HV583 128-Channel Serial to Parallel Converter with Push-Pull Outputs Features Description • 128 High-Voltage Channels - Up to 80V Operating Output Voltage - 30 mA Peak Output Sink/Source Current - Output Diodes to Ground for Efficient Power Recovery • Four Separate Shift Registers - Clockwise and Counter-Clockwise Data Shifting via DIR Pin • 40 MHz Data Rate HV583 is a unipolar, 128-channel low-voltage serial to high-voltage parallel converter with push-pull outputs. This device has been designed for applications requiring multiple high-voltage outputs with current sinking and sourcing capabilities, such as plasma displays and Inkjet printers. The device consists of four parallel 32-bit shift registers, a 128-bit latch and 128 high-voltage outputs. Data can be input at 40 MHz or up to 25 MHz when cascaded in a multiple device configuration. Applications HV583 is offered in a 169-ball 10 x 10 x 1.1 mm TFBGA package. • Inkjet Printer Driver • Plasma Display Driver • 3D Printer Driver Package Type HV583 10x10x1.1 mm TFBGA* Bottom View Related Devices • HV582: 96-Channel Serial to Parallel Converter with Push-Pull Outputs 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N * See Section Section 2.0 “Package Pin Configurations and Function Description”. 2015 Microchip Technology Inc. DS20005461A-page 1 HV583 Block Diagram VDD VPP D1B 32-Bit Shift Register D1A D2B D0 D1 D2 D3 D4 D5 D6 D7 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 HVOUT 0 32-Bit Shift Register D2A D3B 128-Bit Latch 32-Bit Shift Register D3A D4B 32-Bit Shift Register D124 D125 D126 D127 Q124 Q125 Q126 Q127 HVOUT 127 D4A CLK DIR RST LE OH OL OE DGND DS20005461A-page 2 PGND 2015 Microchip Technology Inc. HV583 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Rating† Supply Voltage VDD.................................................................................................................................... -0.5V to +6.5V High-Voltage Supply VPP ............................................................................................................................ -0.5V to +90V Output Sink and Source Current IOUT .................................................................................................. -65 mA to +40 mA Output Body Diode Current IDIODE....................................................................................................... -65 mA to +65 mA Logic Input Voltage..............................................................................................................................-0.5V to VDD +0.5V Operating Junction Temperature.............................................................................................................-25°C to +125°C Storage Temperature ..............................................................................................................................-40°C to +150°C †Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device is ESD sensitive. Use appropriate ESD precautions. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min. Typ. Max. Units High-Voltage Supply VPP 15 - 80 V Low-Voltage Supply VDD 4.5 5.0 5.5 V Conditions HVOUT Peak Output Current IOUT -30 - 30 mA VPP Power Supply Slew Rate SR - - 8.0 V/μs Clock Frequency fCLK - - 40 MHz Data Read - - 25 MHz Cascaded Devices TABLE 1-1: POWER SEQUENCES Sequence Type Steps Power- Up Sequence 1. 2. 3. 4. Connect Ground. Apply VDD. Set All Inputs (Data, CLK, etc.) to a known state. Apply VPP Power- Down Sequence Repeat the Power-Up sequence in reverse order. DC ELECTRICAL CHARACTERISTICS Electrical specifications: Unless otherwise specified, TA = TJ = +25°C, VDD = 5.0V and VPP = 80V. Parameter VPP Quiescent Supply Current Symbol Min. Typ. Max. Units IPPQ — — 10 μA VDD Quiescent Supply Current IDDQ — — 10 μA High-Level Output Voltage HVOH 73 76 — V 10 — — HVOHD — — 81.5 Low-Level Output Voltage HVOL — 3.0 Output N-Channel Body Diode HVOLD -1.5 — Output P-Channel Body Diode Note 1: Conditions IOUT = 15 mA, VPP = 80V IOUT = 10 mA, VPP = 20V V IOUT = -30 mA, VPP = 80V (Note 1) 6.0 V IOUT = -15 mA — V IOUT = 30 mA (Note 1) Specification is for design guidance only. 2015 Microchip Technology Inc. DS20005461A-page 3 HV583 DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical specifications: Unless otherwise specified, TA = TJ = +25°C, VDD = 5.0V and VPP = 80V. Parameter Symbol Min. Typ. Max. Units Logic Input High Voltage VIH 2.3 — VDD V Logic Input Low Voltage VIL 0 — 0.7 Logic Input High Current IIH — — 1.0 10 30 60 VIH = 5.0V, for DIR only Logic Input Low Current IIL -1.0 — — VIL = -0.3V Logic Output High VOH 4.5 — — Logic Output Low VOL — — 0.5 Note 1: Conditions VDD = 4.5V to 5.5V VDD = 4.5V to 5.5V μA VIH = 5.3V, VDD = 5.0V V IOUT = 1.0 mA IOUT = -1.0 mA Specification is for design guidance only. AC ELECTRICAL CHARACTERISTICS Electrical specifications: Unless otherwise specified TA = TJ = 25°C, VDD = 5.0V and VPP = 80V Symbol Min. Typ. Max. Units Clock Pulse Width, High and Low(1) Parameter twCLK 10 — — ns LE Pulse Width, High and Low(2) twLE 10 — — Setup Time, DnA/B to CLK(1) Conditions VDD = 4.5V to 5.5V TJ = -25°C to 125°C tsu1 5 — — Setup Time, CLK to LE(1) tsu2 10 — — Setup Time, LE to OL,OH(1) tsu3 25 — — Hold Time, CLK to DnA/B(1) th1 5 — — th2 10 — — CLK to DnA/B (High-to-Low) tpdHL — — 25 CLK to DnA/B (Low-to-High) tpdLH — — 25 CL = 15 pF LE,OL,OH to HVOUTn (High-to-Low) tpHL — — 150 CL = 50 pF LE,OL,OH to HVOUTn (Low-to-High) tpLH Typ-40 tpHL+ tf Typ+40 CL = 80 pF OE to HVOUTn (High-to-Low) tpHZL — — 150 CL = 50 pF OE to HVOUTn (Low-to-High) tpLZH Typ-40 tpHL+ tf Typ+40 CL = 80 pF OE to HVOUTn (High-to-Low) tpHZ — — 300 RL = 10K, CL = 50 pF OE to HVOUTn (Low-to-High) Hold Time, LE to CLK (1) CL = 15 pF tpLZ — — 300 RL = 10K, CL = 50 pF Rise Time HVOUTn tr — — 120 CL = 50 pF Fall Time HVOUTn tf — — 120 CL = 50 pF Note 1: 2: Specification is obtained by characterization and is not 100% tested. Specification is for design guidance only. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Operating Junction Temperature TJ -25 — +125 °C Storage Temperature TA -40 — +150 °C JA — 27 — °C/W Conditions Temperature Ranges Package Thermal Resistance Thermal Resistance, 169-Ball TFBGA DS20005461A-page 4 2015 Microchip Technology Inc. HV583 1.1 Logic Characteristics TABLE 1-2: SHIFT REGISTER TRUTH TABLE DIR Legend: D = H = L = X = Z = = CLK State Direction L or Open Shift DnB to DnA L or Open Hold DnB to DnA H Shift DnA to DnB H Hold DnA to DnB Data Level High Level Low Don’t Care High Impedance Low-to-High Transition = High-to-Low Transition TABLE 1-3: LATCH TRUTH TABLE LE Output State of Latch L to H Latch Execution H to L Hold TABLE 1-4: HVOUTn TRUTH TABLE OE OL OH DnA/DnB HVOUTn L H H H H X L H H H X X L H H X X X L H Z L H L H TABLE 1-5: RESET TRUTH TABLE RST CLK 0 0 2015 Microchip Technology Inc. Shift Register Latches X Shift X X Latch Clear X X Clear X 1 1 LE X X DS20005461A-page 5 HV583 TABLE 1-6: OUTPUT SHIFT OPERATION Input Output DIR Shift Operation D1A = D D1B H D to D124...D0 to D1B D2A = D D2B H D to D125...D1 to D2B D3A = D D3B H D to D126...D2 to D3B D4A = D D4B H D to D127...D3 to D4B D1B = D D1A L or Open D to D0...D124 to D1A D2B = D D2A L or Open D to D1...D125 to D2A D3B = D D3A L or Open D to D2....D126 to D3A D4B = D D4A L or Open D to D3....D127 to D4A DS20005461A-page 6 2015 Microchip Technology Inc. HV583 1.2 Timing Diagram twCLK twCLK VIH CLK 50% 50% 50% VIL tsu1 th1 tsu1 th1 VIH DnA/B (input) 50% 50% 50% VIL tpdLH tpdHL VOH 50% 50% DnA/B (output) VOL th2 tsu2 twLE twLE VIH LE 50% 50% 50% 50% VIL tsu3 VIH OL, OH 50% VIL VIH OE 50% VIL VIH 50% 50% OE VIL VIH 50% 50% LE, OH, OL VIL tpHZ tpLZ tpLZH tpHZL tpLH 90% 90% 10% 10% tpHL 90% VOH 90% HVOUTn 10% 10% VOL tf tr VIH LE, OH, OL 50% VIL VOH 90% HVOUTn 10% tpHL HVOUTn VOL VOH tf 90% tpLH= tpHL+ tf 10% 2015 Microchip Technology Inc. tr VOL DS20005461A-page 7 HV583 2.0 PACKAGE PIN CONFIGURATIONS AND FUNCTION DESCRIPTION This section details the pin designation for the 169-Ball TFBGA package (Figure 2-1). The descriptions of the pins are listed in Table 2-1. Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 HVOUT86 HVOUT85 HVOUT83 HVOUT80 HVOUT76 HVOUT71 HVOUT66 HVOUT61 HVOUT56 HVOUT51 HVOUT47 HVOUT44 HVOUT42 HVOUT87 HVOUT84 HVOUT82 HVOUT79 HVOUT75 HVOUT70 HVOUT65 HVOUT60 HVOUT55 HVOUT50 HVOUT46 HVOUT43 HVOUT41 HVOUT89 HVOUT88 HVOUT81 HVOUT78 HVOUT74 HVOUT69 HVOUT64 HVOUT59 HVOUT54 HVOUT49 HVOUT45 HVOUT39 HVOUT40 HVOUT92 HVOUT91 HVOUT90 HVOUT77 HVOUT73 HVOUT68 HVOUT63 HVOUT58 HVOUT53 HVOUT48 HVOUT36 HVOUT37 HVOUT38 HVOUT96 HVOUT95 HVOUT94 HVOUT93 HVOUT72 HVOUT67 HVOUT62 HVOUT57 HVOUT52 HVOUT32 HVOUT33 HVOUT34 HVOUT35 HVOUT100 HVOUT99 HVOUT98 HVOUT97 VPP VPP VPP VPP VPP HVOUT28 HVOUT29 HVOUT30 HVOUT31 HVOUT104 HVOUT103 HVOUT102 HVOUT101 VPP VPP VPP VPP VPP HVOUT24 HVOUT25 HVOUT26 HVOUT27 HVOUT108 HVOUT107 HVOUT106 HVOUT105 NC PGND PGND PGND NC HVOUT20 HVOUT21 HVOUT22 HVOUT23 HVOUT112 HVOUT111 HVOUT110 HVOUT109 PGND PGND PGND PGND PGND HVOUT16 HVOUT17 HVOUT18 HVOUT19 HVOUT115 HVOUT114 HVOUT113 DGND VDD NC VDD DGND HVOUT0 HVOUT13 HVOUT14 HVOUT15 HVOUT117 HVOUT116 HVOUT122 HVOUT125 D1A D4A OE LE D3B HVOUT1 HVOUT4 HVOUT11 HVOUT12 HVOUT118 HVOUT120 HVOUT123 HVOUT126 D2A OL DIR CLK D2B HVOUT2 HVOUT5 HVOUT7 HVOUT10 HVOUT119 HVOUT121 HVOUT124 HVOUT127 D3A OH RST D4B D1B HVOUT3 HVOUT6 HVOUT8 HVOUT9 A B C D E F G H J K NC L M N FIGURE 2-1: DS20005461A-page 8 169-Ball TFBGA Package. 2015 Microchip Technology Inc. HV583 TABLE 2-1: PIN ASSIGNMENT Pin # Name Pin # Name Pin # Name Pin # Name A1 HVOUT86 D5 HVOUT73 H5, H9, K4, K7 NC M8 CLK A2 HVOUT85 D6 HVOUT68 H6, H7, H8, J5, J6, J7, J8, J9 PGND M9 D2B A3 HVOUT83 D7 HVOUT63 H10 HVOUT20 M10 HVOUT2 A4 HVOUT80 D8 HVOUT58 H11 HVOUT21 M11 HVOUT5 A5 HVOUT76 D9 HVOUT53 H12 HVOUT22 M12 HVOUT7 A6 HVOUT71 D10 HVOUT48 H13 HVOUT23 M13 HVOUT10 A7 HVOUT66 D11 HVOUT36 J1 HVOUT112 N1 HVOUT119 A8 HVOUT61 D12 HVOUT37 J2 HVOUT111 N2 HVOUT121 A9 HVOUT56 D13 HVOUT38 J3 HVOUT110 N3 HVOUT124 A10 HVOUT51 E1 HVOUT96 J4 HVOUT109 N4 HVOUT127 A11 HVOUT47 E2 HVOUT95 J10 HVOUT16 N5 D3A A12 HVOUT44 E3 HVOUT94 J11 HVOUT17 N6 OH A13 HVOUT42 E4 HVOUT93 J12 HVOUT18 N7 RST B1 HVOUT87 E5 HVOUT72 J13 HVOUT19 N8 D4B B2 HVOUT84 E6 HVOUT67 K1 HVOUT115 N9 D1B B3 HVOUT82 E7 HVOUT62 K2 HVOUT114 N10 HVOUT3 B4 HVOUT79 E8 HVOUT57 K3 HVOUT113 N11 HVOUT6 B5 HVOUT75 E9 HVOUT52 K5, K9 DGND N12 HVOUT8 B6 HVOUT70 E10 HVOUT32 K6, K8 VDD N13 HVOUT9 B7 HVOUT65 E11 HVOUT33 K10 HVOUT0 B8 HVOUT60 E12 HVOUT34 K11 HVOUT13 B9 HVOUT55 E13 HVOUT35 K12 HVOUT14 B10 HVOUT50 F1 HVOUT100 K13 HVOUT15 B11 HVOUT46 F2 HVOUT99 L1 HVOUT117 B12 HVOUT43 F3 HVOUT98 L2 HVOUT116 B13 HVOUT41 F4 HVOUT97 L3 HVOUT122 C1 HVOUT89 F5, F6, F7, F8, F9, G5, G6, G7, G8, G9 VPP L4 HVOUT125 C2 HVOUT88 F10 HVOUT28 L5 D1A C3 HVOUT81 F11 HVOUT29 L6 D4A C4 HVOUT78 F12 HVOUT30 L7 OE C5 HVOUT74 F13 HVOUT31 L8 LE C6 HVOUT69 G1 HVOUT104 L9 D3B C7 HVOUT64 G2 HVOUT103 L10 HVOUTN1 C8 HVOUT59 G3 HVOUT102 L11 HVOUT4 C9 HVOUT54 G4 HVOUT101 L12 HVOUT11 C10 HVOUT49 G10 HVOUT24 L13 HVOUT12 C11 HVOUT45 G11 HVOUT25 M1 HVOUT118 C12 HVOUT39 G12 HVOUT26 M2 HVOUT120 C13 HVOUT40 G13 HVOUT27 M3 HVOUT123 D1 HVOUT92 H1 HVOUT108 M4 HVOUT126 D2 HVOUT91 H2 HVOUT107 M5 D2A D3 HVOUT90 H3 HVOUT106 M6 OL D4 HVOUT77 H4 HVOUT105 M7 DIR 2015 Microchip Technology Inc. DS20005461A-page 9 HV583 2.1 High-Voltage Output Pins (HVOUT0 to HVOUT127) These are (Push-Pull). 2.2 the high-voltage output 2.9 channels High-Voltage Power Supply Pins (VPP) High-voltage power supply pins for the output channels (HVOUTn). 2.3 The Latch Enable pin controls the data transfer from the input shift registers to the 128-bit latch and the HVOUTn channels. When LE transitions from Low to High (rising edge), data is transferred from the 128-bit data latch to the HVOUTn output channels. When LE is Low, new data can be clocked into the shift registers. 2.10 No Connection Pins (NC) NC pins do not have any functionality on the IC. These pins should not be connected. Latch Enable Pin (LE) Data Input/Output Pins (D1B, D2B, D3B, D4B) Data Input/Output pins are configurable as inputs or outputs for the shift registers, depending on the state of the Direction pin (DIR). High-voltage ground pins provide the reference ground level for the high-voltage output channels. When DIR is Low, pins D1B to D4B are configured as inputs to the data shift registers. When DIR is High, pins are configured as outputs of the data shift registers. 2.5 2.11 2.4 High-Voltage Ground Pins (PGND) Digital Logic Ground Pins (DGND) Output Low Pin (OL) Digital Logic Ground pins provide a reference ground level for the low-voltage section of the IC, shift-registers, latches and decoders. The Output Low pin sets all high-voltage output channels (HVOUT0 to HVOUT127) to a Low-level state (PGND). 2.6 When OL is set Low and OE is High, all the HVOUTn channels are forced to a Low-level state (PGND), regardless of the data stored in the 128-bit latch. Logic Power Supply Pins (VDD) Logic power supply pins for the 32-bit shift registers, 128-bit latch and decoders. 2.7 Data Input/Output Pins (D1A, D2A, D3A, D4A) Data Input/Output pins are configurable as inputs or outputs for the shift registers depending on the state of the Direction pin (DIR). When DIR is High, pins D1A to D4A are configured as inputs to the data shift registers. When DIR is Low, these pins are configured as outputs of the data shift registers. 2.8 Output Enable Pin (OE) 2.12 Direction Pin (DIR) The DIR pin controls the direction of the input data flow for the input registers, whether it is clockwise (DnB to DnA) or counter-clockwise (DnA to DnB). When the DIR pin is set High, data flows from DnA to DnB. When DIR pin is set Low, data flows from DnB to DnA. See Table 1-6 for more information. 2.13 Clock Input Pin (CLK) This is the Clock Input pin for 32-bit input shift registers. 2.14 Output High Pin (OH) The Output Enable pin controls the functionality of the high-voltage output channels. The Output High pin sets all high-voltage output channels (HVOUT0 to HVOUT127) to a High-level state (VPP). When OE is High, all HVOUTn channels are enabled and form a push-pull configuration to operate according to input data, OL or OH configuration states. When OE is Low, all HVOUTn channels are forced to a highimpedance state, regardless of the data stored in the 128-bit latch or the state of the OL and OH pins. When OH is Low while OE and OL are High, all the HVOUTn channels are forced to a High-level state (VPP), regardless of the data stored in the 128-bit latch. See Table 1-4 for more information. 2.15 Reset Pin (RST) The RST pin clears shift registers and the 128-bit latch data content when it is set High during the rising edge of the CLK and LE, respectively. See Table 1-5 for more information. DS20005461A-page 10 2015 Microchip Technology Inc. HV583 3.0 FUNCTIONAL DESCRIPTION 3.1 Application Information HV583 is designed for applications requiring multiple high-voltage outputs with current sinking and sourcing capabilities in the range of ±30 mA. Typical applications where the HV583 is utilized are in plasma displays, Inkjet printer drivers and 3D printer drivers. The HV583 is a unipolar, 128-channel low-voltage serial to high-voltage parallel converter. The device consists of four parallel 32-bit shift registers, a 128-bit latch and 128 high-voltage outputs. The four independent shift registers allow data to be updated into the 128-bit latch at four times the speed of a single register, providing a fast update rate for the 128 output channels. The 128-bit latch holds the data for the high-voltage output channels; whether it is a High-level or Low-level state. The flow of the input data can switch direction from clockwise (DnB to DnA) to counter-clockwise (DnA to DnB) by controlling the DIR pin. A reset pin (RST) is provided to clear the contents of the latches. All channels can be set at the same time to a high-impedance state (High Z), Low-level state, or High-level state through the OE, OL and OH pins, respectively. The high-output voltages (HVOUTn) can operate from 15V to 80V with a maximum current source and sink capability of 30 mA. High-Voltage Power Supply Low-Voltage Power Supply Piezo Element HV583 Low Voltage High Voltage HVOUT0 D(1-4)A CLK LE Microprocessor OE OL Shift Register Latches Output Control Level Translators and Push-Pull Output Buffers OH HVOUT127 DIR RST D(1-4)B DIN(1-4) for Cascading the next HV583 FIGURE 3-1: Typical Application Block Diagram. 2015 Microchip Technology Inc. DS20005461A-page 11 HV583 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 169-Ball TFBGA (10 x10 x1.1 mm) XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS20005461A-page 12 Example HV583GA ^^e3 1533256 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. 2015 Microchip Technology Inc. HV583 169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA] (Complies with JEDEC Terminal Assignment recommendations) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D NOTE 1 A D 4 B E 4 E (DATUM B) (DATUM A) 2X 0.15 C 2X TOP VIEW 0.15 C A A2 0.20 C C SEATING PLANE A1 169X SIDE VIEW e BOTTOM VIEW 0.10 C 169X Øb 0.15 0.08 C A B C Microchip Technology Drawing C04-377-J Rev C Sheet 1 of 2 2015 Microchip Technology Inc. DS20005461A-page 13 HV583 169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA] (Complies with JEDEC Terminal Assignment recommendations) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 A2 Mold Cap Thickness Overall Length D E Overall Width b Ball Diameter MIN 0.21 0.50 0.35 MILLIMETERS NOM 169 0.75 BSC 0.32 0.45 10.00 10.00 0.40 MAX 1.10 0.50 0.45 Notes: 1. Terminal A1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-377-J Rev C Sheet 2 of 2 DS20005461A-page 14 2015 Microchip Technology Inc. HV583 169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA] (Complies with JEDEC Terminal Assignment recommendations) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 1 2 3 4 5 6 7 8 9 10 11 12 13 A B C D E F C2 G H J K L M N Øb E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C1 Contact Pad Spacing C2 b Contact Pad Diameter (X169) MIN MILLIMETERS NOM 0.75 BSC 9.00 9.00 0.35 MAX Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2377-J Rev C 2015 Microchip Technology Inc. DS20005461A-page 15 HV583 NOTES: DS20005461A-page 16 2015 Microchip Technology Inc. HV583 APPENDIX A: REVISION HISTORY Revision A (December 2015) • Original release of this document. 2015 Microchip Technology Inc. DS20005461A-page 17 HV583 NOTES: DS20005461A-page 18 2015 Microchip Technology Inc. HV583 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XX-X Device Package Examples: a) Device: HV583: Low-Voltage Serial to High-Voltage Parallel Converter with HV Outputs Package: GA-G = HV583GA-G: 169-Ball 10x10 TFBGA Package Thin Fine Pitch Ball Grid Array - 10 x 10 x 1.1 mm Body, 169-lead (TFBGA) 2015 Microchip Technology Inc. DS20005461A-page 19 HV583 NOTES: DS20005461A-page 20 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0106-3 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS20005461A-page 21 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 07/14/15 DS20005461A-page 22 2015 Microchip Technology Inc.