HV583 Data Sheet

HV583
128-Channel Serial to Parallel Converter with Push-Pull Outputs
Features
Description
• 128 High-Voltage Channels
- Up to 80V Operating Output Voltage
- 30 mA Peak Output Sink/Source Current
- Output Diodes to Ground for Efficient Power
Recovery
• Four Separate Shift Registers
- Clockwise and Counter-Clockwise Data
Shifting via DIR Pin
• 40 MHz Data Rate
HV583 is a unipolar, 128-channel low-voltage serial to
high-voltage parallel converter with push-pull outputs.
This device has been designed for applications
requiring multiple high-voltage outputs with current
sinking and sourcing capabilities, such as plasma
displays and Inkjet printers.
The device consists of four parallel 32-bit shift
registers, a 128-bit latch and 128 high-voltage outputs.
Data can be input at 40 MHz or up to 25 MHz when
cascaded in a multiple device configuration.
Applications
HV583 is offered in a 169-ball 10 x 10 x 1.1 mm
TFBGA package.
• Inkjet Printer Driver
• Plasma Display Driver
• 3D Printer Driver
Package Type
HV583
10x10x1.1 mm TFBGA*
Bottom View
Related Devices
• HV582: 96-Channel Serial to Parallel Converter
with Push-Pull Outputs
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
* See Section Section 2.0 “Package Pin Configurations
and Function Description”.
 2015 Microchip Technology Inc.
DS20005461A-page 1
HV583
Block Diagram
VDD
VPP
D1B
32-Bit
Shift
Register
D1A
D2B
D0
D1
D2
D3
D4
D5
D6
D7
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
HVOUT 0
32-Bit
Shift
Register
D2A
D3B
128-Bit
Latch
32-Bit
Shift
Register
D3A
D4B
32-Bit
Shift
Register
D124
D125
D126
D127
Q124
Q125
Q126
Q127
HVOUT 127
D4A
CLK
DIR
RST
LE
OH
OL
OE
DGND
DS20005461A-page 2
PGND
 2015 Microchip Technology Inc.
HV583
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Rating†
Supply Voltage VDD.................................................................................................................................... -0.5V to +6.5V
High-Voltage Supply VPP ............................................................................................................................ -0.5V to +90V
Output Sink and Source Current IOUT .................................................................................................. -65 mA to +40 mA
Output Body Diode Current IDIODE....................................................................................................... -65 mA to +65 mA
Logic Input Voltage..............................................................................................................................-0.5V to VDD +0.5V
Operating Junction Temperature.............................................................................................................-25°C to +125°C
Storage Temperature ..............................................................................................................................-40°C to +150°C
†Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability. Device is ESD sensitive. Use appropriate ESD precautions.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min.
Typ.
Max.
Units
High-Voltage Supply
VPP
15
-
80
V
Low-Voltage Supply
VDD
4.5
5.0
5.5
V
Conditions
HVOUT Peak Output Current
IOUT
-30
-
30
mA
VPP Power Supply Slew Rate
SR
-
-
8.0
V/μs
Clock Frequency
fCLK
-
-
40
MHz
Data Read
-
-
25
MHz
Cascaded Devices
TABLE 1-1:
POWER SEQUENCES
Sequence Type
Steps
Power- Up Sequence
1.
2.
3.
4.
Connect Ground.
Apply VDD.
Set All Inputs (Data, CLK, etc.) to a known state.
Apply VPP
Power- Down Sequence
Repeat the Power-Up sequence in reverse order.
DC ELECTRICAL CHARACTERISTICS
Electrical specifications: Unless otherwise specified, TA = TJ = +25°C, VDD = 5.0V and VPP = 80V.
Parameter
VPP Quiescent Supply Current
Symbol
Min.
Typ.
Max.
Units
IPPQ
—
—
10
μA
VDD Quiescent Supply Current
IDDQ
—
—
10
μA
High-Level Output Voltage
HVOH
73
76
—
V
10
—
—
HVOHD
—
—
81.5
Low-Level Output Voltage
HVOL
—
3.0
Output N-Channel Body Diode
HVOLD
-1.5
—
Output P-Channel Body Diode
Note 1:
Conditions
IOUT = 15 mA, VPP = 80V
IOUT = 10 mA, VPP = 20V
V
IOUT = -30 mA, VPP = 80V
(Note 1)
6.0
V
IOUT = -15 mA
—
V
IOUT = 30 mA (Note 1)
Specification is for design guidance only.
 2015 Microchip Technology Inc.
DS20005461A-page 3
HV583
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical specifications: Unless otherwise specified, TA = TJ = +25°C, VDD = 5.0V and VPP = 80V.
Parameter
Symbol
Min.
Typ.
Max.
Units
Logic Input High Voltage
VIH
2.3
—
VDD
V
Logic Input Low Voltage
VIL
0
—
0.7
Logic Input High Current
IIH
—
—
1.0
10
30
60
VIH = 5.0V, for DIR only
Logic Input Low Current
IIL
-1.0
—
—
VIL = -0.3V
Logic Output High
VOH
4.5
—
—
Logic Output Low
VOL
—
—
0.5
Note 1:
Conditions
VDD = 4.5V to 5.5V
VDD = 4.5V to 5.5V
μA
VIH = 5.3V, VDD = 5.0V
V
IOUT = 1.0 mA
IOUT = -1.0 mA
Specification is for design guidance only.
AC ELECTRICAL CHARACTERISTICS
Electrical specifications: Unless otherwise specified TA = TJ = 25°C, VDD = 5.0V and VPP = 80V
Symbol
Min.
Typ.
Max.
Units
Clock Pulse Width, High and Low(1)
Parameter
twCLK
10
—
—
ns
LE Pulse Width, High and Low(2)
twLE
10
—
—
Setup Time, DnA/B to
CLK(1)
Conditions
VDD = 4.5V to 5.5V
TJ = -25°C to 125°C
tsu1
5
—
—
Setup Time, CLK to LE(1)
tsu2
10
—
—
Setup Time, LE to OL,OH(1)
tsu3
25
—
—
Hold Time, CLK to DnA/B(1)
th1
5
—
—
th2
10
—
—
CLK to DnA/B (High-to-Low)
tpdHL
—
—
25
CLK to DnA/B (Low-to-High)
tpdLH
—
—
25
CL = 15 pF
LE,OL,OH to HVOUTn (High-to-Low)
tpHL
—
—
150
CL = 50 pF
LE,OL,OH to HVOUTn (Low-to-High)
tpLH
Typ-40
tpHL+ tf
Typ+40
CL = 80 pF
OE to HVOUTn (High-to-Low)
tpHZL
—
—
150
CL = 50 pF
OE to HVOUTn (Low-to-High)
tpLZH
Typ-40
tpHL+ tf
Typ+40
CL = 80 pF
OE to HVOUTn (High-to-Low)
tpHZ
—
—
300
RL = 10K, CL = 50 pF
OE to HVOUTn (Low-to-High)
Hold Time, LE to CLK
(1)
CL = 15 pF
tpLZ
—
—
300
RL = 10K, CL = 50 pF
Rise Time HVOUTn
tr
—
—
120
CL = 50 pF
Fall Time HVOUTn
tf
—
—
120
CL = 50 pF
Note 1:
2:
Specification is obtained by characterization and is not 100% tested.
Specification is for design guidance only.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Junction Temperature
TJ
-25
—
+125
°C
Storage Temperature
TA
-40
—
+150
°C
JA
—
27
—
°C/W
Conditions
Temperature Ranges
Package Thermal Resistance
Thermal Resistance, 169-Ball TFBGA
DS20005461A-page 4
 2015 Microchip Technology Inc.
HV583
1.1
Logic Characteristics
TABLE 1-2:
SHIFT REGISTER TRUTH TABLE
DIR
Legend:
D
=
H
=
L
=
X
=
Z
=
=
CLK
State
Direction
L or Open
Shift
DnB to DnA
L or Open
Hold
DnB to DnA
H
Shift
DnA to DnB
H
Hold
DnA to DnB
Data
Level High
Level Low
Don’t Care
High Impedance
Low-to-High Transition
= High-to-Low Transition
TABLE 1-3:
LATCH TRUTH TABLE
LE
Output State of Latch
L to H
Latch Execution
H to L
Hold
TABLE 1-4:
HVOUTn TRUTH TABLE
OE
OL
OH
DnA/DnB
HVOUTn
L
H
H
H
H
X
L
H
H
H
X
X
L
H
H
X
X
X
L
H
Z
L
H
L
H
TABLE 1-5:
RESET TRUTH TABLE
RST
CLK
0
0
 2015 Microchip Technology Inc.
Shift Register
Latches
X
Shift
X
X
Latch
Clear
X
X
Clear
X
1
1
LE
X
X
DS20005461A-page 5
HV583
TABLE 1-6:
OUTPUT SHIFT OPERATION
Input
Output
DIR
Shift Operation
D1A = D
D1B
H
D to D124...D0 to D1B
D2A = D
D2B
H
D to D125...D1 to D2B
D3A = D
D3B
H
D to D126...D2 to D3B
D4A = D
D4B
H
D to D127...D3 to D4B
D1B = D
D1A
L or Open
D to D0...D124 to D1A
D2B = D
D2A
L or Open
D to D1...D125 to D2A
D3B = D
D3A
L or Open
D to D2....D126 to D3A
D4B = D
D4A
L or Open
D to D3....D127 to D4A
DS20005461A-page 6
 2015 Microchip Technology Inc.
HV583
1.2
Timing Diagram
twCLK
twCLK
VIH
CLK
50%
50%
50%
VIL
tsu1
th1
tsu1
th1
VIH
DnA/B
(input)
50%
50%
50%
VIL
tpdLH
tpdHL
VOH
50%
50%
DnA/B
(output)
VOL
th2
tsu2
twLE
twLE
VIH
LE
50%
50%
50%
50%
VIL
tsu3
VIH
OL, OH
50%
VIL
VIH
OE
50%
VIL
VIH
50%
50%
OE
VIL
VIH
50%
50%
LE, OH, OL
VIL
tpHZ
tpLZ
tpLZH
tpHZL
tpLH
90%
90%
10%
10%
tpHL
90%
VOH
90%
HVOUTn
10%
10%
VOL
tf
tr
VIH
LE, OH, OL
50%
VIL
VOH
90%
HVOUTn
10%
tpHL
HVOUTn
VOL
VOH
tf
90%
tpLH= tpHL+ tf
10%
 2015 Microchip Technology Inc.
tr
VOL
DS20005461A-page 7
HV583
2.0
PACKAGE PIN
CONFIGURATIONS AND
FUNCTION DESCRIPTION
This section details the pin designation for the 169-Ball
TFBGA package (Figure 2-1). The descriptions of the
pins are listed in Table 2-1.
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
HVOUT86
HVOUT85
HVOUT83
HVOUT80
HVOUT76
HVOUT71
HVOUT66
HVOUT61
HVOUT56
HVOUT51
HVOUT47
HVOUT44
HVOUT42
HVOUT87
HVOUT84
HVOUT82
HVOUT79
HVOUT75
HVOUT70
HVOUT65
HVOUT60
HVOUT55
HVOUT50
HVOUT46
HVOUT43
HVOUT41
HVOUT89
HVOUT88
HVOUT81
HVOUT78
HVOUT74
HVOUT69
HVOUT64
HVOUT59
HVOUT54
HVOUT49
HVOUT45
HVOUT39
HVOUT40
HVOUT92
HVOUT91
HVOUT90
HVOUT77
HVOUT73
HVOUT68
HVOUT63
HVOUT58
HVOUT53
HVOUT48
HVOUT36
HVOUT37
HVOUT38
HVOUT96
HVOUT95
HVOUT94
HVOUT93
HVOUT72
HVOUT67
HVOUT62
HVOUT57
HVOUT52
HVOUT32
HVOUT33
HVOUT34
HVOUT35
HVOUT100
HVOUT99
HVOUT98
HVOUT97
VPP
VPP
VPP
VPP
VPP
HVOUT28
HVOUT29
HVOUT30
HVOUT31
HVOUT104 HVOUT103 HVOUT102 HVOUT101
VPP
VPP
VPP
VPP
VPP
HVOUT24
HVOUT25
HVOUT26
HVOUT27
HVOUT108 HVOUT107 HVOUT106 HVOUT105
NC
PGND
PGND
PGND
NC
HVOUT20
HVOUT21
HVOUT22
HVOUT23
HVOUT112 HVOUT111 HVOUT110 HVOUT109
PGND
PGND
PGND
PGND
PGND
HVOUT16
HVOUT17
HVOUT18
HVOUT19
HVOUT115 HVOUT114 HVOUT113
DGND
VDD
NC
VDD
DGND
HVOUT0
HVOUT13
HVOUT14
HVOUT15
HVOUT117 HVOUT116 HVOUT122 HVOUT125
D1A
D4A
OE
LE
D3B
HVOUT1
HVOUT4
HVOUT11
HVOUT12
HVOUT118 HVOUT120 HVOUT123 HVOUT126
D2A
OL
DIR
CLK
D2B
HVOUT2
HVOUT5
HVOUT7
HVOUT10
HVOUT119 HVOUT121 HVOUT124 HVOUT127
D3A
OH
RST
D4B
D1B
HVOUT3
HVOUT6
HVOUT8
HVOUT9
A
B
C
D
E
F
G
H
J
K
NC
L
M
N
FIGURE 2-1:
DS20005461A-page 8
169-Ball TFBGA Package.
 2015 Microchip Technology Inc.
HV583
TABLE 2-1:
PIN ASSIGNMENT
Pin #
Name
Pin #
Name
Pin #
Name
Pin #
Name
A1
HVOUT86
D5
HVOUT73
H5, H9, K4, K7
NC
M8
CLK
A2
HVOUT85
D6
HVOUT68
H6, H7, H8,
J5, J6, J7, J8, J9
PGND
M9
D2B
A3
HVOUT83
D7
HVOUT63
H10
HVOUT20
M10
HVOUT2
A4
HVOUT80
D8
HVOUT58
H11
HVOUT21
M11
HVOUT5
A5
HVOUT76
D9
HVOUT53
H12
HVOUT22
M12
HVOUT7
A6
HVOUT71
D10
HVOUT48
H13
HVOUT23
M13
HVOUT10
A7
HVOUT66
D11
HVOUT36
J1
HVOUT112
N1
HVOUT119
A8
HVOUT61
D12
HVOUT37
J2
HVOUT111
N2
HVOUT121
A9
HVOUT56
D13
HVOUT38
J3
HVOUT110
N3
HVOUT124
A10
HVOUT51
E1
HVOUT96
J4
HVOUT109
N4
HVOUT127
A11
HVOUT47
E2
HVOUT95
J10
HVOUT16
N5
D3A
A12
HVOUT44
E3
HVOUT94
J11
HVOUT17
N6
OH
A13
HVOUT42
E4
HVOUT93
J12
HVOUT18
N7
RST
B1
HVOUT87
E5
HVOUT72
J13
HVOUT19
N8
D4B
B2
HVOUT84
E6
HVOUT67
K1
HVOUT115
N9
D1B
B3
HVOUT82
E7
HVOUT62
K2
HVOUT114
N10
HVOUT3
B4
HVOUT79
E8
HVOUT57
K3
HVOUT113
N11
HVOUT6
B5
HVOUT75
E9
HVOUT52
K5, K9
DGND
N12
HVOUT8
B6
HVOUT70
E10
HVOUT32
K6, K8
VDD
N13
HVOUT9
B7
HVOUT65
E11
HVOUT33
K10
HVOUT0
B8
HVOUT60
E12
HVOUT34
K11
HVOUT13
B9
HVOUT55
E13
HVOUT35
K12
HVOUT14
B10
HVOUT50
F1
HVOUT100
K13
HVOUT15
B11
HVOUT46
F2
HVOUT99
L1
HVOUT117
B12
HVOUT43
F3
HVOUT98
L2
HVOUT116
B13
HVOUT41
F4
HVOUT97
L3
HVOUT122
C1
HVOUT89
F5, F6, F7, F8, F9,
G5, G6, G7, G8, G9
VPP
L4
HVOUT125
C2
HVOUT88
F10
HVOUT28
L5
D1A
C3
HVOUT81
F11
HVOUT29
L6
D4A
C4
HVOUT78
F12
HVOUT30
L7
OE
C5
HVOUT74
F13
HVOUT31
L8
LE
C6
HVOUT69
G1
HVOUT104
L9
D3B
C7
HVOUT64
G2
HVOUT103
L10
HVOUTN1
C8
HVOUT59
G3
HVOUT102
L11
HVOUT4
C9
HVOUT54
G4
HVOUT101
L12
HVOUT11
C10
HVOUT49
G10
HVOUT24
L13
HVOUT12
C11
HVOUT45
G11
HVOUT25
M1
HVOUT118
C12
HVOUT39
G12
HVOUT26
M2
HVOUT120
C13
HVOUT40
G13
HVOUT27
M3
HVOUT123
D1
HVOUT92
H1
HVOUT108
M4
HVOUT126
D2
HVOUT91
H2
HVOUT107
M5
D2A
D3
HVOUT90
H3
HVOUT106
M6
OL
D4
HVOUT77
H4
HVOUT105
M7
DIR
 2015 Microchip Technology Inc.
DS20005461A-page 9
HV583
2.1
High-Voltage Output Pins
(HVOUT0 to HVOUT127)
These are
(Push-Pull).
2.2
the
high-voltage
output
2.9
channels
High-Voltage Power Supply Pins
(VPP)
High-voltage power supply pins for the output channels
(HVOUTn).
2.3
The Latch Enable pin controls the data transfer from
the input shift registers to the 128-bit latch and the
HVOUTn channels.
When LE transitions from Low to High (rising edge),
data is transferred from the 128-bit data latch to the
HVOUTn output channels. When LE is Low, new data
can be clocked into the shift registers.
2.10
No Connection Pins (NC)
NC pins do not have any functionality on the IC. These
pins should not be connected.
Latch Enable Pin (LE)
Data Input/Output Pins
(D1B, D2B, D3B, D4B)
Data Input/Output pins are configurable as inputs or
outputs for the shift registers, depending on the state of
the Direction pin (DIR).
High-voltage ground pins provide the reference ground
level for the high-voltage output channels.
When DIR is Low, pins D1B to D4B are configured as
inputs to the data shift registers. When DIR is High,
pins are configured as outputs of the data shift
registers.
2.5
2.11
2.4
High-Voltage Ground Pins (PGND)
Digital Logic Ground Pins (DGND)
Output Low Pin (OL)
Digital Logic Ground pins provide a reference ground
level for the low-voltage section of the IC, shift-registers, latches and decoders.
The Output Low pin sets all high-voltage output channels (HVOUT0 to HVOUT127) to a Low-level state
(PGND).
2.6
When OL is set Low and OE is High, all the HVOUTn channels are forced to a Low-level state (PGND), regardless of
the data stored in the 128-bit latch.
Logic Power Supply Pins (VDD)
Logic power supply pins for the 32-bit shift registers,
128-bit latch and decoders.
2.7
Data Input/Output Pins
(D1A, D2A, D3A, D4A)
Data Input/Output pins are configurable as inputs or
outputs for the shift registers depending on the state of
the Direction pin (DIR).
When DIR is High, pins D1A to D4A are configured as
inputs to the data shift registers. When DIR is Low,
these pins are configured as outputs of the data shift
registers.
2.8
Output Enable Pin (OE)
2.12
Direction Pin (DIR)
The DIR pin controls the direction of the input data flow
for the input registers, whether it is clockwise (DnB to
DnA) or counter-clockwise (DnA to DnB).
When the DIR pin is set High, data flows from DnA to
DnB. When DIR pin is set Low, data flows from DnB to
DnA. See Table 1-6 for more information.
2.13
Clock Input Pin (CLK)
This is the Clock Input pin for 32-bit input shift registers.
2.14
Output High Pin (OH)
The Output Enable pin controls the functionality of the
high-voltage output channels.
The Output High pin sets all high-voltage output channels
(HVOUT0 to HVOUT127) to a High-level state (VPP).
When OE is High, all HVOUTn channels are enabled
and form a push-pull configuration to operate according
to input data, OL or OH configuration states. When OE
is Low, all HVOUTn channels are forced to a highimpedance state, regardless of the data stored in the
128-bit latch or the state of the OL and OH pins.
When OH is Low while OE and OL are High, all the
HVOUTn channels are forced to a High-level state (VPP),
regardless of the data stored in the 128-bit latch. See
Table 1-4 for more information.
2.15
Reset Pin (RST)
The RST pin clears shift registers and the 128-bit latch
data content when it is set High during the rising edge
of the CLK and LE, respectively. See Table 1-5 for
more information.
DS20005461A-page 10
 2015 Microchip Technology Inc.
HV583
3.0
FUNCTIONAL DESCRIPTION
3.1
Application Information
HV583 is designed for applications requiring multiple
high-voltage outputs with current sinking and sourcing
capabilities in the range of ±30 mA. Typical
applications where the HV583 is utilized are in plasma
displays, Inkjet printer drivers and 3D printer drivers.
The HV583 is a unipolar, 128-channel low-voltage
serial to high-voltage parallel converter. The device
consists of four parallel 32-bit shift registers, a 128-bit
latch and 128 high-voltage outputs.
The four independent shift registers allow data to be
updated into the 128-bit latch at four times the speed of
a single register, providing a fast update rate for the
128 output channels. The 128-bit latch holds the data
for the high-voltage output channels; whether it is a
High-level or Low-level state. The flow of the input data
can switch direction from clockwise (DnB to DnA) to
counter-clockwise (DnA to DnB) by controlling the DIR
pin. A reset pin (RST) is provided to clear the contents
of the latches. All channels can be set at the same time
to a high-impedance state (High Z), Low-level state, or
High-level state through the OE, OL and OH pins,
respectively.
The high-output voltages (HVOUTn) can operate from
15V to 80V with a maximum current source and sink
capability of 30 mA.
High-Voltage
Power Supply
Low-Voltage
Power Supply
Piezo Element
HV583
Low Voltage
High Voltage
HVOUT0
D(1-4)A
CLK
LE
Microprocessor
OE
OL
Shift Register
Latches
Output Control
Level Translators
and
Push-Pull Output
Buffers
OH
HVOUT127
DIR
RST
D(1-4)B
DIN(1-4) for Cascading the next HV583
FIGURE 3-1:
Typical Application Block Diagram.
 2015 Microchip Technology Inc.
DS20005461A-page 11
HV583
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
169-Ball TFBGA (10 x10 x1.1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005461A-page 12
Example
HV583GA ^^e3
1533256
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
 2015 Microchip Technology Inc.
HV583
169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]
(Complies with JEDEC Terminal Assignment recommendations)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
NOTE 1
A
D
4
B
E
4
E
(DATUM B)
(DATUM A)
2X
0.15 C
2X
TOP VIEW
0.15 C
A
A2
0.20 C
C
SEATING
PLANE
A1
169X
SIDE VIEW
e
BOTTOM VIEW
0.10 C
169X Øb
0.15
0.08
C A B
C
Microchip Technology Drawing C04-377-J Rev C Sheet 1 of 2
 2015 Microchip Technology Inc.
DS20005461A-page 13
HV583
169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]
(Complies with JEDEC Terminal Assignment recommendations)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
A
Overall Height
Standoff
A1
A2
Mold Cap Thickness
Overall Length
D
E
Overall Width
b
Ball Diameter
MIN
0.21
0.50
0.35
MILLIMETERS
NOM
169
0.75 BSC
0.32
0.45
10.00
10.00
0.40
MAX
1.10
0.50
0.45
Notes:
1. Terminal A1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-377-J Rev C Sheet 2 of 2
DS20005461A-page 14
 2015 Microchip Technology Inc.
HV583
169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]
(Complies with JEDEC Terminal Assignment recommendations)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
1
2
3
4
5
6
7
8
9
10
11
12
13
A
B
C
D
E
F
C2
G
H
J
K
L
M
N
Øb
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C1
Contact Pad Spacing
C2
b
Contact Pad Diameter (X169)
MIN
MILLIMETERS
NOM
0.75 BSC
9.00
9.00
0.35
MAX
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2377-J Rev C
 2015 Microchip Technology Inc.
DS20005461A-page 15
HV583
NOTES:
DS20005461A-page 16
 2015 Microchip Technology Inc.
HV583
APPENDIX A:
REVISION HISTORY
Revision A (December 2015)
• Original release of this document.
 2015 Microchip Technology Inc.
DS20005461A-page 17
HV583
NOTES:
DS20005461A-page 18
 2015 Microchip Technology Inc.
HV583
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX-X
Device
Package
Examples:
a)
Device:
HV583: Low-Voltage Serial to High-Voltage Parallel
Converter with HV Outputs
Package:
GA-G
=
HV583GA-G: 169-Ball 10x10 TFBGA Package
Thin Fine Pitch Ball Grid Array - 10 x 10 x 1.1 mm
Body, 169-lead (TFBGA)
 2015 Microchip Technology Inc.
DS20005461A-page 19
HV583
NOTES:
DS20005461A-page 20
 2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0106-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005461A-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20005461A-page 22
 2015 Microchip Technology Inc.