (6) (7) Parameter Min 1 Center to center DQS-DQSN spacing 2 DQS E differential pair Skew Length Mismatch (3) 3 Center to center DQS to other DDR2 trace spacing 4 DQS/Dx nominal trace length 5 Dx to DQS Skew Length Mismatch 6 Dx to Dx Skew Length Mismatch 7 Center to center Dx to other DDR2 trace spacing 8 Center to Center Dx to other Dx trace spacing Typ (2) Max Unit Notes 2w 25 Mils See Note (4) Mils See Notes (2) 100 Mils See Note (5) 100 Mils See Note (5) 4w See Notes (4) 3w See Notes (7) 4w DQLM-50 DQLM DQLM+ 50 , (5) (6) (4) , , "Dx" indicates a data line. E indicates length of DQS differential pair or Dx signal. Series terminator, if used, should be located closest to DDR. Differential impedance should be 100-ohms. Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. There is no need and it is not recommended to skew match across data bytes, i.e., from DQS0 and data byte 0 to DQS1 and data byte 1. Dx's from other DQS domains are considered other DDR2 trace. DQLM is the longest Manhattan distance of each of the DQS and Dx net classes. A1 FL Figure 6-30 shows the routing for the SDRC_STRBENx net classes. Table 6-33 contains the routing specification. SDRC_STRBENx net classes should be shielded from or routed on different layers than the DQx net classes. DDR2 Controller T A1 Microprocessor FH T Figure 6-30. SDRC_STRBENx Routing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 149 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-33. SDRC_STRBENx Routing Specification (1) (2) No. 1 Parameter Min SDRC_STRBEN1 Length F CKB0B2 See Note (4) See Note (5) DQS/Dx nominal trace length 5 SDRC_STRBENx Skew (5) Notes (3) 4 (4) Unit See Note Center to center SDRC_STRBENx to any other trace spacing (3) Max CKB0B1 3 (1) (2) Typ SDRC_STRBEN0 Length F 4w DQLM-50 DQLM DQLM+50 Mils 100 Mils STRBENx termination resistors should be placed close to AM3517/05 STRBENx signal (not close to STRBEN_DLYx signal). Ensure signal velocities across different layers are taken into account when calculating STRBENx length. For example, if DQS0 and DSQ1 are 1inch each, and DQS0 is on a layer that is 10% faster, use 1.1inch as the length for DQS0. CKB0B1 is the sum of the length of the CLK (the portion that goes to the memory associated with DQS0 and DQS1) plus the average length of the DQS0 and DQS1 differential pairs. CKB0B2 is the sum of the length of the CLK (the portion that goes to the memory associated with DQS2 and DQS3) plus the average length of the DQS2 and DQS3 differential pairs. Skew from CKB0B1 or CKB0B2. 6.4.2.2.12 On Die Termination (ODT) ODT should only be used with 1 chip select as shown in Figure 6-31. If using sdrc_cs0 and sdrc_cs1, sdrc_odt should not be used. ODT signals should be tied off at the memory. sdrc_cs0 CS# sdrc_odt ODT DDR2 Microprocessor CS# ODT DDR2 vo DDR2 on One Chip Select Figure 6-31. ODT Connection Using One Chip select (sdrc_cs0) 150 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.5 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Video Interfaces 6.5.1 Video Processing Subsystem (VPSS) The Video Processing Sub-System (VPSS) provides a Video Processing Front End (VPFE) input interface for external imaging peripherals (i.e., image sensors, video decoders, and so forth). 6.5.1.1 Video Processing Front End (VPFE) The Video Processing Front-End (VPFE) controller receives input video/image data from external capture devices and stores it to external memory which is transferred into the external memory via a built in DMA engine. An internal buffer block provides a high bandwidth path between the VPSS module and the external memory. The Cortex-A8 will process the image data based on application requirements. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 151 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 6.5.1.1.1 Video Processing Front End (VPFE) Timing Table 6-34 and Table 6-35 assume testing over recommended operating conditions. Table 6-34. VPFE Timing Requirements NO. 1.8V, 3.3V PARAMETER MIN MAX 13.33 100 UNIT VF1 tc(VDIN_CLK) Cycle time, pixel clock input, VDIN_CLK VF2 tsu(VDIN_D-VDIN_CLK) Setup time, VDIN_D to VDIN_CLK rising edge 3.5 ns ns VF3 tsu(VDIN_HD-VDIN_CLK) Setup time, VDIN_HD to VDIN_CLK rising edge 3.5 ns VF4 tsu(VDIN_VD-VDIN_CLK) Setup time, VDIN_VD to VDIN_CLK rising edge 3.5 ns VF5 tsu(VDIN_WEN-VDIN_CLK) Setup time, VDIN_WEN to VDIN_CLK rising edge 3.5 ns VF6 tsu(C_FLD-VDIN_CLK) Setup time, VDIN_FIELD to VDIN_CLK rising edge 3.5 ns VF7 th(VDIN_CLK-VDIN_D) Hold time, VDIN_D valid after VDIN_CLK rising edge 2.5 ns VF8 th(VDIN-HD-VDIN_CLK) Hold time, VDIN_HD to VDIN_CLK rising edge 2.5 ns VF9 th(VDIN_VD-VDIN_CLK) Hold time, VDIN_VD to VDIN_CLK rising edge 2.5 ns VF10 th(VDIN_WEN-VDIN_CLK) Hold time, VDIN_WEN to VDIN_CLK rising edge 2.5 ns VF11 th(C_FLD-VDIN_CLK) Hold time, VDIN_FIELD to VDIN_CLK rising edge 2.5 ns Table 6-35. VPFE Output Switching Characteristics NO. 1.8V, 3.3V PARAMETER MIN MAX UNIT VF12 td(VDIN_HD-VDIN_CLK) Output delay time, VDIN_HD to CLK rising edge 10 ns VF13 td(VDIN_VD-VDIN_CLK) Output delay time, VDIN_VD to CLK rising edge 10 ns VF14 td(VDIN_WEN-VDIN_CLK) Output delay time, VDIN_WEN to CLK rising edge 10 ns VF15 toh(VDIN_HD-VDIN_CLK) Output hold time, VDIN_HD to CLK rising edge 0.5 ns VF16 toh(VDIN_VD-VDIN_CLK) Output hold time, VDIN_VD to CLK rising edge 0.5 ns VF17 toh(C_FLD-VDIN_CLK) Output hold time, VDIN_FLD to CLK rising edge 0.5 ns VF1 VDIN_CLK (Falling Edge) VDIN_CLK (Rising Edge) VF2 VF7 VF7 VDIN_D[xx] VDIN_HD, VDIN_VD, VDIN_FIELD VF8, VF9, VF11 VF3, VF4, VF6 VF10 VF5 VDIN_WEN SPRS550-001 Figure 6-32. VPFE0 Input Timings 152 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 VDIN_CLK (Falling Edge) VDIN_CLK (Rising Edge) VF15, VF16, VF17 VF12, VF13, VF14 VDIN_HD, VDIN_VD, VDIN_FIELD VF12, VF13, VF14 VF15, VF16, VF17 SPRS550-002 Figure 6-33. VPFE Output Timings VF18 VDIN_HD (Falling Edge) VDIN_HD (Rising Edge) VF19 VF20 VDIN_D[xx] SPRS550-003 Figure 6-34. VPFE Input Timings With VDIN0_HD as Pixel Clock 6.5.2 Display Subsystem (DSS) The display subsystem (DSS) provides the logic to display the video frame from external (SDRAM) or internal (SRAM) memory on an LCD panel or a TV set. The DSS integrates a display controller. It can be used in two configurations: • LCD display support in: – Bypass mode (RFBI module bypassed) – RFBI mode (through RFBI module) • TV display support (not discussed in this document because of its analog IO signals) The two display supports can be active at the same time. 6.5.2.1 LCD Display Support in Bypass Mode Two types of LCD panel are supported: • Thin film transistor (TFT) or active matrix technology • Supertwisted nematic (STN) or passive matrix technology Both configurations are discussed in the following paragraphs. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 153 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 6.5.2.1.1 LCD Display in TFT Mode Table 6-36 assumes testing over the recommended operating conditions (see Figure 6-35). Table 6-36. LCD Display Interface Switching Characteristics in TFT Mode (1) NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX DL0 td(PCLKA-HSYNCT) Delay time, dss_pclk active edge to dss_hsync transition -4.215 4.215 ns DL1 td(PCLKA-VSYNCT) Delay time, dss_pclk active edge to dss_vsync transition -4.215 4.215 ns DL2 td(PCLKA-ACBIASA) Delay time, dss_pclk active edge to dss_acbias active level -4.215 4.215 ns DL3 td(PCLKA-DATAV) Delay time, dss_pclk active edge to dss_data bus valid -4.215 4.215 ns DL4 tc(PCLK) Cycle time (2), dss_pclk 13.468 DL5 tw(PCLK) Pulse duration, dss_pclk low or high cload Load capacitance (1) (2) 6.06 ns 7.46 ns 25 pF The capacitive load is equivalent to 25 pF. The pixel clock frequency is software programmable via the pixel clock divider configuration from 1 to 255 division range in the DISPC_DIVISOR register. DL5 DL4 dss_pclk DL1 dss_vsync DL0 dss_hsync DL2 dss_acbias DL3 dss_data[23:0] 030-061 Figure 6-35. LCD Display in TFT Mode(1) (2) (3) (4) (1) The pixel data bus depends on the use of 8-, 9-, 12-, 16-, 18-, or 24-bit per pixel data output pins. (2) The pixel clock frequency is programmable. (3) All timings not illustrated in the waveform are programmable by software, control signal polarity, and driven edge of dss_pclk. (4) For more information, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). 154 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.5.2.1.2 LCD Display in STN Mode Table 6-37 assumes testing over the recommended operating conditions (see Figure 6-36). Table 6-37. LCD Display Interface Switching Characteristics in STN Mode (1) NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX 6.9 DL3 td(PCLKA-DATAV) Delay time, dss_pclk active edge to dss_data bus valid -4.21 DL4 tc(PCLK) Cycle time (4), dss_pclk 22.73 DL5 tw(PCLK) Pulse duration, dss_pclk low or high 10.23 cload Load capacitance (1) (2) (3) (4) (2) (3) ns ns 12.5 ns 40 pF The DSS in STN mode is used with 4 or 8 pins only; unused pixel data bits always remain low. The capacitive load is equivalent to 40 pF. For more information, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). The pixel clock frequency is software programmable via the pixel clock divider configuration from 1 to 255 division range in the DISPC_DIVISOR register. DL5 DL4 dss_pclk dss_vsync dss_hsync dss_acbias DL3 dss_data[23:0] 030-062 Figure 6-36. LCD Display in STN Mode(1) (2) (3) (4) (5) (1) The pixel data bus depends on the use 4-, 8-, 12-, 16-, 18-, or 24-bit per pixel data output pins. (2) All timings not illustrated in the waveform are programmable by software, control signal polarity, and driven edge of dss_pclk. (3) dss_vsync width must be programmed to be as small as possible. (4) The pixel clock frequency is programmable. (5) For more information, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 155 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6 www.ti.com Serial Communications Interfaces 6.6.1 Multichannel Buffered Serial Port (McBSP) Timing There are five McBSP modules called McBSP1 through McBSP5. McBSP provides a full-duplex, direct serial interface between the AM3517/05 device and other devices in a system such as other application devices or codecs. It can accommodate a wide range of peripherals and clocked frame-oriented protocols (I2S, PCM, and TDM) due to its high level of versatility. The McBSP1-5 modules may support two types of data transfer at the system level: • The full-cycle mode, for which one clock period is used to transfer the data, generated on one edge and captured on the same edge (one clock period later). • The half-cycle mode, for which one half clock period is used to transfer the data, generated on one edge and captured on the opposite edge (one half clock period later). Note that a new data is generated only every clock period, which secures the required hold time. The interface clock (CLKX/CLKR) activation edge (data/frame sync capture and generation) has to be configured accordingly with the external peripheral (activation edge capability) and the type of data transfer required at the system level. The AM3517/05 McBSP1-5 timing characteristics are described for both rising and falling activation edges. McBSP1 supports: • 6-pin mode: dx and dr as data pins; clkx, clkr, fsx, and fsr as control pins. • 4-pin mode: dx and dr as data pins; clkx and fsx pins as control pins. The clkx and fsx pins are internally looped back via software configuration, respectively, to the clkr and fsr internal signals for data receive. McBSP2, 3, 4, and 5 support only the 4-pin mode. The following sections describe the timing characteristics for applications in normal mode (that is, AM3517/05 McBSPx connected to one peripheral) and TDM applications in multipoint mode. 6.6.1.1 McBSP in Normal Mode Table 6-38 through Table 6-40 assume testing over the recommended operating conditions. Table 6-38. McBSP Timing Conditions TIMING CONDITION PARAMETER 1.8V, 3.3 V Input Conditions UNIT VALUE tR Input signal rise time 2 (1) ns tF Input signal fall time 2 ns Output load capacitance 10 pF Output Conditions CLOAD (1) Maximum value. Table 6-39. McBSP1,2,4,5 Output Clock Pulse Duration PARAMETER VDDSHV = 1.8V, 3.3V MIN tC(CLK) Cycle Time, mcbsp1_clkr/mcbspx_clkx UNIT MAX 20.83 ns (1) tW(CLKH) (1) (2) 156 Typical pulse duration, mcbsp1_clkr / mcbspx_clkx high (1) 0.5*P (2) 0.5*P (2) ns In mcbspx, x identifies the McBSP number; 1, 2, 4, or 5. P = mcbsp1_clkr / mcbspx_clkx clock period. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-39. McBSP1,2,4,5 Output Clock Pulse Duration (continued) PARAMETER VDDSHV = 1.8V, 3.3V tW(CLKL) Typical pulse duration, mcbsp1_clkr / mcbspx_clkx low (1) tdc(CLK) Duty cycle error, mcbsp1_clkr / mcbspx_clkx (1) UNIT 0.5*P (2) 0.5*P (2) ns -0.75 0.75 ns Table 6-40. McBSP3 Output Clock Pulse Duration PARAMETER VDDSHV = 1.8V, 3.3V MIN tC(CLK) Cycle time, mcbsp3_clkx UNIT MAX 31.25 ns (1) ns tW(CLKH) Typical pulse duration, mcbsp3_clkx high 0.5*P tW(CLKL) Typical pulse duration, mcbsp3_clkx low 0.5*P (1) 0.5*P (1) ns tdc(CLK) Duty cycle error, mcbsp3_clkx -0.75 0.75 ns (1) 0.5*P (1) P = mcbsp3_clkx clock period 6.6.1.1.1 McBSP1 Table 6-41 through Table 6-48 list the timing requirements and switching characteristics for McBSP1. Table 6-41. McBSP1 Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV=3.3V MIN B3 B4 B5 B6 tsu(DRVCLKAE) VDDSHV=1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.0 4.0 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp1_fsr / mcbsp1_fsx valid before mcbsp1_clkr / mcbsp1_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns th(CLKAE-FSV) Hold time, mcbsp1_fsr / mcbsp1_fsx valid after mcbsp1_clkr / mcbsp1_clkx active edge Half Cycle Slave 0.5 0.5 ns Full Cycle Slave 1.0 1.0 ns th(CLKAEDRV) tsu(FSVCLKAE) Setup time, mcbsp1_dr valid before mcbsp1_clkr / mcbsp1_clkx active edge MAX Hold time, mcbsp1_dr valid after mcbsp1_clkr / mcbsp1_clkx active edge Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 157 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-42. McBSP1 Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER VDDSHV=3.3V td(CLKAE-FSV) Delay time, mcbsp1_clkr active edge to mcbsp1_fsr / mcbsp1_fsx valid VDDSHV=1.8V MIN MAX MIN MAX 0.2 14.8 0.2 14.8 UNIT ns Table 6-43. McBSP1 Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp1_fsx valid before mcbsp1_clkx active edge Full Cycle Slave 5.2 4.7 ns Half Cycle Slave 4.2 3.7 ns Hold time, mcbsp1_fsx valid after mcbsp1_clkx active edge Full Cycle Slave 5.2 4.7 ns Half Cycle Slave 1.0 0.5 ns Table 6-44. McBSP1 Switching Characteristics - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V B2 td(CLKXAEFSXV) Delay time, mcbsp1_clkx active edge to mcbsp1_fsx valid B8 td(CLKXAEDXV) Delay time, mcbsp1_clkx active edge to mcbsp1_dx valid VDDSHV = 1.8V UNIT MIN MAX MIN MAX 0.2 14.8 0.7 14.8 ns Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns Table 6-45. McBSP1 Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 158 tsu(DRVCLKAE) th(CLKAEDRV) tsu(FSVCLKAE) Setup time, mcbsp1_dr valid before mcbsp1_clkr / mcbsp1_clkx active edge Hold time, mcbsp1_dr valid after mcbsp1_clkr / mcbsp1_clkx active edge Setup time, mcbsp1_fsr / mcbsp1_fsx valid before mcbsp1_clkr / mcbsp1_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.0 4.0 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-45. McBSP1 Timing Requirements - Falling Edge and Receive Mode (continued) No. PARAMETER B6 th(CLKAE-FSV) Hold time, mcbsp1_fsr / mcbsp1_fsx valid after mcbsp1_clkr / mcbsp1_clkx active edge VDDSHV = 3.3V VDDSHV = 1.8V UNIT Half Cycle Slave 0.5 0.5 ns Full Cycle Slave 1.0 1.0 ns Table 6-46. McBSP1 Switching Characteristics - Falling Edge and Receive Mode No. B2 PARAMETER VDDSHV = 3.3V td(CLKAE-FSV) Delay time, mcbsp1_clkr / mcbsp1_clkx active edge to mcbsp1_fsr / mcbsp1_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.7 14.8 UNIT ns Table 6-47. McBSP1 Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp1_fsx valid before mcbsp1_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp1_fsx valid after mcbsp1_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-48. McBSP1 Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V B2 td(CLKXAEFSXV) Delay time, mcbsp1_clkx active edge to mcbsp1_fsx valid B8 td(CLKXAEDXV) Delay time, mcbsp1_clkx active edge to mcbsp1_dx valid VDDSHV = 1.8V UNIT MIN MAX MIN MAX 0.2 14.8 0.2 14.8 ns Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 159 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 6.6.1.1.2 McBSP2 Table 6-49 through Table 6-56 list the timing requirements and switching characteristics for McBSP2. Table 6-49. McBSP2 Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FSVCLKXAE) th(CLKXAEFSV) Setup time, mcbsp2_dr valid before mcbsp2_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.2 4.2 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp2_fsx valid before mcbsp2_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp2_fsx valid after mcbsp2_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp2_dr valid after mcbsp2_clkx active edge Table 6-50. McBSP2 Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp2_clkx active edge to mcbsp2_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.2 14.8 UNIT ns Table 6-51. McBSP2 Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 160 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp2_fsx valid before mcbsp2_clkx active edge Half Cycle Slave 5.2 4.7 ns Full Cycle Slave 4.2 3.7 ns Hold time, mcbsp2_fsx valid after mcbsp2_clkx active edge Half Cycle Slave 5.2 4.7 ns Full Cycle Slave 1.0 0.5 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-52. McBSP2 Switching Characteristics - Rising Edge and Transmit Mode No. PARAMETER B2 td(CLKXAEFSXV) Delay time, mcbsp2_clkx active edge to mcbsp2_fsx valid B8 td(CLKXAEDXV) Delay time, mcbsp2_clkx active edge to mcbsp2_dx valid VDDSHV = 3.3V VDDSHV = 1.8V UNIT MIN MAX MIN MAX 0.2 14.8 0.2 14.8 ns Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns Table 6-53. McBSP2 Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FSXVCLKXAE) th(CLKXAEFSXV) Setup time, mcbsp2_dr valid before mcbsp2_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.2 4.2 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp2_fsx valid before mcbsp2_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp2_fsx valid after mcbsp2_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp2_dr valid after mcbsp2_clkx active edge Table 6-54. McBSP2 Switching Characteristics - Falling Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp2_clkx active edge to mcbsp2_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.2 14.8 UNIT ns Table 6-55. McBSP2 Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 tsu(FSXVCLKXAE) Setup time, mcbsp2_fsx valid before mcbsp2_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 161 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-55. McBSP2 Timing Requirements - Falling Edge and Transmit Mode (continued) No. B6 PARAMETER th(CLKXAEFSXV) Hold time, mcbsp2_fsx valid after mcbsp2_clkx active edge VDDSHV = 3.3V VDDSHV = 1.8V UNIT Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-56. McBSP2 Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp2_clkx active edge to mcbsp2_fsx valid 0.2 14.8 0.2 14.8 ns B8 td(CLKXAEDXV) Delay time, mcbsp2_clkx active edge to mcbsp2_dx valid Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns 6.6.1.1.3 McBSP3 6.6.1.1.3.1 McBSP3 Multiplexed on McBSP3 Pins Table 6-57 through Table 6-64 list the timing conditions and switching characteristics for McBSP3 multiplexed on McBSP3 pins. Note: All timings apply only to Set #1- multiplexing on mcbsp3 pins. Table 6-57. McBSP3 (Set #1) Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 162 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FSVCLKXAE) th(CLKXAEFSV) Setup time, mcbsp3_dr valid before mcbsp3_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 5.6 5.6 ns Full Cycle Slave 5.8 5.8 ns Half Cycle Master 8.3 8.3 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp3_dr valid after mcbsp3_clkx active edge Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-58. McBSP3 (Set #1) Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 22.2 0.2 22.2 UNIT ns Table 6-59. McBSP3 (Set #1) Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1 1 ns Table 6-60. McBSP3 (Set #1) Switching Characteristics - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid 0.2 22.2 0.2 22.2 ns B8 td(CLKXAEDXV) Delay time, mcbsp3_clkx active edge to mcbsp3_dx valid Master 0.6 22.2 0.6 22.2 ns Slave 0.6 22.2 0.6 22.2 ns Table 6-61. McBSP3 (Set #1) Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN tsu(DRVCLKXAE) th(CLKXAEDRV) B5 B6 tsu(FXSVCLKXAE) th(CLKXAEFSXV) Setup time, mcbsp3_dr valid before mcbsp3_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 5.6 5.6 ns Full Cycle Slave 5.8 5.8 ns Half Cycle Master 8.3 8.3 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp3_dr valid after mcbsp3_clkx active edge Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 163 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-62. McBSP3 (Set #1) Switching Characteristics - Falling Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 22.2 0.2 22.2 UNIT ns Table 6-63. McBSP3 (Set #1) Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-64. McBSP3 (Set #1) Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid 0.2 22.2 0.2 22.2 ns B8 td(CLKXAEDXV) Delay time, mcbsp3_clkx active edge to mcbsp3_dx valid Master 0.6 22.2 0.6 22.2 ns Slave 0.6 22.2 0.6 22.2 ns 6.6.1.1.3.2 McBSP3 Multiplexed on UART2 or McBSP1 Pins Table 6-65 through Table 6-72 list the timing conditions and switching characteristics for McBSP3 multiplexed on UART2 or McBSP1 pins. Note: These timings only apply to Set #2 (multiplexing mode on uart2 pins) and Set #3 (multiplexing on mcbsp1 pins). Table 6-65. McBSP3 (Sets #2 and #3) Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 164 tsu(DRVCLKXAE) th(CLKXAEDRV) Setup time, mcbsp3_dr valid before mcbsp3_clkx active edge Hold time, mcbsp3_dr valid after mcbsp3_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.2 4.2 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-65. McBSP3 (Sets #2 and #3) Timing Requirements - Rising Edge and Receive Mode (continued) No. B5 B6 PARAMETER tsu(FSVCLKXAE) th(CLKXAEFSV) VDDSHV = 3.3V VDDSHV = 1.8V UNIT Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-66. McBSP3 (Sets #2 and #3) Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.2 14.8 UNIT ns Table 6-67. McBSP3 (Sets #2 and #3) Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-68. McBSP3 (Sets #2 and #3) Switching Characteristics - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid 0.2 14.8 0.2 14.8 ns B8 td(CLKXAEDXV) Delay time, mcbsp3_clkx active edge to mcbsp3_dx valid Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns Table 6-69. McBSP3 (Sets #2 and #3) Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 tsu(DRVCLKXAE) Setup time, mcbsp3_dr valid before mcbsp3_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 5.0 5.0 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 4.2 4.2 ns Full Cycle Slave 4.2 4.2 ns Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 165 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-69. McBSP3 (Sets #2 and #3) Timing Requirements - Falling Edge and Receive Mode (continued) No. B4 B5 B6 PARAMETER th(CLKXAEDRV) tsu(FXSVCLKXAE) th(CLKXAEFSXV) Hold time, mcbsp3_dr valid after mcbsp3_clkx active edge VDDSHV = 3.3V VDDSHV = 1.8V UNIT Half Cycle Master 5.8 5.8 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-70. McBSP3 (Sets #2 and #3) Switching Characteristics - Falling Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.2 14.8 UNIT ns Table 6-71. McBSP3 (Sets #2 and #3) Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp3_fsx valid before mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp3_fsx valid after mcbsp3_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Table 6-72. McBSP3 (Sets #2 and #3) Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1 .8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp3_clkx active edge to mcbsp3_fsx valid 0.2 14.8 0.2 14.8 ns B8 td(CLKXAEDXV) Delay time, mcbsp3_clkx active edge to mcbsp3_dx valid Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns 6.6.1.1.4 McBSP4 Table 6-73 through Table 6-80 list the timing requirements and switching characteristics for McBSP4. Table 6-73. McBSP4 Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN 166 MAX VDDSHV = 1.8V MIN UNIT MAX Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-73. McBSP4 Timing Requirements - Rising Edge and Receive Mode (continued) No. B3 B4 B5 B6 PARAMETER tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FSVCLKXAE) th(CLKXAEFSV) Setup time, mcbsp4_dr valid before mcbsp4_clkx active edge VDDSHV = 3.3V VDDSHV = 1.8V UNIT Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 3.2 3.2 ns Full Cycle Slave 4.2 4.2 ns Half Cycle Master 7.7 7.7 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp4_fsx valid before mcbsp4_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 4.2 4.2 ns Hold time, mcbsp4_fsx valid after mcbsp4_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp4_dr valid after mcbsp4_clkx active edge Table 6-74. McBSP4 Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp4_clkx active edge to mcbsp4_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 16.6 0.2 16.6 UNIT ns Table 6-75. McBSP4 Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp4_fsx valid before mcbsp4_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 3.7 3.7 ns Hold time, mcbsp4_fsx valid after mcbsp4_clkx active edge Half Cycle Slave 1.0 1.0 ns Full Cycle Slave 1.0 1.0 ns Table 6-76. McBSP4 Switching Characteristics - Rising Edge and Transmit Mode No. B2 PARAMETER td(CLKXAEFSXV) Delay time, mcbsp4_clkx active edge to mcbsp4_fsx valid Copyright © 2009–2014, Texas Instruments Incorporated VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX 0.2 16.6 0.2 16.6 UNIT ns Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 167 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-76. McBSP4 Switching Characteristics - Rising Edge and Transmit Mode (continued) No. B8 PARAMETER td(CLKXAEDXV) Delay time, mcbsp4_clkx active edge to mcbsp4_dx valid VDDSHV = 3.3V VDDSHV = 1.8V UNIT Master 0.6 16.6 0.6 16.6 ns Slave 0.6 17.3 0.6 17.3 ns Table 6-77. McBSP4 Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FXSVCLKXAE) th(CLKXAEFSXV) Setup time, mcbsp4_dr valid before mcbsp4_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 5.6 5.6 ns Full Cycle Slave 5.8 5.8 ns Half Cycle Master 7.7 7.7 ns Half Cycle Slave 5.2 5.2 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp4_fsx valid before mcbsp4_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp4_fsx valid after mcbsp4_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp4_dr valid after mcbsp4_clkx active edge Table 6-78. McBSP4 Switching Characteristics - Falling Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp4_clkx active edge to mcbsp4_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 16.6 0.2 16.6 UNIT ns Table 6-79. McBSP4 Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 B6 168 tsu(FSXVCLKXAE) th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp4_fsx valid before mcbsp4_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 3.7 3.7 ns Hold time, mcbsp4_fsx valid after mcbsp4_clkx active edge Half Cycle Slave 5.2 5.2 ns Full Cycle Slave 1.0 1.0 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-80. McBSP4 Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX UNIT B2 td(CLKXAEFSXV) Delay time, mcbsp4_clkx active edge to mcbsp4_fsx valid 0.2 16.6 0.2 16.6 ns B8 td(CLKXAEDXV) Delay time, mcbsp4_clkx active edge to mcbsp4_dx valid Master 0.6 16.6 0.6 16.6 ns Slave 0.6 17.3 0.6 17.3 ns 6.6.1.1.5 McBSP5 Table 6-81 through Table 6-88 list the timing conditions and switching characteristics for McBSP5. Table 6-81. McBSP5 Timing Requirements - Rising Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FSVCLKXAE) th(CLKXAEFSV) Setup time, mcbsp5_dr valid before mcbsp5_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 5.6 5.6 ns Full Cycle Slave 5.8 5.8 ns Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp5_fsx valid before mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp5_fsx valid after mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp5_dr valid after mcbsp5_clkx active edge Table 6-82. McBSP5 Switching Characteristics - Rising Edge and Receive Mode No. B2 PARAMETER td(CLKXAEFSXV) VDDSHV = 3.3V Delay time, mcbsp5_clkx active edge to mcbsp5_fsx valid VDDSHV = 1.8V MIN MAX MIN MAX 0.2 14.8 0.7 14.8 UNIT ns Table 6-83. McBSP5 Timing Requirements - Rising Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 tsu(FSXVCLKXAE) Setup time, mcbsp5_fsx valid before mcbsp5_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 169 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-83. McBSP5 Timing Requirements - Rising Edge and Transmit Mode (continued) No. B6 PARAMETER th(CLKXAEFSXV) Hold time, mcbsp5_fsx valid after mcbsp5_clkx active edge VDDSHV = 3.3V VDDSHV = 1.8V UNIT Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Table 6-84. McBSP5 Switching Characteristics - Rising Edge and Transmit Mode No. PARAMETER B2 td(CLKXAEFSXV) Delay time, mcbsp5_clkx active edge to mcbsp5_fsx valid B8 td(CLKXAEDXV) Delay time, mcbsp5_clkx active edge to mcbsp5_dx valid VDDSHV = 3.3V VDDSHV = 1.8V UNIT MIN MAX MIN MAX 0.2 14.8 0.2 14.8 ns Master 0.6 14.8 0.6 14.8 ns Slave 0.6 14.8 0.6 14.8 ns Table 6-85. McBSP5 Timing Requirements - Falling Edge and Receive Mode No. PARAMETER VDDSHV = 3.3V MIN B3 B4 B5 B6 tsu(DRVCLKXAE) th(CLKXAEDRV) tsu(FXSVCLKXAE) th(CLKXAEFSXV) Setup time, mcbsp5_dr valid before mcbsp5_clkx active edge MAX VDDSHV = 1.8V MIN UNIT MAX Half Cycle Master 7.5 7.5 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 5.6 5.6 ns Full Cycle Slave 5.8 5.8 ns Half Cycle Master 8.3 8.3 ns Half Cycle Slave 7.7 7.7 ns Full Cycle Master 1.5 1.5 ns Full Cycle Slave 0.9 0.9 ns Setup time, mcbsp5_fsx valid before mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp5_fsx valid after mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Hold time, mcbsp5_dr valid after mcbsp5_clkx active edge Table 6-86. McBSP5 Switching Characteristics - Falling Edge and Receive Mode No. B2 170 PARAMETER td(CLKXAEFSXV) Delay time, mcbsp5_clkx active edge to mcbsp5_fsx valid VDDSHV = 3.3V VDDSHV = 1.8V MIN MAX MIN MAX 0.2 22.2 0.2 22.2 UNIT ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-87. McBSP5 Timing Requirements - Falling Edge and Transmit Mode No. PARAMETER VDDSHV = 3.3V MIN B5 tsu(FSXVCLKXAE) B6 th(CLKXAEFSXV) MAX VDDSHV = 1.8V MIN UNIT MAX Setup time, mcbsp5_fsx valid before mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 5.8 5.8 ns Hold time, mcbsp5_fsx valid after mcbsp5_clkx active edge Half Cycle Slave 7.7 7.7 ns Full Cycle Slave 1.0 1.0 ns Table 6-88. McBSP5 Switching Characteristics - Falling Edge and Transmit Mode No. PARAMETER B2 td(CLKXAEFSXV) Delay time, mcbsp5_clkx active edge to mcbsp5_fsx valid B8 td(CLKXAEDXV) Delay time, mcbsp5_clkx active edge to mcbsp5_dx valid VDDSHV = 3.3V VDDSHV = 1.8V UNIT MIN MAX MIN MAX 0.2 22.2 0.2 22.2 ns Master 0.6 22.2 0.6 22.2 ns Slave 0.6 22.2 0.6 22.2 ns 6.6.1.1.6 McBSP in TDM Mode Table 6-89 through Table 6-91 assume testing over the recommended operating conditions. Table 6-89. McBSP Timing Conditions – TDM in Multipoint Mode PARAMETER DESCRIPTION VDDSHV = 1.8V or 3.3V MIN MAX UNIT tr Input signal rise time 1 8.5 ns tf Input signal fall time 1 8.5 ns Cload Output load capacitance 40 pf Table 6-90. McBSP Timing Requirements — TDM in Multipoint Mode INDEX PARAMETER DESCRIPTION VDDSHV = 1.8V or 3.3V MIN UNIT MAX tw(CLKH) Cycle Time, mcbspx_clkx 162.8 ns tw(CLKH) Typical Pulse duration, mcbspx_clkx high 81.4 ns tw(CLKL) Typical Pulse duration, mcbspx_clkx low 81.4 tdc(CLK) Duty cycle error, mcbspx_clkx -8.14 B3 tsu(DRV-CLKAE) Setup time, mcbspx_dr valid before mcbspx_clkx active edge 9 ns B4 th(CLKAE-DRV) Hold time, mcbspx_dr valid after mcbspx_clkx active edge 2.4 ns B5 tsu(FSV-CLKAE) Setup time, mcbspx_fsx valid before mcbspx_clkx active edge 9 ns B6 th(CLKAE-FSV) Hold time, mcbspx_fsx valid after mcbspx_clkx active edge 2.4 ns Copyright © 2009–2014, Texas Instruments Incorporated ns 8.14 ns Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 171 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-91. McBSP Switching Characteristics — TDM in Multipoint Mode INDEX PARAMETER B8 td(CLKXAE-DXV) DESCRIPTION VDDSHV = 1.8V or 3.3V Delay time, mcbspx_clkx active edge to mcbspx_dx valid MIN MAX 0.6 16.8 UNIT ns 6.6.1.1.7 McBSP Timing Diagrams mcbspx_clkr B2 B2 mcbspx_fsr B3 mcbspx_dr B4 D7 D5 D6 030-068 Figure 6-37. McBSP Rising Edge Receive Timing in Master Mode mcbspx_clkr B5 B6 mcbspx_fsr B3 mcbspx_dr B4 D7 D6 D5 030-069 Figure 6-38. McBSP Rising Edge Receive Timing in Slave Mode mcbspx_clkx B2 B2 mcbspx_fsx B8 mcbspx_dx D7 D6 D5 030-070 Figure 6-39. McBSP Rising Edge Transmit Timing in Master Mode mcbspx_clkx B5 B6 mcbspx_fsx B8 mcbspx_dx D7 D6 D5 030-071 Figure 6-40. McBSP Rising Edge Transmit Timing in Slave Mode mcbspx_clkr B2 B2 mcbspx_fsr B3 mcbspx_dr B4 D7 D6 D5 030-072 Figure 6-41. McBSP Falling Edge Receive Timing in Master Mode 172 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 mcbspx_clkr B5 B6 mcbspx_fsr B3 mcbspx_dr B4 D7 D6 D5 030-073 Figure 6-42. McBSP Falling Edge Receive Timing in Slave Mode mcbspx_clkx B2 B2 mcbspx_fsx B8 mcbspx_dx D7 D6 D5 030-074 Figure 6-43. McBSP Falling Edge Transmit Timing in Master Mode mcbspx_clkx B5 B6 mcbspx_fsx B8 mcbspx_dx D7 D6 D5 030-075 Figure 6-44. McBSP Falling Edge Transmit Timing in Slave Mode Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 173 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6.2 www.ti.com Multichannel Serial Port Interface (McSPI) Timing The multichannel SPI is a master/slave synchronous serial bus. The McSPI1 module supports up to four peripherals and the others (McSPI2, McSPI3, and McSPI4) support up to two peripherals. The following timings are applicable to the different configurations of McSPI in master/slave mode for any McSPI and any channel (n). 6.6.2.1 McSPI in Slave Mode Table 6-92 and Table 6-93 assume testing over the recommended operating conditions. Table 6-92. McSPI Interface Timing Requirements – Slave Mode NO. PARAMETER 1.8 V MIN 3.3 V MAX SS0 tc(CLK) Cycle time, mcspix_clk 41.67 SS1 tw(CLK) Pulse duration, mcspix_clk high or low 18.75 SS2 tsu(SIMOV-CLKAE) Setup time, mcspix_simo valid before mcspix_clk active edge 4.2 SS3 th(SIMOV-CLKAE) Hold time, mcspix_simo valid after mcspix_clk active edge SS4 tsu(CS0V-CLKFE) SS5 th(CS0I-CLKLE) ns 11.25 ns 4 ns 4.6 3 ns Setup time, mcspix_cs0 valid before mcspix_clk first edge 13.8 7 ns Hold time, mcspix_cs0 invalid after mcspix_clk last edge 13.8 9.17 ns PARAMETER SS6 td(CLKAE-SOMIV) Delay time, mcspix_clk active edge to mcspix_somi shifted SS7 td(CS0AE-SOMIV) Delay time, mcspix_cs0 active edge to Modes 0 and 2 mcspix_somi shifted (1) (2) (3) (4) 174 UNIT MAX 41.67 22.92 Table 6-93. McSPI Interface Switching Characteristics (1) NO. MIN (2) (3) (4) 1.8 V 3.3 V UNIT MIN MAX MIN MAX 1.8 15.9 2 16.5 ns 15.9 ns 16.38 The capacitive load is equivalent to 20 pF. In mcspix, x is equal to 1, 2, 3, or 4. The polarity of mcspix_clk and the active edge (rising or falling) on which mcspix_simo is driven and mcspix_somi is latched is all software configurable. This timing applies to all configurations regardless of mcspix_clk polarity and which clock edges are used to drive output data and capture input data. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Mode 0 & 2 mcspix_cs0(EPOL=1) SS0 SS4 SS5 SS1 mcspix_clk(POL=0) SS0 SS1 mcspix_clk(POL=1) SS2 SS3 mcspix_simo Bit n-1 Bit n-2 SS7 mcspix_somi Bit n-3 Bit n-4 Bit 0 SS6 Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0 Mode 1 & 3 mcspix_cs0(EPOL=1) SS0 SS1 mcspix_clk(POL=0) SS0 SS4 SS1 SS5 mcspix_clk(POL=1) SS3 SS2 Bit n-1 mcspix_simo Bit n-2 Bit n-3 Bit 1 Bit 0 SS6 Bit n-1 mcspix_somi Bit n-2 Bit n-3 Bit 1 Bit 0 030-076 Figure 6-45. McSPI Interface Transmit and Receive in Slave Mode(1) (2) (1) The active clock edge (rising or falling) on which mcspi_somi is driven and mcspi_simo data is latched is software configurable with the bit MSPI_CHCONFx[0] = PHA and the bit MSPI_CHCONFx[1] = POL. (2) The polarity of mcspix_csi is software configurable with the bit MSPI_CHCONFx[6] = EPOL In mcspix, x is equal to 1, 2, 3, or 4. 6.6.2.2 McSPI in Master Mode Table 6-94 and Table 6-95 assume testing over the recommended operating conditions. Table 6-94. McSPI1, 2, and 4 Interface Timing Requirements – Master Mode (1) NO. PARAMETER 1.8 V MIN (2) 3.3 V MAX MIN UNIT MAX SM2 tsu(SOMIV-CLKAE) Setup time, mcspix_somi valid before mcspix_clk active edge 2.56 4 ns SM3 th(SOMIV-CLKAE) Hold time, mcspix_somi valid after mcspix_clk active edge 2.93 4 ns (1) (2) The input timing requirements are given by considering a rise time and a fall time of 4 ns. In mcspix, x is equal to 1, 2, 3, or 4. In mcspix_csn, n is equal to 0, 1, 2, or 3 for x equal to 1, n is equal to 0 or 1 for x equal to 2 and 3. n is equal to 0 for x equal to 4. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 175 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-95. McSPI1, 2, and 4 Interface Switching Characteristics – Master Mode (1) NO. PARAMETER 1.8 V MIN SM0 tc(CLK) Cycle time, mcspix_clk 20.83 tj(CLK) Cycle jitter (4), mcspix_clk -200 SM1 tw(CLK) Pulse duration, mcspix_clk high or low 0.45P SM4 td(CLKAE-SIMOV) Delay time, mcspix_clk active edge to mcspix_simo shifted -2.1 SM5 td(CSnA-CLKFE) Delay time, mcspix_csi active to mcspix_clk first edge SM6 SM7 (1) (2) (3) (4) (5) (6) (7) td(CLKLE-CSnI) Delay time, mcspix_clk last edge to mcspix_csi inactive td(CSnAE-SIMOV) Delay time, mcspix_csi active edge to mcspix_simo shifted (5) (2) (3) 3.3 V MAX MIN UNIT MAX 20.83 200 0.55P ns -200 (5) 0.45P 5 200 (5) 0.55P ps (5) ns -3 6 ns Modes 1 and 3 A (6) - 3.2 A (6) - 3.0 6 ns Modes 0 and 2 B (7) - 3.2 B (7) -3.0 6 ns Modes 1 and 3 B (7) - 3.2 B (7) - 3.0 ns Modes 0 and 2 A (6) - 3.2 A (6) - 3.0 ns Modes 0 and 2 5 5 ns Timings are given for a maximum load capacitance of 20 pF for spix_csn signals, 30 pF for spix_clk and spix_simo signals with x = 1 or 2, and 20 pF for spi4_clk and spi4_simo signals. In mcspix, x is equal to 1, 2, 3, or 4. In mcspix_csn, n is equal to 0, 1, 2, or 3 for x equal to 1, n is equal to 0 or 1 for x equal to 2 and 3. n is equal to 0 for x equal to 4. The polarity of mcspix_clk and the active edge (rising or falling) on which mcspix_simo is driven and mcspix_somi is latched is all software configurable. Maximum cycle jitter supported by mcspix_clk input clock. P = mcspix_clk clock period Case P = 20.8 ns, A = (TCS+0.5)*P (TCS is a bit field of MSPI_CHCONFx[26:25] register). Case P > 20.8 ns, A = TCS*P (TCS is a bitfield of MSPI_CHCONFx[26:25] register). For more information, see the Device Multichannel Serial Port Interface (McSPI) Reference Guide [SPRUFV6]. B = TCS*P (TCS is a bit field of MSPI_CHCONFx[26:25] register). For more information, see the Device Multichannel Serial Port Interface (McSPI) Reference Guide [SPRUFV6]. Table 6-96 and Table 6-97 assume testing over the recommended operating conditions. Table 6-96. McSPI 3 Interface Timing Requirements – Master Mode (1) NO. PARAMETER 1.8 V MIN (2) 3.3 V MAX MIN UNIT MAX SM2 tsu(SOMIV-CLKAE) Setup time, mcspi3_somi valid before mcspi3_clk active edge 2.5 4 ns SM3 th(SOMIV-CLKAE) Hold time, mcspi3_somi valid after mcspi3_clk active edge 2.89 4 ns (1) (2) 176 The input timing requirements are given by considering a rise time and a fall time of 4 ns. In mcspi3_csn, n is equal to 0 or 1. The polarity of mcspi3_clk and the active edge (rising or falling) on which mcspi3_simo is driven and mcspi3_somi is latched is all software configurable. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-97. McSPI3 Interface Switching Characteristics – Master Mode (1) NO. PARAMETER 1.8 V MIN SM0 tc(CLK) Cycle time, mcspix_clk 41.67 tj(CLK) Cycle jitter (4) -200 (5) (2) (3) 3.3 V MAX MIN UNIT MAX 41.67 200 (5) tw(CLK) Pulse duration, mcspix_clk high or low 0.45P td(CLKAE-SIMOV) Delay time, mcspix_clk active edge to mcspix_simo shifted -2.1 SM5 td(CSnA-CLKFE) Delay time, mcspix_csi active Modes 1 to mcspix_clk first edge and 3 A (6) - 4.4 A (6) - 3.0 6 ns Modes 0 and 2 B (7) - 4.4 B (7) - 3.0 6 ns Modes 1 and 3 B (7) - 4.4 B (7) - 3.0 ns Modes 0 and 2 A (6) - 4.4 A (6) - 3.0 ns SM7 (1) (2) (3) (4) (5) (6) (7) td(CLKLE-CSnI) td(CSnAE-SIMOV) Delay time, mcspix_clk last edge to mcspix_csi inactive Delay time, mcspix_csi active Modes 0 edge to mcspix_simo shifted and 2 11.3 0.55P ps (5) SM4 11.3 0.45P (5) ns 200 SM1 SM6 0.55P -200 -3 ns ns 5 ns The capacitive load is equivalent to 20 pF. In mcspi3_csn, n is equal to 0 or 1. The polarity of mcspi3_clk and the active edge (rising or falling) on which mcspi3_simo is driven and mcspi3_somi is latched are all software configurable. This timing applies to all configurations regardless of McSPI3_CLK polarity and which clock edges are used to drive output data and capture input data. Maximum cycle jitter supported by mcspix_clk input clock. P = mcspix_clk clock period. Case P = 20.8 ns, A = (TCS + 0.5)*P (TCS is a bit field of MSPI_CHCONFx[26:25] register). Case P > 20.8 ns, A = TCS*P (TCS is a bit field of MSPI_CHCONFx[26:25] register). For more information, see the Device Multichannel Serial Port Interface (McSPI) Reference Guide [SPRUFV6]. B = TCS*P (TCS is a bit field of MSPI_CHCONFx[26:25] register). For more information, see the Device Multichannel Serial Port Interface (McSPI) Reference Guide [SPRUFV6]. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 177 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 mcspix_csn(EPOL=1) www.ti.com Mode 0 & 2 SM0 SM5 SM6 SM1 mcspix_clk(POL=0) SM0 SM1 mcspix_clk(POL=1) SM4 SM7 mcspix_simo Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0 SM2 SM3 mcspix_somi Bit n-1 Bit n-2 Bit n-3 Bit 0 Bit n-4 Mode 1 & 3 mcspix_csn(EPOL=1) SM0 SM1 mcspix_clk(POL=0) SM0 SM1 SM5 SM6 mcspix_clk(POL=1) SM4 mcspix_simo Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit 0 SM2 SM3 mcspix_somi Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit 0 030-077 Figure 6-46. McSPI Interface Transmit and Receive in Master Mode(1) (2) (3) (1) The active clock edge (rising or falling) on which mcspix_simo is driven and mcspi_somi data is latched is software configurable with the bit MSPI_CHCONFx[0] = PHA and the bit MSPI_CHCONFx[1] = POL. (2) The polarity of mcspix_csi is software configurable with the bit MSPI_CHCONFx[6] = EPOL. (3) In mcspix, x is equal to 1. In mcspix_csn, n is equal to 0, 1, 2, or 3. 178 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.6.3 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Multiport Full-Speed Universal Serial Bus (USB) Interface The AM3517/05 microprocessor provides three USB ports working in full- and low-speed data transactions (up to 12Mbit/s). Connected to either a serial link controller or a serial PHY (PHY interface modes) it supports: • 6-pin (Tx: Dat/Se0 or Tx: Dp/Dm) unidirectional mode • 4-pin bidirectional mode • 3-pin bidirectional mode 6.6.3.1 Multiport Full-Speed Universal Serial Bus (USB) – Unidirectional Standard 6-pin Mode Table 6-98 through Table 6-100 assume testing over the recommended operating conditions. Table 6-98. Low-/Full-Speed USB Timing Conditions Unidirectional Standard 6-pin Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT Input Conditions tR Input signal rise time 2.0 ns tF Input signal fall time 2.0 ns Output load capacitance 15.0 pF Output Conditions CLOAD Table 6-99. Low-/Full-Speed USB Timing Requirements Unidirectional Standard 6-pin Mode NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX FSU1 td(Vp,Vm) Time duration, mmx_rxdp and mmx_rxdm low together during transition 14.0 ns FSU2 td(Vp,Vm) Time duration, mmx_rxdp and mmx_rxdm high together during transition 8.0 ns FSU3 td(RCVU0) Time duration, mmx_rrxcv undefine during a single end 0 (mmx_rxdp and mmx_rxdm low together) 14.0 ns FSU4 td(RCVU1) Time duration, mmx_rxrcv undefine during a single end 1 (mmx_rxdp and mmx_rxdm high together) 8.0 ns Table 6-100. Low-/Full-Speed USB Switching Characteristics Unidirectional Standard 6-pin Mode NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX FSU5 td(TXENL-DATV) Delay time, mmx_txen_n low to mmx_txdat valid 81.8 84.8 ns FSU6 td(TXENL-SE0V) Delay time, mmx_txen_n low to mmx_txse0 valid 81.8 84.8 ns FSU7 ts(DAT-SE0) Skew between mmx_txdat and mmx_txse0 transition 1.5 ns FSU8 td(DATI-TXENH) Delay time, mmx_txdat invalid to mmx_txen_n high 81.8 FSU9 td(SE0I-TXENH) Delay time, mmx_txse0 invalid to mmx_txen_n high 81.8 tR(do) Rise time, mmx_txen_n 4.0 ns tF(do) Fall time, mmx_txen_n 4.0 ns tR(do) Rise time, mmx_txdat 4.0 ns tF(do) Fall time, mmx_txdat 4.0 ns tR(do) Rise time, mmx_txse0 4.0 ns tF(do) Fall time, mmx_txse0 4.0 ns Copyright © 2009–2014, Texas Instruments Incorporated ns ns Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 179 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Transmit mmx_txen_n FSU5 Receive FSU8 mmx_txdat FSU6 FSU7 FSU9 mmx_txse0 FSU1 FSU2 FSU1 FSU2 FSU3 FSU4 mmx_rxdp mmx_rxdm mmx_rxrcv 030-080 In mmx, x is equal to 0, 1, or 2. Figure 6-47. Low-/Full-Speed USB Unidirectional Standard 6-pin Mode 6.6.3.2 Multiport Full-Speed Universal Serial Bus (USB) – Bidirectional Standard 4-pin Mode Table 6-101 through Table 6-103 assume testing over the recommended operating conditions. Table 6-101. Low-/Full-Speed USB Timing Conditions Bidirectional Standard 4-pin Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT Input Conditions tR Input signal rise time 2.0 ns tF Input signal fall time 2.0 ns Output load capacitance 15.0 pF Output Conditions CLOAD Table 6-102. Low-/Full-Speed USB Timing Requirements Bidirectional Standard 4-pin Mode NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX FSU10 td(DAT,SE0) Time duration, mmx_txdat and mmx_txse0 low together during transition 14.0 ns FSU11 td(DAT,SE0) Time duration, mmx_txdat and mmx_txse0 high together during transition 8.0 ns FSU12 td(RCVU0) Time duration, mmx_rrxcv undefine during a single end 0 (mmx_txdat and mmx_txse0 low together) 14.0 ns FSU13 td(RCVU1) Time duration, mmx_rxrcv undefine during a single end 1 (mmx_txdat and mmx_txse0 high together) 8.0 ns Table 6-103. Low-/Full-Speed USB Switching Characteristics Bidirectional Standard 4-pin Mode NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX FSU14 td(TXENL-DATV) Delay time, mmx_txen_n low to mmx_txdat valid 81.8 84.8 ns FSU15 td(TXENL-SE0V) Delay time, mmx_txen_n low to mmx_txse0 valid 81.8 84.8 ns FSU16 ts(DAT-SE0) Skew between mmx_txdat and mmx_txse0 transition 1.5 ns FSU17 td(DATV-TXENH) Delay time, mmx_txdat invalid before mmx_txen_n high 81.8 FSU18 td(SE0V-TXENH) Delay time, mmx_txse0 invalid before mmx_txen_n high 81.8 tR(txen) Rise time, mmx_txen_n 180 ns ns 4.0 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-103. Low-/Full-Speed USB Switching Characteristics Bidirectional Standard 4-pin Mode (continued) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX tF(txen) Fall time, mmx_txen_n 4.0 ns tR(dat) Rise time, mmx_txdat 4.0 ns tF(dat) Fall time, mmx_txdat 4.0 ns tR(se0) Rise time, mmx_txse0 4.0 ns tF(se0) Fall time, mmx_txse0 4.0 ns Transmit mmx_txen_n FSU14 FSU17 Receive FSU10 FSU11 FSU18 FSU10 FSU11 FSU12 FSU13 mmx_txdat FSU15 FSU16 mmx_txse0 mmx_rxrcv 030-081 In mmx, x is equal to 0, 1, or 2. Figure 6-48. Low-/Full-Speed USB Bidirectional Standard 4-pin Mode 6.6.3.3 Multiport Full-Speed Universal Serial Bus (USB) – Bidirectional Standard 3-pin Mode Table 6-104 through Table 6-106 assume testing over the recommended operating conditions. Table 6-104. Low-/Full-Speed USB Timing Conditions Bidirectional Standard 3-pin Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT Input Conditions tR Input signal rise time 2.0 ns tF Input signal fall time 2.0 ns Output load capacitance 15.0 pF Output Conditions CLOAD Table 6-105. Low-/Full-Speed USB Timing Requirements Bidirectional Standard 3-pin Mode NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX FSU19 td(DAT,SE0) Time duration, mmx_txdat and mmx_txse0 low together during transition 14.0 ns FSU20 td(DAT,SE0) Time duration, mmx_tsdat and mmx_txse0 high together during transition 8.0 ns Table 6-106. Low-/Full-Speed USB Switching Characteristics Bidirectional Standard 3-pin Mode NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX FSU21 td(TXENL-DATV) Delay time, mmx_txen_n low to mmx_txdat valid 81.8 84.8 ns FSU22 td(TXENL-SE0V) Delay time, mmx_txen_n low to mmx_txse0 valid 81.8 84.8 ns FSU23 ts(DAT-SE0) Skew between mmx_txdat and mmx_txse0 transition 1.5 ns Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 181 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-106. Low-/Full-Speed USB Switching Characteristics Bidirectional Standard 3-pin Mode (continued) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX FSU24 td(DATI-TXENH) Delay time, mmx_txdat invalid to mmx_txen_n high 81.8 FSU25 td(SE0I-TXENH) Delay time, mmx_txse0 invalid to mmx_txen_n high 81.8 tR(do) Rise time, mmx_txen_n 4.0 ns tF(do) Fall time, mmx_txen_n 4.0 ns tR(do) Rise time, mmx_txdat 4.0 ns tF(do) Fall time, mmx_txdat 4.0 ns tR(do) Rise time, mmx_txse0 4.0 ns tF(do) Fall time, mmx_txse0 4.0 ns Transmit mmx_txen_n FSU21 ns ns Receive FSU24 FSU19 FSU20 FSU25 FSU19 FSU20 mmx_txdat FSU22 FSU23 mmx_txse0 030-082 In mmx, x is equal to 0, 1, or 2. Figure 6-49. Low-/Full-Speed USB Bidirectional Standard 3-pin Mode 6.6.4 Multiport High-Speed Universal Serial Bus (USB) Timing In addition to the full-speed USB controller, a high-speed (HS) USB controller is instantiated inside the AM3517/05. It allows high-speed transactions (up to 480 Mbit/s) on the USB ports 1 and 2. • Port 1 and port 2: – 12-bit master mode (SDR) 6.6.4.1 High-Speed Universal Serial Bus (USB) on Ports 1 and 2 12-bit Master Mode Table 6-107 through Table 6-109 assume testing over the recommended operating conditions. Table 6-107. High-Speed USB Timing Conditions 12-bit Master Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT tR Input signal rise time 2 ns tF Input signal fall time 2 ns Output load capacitance 3 pF Input Conditions Output Conditions CLOAD Table 6-108. High-Speed USB Timing Requirements 12-bit Master Mode (1) NO. PARAMETER 1.8V, 3.3V MIN HSU3 HSU4 (1) 182 UNIT MAX ts(DIRV-CLKH) Setup time, hsusbx_dir valid before hsusbx_clk rising edge 7.5 ns ts(NXTV-CLKH) Setup time, hsusbx_nxt valid before hsusbx_clk rising edge 7.5 ns th(CLKH-DIRIV) Hold time, hsusbx_dir valid after hsusbx_clk rising edge 0.2 ns In hsusbx, x is equal to 1 or 2. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-108. High-Speed USB Timing Requirements 12-bit Master Mode(1) (continued) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX th(CLKH-NXT/IV) Hold time, hsusbx_nxt valid after hsusbx_clk rising edge 0.2 ns HSU5 ts(DATAV-CLKH) Setup time, hsusbx_data[0:7] valid before hsusbx_clk rising edge 7.5 ns HSU6 th(CLKH-DATIV) Hold time, hsusbx_data[0:7] valid after hsusbx_clk rising edge 0.2 ns Table 6-109. High-Speed USB Switching Characteristics 12-bit Master Mode (1) N O. PARAMETER 1.8V, 3.3V MIN HSU0 HSU1 HSU2 (1) (2) UNIT MAX fp(CLK) hsusbx_clk clock frequency 60 MHz tj(CLK) Jitter standard deviation (2), hsusbx_clk 200 ps td(CLKH-STPV) Delay time, hsusbx_clk high to output hsusbx_stp valid 13 ns td(CLKH-STPIV) Delay time, hsusbx_clk high to output hsusbx_stp invalid td(CLKH-DV) Delay time, hsusbx_clk high to output hsusbx_data[0:7] valid td(CLKH-DIV) Delay time, hsusbx_clk high to output hsusbx_data[0:7] invalid tR(do) Rise time, output signals 2 ns tF(do) Fall time, output signals 2 ns 2 ns 13 2 ns ns In hsusbx, x is equal to 1 or 2. The jitter probability density can be approximated by a Gaussian function. HSU0 hsusbx_clk HSU1 HSU1 hsusbx_stp HSU3 HSU4 hsusbx_dir_&_nxt HSU5 HSU2 hsusbx_data[7:0] HSU2 Data_OUT HSU6 Data_IN 030-087 In hsusbx, x is equal to 1 or 2. Figure 6-50. High-Speed USB 12-bit Master Mode Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 183 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6.5 www.ti.com USB0 OTG (USB2.0 OTG) The AM3517/05 USB2.0 peripheral supports the following features: • USB 2.0 peripheral at speeds high speed (HS: 480 Mb/s) and full speed (FS: 12 Mb/s) • USB 2.0 host at speeds HS, FS, and low speed (LS: 1.5 Mb/s) • All transfer modes (control, bulk, interrupt, and isochronous) • 16 Transmit (TX) and 16 Receive (RX) endpoints in addition to endpoint 0 • FIFO RAM – 32K endpoint – Programmable size • Integrated USB 2.0 High Speed PHY • Connects to a standard Charge Pump for VBUS 5 V generation • RNDIS mode for accelerating RNDIS type protocols using short packet termination over USB 6.6.5.1 USB OTG Electrical Parameters The USB OTG electrical parameters meet or exceed those specified in the following documents which can be obtained from the USB Implementers Forum: • Universal Serial Bus Specification, Revision 2.0, April 27, 2000 • On-The-Go Supplement to the USB 2.0 Specification, Revision 1.3, December 5, 2006 • Engineering Change Notice “Pull-up/pull-down resistors”, Universal Serial Bus Specification Revision 2.0 For additional information related to USB OTG electrical parameters, please see the respective documents on the USB Implementers Forum web site (http://www.usb.org). 184 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.6.6 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 High-End Controller Area Network Controller (HECC) Timing The AM3517/05 device has a High-End Controller Area Network Controller (HECC). The HECC uses established protocol to communicate serially with other controllers in harsh environments. The HECC is fully compliant with the Controller Area Network (CAN) protocol, version 2.0B. Key features of the HECC include the following: • CAN, version 2.0B compliant • 32 RX/TX message objects • 32 receive identifier masks • Programmable wake-up on bus activity • Programmable interrupt scheme • Automatic reply to a remote request • Automatic re-transmission in case of error or loss of arbitration • Protection against reception of a new message • 32-bit time stamp • Local network time counter • Programmable priority register for each message • Programmable transmission and reception time-out • HECC/SCC mode of operation • Standard-Extended Identifier • Self-test mode 6.6.6.1 HECC Timing Requirements Table 6-110. Timing Requirements for HECC Receive (see Figure 6-51) 1.8 V, 3.3 V NO. (1) 1 f(baud) Maximum programmable baud rate 2 tw(HECC_RX) Pulse duration, receive data bit MIN MAX H-1 (1) H+3 (1) 1 UNIT Mbps ns These values are relative to H (where H = 1/(baud rate). 6.6.6.2 HECC Switching Characteristics Table 6-111. Switching Characteristics Over Recommended Operating Conditions for HECC Transmit (see Figure 6-51) NO. (1) 1.8 V, 3.3 V PARAMETER 3 f(baud) Maximum programmable baud rate 4 tw(HECC_TX) Pulse duration, transmit data bit MIN UNIT MAX 1 H-1 (1) H+3 (1) Mbps ns These values are relative to H (where H = 1/(baud rate). 2 HECCx_RX 4 HECCx_TX Figure 6-51. HECC Transmit/Receive Timing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 185 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6.7 www.ti.com Ethernet Media Access Controller (EMAC) The Ethernet Media Access Controller (EMAC) provides an efficient interface between the AM3517/05 and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support. The EMAC controls the flow of packet data from the AM3517/05 device to the PHY. The MDIO module controls PHY configuration and status monitoring. Both the EMAC and the MDIO modules interface to the AM3517/05 device through a custom interface that allows efficient data transmission and reception. This custom interface is referred to as the EMAC control module, and is considered integral to the EMAC/MDIO peripheral. The control module is also used to multiplex and control interrupts. 6.6.7.1 EMAC Electrical Data/ Timing Table 6-112 through Table 6-114 assume testing over the recommended operating conditions. Table 6-112. RMII Input Timing Requirements NO. 1.8V, 3.3V PARAMETER fc(REFCLK) Frequency, REF_CLK MIN TYP MAX 50 UNIT MHz ft (REFCLK) Frequency stability, REF_CLK 1 tc(REFCLK) Cycle Time, REF_CLK +/-50 2 tw(REFCLKH) Pulse Width, REF_CLK High 7 13 ns 3 tw(REFCLKL) Pulse Width, REF_CLK Low 7 13 ns 6 tsu(RXD-REFCLK) Input Setup Time, RXD Valid before REF_CLK High 4 ns 7 th(REFCLK-RXD) Input Hold Time, RXD Valid after REF_CLK High 2 ns 8 tsu(CRSDV-REFCLK) Input Setup Time, CRSDV Valid before REF_CLK High 4 ns 9 th(REFCLK-CRSDV) Input Hold Time, CRSDV Valid after REF_CLK High 2 ns 10 tsu(RXER-REFCLK) Input Setup Time, RXER Valid before REF_CLK High 4 ns 11 th(REFCLKR-RXER) Input Hold Time, RXER Valid after REF_CLK High 2 ns 20 ppm ns Table 6-113. RMII Timing Conditions TIMING CONDITION PARAMETER Input Conditions 1.8V, 3.3V UNIT MIN MAX tR Input signal rise time 1 5 ns tF Input signal fall time 1 5 ns 5.5 pF Output Conditions CLOAD Output load capacitance Table 6-114. RMII Output Switching Characteristics NO. 186 PARAMETER 1.8V, 3.3V MIN TYP MAX UNIT 4 td(REFCLK-TXD) Output Delay Time, REF_CLK High to TXD Valid 2.5 13 ns 5 td(REFCLK-TXEN) Output Delay Time, REF_CLK High to TXEN Valid 2.5 13 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 1 2 3 REF_CLK 5 5 TXEN 4 TXD[1:0] 6 7 RXD[1:0] 8 9 CRS_DV 10 11 RXER_IN SPRS550-004 Figure 6-52. RMII Timing Diagram Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 187 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6.8 www.ti.com Management Data Input/Output (MDIO) The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to interrogate and control Ethernet PHY(s) using a shared two-wire bus. Host software uses the MDIO module to configure the auto-negotiation parameters of each PHY attached to the EMAC, retrieve the negotiation results, and configure required parameters in the EMAC module for correct operation. The module is designed to allow almost transparent operation of the MDIO interface, with very little maintenance from the core processor. Only one PHY may be connected at any given time. 6.6.8.1 Management Data Input/Output (MDIO) Electrical Data/Timing Table 6-115. Timing Requirements for MDIO Input (see Figure 6-53 and Figure 6-54) No. PARAMETER MIN MAX UNIT 1 tc(MD_CLK) Cycle time, MD_CLK 400 ns 4 tsu(MDIO-MDCLKH) Setup time, MDIO data input valid before MD_CLK high 20 ns 5 th(MDCLKH-MDIO) Hold time, MDIO data input valid after MDCLK high 0 ns 1 MD_CLK 4 5 MDIO_D (input) Figure 6-53. MDIO Input Timing Table 6-116. Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see Figure 6-54) No. 7 PARAMETER td(MDCLKL-MDIO) Delay time, MDCLK low to MDIO data output valid MIN MAX UNIT 0 100 ns 1 MD_CLK 7 MDIO_D (output) Figure 6-54. MDIO Output Timing 6.6.9 Universal Asynchronous Receiver/Transmitter (UART) The AM3517/05 has four UARTs (one with Infrared Data Association [IrDA] and Consumer Infrared [CIR] modes). 188 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-117. Timing Requirements for UARTx Receive (1) 1.8V, 3.3V NO. (1) MIN MAX UNIT 4 tw(URXDB) Pulse duration, receive data bit (RXDn) .96U 1.05U ns 5 tw(URXSB) Pulse duration, receive start bit .96U 1.05U ns U = UART baud time = 1/programmed baud rate. Table 6-118. Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (1) NO. 1.8V, 3.3V PARAMETER MIN UART0 Maximum programmable baud rate f(baud_15) 5 UART0 Maximum programmable baud rate f(baud_30) 0.23 UNIT 1 f(baud) 2 tw(UTXDB) Pulse duration, transmit data bit, 15/30/100 pF U-2 U+2 ns 3 tw(UTXSB) Pulse duration, transmit start bit, 15/30/100 pF U-2 U+2 ns UART0 Maximum programmable baud rate f(baud_100) (1) MAX mbps 0.115 U = UART baud time = 1/programmed baud rate. 3 2 UART_TXDn Start Bit Data Bits 5 4 UART_RXDn Start Bit Data Bits Figure 6-55. UART Transmit/Receive Timing 6.6.9.1 UART IrDA Interface The IrDA module can operate in three different modes: • Slow infrared (SIR) (≤115.2 Kbits/s) • Medium infrared (MIR) (0.576 Mbits/s and 1.152 Mbits/s) • Fast infrared (FIR) (4 Mbits/s) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 189 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Pulse duration 90% 90% 50% 50% 10% 10% tr tf 030-118 Figure 6-56. UART IrDA Pulse Parameters 6.6.9.1.1 IrDA—Receive Mode Table 6-119. UART IrDA—Signaling Rate and Pulse Duration—Receive Mode SIGNALING RATE ELECTRICAL PULSE DURATION MIN NOMINAL MAX UNIT SIR 2.4 Kbit/s 1.41 78.1 88.55 μs 9.6 Kbit/s 1.41 19.5 22.13 μs 19.2 Kbit/s 1.41 9.75 11.07 μs 38.4 Kbit/s 1.41 4.87 5.96 μs 57.6 Kbit/s 1.41 3.25 4.34 μs 115.2 Kbit/s 1.41 1.62 2.23 μs MIR 0.576 Mbit/s 297.2 416 518.8 ns 1.152 Mbit/s 149.6 208 258.4 ns 4.0 Mbit/s (Single pulse) 67 125 164 ns 4.0 Mbit/s (Double pulse) 190 250 289 ns FIR Table 6-120. UART IrDA—Rise and Fall Time—Receive Mode 190 PARAMETER MAX UNIT tR Rising time, uart3_rx_irrx 200 ns tF Falling time, uart3_rx_irrx 200 ns Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 6.6.9.1.2 IrDA—Transmit Mode Table 6-121. UART IrDA—Signaling Rate and Pulse Duration—Transmit Mode SIGNALING RATE ELECTRICAL PULSE DURATION MIN NOMINAL UNIT MAX SIR 2.4 Kbit/s 78.1 78.1 78.1 μs 9.6 Kbit/s 19.5 19.5 19.5 μs 19.2 Kbit/s 9.75 9.75 9.75 μs 38.4 Kbit/s 4.87 4.87 4.87 μs 57.6 Kbit/s 3.25 3.25 3.25 μs 115.2 Kbit/s 1.62 1.62 1.62 μs 0.576 Mbit/s 414 416 419 ns 1.152 Mbit/s 206 208 211 ns 4.0 Mbit/s (Single pulse) 123 125 128 ns 4.0 Mbit/s (Double pulse) 248 250 253 ns MIR FIR 6.6.10 HDQ / 1-Wire Interfaces This module is intended to work with both the HDQ and the 1-Wire protocols. The protocols use a single wire to communicate between the master and the slave. The protocols employ an asynchronous return to 1 mechanism where, after any command, the line is pulled high. 6.6.10.1 HDQ Protocol Table 6-122 and Table 6-123 assume testing over the recommended operating conditions (see Figure 657 through Figure 6-60). Table 6-122. HDQ Timing Requirements PARAMETER DESCRIPTION MIN tCYCD Bit window 253 tHW1 Reads 1 tHW0 Reads 0 tRSPS Command to host respond time (1) (1) MAX UNIT s 68 180 Defined by software. Table 6-123. HDQ Switching Characteristics PARAMETER DESCRIPTION tB Break timing MIN TYP tBR Break recovery 63 tCYCH Bit window 253 tDW1 Sends1 (write) 1.3 tDW0 Sends0 (write) 101 MAX UNIT 193 tB s tBR HDQ 030-095 Figure 6-57. HDQ Break (Reset) Timing Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 191 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com tCYCH tHW0 tHW1 HDQ 030-096 Figure 6-58. HDQ Read Bit Timing (Data) tCYCD tDW0 tDW1 HDQ 030-097 Figure 6-59. HDQ Write Bit Timing (Command/Address or Data) Command _byte_written Data_byte_received 0_(LSB ) Break 1 tRSPS 6 1 7_(MSB) 0_(LSB) 6 HDQ 030-098 Figure 6-60. HDQ Communication Timing 6.6.10.2 1-Wire Protocol Table 6-124 and Table 6-125 assume testing over the recommended operating conditions (see Figure 661 through Figure 6-63). Table 6-124. 1-Wire Timing Requirements PARAMETER DESCRIPTION tPDH Presence pulse delay high tPDL Presence pulse delay low tRDV + tREL Read bit-zero time MIN MAX UNIT 68 s 68 tPDH 102 Table 6-125. 1-Wire Switching Characteristics PARAMETER DESCRIPTION tRSTL Reset time low MIN TYP 484 tRSTH Reset time high 484 tSLOT Write bit cycle time 102 tLOW1 Write bit-one time 1.3 tLOW0 Write bit-zero time 101 tREC Recovery time 134 tLOWR Read bit strobe time 13 MAX UNIT s tRSTH 1-WIRE tRTSL tPDH tPDL 030-099 Figure 6-61. 1-Wire Break (Reset) Timing 192 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 tSLOT_and_ tREC tRDV_and_ tREL 1-WIRE tLOWR 030-100 Figure 6-62. 1-Wire Read Bit Timing (Data) tSLOT_and_tREC tLOW0 1-WIRE tLOW1 030-101 Figure 6-63. 1-Wire Write Bit Timing (Command/Address or Data) Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 193 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 6.6.11 I2C Interface The multimaster I2C peripheral provides an interface between two or more devices via an I2C serial bus. The I2C controller supports the multimaster mode which allows more than one device capable of controlling the bus to be connected to it. Each I2C device is recognized by a unique address and can operate as either transmitter or receiver, according to the function of the device. In addition to being a transmitter or receiver, a device connected to the I2C bus can also be considered as master or slave when performing data transfers. This data transfer is carried out via two serial bidirectional wires: • An SDA data line • An SCL clock line The following sections illustrate the data transfer is in master or slave configuration with 7-bit addressing format. The I2C interface is compliant with Philips I2C specification version 2.1. It supports standard mode (up to 100K bits/s), fast mode (up to 400K bits/s) and high-speed mode (up to 3.4Mb/s) . 6.6.11.1 I2C Standard/Fast-Speed Mode Table 6-126. I2C Standard/Fast-Speed Mode Timings 1.8V, 3.3-V PARAMETER (1) NO. STANDARD MODE MIN MAX FAST MODE MIN MAX fSCL Clock Frequency, i2cX_scl I1 tw(SCLH) Pulse Duration, i2cX_scl high I2 tw(SCLL) Pulse Duration, i2cX_scl low 4.7 1.3 s I3 tsu(SDAV-SCLH) Setup time, i2cX_sda valid before i2cX_scl active level 250 100 (2) ns I4 th(SCLHSDAV) Hold time, i2cX_sda valid after i2cX_scl active level I5 tsu(SDAL-SCLH) Setup time, i2cX_scl high after i2cX_sda low (for a START (4) condition or a repeated START condition) I6 th(SCLHSDAH) I7 I8 (1) (2) (3) (4) 194 100 UNIT 4 400 0.6 3.45 (3) kHz s 0.9 (3) s 4.7 0.6 s Hold time, i2cX_sda low level after i2cX_scl high level (STOP condition) 4 0.6 s th(SCLHRSTART) Hold time, i2cX_sda low level after i2cX_scl high level (for a repeated START condition) 4 0.6 s tw(SDAH) Pulse duration, i2cX_sda high between STOP and START conditions 4.7 1.3 s tR(SCL) Rise time, i2cX_scl 1000 300 ns tF(SCL) Fall time, i2cX_scl 300 300 ns tR(SDA) Rise time, i2cX_sda 1000 300 ns tF(SDA) Fall time, i2cX_sda 300 300 ns CB Capacitive load for each bus line 60 60 pF In i2cX, X is equal to 1, 2, or 3. A fast-mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tsu(SDAV-SCLH) 250 ns must then be met. This is automatically the case if the device does not stretch the low period of the i2cx_scl. If such a device does stretch the low period of the i2cx_scl, it must output the next data bit to the i2cx_sda line tr(SDA) max + tsu(SDAV-SCLH) = 1000 + 250 = 1250 ns (according to the standard-mode I2C-bus specification) before the i2cx_scl line is released. The maximum th(SCLH-SDA) has only to be met if the device does not stretch the low period of the i2cx_scl signal. After this time, the first clock is generated. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 START REPEAT START START STOP i2cX_sda I2 I6 I5 I1 I3 I4 I8 I6 I7 i2cX_scl 030-093 2 Figure 6-64. I C Standard/Fast Mode Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 195 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 6.6.11.2 I2C High-Speed Mode Table 6-127. I2C High-Speed Mode Timings (1) (2) 1.8V, 3.3V NO. PARAMETER UNIT MIN I1 fSCL Clock frequency, i2cX_scl tw(SCLH) Pulse duration, i2cX_scl high MAX 3.4 MHz 60 (3) I2 tw(SCLL) Pulse duration, i2cX_scl low I3 tsu(SDAV-SCLH) Setup time, i2cX_sda valid before i2cX_scl active level I4 th(SCLHSDAV) Hold time, i2cX_sda valid after i2cX_scl active level I5 tsu(SDAL-SCLH) Setup time, i2cX_scl high after i2cX_sda low (for a START (4) condition or a repeated START condition) 160 s I6 th(SCLHSDAH) Hold time, i2cX_sda low level after i2cX_scl high level (STOP condition) 160 s I7 th(SCLHRSTART) Hold time, i2cX_sda low level after i2cX_scl high level (for a repeated START condition) 160 ns tR(SCL) Rise time, i2cX_scl 10 40 ns tR(SCL) Rise time, i2cX_scl after a repeated START condition and after a bit acknowledge 10 80 ns tF(SCL) Fall time, i2cX_scl 10 40 ns tR(SDA) Rise time, i2cX_sda 10 80 ns tF(SDA) Fall time, i2cX_sda 10 80 ns (1) (2) 160 s (3) s 10 ns 70 s In i2cX, X is equal to 1, 2, or 3. The device provides (via the I2C bus) a hold time of at least 300 ns for the i2cx_sda signal (refer to the fall and rise time of i2cx_scl) to bridge the undefined region of the falling edge of i2cx_scl. HS-mode master devices generate a serial clock signal with a high to low ratio of 1 to 2. tw(SCLL) > 2 tw(SCLH). After this time, the first clock is generated. (3) (4) START REPEAT STOP i2cX_sda I5 I6 I1 I2 I3 I4 I7 i2cX_scl 030-094 2 Figure 6-65. I C High-Speed Mode(1) (2) (3) (1) HS-mode master devices generate a serial clock signal with a high-to-low ratio of 1 to 2. tw(SCLL) > 2 x tw(SCLH). (2) In i2cX, X is equal to 1, 2, or 3. (3) After this time, the first clock is generated. Table 6-128. Correspondence Standard vs. TI Timing References STANDARD-I2C AM3517/05 196 S/F Mode HS Mode fSCL FSCL FSCLH I1 tw(SCLH) THIGH THIGH I2 tw(SCLL) TLOW TLOW I3 tsu(SDAV-SCLH) TSU;DAT TSU;DAT I4 th(SCLH-SDAV) TSU;DAT TSU;DAT I5 tsu(SDAL-SCLH) TSU;STA TSU;STA I6 th(SCLH-SDAH) THD;STA THD;STA I7 th(SCLH-RSTART) TSU;STO TSU;STO I8 tw(SDAH) TBUF Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.7 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Removable Media Interfaces 6.7.1 High-Speed Multimedia Memory Card (MMC) and Secure Digital IO Card (SDIO) Timing The MMC/SDIO host controller provides an interface to high-speed and standard MMC, SD memory cards, or SDIO cards. The application interface is responsible for managing transaction semantics. The MMC/SDIO host controller deals with MMC/SDIO protocol at transmission level, packing data, adding CRC, start/end bit, and checking for syntactical correctness. There are three MMC interfaces on the AM3517/05: • MMC/SD/SDIO Interface 1: – 1.8-V/3.3-V support – 8 bits • MMC/SD/SDIO Interface 2: – 1.8-V/3.3-V support – 8 bits – 4 bits with external transceiver allowing to support 1.8-V/3.3-V peripherals in 1.8-V mode operation. Transceiver direction control signals are multiplexed with the upper four data bits. • MMC/SD/SDIO Interface 3: – 1.8-V/3.3-V support – 8 bits 6.7.1.1 MMC/SD/SDIO in SD Identification Mode Table 6-129 through Table 6-131 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-129. MMC/SD/SDIO Timing Conditions SD Identification Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT MIN MAX SD Identification Mode Input Conditions tr Input signal rise time 10 ns tf Input signal fall time 10 ns Output Conditions CLOAD Output load capacitance 30 pF Table 6-130. MMC/SD/SDIO Timing Requirements SD Identification Mode (1) NO. PARAMETER (2) (3) (4) 1.8V, 3.3V MIN UNIT MAX SD Identification Mode MMC/SD/SDIO Interface 1 HSSD3/SD3 tsu(CMDV-CLKIH) Setup time, mmc1_cmd valid before mmc1_clk rising clock edge 1198.4 ns HSSD4/SD4 tsu(CLKIH-CMDIV) Hold time, mmc1_cmd valid after mmc1_clk rising clock edge 1249.2 ns Setup time, mmc2_cmd valid before mmc2_clk rising clock edge 1198.4 ns MMC/SD/SDIO Interface 2 HSSD3/SD3 (1) (2) (3) (4) tsu(CMDV-CLKIH) Timing parameters refer to output clock specified in Table 6-131. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified in Table 6-131. Corresponding figures showing timing parameters are common with other interface modes. (See SD and HS SD modes). For more information, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 197 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-130. MMC/SD/SDIO Timing Requirements SD Identification Mode(1) NO. PARAMETER (2) (3)(4) 1.8V, 3.3V MIN HSSD4/SD4 tsu(CLKIH-CMDIV) (continued) UNIT MAX Hold time, mmc2_cmd valid after mmc2_clk rising clock edge 1249.2 ns MMC/SD/SDIO Interface 3 HSSD3/SD3 tsu(CMDV-CLKIH) Setup time, mmc3_cmd valid before mmc3_clk rising clock edge 1198.4 ns HSSD4/SD4 tsu(CLKIH-CMDIV) Hold time, mmc3_cmd valid after mmc3_clk rising clock edge 1249.2 ns Table 6-131. MMC/SD/SDIO Switching Characteristics SD Identification Mode (1) (2) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX SD Identification Mode HSSD1/SD1 tc(clk) Cycle time, output clk period HSSD2/SD2 tW(clkH) Typical pulse duration, output clk high HSSD2/SD2 2500 X (3)*PO (4) Y (5) *PO ns ns (4) tW(clkL) Typical pulse duration, output clk low tdc(clk) Duty cycle error, output clk 125 ns ns tj(clk) Jitter standard deviation, output clk 200 ps tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns td(CLKOH-CMD) Delay time, mmc1_clk rising clock edge to mmc1_cmd transition 2492.7 ns MMC/SD/SDIO Interface 1 HSSD5/SD5 6.3 MMC/SD/SDIO Interface 2 HSSD5/SD5 tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns td(CLKOH-CMD) Delay time, mmc2_clk rising clock edge to mmc2_cmd transition 2492.7 ns 6.3 MMC/SD/SDIO Interface 3 HSSD5/SD5 (1) (2) (3) (4) (5) tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns td(CLKOH-CMD) Delay time, mmc3_clk rising clock edge to mmc3_cmd transition 2492.7 ns 6.3 Corresponding figures showing timing parameters are common with other interface modes (see SD and HS SD modes). The jitter probability density can be approximated by a Gaussian function. The X parameter is defined as listed below. PO = output clk period in ns. The Y parameter is defined as listed below. Table 6-132. X Parameter CLKD X 1 or Even 0.5 Odd (trunc[CLKD/2]+1)/CLKD 198 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-133. Y Parameter CLKD Y 1 or Even 0.5 Odd (trunc[CLKD/2])/CLKD 6.7.1.2 MMC/SD/SDIO in High-Speed MMC Mode Table 6-134 through Table 6-136 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-134. MMC/SD/SDIO Timing Conditions High-Speed MMC Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT MIN MAX High-Speed MMC Mode Input Conditions tr Input signal rise time 0.19 3 ns tf Input signal fall time 0.19 3 ns 30 pF Output Conditions CLOAD Output load capacitance Table 6-135. MMC/SD/SDIO Timing Requirements High-Speed MMC Mode (1) (2) (3) (4) NO. PARAMETER 1.8 V MIN 3.3V MAX MIN UNIT MAX High-Speed MMC Mode MMC/SD/SDIO Interface 1 MMC3 tsu(CMDV-CLKIH) Setup time, mmc1_cmd valid before mmc1_clk rising clock edge 2.13 2.41 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc1_cmd valid after mmc1_clk rising clock edge 3.47 2.09 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc1_datx valid before mmc1_clk rising clock edge 2.13 2.41 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc1_datx valid after mmc1_clk rising clock edge 3.47 2.09 ns MMC/SD/SDIO Interface 2 MMC3 tsu(CMDV-CLKIH) Setup time, mmc2_cmd valid before mmc2_clk rising clock edge 2.88 3.23 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc2_cmd valid after mmc2_clk rising clock edge 2.90 1.46 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc2_datx valid before mmc2_clk rising clock edge 2.88 3.23 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc2_datx valid after mmc2_clk rising clock edge 2.90 1.46 ns MMC/SD/SDIO Interface 3 MMC3 tsu(CMDV-CLKIH) Setup time, mmc3_cmd valid before mmc3_clk rising clock edge 3.38 3.41 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc3_cmd valid after mmc3_clk rising clock edge 2.83 1.46 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc3_datx valid before mmc3_clk rising clock edge 3.38 3.41 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc3_datx valid after mmc3_clk rising clock edge 2.83 1.46 ns (1) (2) (3) (4) In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. Timing parameters refer to output clock specified in Table 6-136. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified in Table 6-136. Corresponding figures showing timing parameters are common with Standard MMC mode. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 199 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-136. MMC/SD/SDIO Switching Characteristics High-Speed MMC Mode (1) (2) N O. PARAMETER 1.8V, 3.3V MIN UNIT MAX High-Speed MMC Mode MMC1 tc(clk) Cycle time, output clk period 20.83 (3) *PO (4) MMC2 tW(clkH) Typical pulse duration, output clk high X MMC2 tW(clkL) Typical pulse duration, output clk low Y (5)*PO (4) tdc(clk) Duty cycle error, output clk tj(clk) Jitter standard deviation, output clk ns ns ns 1041.67 ps 200 ps MMC/SD/SDIO Interface 1 tc(clk) Rise time, output clk 3 ns tW(clkH) Fall time, output clk 3 ns tW(clkL) Rise time, output data 3 ns tdc(clk) Fall time, output data 3 ns MMC5 td(CLKOH-CMD) Delay time, mmc1_clk rising clock edge to mmc1_cmd transition 3.7 14.11 ns MMC6 td(CLKOH-DATx) Delay time, mmc1_clk rising clock edge to mmc1_datx transition 3.7 16.50 ns MMC/SD/SDIO Interface 2 tc(clk) Rise time, output clk 3 ns tW(clkH) Fall time, output clk 3 ns tW(clkL) Rise time, output data 3 ns tdc(clk) Fall time, output data 3 ns MMC5 td(CLKOH-CMD) Delay time, mmc2_clk rising clock edge to mmc2_cmd transition 3.7 14.11 ns MMC6 td(CLKOH-DATx) Delay time, mmc2_clk rising clock edge to mmc2_datx transition 3.7 16.50 ns MMC/SD/SDIO Interface 3 tc(clk) Rise time, output clk 3 ns tW(clkH) Fall time, output clk 3 ns tW(clkL) Rise time, output data 3 ns tdc(clk) Fall time, output data 3 ns MMC5 td(CLKOH-CMD) Delay time, mmc3_clk rising clock edge to mmc3_cmd transition 3.7 14.11 ns MMC6 td(CLKOH-DATx) Delay time, mmc3_clk rising clock edge to mmc3_datx transition 3.7 14.11 ns (1) (2) (3) (4) (5) In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. The jitter probability density can be approximated by a Gaussian function. The X parameter is defined as listed below. PO = output clk period in ns. The Y parameter is defined as listed below. Table 6-137. X Parameter CLKD X 1 or Even 0.5 Odd (trunc[CLKD/2]+1)/CLKD Table 6-138. Y Parameter CLKD Y 1 or Even 0.5 Odd (trunc[CLKD/2])/CLKD 200 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 For details about clock division factor CLKD, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). 6.7.1.3 MMC/SD/SDIO in Standard MMC Mode and MMC Identification Mode Table 6-139 through Table 6-141 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-139. MMC/SD/SDIO Timing Conditions Standard MMC Mode and MMC Identification Mode TIMING CONDITION PARAMETER 1.8-V,3.3-V MIN UNIT MAX Standard MMC Mode and MMC Identification Mode Input Conditions tr Input signal rise time 0.19 10 ns tf Input signal fall time 0.19 10 ns Output Conditions CLOAD Output load capacitance Copyright © 2009–2014, Texas Instruments Incorporated 30 pF Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 201 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-140. MMC/SD/SDIO Timing Requirements Standard MMC Mode and MMC Identification Mode (1) (2) (3) NO. PARAMETER 1.8 V MIN 3.3V MAX MIN UNIT MAX Standard MMC Mode and MMC Identification Mode MMC/SD/SDIO Interface 1 MMC3 tsu(CMDV-CLKIH) Setup time, mmc1_cmd valid before mmc1_clk rising clock edge 2.13 2.41 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc1_cmd valid after mmc1_clk rising clock edge 3.47 2.09 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc1_datx valid before mmc1_clk rising clock edge 2.13 2.41 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc1_datx valid after mmc1_clk rising clock edge 3.47 2.09 ns MMC3 tsu(CMDV-CLKIH) Setup time, mmc2_cmd valid before mmc2_clk rising clock edge 2.88 3.23 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc2_cmd valid after mmc2_clk rising clock edge 2.90 1.46 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc2_datx valid before mmc2_clk rising clock edge 2.88 3.23 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc2_datx valid after mmc2_clk rising clock edge 2.90 1.46 ns MMC3 tsu(CMDV-CLKIH) Setup time, mmc3_cmd valid before mmc3_clk rising clock edge 3.38 3.41 ns MMC4 th(CLKIH-CMDIV) Hold time, mmc3_cmd valid after mmc3_clk rising clock edge 2.83 1.46 ns MMC7 tsu(DATxV-CLKIH) Setup time, mmc3_datx valid before mmc3_clk rising clock edge 3.38 3.41 ns MMC8 th(CLKIH-DATxIV) Hold time, mmc3_datx valid after mmc3_clk rising clock edge 2.83 1.46 ns MMC/SD/SDIO Interface 2 MMC/SD/SDIO Interface 3 (1) (2) (3) Timing parameters are referred to output clock specified in Table 6-141. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified in Table 6-141. In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. Table 6-141. MMC/SD/SDIO Switching Characteristics Standard MMC Mode and MMC Identification Mode (1) (2) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX MMC Identification Mode MMC1 tc(clk) Cycle time MMC2 tW(clkH) Typical pulse duration, output clk high X (3)*PO (4) 2500 ns ns MMC2 tW(clkL) Typical pulse duration, output clk low Y (5)*PO (4) ns tdc(clk) Duty cycle error, output clk tj(clk) Jitter standard deviation 2604.17 ns 200 ps 2500 ns Standard MMC Mode MMC1 tc(clk) Cycle time (3) ns ns MMC2 tW(clkH) Typical pulse duration, output clk high X MMC2 tW(clkL) Typical pulse duration, output clk low Y (5)*PO (4) (1) (2) (3) (4) (5) 202 *PO (4) In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. The jitter probability density can be approximated by a Gaussian function. The X parameter is defined as listed below. PO = output clk period in ns. The Y parameter is defined as listed below. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-141. MMC/SD/SDIO Switching Characteristics Standard MMC Mode and MMC Identification Mode(1)(2) (continued) NO. PARAMETER 1.8V, 3.3V MIN tdc(clk) Duty cycle error, output clk tj(clk) UNIT MAX 2604.17 ps Jitter standard deviation 200 ps tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns MMC5 td(CLKOH-CMD) Delay time, mmc1_clk rising clock edge to mmc1_cmd transition 4.3 47.78 ns MMC6 td(CLKOH-DATx) Delay time, mmc1_clk rising clock edge to mmc1_datx transition 4.3 47.78 ns MMC/SD/SDIO Interface 1 MMC/SD/SDIO Interface 2 tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns MMC5 td(CLKOH-CMD) Delay time, mmc2_clk rising clock edge to mmc2_cmd transition 4.3 47.78 ns MMC6 td(CLKOH-DATx) Delay time, mmc2_clk rising clock edge to mmc2_datx transition 4.3 47.78 ns MMC/SD/SDIO Interface 3 tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns MMC5 td(CLKOH-CMD) Delay time, mmc3_clk rising clock edge to mmc3_cmd transition 4.3 47.78 ns MMC6 td(CLKOH-DATx) Delay time, mmc3_clk rising clock edge to mmc3_datx transition 4.3 47.78 ns Table 6-142. X Parameter CLKD X 1 or Even 0.5 Odd (trunc[CLKD/2]+1)/CLKD Table 6-143. Y Parameter CLKD Y 1 or Even 0.5 Odd (trunc[CLKD/2])/CLKD Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 203 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com For details about clock division factor CLKD, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). MMC1 MMC2 mmcx_clk MMC3 MMC4 mmcx_cmd MMC7 MMC8 mmcx_dat[3:0] 030-104 In mmcx, x is equal to 1, 2, or 3. Figure 6-66. MMC/SD/SDIO High-Speed and Standard MMC Modes Data/Command Receive MMC1 MMC2 mmcx_clk MMC5 MMC5 mmcx_cmd MMC6 MMC6 mmcx_dat[3:0] 030-105 In mmcx, x is equal to 1, 2, or 3. Figure 6-67. MMC/SD/SDIO High-Speed and Standard MMC Modes Data/Command Transmit 6.7.1.4 MMC/SD/SDIO in High-Speed SD Mode Table 6-144 through Table 6-146 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-144. MMC/SD/SDIO Timing Conditions High-Speed SD Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT MIN MAX High-Speed SD Mode Input Conditions tR Input signal rise time 0.19 3 ns tF Input signal fall time 0.19 3 ns Output Conditions CLOAD Output load capacitance 30 pF Table 6-145. MMC/SD/SDIO Timing Requirements High-Speed SD Mode (1) (2) (3) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX High-Speed SD Mode MMC/SD/SDIO Interface 1 HSSD3 tsu(CMDV-CLKIH) Setup time, mmc1_cmd valid before mmc1_clk rising clock edge 5.61 ns HSSD4 th(CLKIH-CMDIV) Hold time, mmc1_cmd valid after mmc1_clk rising clock edge 2.28 ns (1) (2) (3) 204 In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified in Table 6-146. Timing Parameters refer to output clock specified in Table 6-146. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-145. MMC/SD/SDIO Timing Requirements High-Speed SD Mode(1)(2)(3) (continued) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX HSSD7 tsu(DATxV-CLKIH) Setup time, mmc1_datx valid before mmc1_clk rising clock edge 5.61 ns HSSD8 th(CLKIH-DATxIV) Hold time, mmc1_datx valid after mmc1_clk rising clock edge 2.28 ns MMC/SD/SDIO Interface 2 HSSD3 tsu(CMDV-CLKIH) Setup time, mmc2_cmd valid before mmc2_clk rising clock edge 5.61 ns HSSD4 th(CLKIH-CMDIV) Hold time, mmc2_cmd valid after mmc2_clk rising clock edge 2.28 ns HSSD7 tsu(DATxV-CLKIH) Setup time, mmc2_datx valid before mmc2_clk rising clock edge 5.61 ns HSSD8 th(CLKIH-DATxIV) Hold time, mmc2_datx valid after mmc2_clk rising clock edge 2.28 ns MMC/SD/SDIO Interface 3 HSSD3 tsu(CMDV-CLKIH) Setup time, mmc3_cmd valid before mmc3_clk rising clock edge 5.61 ns HSSD4 th(CLKIH-CMDIV) Hold time, mmc3_cmd valid after mmc3_clk rising clock edge 2.28 ns HSSD7 tsu(DATxV-CLKIH) Setup time, mmc3_datx valid before mmc3_clk rising clock edge 5.61 ns HSSD8 th(CLKIH-DATxIV) Hold time, mmc3_datx valid after mmc3_clk rising clock edge 2.28 ns Table 6-146. MMC/SD/SDIO Switching Characteristics High-Speed SD Mode (1) (2) NO. PARAMETER 1.8 V, 3.3 V MIN UNIT MAX High-Speed SD Mode HSSD1 tc(clk) Cycle time 20.83 (3) *PO (4) HSSD2 tW(clkH) Typical pulse duration, output clk high X HSSD2 tW(clkL) Typical pulse duration, output clk low Y (5)*PO (4) tdc(clk) Duty cycle error, output clk tj(clk) Jitter standard deviation ns ns ns 1041.67 ps 200 ps MMC/SD/SDIO Interface 1 tr(clk) Rise time, output clk 3 ns tf(clkH) Fall time, output clk 3 ns tr(clkL) Rise time, output data 3 ns tf(clk) Fall time, output data 3 ns HSSD5 td(CLKOH-CMD) Delay time, mmc1_clk rising clock edge to mmc1_cmd transition 3.72 14.11 ns HSSD6 td(CLKOH-DATx) Delay time, mmc1_clk rising clock edge to mmc1_datx transition 3.72 14.11 ns MMC/SD/SDIO Interface 2 (1) (2) (3) (4) (5) tr(clk) Rise time, output clk 3 ns tf(clkH) Fall time, output clk 3 ns tr(clkL) Rise time, output data 3 ns tf(clk) Fall time, output data 3 ns In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. The jitter probability density can be approximated by a Gaussian function. The X parameter is defined as listed in Table 6-147. PO = output clk period in ns. The Y parameter is defined as listed in Table 6-148. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 205 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-146. MMC/SD/SDIO Switching Characteristics High-Speed SD Mode(1)(2) (continued) NO. PARAMETER 1.8 V, 3.3 V UNIT MIN MAX HSSD5 td(CLKOH-CMD) Delay time, mmc2_clk rising clock edge to mmc2_cmd transition 3.72 14.11 ns HSSD6 td(CLKOH-DATx) Delay time, mmc2_clk rising clock edge to mmc2_datx transition 3.72 14.11 ns MMC/SD/SDIO Interface 3 tr(clk) Rise time, output clk 3 ns tf(clkH) Fall time, output clk 3 ns tr(clkL) Rise time, output data 3 ns tf(clk) Fall time, output data 3 ns HSSD5 td(CLKOH-CMD) Delay time, mmc3_clk rising clock edge to mmc3_cmd transition 3.72 14.11 ns HSSD6 td(CLKOH-DATx) Delay time, mmc3_clk rising clock edge to mmc3_datx transition 3.72 14.11 ns Table 6-147. X Parameters CLKD X 1 or Even 0.5 Odd (trunc[CLKD/2]+1)/CLKD Table 6-148. Y Parameters CLKD Y 1 or Even 0.5 Odd (trunc[CLKD/2])/CLKD For details about clock division factor CLKD, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). HSSD1 HSSD2 mmcx_clk HSSD3 HSSD4 mmcx_cmd HSSD7 HSSD8 mmcx_dat[3:0] 030-106 In mmcx, x is equal to 1, 2, or 3. Figure 6-68. MMC/SD/SDIO High-Speed SD Mode Data/Command Receive HSSD1 HSSD2 mmcx_clk HSSD5 HSSD5 mmcx_cmd HSSD6 HSSD6 mmcx_dat[3:0] 030-107 In mmcx, x is equal to 1, 2, or 3. Figure 6-69. MMC/SD/SDIO High-Speed SD Mode Data/Command Transmit 206 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.7.1.5 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 MMC/SD/SDIO in Standard SD Mode Table 6-149 through Table 6-151 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-149. MMC/SD/SDIO Timing Conditions Standard SD Mode TIMING CONDITION PARAMETER 1.8V, 3.3V UNIT MIN MAX Standard SD Mode Input Conditions tR Input signal rise time 0.19 10 ns tF Input signal fall time 0.19 10 ns Output Conditions CLOAD Output load capacitance Copyright © 2009–2014, Texas Instruments Incorporated 30 pF Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 207 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-150. MMC/SD/SDIO Timing Requirements Standard SD Mode (1) (2) (3) NO. PARAMETER 1.8 V, 3.3V MIN UNIT MAX Standard SD Mode MMC/SD/SDIO Interface 1 SD3 tsu(CMDV-CLKIH) Setup time, mmc1_cmd valid before mmc1_clk rising clock edge 6.23 ns SD4 th(CLKIH-CMDIV) Hold time, mmc1_cmd valid after mmc1_clk rising clock edge 19.37 ns SD7 tsu(DATxV-CLKIH) Setup time, mmc1_datx valid before mmc1_clk rising clock edge 6.23 ns SD8 th(CLKIH-DATxIV) Hold time, mmc1_datx valid after mmc1_clk rising clock edge 19.37 ns MMC/SD/SDIO Interface 2 SD3 tsu(CMDV-CLKIH) Setup time, mmc2_cmd valid before mmc2_clk rising clock edge 6.23 ns SD4 th(CLKIH-CMDIV) Hold time, mmc2_cmd valid after mmc2_clk rising clock edge 19.37 ns SD7 tsu(DATxV-CLKIH) Setup time, mmc2_datx valid before mmc2_clk rising clock edge 6.23 ns SD8 th(CLKIH-DATxIV) Hold time, mmc2_datx valid after mmc2_clk rising clock edge 19.37 ns MMC/SD/SDIO Interface 3 SD3 tsu(CMDV-CLKIH) Setup time, mmc3_cmd valid before mmc3_clk rising clock edge 6.23 ns SD4 th(CLKIH-CMDIV) Hold time, mmc3_cmd valid after mmc3_clk rising clock edge 19.37 ns SD7 tsu(DATxV-CLKIH) Setup time, mmc3_datx valid before mmc3_clk rising clock edge 6.23 ns SD8 th(CLKIH-DATxIV) Hold time, mmc3_datx valid after mmc3_clk rising clock edge 19.37 ns (1) (2) (3) Timing parameters refer to output clock specified in Table 6-151. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified in Table 6-151. In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. Table 6-151. MMC/SD/SDIO Switching Characteristics Standard SD Mode (1) (2) NO. PARAMETER 1.8V, 3.3V MIN UNIT MAX Standard SD Mode SD1 tc(clk) Cycle time SD2 tW(clkH) Typical pulse duration, output clk high X (3)*PO (4) 41.67 ns ns SD2 tW(clkL) Typical pulse duration, output clk low Y (5)*PO (4) ns tdc(clk) Duty cycle error, output clk 2083.33 ps tj(clk) Jitter standard deviation 200 ps tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns MMC/SD/SDIO Interface 1 (1) (2) (3) (4) (5) 208 The jitter probability density can be approximated by a Gaussian function. In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7. The X parameter is defined as listed in Table 6-152. PO = output clk period in ns. The Y parameter is defined as listed in Table 6-153. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Table 6-151. MMC/SD/SDIO Switching Characteristics Standard SD Mode(1)(2) (continued) NO. PARAMETER 1.8V, 3.3V UNIT MIN MAX SD5 td(CLKOH-CMD) Delay time, mmc1_clk rising clock edge to mmc1_cmd transition 6.13 35.53 ns SD6 td(CLKOH-DATx) Delay time, mmc1_clk rising clock edge to mmc1_datx transition 6.13 35.53 ns MMC/SD/SDIO Interface 2 tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns SD5 td(CLKOH-CMD) Delay time, mmc2_clk rising clock edge to mmc2_cmd transition 6.13 35.53 ns SD6 td(CLKOH-DATx) Delay time, mmc2_clk rising clock edge to mmc2_datx transition 6.13 35.53 ns MMC/SD/SDIO Interface 3 tr(clk) Rise time, output clk 10 ns tf(clkH) Fall time, output clk 10 ns tr(clkL) Rise time, output data 10 ns tf(clk) Fall time, output data 10 ns SD5 td(CLKOH-CMD) Delay time, mmc3_clk rising clock edge to mmc3_cmd transition 6.13 35.53 ns SD6 td(CLKOH-DATx) Delay time, mmc3_clk rising clock edge to mmc3_datx transition 6.13 35.53 ns Table 6-152. X Parameter CLKD X 1 or Even 0.5 Odd (trunc[CLKD/2]+1)/CLKD Table 6-153. Y Parameter CLKD Y 1 or Even 0.5 Odd (trunc[CLKD/2])/CLKD For details about clock division factor CLKD, see the AM35x ARM Microprocessor Technical Reference Manual (SPRUGR0). SD1 SD2 mmcx_clk SD3 SD4 mmcx_cmd SD7 SD8 mmcx_dat[3:0] 030-108 In mmcx, x is equal to 1, 2, or 3. Figure 6-70. MMC/SD/SDIO Standard SD Mode Data/Command Receive Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 209 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com SD1 SD2 mmcx_clk SD5 SD5 mmcx_cmd SD6 SD6 mmcx_dat[3:0] 030-109 In mmcx, x is equal to 1, 2, or 3. Figure 6-71. MMC/SD/SDIO Standard SD Mode Data/Command Transmit 210 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 6.8 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Test Interfaces The emulation and trace interfaces allow tracing activities of the following CPUs: • ARM CortexTM-A8 through an Embedded Trace Macro-cell (ETM11) dedicated to enable real-time trace of the ARM subsystem operations. All processors can be emulated via JTAG ports. 6.8.1 Embedded Trace Macro Interface (ETM) Table 6-154 assumes testing over the recommended operating conditions. Table 6-154. Embedded Trace Macro Interface Switching Characteristics NO. PARAMETER MIN MAX UNIT 166 MHz f 1/tc(CLK) Frequency, etk_clk ETM0 tc(CLK) Cycle time 6.02 ETM1 tW(CLK) Clock pulse width, etk_clk 3.01 ETM2 td(CLK-CTL) Delay time, etk_clk clock edge to etk_ctl transition -0.5 0.5 ns ETM3 td(CLK-D) Delay time, etk_clk clock high to etk_d[15:0] transition -0.5 0.5 ns ns ns ETM0 ETM1 etk_clk ETM2 ETM2 etk_ctl ETM3 ETM3 etk_d[15:0] 030-110 Figure 6-72. Embedded Trace Macro Interface 6.8.2 JTAG Interfaces AM3517/05 JTAG TAP controller handles standard IEEE JTAG interfaces. The following sections define the timing requirements for several tools used to test the AM3517/05 processors as: • Free running clock tool, like XDS560 and XDS510 tools • Adaptive clock tool, like RealView ICE tool and Lauterbach tool 6.8.2.1 JTAG Free Running Clock Mode Table 6-155 through Table 6-157 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-155. JTAG Timing Conditions Free Running Clock Mode TIMING CONDITION PARAMETER 1.8 V 3.3 V MAX MAX UNIT Input Conditions tR Input signal rise time 5 3 ns tF Input signal fall time 5 3 ns Output Conditions CLOAD Output load capacitance Copyright © 2009–2014, Texas Instruments Incorporated 30 pF Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 211 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-156. JTAG Timing Requirements Free Running Clock Mode (1) (2) (3) NO. PARAMETER 1.8V MIN 3.3V MAX MIN MAX UNIT JT4 tc(tck) Cycle time 20 20 ns JT5 tw(tckL) Typical pulse duration, jtag_tck low 10 10 ns JT6 tw(tckH) Typical pulse duration, jtag_tck high 10 tdc(tck) Duty cycle error, jtag_tck -1250 1250 -1250 1250 ps tj(tck) Cycle jitter -1250 1250 -1250 1250 ps JT7 tsu(tdiV-rtckH) Setup time, jtag_tdi valid before jtag_rtck high 1.8 3.8 ns JT8 th(tdiV-rtckH) Hold time, jtag_tdi valid after jtag_rtck high 0.7 2.7 ns JT9 tsu(tmsV-rtckH) Setup time, jtag_tms valid before jtag_rtck high 1.8 3.8 ns JT10 th(tmsV-rtckH) Hold time, jtag_tms valid after jtag_rtck high 0.7 2.7 ns JT12 tsu(emuxV-rtckH) Setup time, jtag_emux 14.6 14.6 ns JT13 th(emuxV-rtckH) Hold time,jtag_emux 2 2 ns (1) (2) (3) 10 ns Maximum cycle jitter supported by jtag _tck input clock. x = 0 to 1 The timing requirements are assured for the cycle jitter and duty cycle error conditions specified. Table 6-157. JTAG Switching Characteristics Free Running Clock Mode (1) (2) 1.8 V NO. PARAMETER (1) JT1 tc(rtck) Cycle time JT2 tw(rtckL) Typical pulse duration, jtag_rtck low JT3 tw(rtckH) Typical pulse duration, jtag_rtck high tdc(rtck) Duty cycle error, jtag_rtck tj(rtck) Jitter standard deviation (2), jtag_rtck tR(rtck) Rise time, jtag_rtck tF(rtck) Fall time, jtag_rtck JT11 td(rtckL-tdoV) 212 Delay time, jtag_rtck low to jtag_tdo valid tR(tdo) Rise time, jtag_tdo tF(tdo) Fall time, jtag_tdo JT14 td(rtckH-emuxV) (1) (2) , jtag_rtck period Delay time, jtag_rtck high to ,jtag_emux MIN 3.3 V MAX MIN MAX UNIT 20 20 ns 10 10 ns 10 -1250 10 1250 -1250 ps 33.33 33.33 ps 4 4 ns 4 ns 8 ns 4 ns 4 -5.8 5.8 -8 4 4 2.7 ns 1250 15.1 2.7 4 ns 15.1 ns tR(emux) Rise time, jtag_emux 6 6 ns tF(emux) Fall time, jtag_emux 6 6 ns Related with the jtag_rtck maximum frequency. The jitter probability density can be approximated by a Gaussian function. Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 JT4 JT5 JT6 jtag_tck JT1 JT2 JT3 jtag_rtck JT7 JT8 JT9 JT10 jtag_tdi jtag_tms JT12 JT13 jtag_emux(IN) JT11 jtag_tdo JT14 jtag_emux(OUT) 030-113 In jtag_emux, x is equal to 0 to 1. Figure 6-73. JTAG Interface Timing Free Running Clock Mode 6.8.2.2 JTAG Adaptive Clock Mode Table 6-158 through Table 6-160 assume testing over the recommended operating conditions and electrical characteristic conditions. Table 6-158. JTAG Timing Conditions Adaptive Clock Mode TIMING CONDITION PARAMETER 1.8 V 3.3 V MAX MAX UNIT Input Conditions tR Input signal rise time 5 3 ns tF Input signal fall time 5 3 ns 30 pF Output Conditions CLOAD Output load capacitance Table 6-159. JTAG Timing Requirements Adaptive Clock Mode (1) (2) 1.8 V NO. PARAMETER MIN 3.3 V MAX MIN MAX UNIT JA4 tc(tck) Cycle time 20 20 ns JA5 tw(tckL) Typical pulse duration, jtag_tck low 10 10 ns JA6 tw(tckH) Typical pulse duration, jtag_tck high tdc(lclk) Duty cycle error, jtag_tck -2500 2500 -2500 2500 ps tj(lclk) Cycle jitter -1500 1500 -1500 1500 ps JA7 tsu(tdiV-tckH) Setup time, jtag_tdi valid before jtag_tck high 13.8 13.8 ns JA8 th(tdiV-tckH) Hold time, jtag_tdi valid after jtag_tck high 13.8 13.8 ns JA9 tsu(tmsV-tckH) Setup time, jtag_tms valid before jtag_tck high 13.8 13.8 ns JA10 th(tmsV-tckH) Hold time, jtag_tms valid after jtag_tck high 13.8 13.8 ns (1) (2) 10 10 ns Maximum cycle jitter supported by jtag _tck input clock. The timing requirements are assured for the cycle jitter and duty cycle error conditions specified. Copyright © 2009–2014, Texas Instruments Incorporated Timing Requirements and Switching Characteristics Submit Documentation Feedback Product Folder Links: AM3517 AM3505 213 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com Table 6-160. JTAG Switching Characteristics Adaptive Clock Mode (1) 1.8 V PARAMETER JA1 tc(rtck) Cycle time 20 20 ns JA2 tw(rtckL) Typical pulse duration, jtag_rtck low 10 10 ns JA3 tw(rtckH) Typical pulse duration, jtag_rtck high tdc(rtck) Duty cycle error, jtag_rtck tj(rtck) Jitter standard deviation tR(rtck) tF(rtck) td(rtckL-tdoV) Delay time, jtag_rtck low to jtag_tdo valid tR(tdo) Rise time, jtag_tdo, tF(tdo) Fall time, jtag_tdo JA11 (1) MIN 3.3 V NO. MAX MIN 10 -2500 MAX 10 -2500 ns 2500 ps 33.33 33.33 ps Rise time, jtag_rtck 4 4 ns Fall time, jtag_rtck 4 4 ns 14.6 ns 4 4 ns 4 4 ns -14.6 2500 UNIT 14.6 -14.6 The jitter probability density can be approximated by a Gaussian function. JA4 JA5 JA6 jtag_tck JA7 JA8 JA9 JA10 jtag_tdi jtag_tms JA1 JA2 JA3 jtag_rtck JA11 jtag_tdo 030-114 Figure 6-74. JTAG Interface Timing Adaptive Clock Mode 214 Timing Requirements and Switching Characteristics Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com SPRS550F – OCTOBER 2009 – REVISED JULY 2014 7 Device and Documentation Support 7.1 Device Support 7.1.1 Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). 7.1.1.1 Getting Started and Next Steps The following products support development of the AM3517/05 device applications: Software Development Tools: • Code Composer Studio™ Integrated Development Environment (IDE) for Sitara ARM Processors: an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. • FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices: a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms. • Pin Mux Utility for ARM Microprocessors: a Windows-based software tool which provides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI ARM MPUs. • Power Estimation Tool (PET): provides users the ability to gain insight in to the power consumption of select Sitara and OMAP processors. Hardware Development Tools: • Uniflash Standalone Flash Tool for TI Microcontrollers (MCUs) and Sitara Processors: a standalone tool used to program on-chip flash memory on TI MCUs and on-board flash memory for Sitara processors. • XDS200 Price/Performance-balanced Debug Probe: a JTAG emulator for TI embedded processors. • XDS560 High Performance Debug Probe: combines state-of-the-art silicon, hardware, and software technology to provide the best hardware debug capabilities. For a complete listing of development-support tools for the AM3517/05 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 7.1.2 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all AM3517/05 processors and support tools. Each device has one of three prefixes: X, P, or null (no prefix). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final devices electrical specifications and may not use production assembly flow. (TMX definition) P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. (TMP definition) null Production version of the silicon die that is fully qualified. (TMS definition) Support tool development evolutionary flow: Device and Documentation Support Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 215 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com TMDX Development support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development support product. TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: Developmental product is intended for internal evaluation purposes. Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TIs standard warranty applies. Predictions show that prototype devices (X or P), have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. For additional description of the device nomenclature markings, see the AM35x ARM Microprocessor Silicon Errata (SPRZ306). X AM3517 PREFIX X = Experimental Device P = Prototype Device blank = Production Device DEVICE SILICON REVISION A ZCN ( ) ( ) blank = no security C = crypto enabled blank = commercial temperature A = extended temperature PACKAGE TYPE ZCN = 491-pin sPBGA ZER = 484-pin sPBGA Figure 7-1. Device Nomenclature 7.2 7.2.1 Documentation Support Related Documentation The following documents describe the AM3517/05 device. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com. The current documentation that describes the AM3517/05 Sitara processor, related peripherals, and other technical collateral, is available in the product folder at: www.ti.com. SPRUGR0 AM35x ARM Microprocessor Technical Reference Manual. Collection of documents providing detailed information on the Sitara architecture including power, reset, and clock control, interrupts, memory map, and switch fabric interconnect. Detailed information on the microprocessor unit (MPU) subsystem as well a functional description of the peripherals supported on AM3517/05 devices is also included. The following documents are related to the AM3517/05 device. Copies of these documents can be obtained directly from the internet or from your Texas Instruments representative. Cortex-A8 Technical Reference Manual. This is the technical reference manual for the Cortex-A8 processor. A copy of this document can be obtained via the internet at http://infocenter.arm.com. See the AM35x ARM Microprocessor Silicon Errata (SPRZ306) to determine the revision of the Cortex-A8 core used on your device. ARM Core Cortex™-A8 (AT400/AT401) Errata Notice. Provides a list of advisories for the different revisions of the Cortex-A8 processor. Contact your TI representative for a copy of this document. See the AM35x ARM Microprocessor Silicon Errata (SPRZ306) to determine the revision of the Cortex-A8 core used on your device. 216 Device and Documentation Support Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 AM3517, AM3505 www.ti.com 7.3 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 Related Links Table 7-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 7-1. Related Links 7.4 PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY AM3517 Click here Click here Click here Click here Click here AM3505 Click here Click here Click here Click here Click here Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 7.5 Trademarks PowerVR SGX is a trademark of Imagination Technologies Ltd. Sitara, Via Channel, E2E are trademarks of Texas Instruments. NEON is a trademark of ARM Ltd or its subsidiaries. Cortex, Jazelle are registered trademarks of ARM Ltd or its subsidiaries. All other trademarks are the property of their respective owners. 7.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Device and Documentation Support Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 217 AM3517, AM3505 SPRS550F – OCTOBER 2009 – REVISED JULY 2014 www.ti.com 8 Mechanical Packaging and Orderable Information 8.1 Package Option Addendum The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 218 Mechanical Packaging and Orderable Information Copyright © 2009–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3517 AM3505 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AM3505AZCN ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3505AZCN 532 AM3505AZCNA ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3505AZCNA 532 AM3505AZCNAC ACTIVE NFBGA ZCN 491 1 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3505AZCNAC 532 AM3505AZCNC ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3505AZCNC 532 AM3505AZER ACTIVE BGA ZER 484 60 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3505AZER 532 AM3505AZERA ACTIVE BGA ZER 484 60 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3517AZCN ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3517AZCNA ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3517AZCNA 532 AM3517AZCNAC ACTIVE NFBGA ZCN 491 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3517AZCNAC 532 AM3517AZER ACTIVE BGA ZER 484 60 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3517AZERA ACTIVE BGA ZER 484 60 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3517AZERA 532 AM3517AZERC ACTIVE BGA ZER 484 60 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3517AZERC 532 XAM3517AZCN OBSOLETE NFBGA ZCN 491 TBD Call TI Call TI 0 to 90 AM3505AZERA 532 AM3517AZCN 532 AM3517AZER 532 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-May-2016 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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