FRDMKW40ZUG

Freescale Semiconductor, Inc.
User’s Guide
Document Number: FRDMKW40ZUG
Rev. 2, 10/2015
FRDM-KW40Z Freescale Freedom
Development Board
User's Guide
1
Introduction
This guide describes the hardware for the FRDM-KW40Z
Freescale Freedom development board. The FRDM-KW40Z
Freedom development board is a small, low-power,
and cost-effective evaluation and development board for
application prototyping and demonstration of the MKW40Z
SoC family of devices. These evaluation boards offer
easy-to-use mass-storage-device mode flash programmer,
a virtual serial port, and standard programming and
run-control capabilities.
The MKW40Z SoC is an ultra-low-power, highly integrated
single-chip device that enables Bluetooth Low Energy
(BLE) and/or IEEE® Std. 802.15.4/RF connectivity for
portable, ultra-low-power embedded systems.
The MKW40Z SoC family integrates a radio transceiver
operating in the 2.36 GHz to 2.48 GHz range (supporting a
range of FSK/GFSK and O-QPSK modulations), ARM®
Cortex®-M0+ CPU, 160 KB flash memory and 20 KB
SRAM, BLE Link Layer hardware, 802.15.4 packet
processor hardware, and peripherals optimized to meet the
requirements of the target applications.
1.1
Audience
This guide is intended for system designers.
© 2015 Freescale Semiconductor, Inc. All rights reserved.
1.
1.1.
2.
2.1.
2.2.
2.3.
2.4.
3.
3.1.
3.2.
3.3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
5.8.
5.9.
6.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Regulatory approval for Canada (IC RSS 210) . . . . . 3
Electrostatic discharge considerations . . . . . . . . . . . . 3
Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . . . 3
FRDM-KW40Z overview and description . . . . . . . . . 4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial and Debug Adapter . . . . . . . . . . . . . . . . . . . . . 7
FRDM-KW40Z development board . . . . . . . . . . . . . 8
FRDM-KW40Z board overview . . . . . . . . . . . . . . . . 8
Functional description . . . . . . . . . . . . . . . . . . . . . . . 12
Schematic, board layout, and bill of materials . . . . . 24
PCB manufacturing specifications . . . . . . . . . . . . . . 33
Single PCB construction . . . . . . . . . . . . . . . . . . . . . 34
Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . . . 35
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Hole specification/tool table . . . . . . . . . . . . . . . . . . . 35
File descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Safety information
2
2.1
Safety information
FCC guidelines
This equipment is to be used by developers for evaluation purposes only, and must not be incorporated into
any other device or system. This device must not be sold to the general public. Integrators are responsible
for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
The FCC approval of this device only covers the original configuration of this device (as supplied).
Any modifications to this product (including changes shown in this guide) may violate the rules of the
Federal Communications Commission and Industry Canada and make the operation of the product
unlawful.
2.1.1
Labeling
The FCC labels are located on the back of the board.
2.1.2
Operating conditions
The device must comply with part 15 of the FCC rules. Operation is subject to these two conditions:
• This device must not cause harmful interference.
• This device must accept any interference received, including interference that can cause undesired
operation.
2.1.3
Exposure limits
The device must comply with FCC radiation exposure limits set forth for an uncontrolled environment.
Install the antenna(s) used by the device to provide a separation distance of at least 8 inches (20 cm) from
all persons.
2.1.4
Antenna restrictions
An intentional radiator must be designed to ensure that no antenna (other than that furnished by the
responsible party) is used with the device. Using a permanently attached antenna or an antenna that uses
a unique coupling to the intentional radiator is considered sufficient to comply with the provisions of this
Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but
using a standard antenna jack or electrical connector is prohibited. This requirement does not apply to
carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217,
15.219, or 15.221 of the IEEE 802.15.4 Standard. This requirement does not apply to intentional radiators
that must be professionally installed (such as perimeter protection systems and field disturbance sensors)
or to other intentional radiators which must be measured at the installation site (in accordance with Section
15.31(d)). The installer is responsible for ensuring that a proper antenna is employed (to not exceed the
limits in this Part).
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Safety information
2.2
Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
these two conditions:
1. This board must not cause interference.
2. This board must accept any interference, including interference that may cause undesired operation
of the device.
2.2.1
26 PART 5—Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3
Electrostatic discharge considerations
Although the damage from electrostatic discharge (ESD) is much less common on these devices when
compared to the early CMOS circuits, use standard handling precautions to avoid exposure to static
discharge. Qualification tests are performed to ensure that these devices can withstand exposure to
reasonable levels of static without suffering any permanent damage.
All ESD testing must conform to the JESD22 Stress Test Qualification for Commercial Grade Integrated
Circuits. During the device qualification, ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM), and the Charge Device Model (CDM).
All latch-up test testing must conform to the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least grounding wrist straps, plus any (or all) of these ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps.
• Static control workstations, static control monitors and table or floor static control systems.
• Static control packaging and transportation materials and environmental systems.
2.4
Disposal instructions
This product may be subject to special disposal requirements. For product disposal instructions,
see freescale.com/productdisposal.
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FRDM-KW40Z overview and description
3
3.1
FRDM-KW40Z overview and description
Introduction
The FRDM-KW40Z development board is an evaluation environment supporting Freescale MKW40Z
SoC transceiver.
The MKW40Z SoC integrates a radio transceiver operating in the 2.36 GHz to 2.48 GHz range (supporting
a range of FSK/GFSK and O-QPSK modulations) and an ARM Cortex-M0+ MCU into a single package.
Freescale supports the MKW40Z SOC with tools and software that include hardware evaluation and
development boards, software development IDE, applications, drivers, custom PHY usable with IEEE Std.
802.15.4 compatible MAC, BLE Link Layer, and enables the usage of the Bluetooth Low Energy protocol
in the MBAN frequency range for proprietary applications.
The FRDM-KW40Z development board consists of the MKW40Z device with 32 MHz reference
oscillator crystal, RF circuitry (including antenna), 2-Mbit external serial flash, and supporting circuitry
in the popular Freedom form. The board is a standalone PCB and supports application development with
Freescale IEEE Std. 802.15.4 protocol stacks.
3.2
3.2.1
Board features
FRDM-KW40Z board
The FRDM-KW40Z development board is based on Freescale Freedom development platform. It is the
most diverse reference design containing the MKW40Z device and all necessary I/O connections for use
as a standalone board, or connected to an application. You can also connect it to the Freedom development
platform.
Figure 1 shows the FRDM-KW40Z development board. A similar board (not shown) uses the MKW40Z
device.
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FRDM-KW40Z overview and description
Figure 1. FRDM-KW40Z Freedom development board
The FRDM-KW40Z development board has these features:
• Freescale ultra-low-power MKW40Z SoC BLE/IEEE Std. 802.15.4 platform.
• IEEE Std. 802.15.4, 2006-compliant transceiver supporting 250 kbps O-QPSK data in 5.0 MHz
channels, and full spread-spectrum encoding and decoding.
• Fully compliant Bluetooth v4.1 Low Energy (BLE).
• IEEE 802.15.4-compliant wireless node.
• Reference design area with small-footprint, low-cost RF node.
— Differential input/output port used with external balun for single-port operation.
— Low count of external components.
— Programmable output power from -20 dBm to +5 dBm at the SMA connector, no harmonic
trap, with DC/DC Bypass and Buck modes of operation.
— Receiver sensitivity is -102 dBm, typical (@1 % PER for 20-byte payload packet) for 802.15.4
applications, at the SMA connector.
— Receiver sensitivity is -91 dBm (for BLE applications).
• Integrated PCB inverted F-type antenna and SMA RF port.
• Selectable power sources.
• DC-DC converter with Buck, Boost, and Bypass operation modes.
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FRDM-KW40Z overview and description
•
•
•
•
•
•
•
•
•
•
•
32 MHz reference oscillator.
32 kHz reference oscillator.
2.4 GHz frequency operation (ISM and MBAN).
External serial flash memory for Over-the-Air Programming (OTAP) support.
Integrated Open-Standard Serial and Debug Adapter (OpenSDA).
Cortex 10-pin (0.05) SWD debug port for target MCU.
Cortex 10-pin (0.05) JTAG port for OpenSDA updates.
Four red LED indicators.
One blue LED indicator.
Two push-button switches.
Two TSI buttons.
This figure shows the main board features and Input/Output headers for the Freescale FRDM-KW40Z
board:
Figure 2. FRDM-KW40Z component placement
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FRDM-KW40Z overview and description
3.3
Serial and Debug Adapter
The FRDM-KW40Z development board includes OpenSDA v2.1-a serial and debug adapter circuit that
includes an open-source hardware design, an open-source bootloader, and debug interface software. It
bridges serial and debug communications between a USB host and an embedded target processor as shown
in Figure 3. The hardware circuit is based on a Freescale Kinetis K20 family microcontroller (MCU) with
128 KB of embedded flash and an integrated USB controller. OpenSDAv2.1 comes preloaded with the
CMSIS-DAP bootloader - an open-source mass storage device (MSD) bootloader and the CMSIS-DAP
Interface firmware (aka mbed interface), which provides a MSD flash programming interface, a virtual
serial port interface, and a CMSIS-DAP debug protocol interface.
For more information on the OpenSDAv2.1 software, see mbed.org and
https://github.com/mbedmicro/CMSIS-DAP.
Figure 3. OpenSDAv2.1 high-level block diagram
OpenSDAv2.1 is managed by a Kinetis K20 MCU built on the ARM Cortex-M4 core. The OpenSDAv2.1
circuit includes a status LED (D2) and a pushbutton (SW6). The pushbutton asserts the Reset signal to the
MKW40Z target MCU. It can also be used to place the OpenSDAv2.1 circuit into bootloader mode. UART
and GPIO signals provide an interface to either the SWD debug port or the K20. The OpenSDAv2.1 circuit
receives power when the USB connector J6 is plugged into a USB host.
3.3.1
Virtual serial port
A serial port connection is available between the OpenSDAv2.1 MCU and pins PTC6 and PTC7 of the
MKW40Z.
NOTE
To enable the Virtual COM, Debug, and MSD features, mbed drivers must
be installed. Download the drivers at
https://developer.mbed.org/handbook/Windows-serial-configuration.
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FRDM-KW40Z development board
4
4.1
FRDM-KW40Z development board
FRDM-KW40Z board overview
The FRDM-KW40Z board is an evaluation board based on Freescale MKW40Z transceiver, and it
provides a platform to evaluate the MKW40Z SoC device and to develop software and applications. The
core device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry (including antenna), and
supporting circuitry.
The FRDM-KW40Z board is intended as the core PCB for MKW40Z device evaluation and application
development, and can be used in the following modes:
• Simple standalone evaluation platform.
• Daughter card for other Freedom development platform boards.
• Mother card for application-specific daughter cards, such as a shield card.
4.1.1
PCB features
The FRDM-KW40Z board has these features:
• The Freescale Freedom development board form factor.
• Four-layer, metal, 0.062 inches thick FR4 board.
• LGA footprint and power supply (DC-DC converter).
• DC-DC converter with Buck, Boost, and Bypass operation modes.
• Printed-metal F-Antenna or SMA connector (for conducted measurements).
• 32 MHz reference oscillator crystal.
• 32.768 kHz crystal provided for optional timing oscillator.
• Standard Freedom daughter card mounting interface (shield).
• External serial flash memory for OTAP support.
• Combo sensor—six-axis sensor with integrated linear accelerometer and magnetometer.
4.1.2
Form factor
Figure 4 shows the FRDM-KW40Z board with the location of the I/O headers. This list provides the
details:
• J1, J2, J3, and J4:
— Headers have standard 0.1 in/2.54 mm pin spacing.
— J2 is 20-pin.
— J1 and J3 are 16-pin.
— J4 is 12-pin.
— All pin headers mounted on the top side of the FRDM-KW40Z board are intended for plugging
into matching receptacles on the Freedom platform development board.
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•
J16, J17, J18, and J22:
— Headers have standard 0.787 in./2.00 mm pin spacing.
— J18 is a 2  2 pin.
— J16, J17, and J22 are 2  3 pins.
— Pin headers mounted on the top side of the FRDM-KW40Z are intended to select between
power configurations, Bypass, Buck, and Boost.
Figure 4. FRDM-KW40Z board with I/O headers locations
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FRDM-KW40Z development board
This figure shows the footprint of the FRDM-KW40Z board with the board dimensions:
Figure 5. FRDM-KW40Z board dimensions
4.1.3
Board level specifications
Table 1. FRDM-KW40Z board specifications
Parameter
Min
Typ
Max
Units
Notes/Conditions
Size (PCB: X, Y)
—
—
81.2  53.3
3.20  2.10
mm
inches
—
Layer build (PCB)
—
1.57
0.062
—
Dielectric material (PCB)
—
—
—
—
FR4
—
—
—
mA
See the data sheet
Operating temperature (see note)
-40
+25
+70
°C
Operating temperature is limited to +70 °C due
to switches. Basic circuit handles a maximum
temperature of +85 °C.
Storage temperature
-30
+25
+70
°C
—
2480
MHz
2480
MHz
General
mm Four-layer
inches
Power
Current consumption
Temperature
RF
802.15.4 frequency range
2405
RF
BLE frequency range
2400
—
—
All 16 channels in the 2450 MHz band
All 40 channels in the 2450 MHz band
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Table 1. FRDM-KW40Z board specifications (continued)
Parameter
RF
ISM and MBAN frequency range
Min
2360
Typ
—
Max
Units
2483
MHz
Notes/Conditions
—
RF receiver
Saturation (maximum input level)
—
+0
—
dBm
See the data sheet
Sensitivity for 1 % packet error rate
(PER) (+25 °C) 802.15.4
—
-102
—
dBm
See the data sheet
Sensitivity for 1 % packet error rate
(PER) (+25 °C) BLE
—
-91
—
dBm
See the data sheet
RF power output
-20
—
+5
dBm
Programmable in steps.
At the antenna feed with no harmonic trap.1
2nd harmonic
—
50
40
dBm
See the data sheet
3rd harmonic
—
50
40
dBm
See the data sheet
FCC
—
—
—
—
Product is approved according to the FCC part
15 Standard.
CE (ETSI)
—
—
—
—
Product is approved according to the EN 300
328 V1.7.1 (2006-10) Standard.
CE (EMC)
—
—
—
—
Product is approved according to the EN 301
489-1 V1.6.1 (2005-09) and EN 301 489-17
V1.2.1 (2002-08) s=Standards.
—
—
—
—
Product is approved according to the IEC
60950-1 and EN 60950-1, First Edition
Standards.
RoHS
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003.
WEEE
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003.
RF transmitter
Regulatory approval
Safety
UL
Environment
1
Harmonic trap will add 1-2 dB of loss
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FRDM-KW40Z development board
4.2
Functional description
The FRDM-KW40Z board is built around Freescale MKW40Z SoC in a 48-pin LGA package. It features
an IEEE Std. 802.15.4 and BLE 2.4 GHz radio frequency transceiver and a Kinetis family ultra-low-power,
mixed-signal ARM Cortex-M0+ MCU in a single package. This board is intended as a simple evaluation
platform and as a building block for application development. The four-layer board provides the MKW40Z
SoC with its required RF circuitry, 32 MHz reference oscillator crystal, and power supply with a DC-DC
converter including Bypass, Buck, and Boost modes. The layout for this base-level functionality can be
used as a reference layout for your target board. This figure shows a simple functional block diagram:
Figure 6. FRDM-KW40Z board functional block diagram
4.2.1
RF performance and considerations
The FRDM-KW40Z board’s integrated transceiver includes a 1 mW nominal output power PA with
internal Voltage-Controlled Oscillator (VCO), integrated transmit/receive switch, on-board power supply
regulation, and full spread-spectrum encoding and decoding. The main specifications of the MKW40Z
SoC are:
• Nominal output power is set to 0 dBm.
• Programmable output power ranges from -20 dBm to +5 dBm at the SMA (no harmonic trap).
• Typical sensitivity is -102 dBm (@1 % PER for 25 °C) at the SMA (802.15.4).
• Typical sensitivity is -91 dBm (@1 % PER for 25 °C) at the SMA (BLE).
• Frequency ranges from 2360 to 2480 MHz.
• Differential bidirectional RF input/output port with integrated transmit/receive switch.
• “F” printed-metal antenna for a small-footprint, low-cost design.
• Minimum number of RF marching components and external 50:100 balun.
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The external 50 (balanced):100 (unbalanced) balun connects a single-ended 50-Ohm port to the
differential RF port of the MKW40Z SoC transceiver. The layout has a provision for out-of-band signal
suppression (components L4 and C33), if required. The following figure shows the typical topology of the
RF circuitry. The RF connector J5 is provided for conducted measurement purposes, and it is used as DNP.
Figure 7. FRDM-KW40Z board’s RF circuitry
4.2.2
Clocks
The FRDM-KW40Z board provides two clocks:
• 32 MHz Reference Oscillator—Figure 8 shows the 32 MHz external crystal Y1. This mounted
crystal meets the specifications outlined in Reference Oscillator Crystal Requirements for the
MC1320x, MC1321x, MC1322x, and MC1323x IEEE 802.15.4 Devices (document AN3251).
The IEEE Std. 802.15.4 requires the frequency to be accurate to less than 40 ppm.
— Capacitors C41 and C42 provide the bulk of the crystal load capacitance. At 25 °C, the
frequency must be accurate to 10 ppm (or less) to enable temperature variation.
— To measure the 32 MHz oscillator frequency, program the CLKOUT (PTB0) signal to provide
buffered output clock signal.
• Optional 32.768 kHz Crystal Oscillator—a secondary 32.768 kHz crystal Y2 is provided
(see Figure 9). Use this oscillator for a low-power accurate time base.
— The module provides the Y2 crystal and its load capacitors C46 and C47.
— Load capacitors C46 and C47 provide the entire crystal load capacitance; there is no on-board
trim capacitance.
— The 32 kHz oscillator components are supplied, but not enabled. The 0 Ohm resistors R71 and
R76 disable the 32 kHz oscillator.
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FRDM-KW40Z development board
Figure 8. FRDM-KW40Z board’s 32 MHz reference oscillator circuit
Figure 9. FRDM-KW40Z board’s optional 32.768 kHz oscillator circuit
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4.2.3
Power management
There are several different ways to power and measure current on the FRDM-KW40Z board.
The FRDM-KW40Z power-management circuit is shown in this figure:
Figure 10. FRDM-KW40Z board’s power-management circuit
Power the FRDM-KW40Z in several ways:
• Power the board through the micro USB type B connector (J6), which provides P5V_USB to LDO
3V3 (U17).
• Power the board through the Freedom development board headers, which provide either P3.3V or
P5-9V_VIN on header J3 pin-16 to LDO 3V3 (U17).
• Power the board from an external battery (Coincell – BT500).
• Power the board from an external DC supply in these ways:
— Connect an adapter that can supply 1.8 to 3.6 VDC to J19 pins 1 using the selector J23 pin 2-3.
— Connect an unregulated external supply (of up to 5.5 VDC) to J19 pin 1 and the GND pin to
use the onboard 3.3 V LDO regulator (using the selector J23 pin 1-2).
The 2-pin 12 headers J8, J20, and J21 can supply current to various board components and measure the
current (if desired). Green LED marked as LED6 is available as a power indicator.
Power headers can supply either the LED, MCU, or peripheral circuits. Measure the current by inserting
a current meter in place of a designated jumper. Connection configurations are described in Table 2.
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Table 2. Power distribution headers
Supply
designation
Header
pins
P3V3_BRD
J8
1-2
Supply voltage to board peripherals
• Normally jumpered
• Jumper used to enable sensor, external flash memory, and buzzer on
board
• Leave open for lowest power
• Usage—measure the current or breakout for current consumption
P3V3_LED_PWR
J20
1-2
Supply voltage to power LED
• Normally jumpered
• Jumper used to enable green power LED on board
• Leave open for lowest power
• Usage—measure the LED current
V_MCU
J21
1-2
Supply voltage to MKW40Z SoC
• Normally jumpered
• Powers the MKW40Z SoC and transceiver
• Usage—measure or supply the MCU and radio current
Description
The DC-DC power configuration headers provide the DC-DC modes, and can be easily modified for the
desired mode. The connection configurations are described in Table 3:
Table 3. DC-DC power distribution headers
DC-DC mode
Reference
designator and
header pins
Description
Bypass
J18 1-2
J16 1-2
J17 3-4
J22 1-3, 2-4
Supply voltage to power Bypass mode
• Normally jumpered as primary mode
• Power level range 1.8 V–3.6 V
Buck
J18 2-4
J16 5-6
J17 3-4
J22 3-5
Supply voltage to power Buck mode
• Alternative configuration, related to Coin cell option
• Power level range 1.8 V–4.2 V
• DC-DC converter requires at least 2.1 V to start; the supply can drop to 1.8 V after
the DC-DC converter settles
Buck
Auto-Start
J18 2-4
J16 3-4
J17 3-4
J22 3-5
Supply voltage to power Buck Auto-Start mode
• Alternative configuration, related to Coin cell option
• Power level range 1.8 V–4.2 V
• DC-DC converter requires at least 2.1 V to start; the supply can drop to 1.8 V after
the DC-DC converter settles
Boost
J18 2-4
J16 3-4
J17 1-2, 5-6
J22 3-5
Supply voltage to power Boost mode
• Alternative configuration, related to single battery option
• Power level range 0.9 V–1.8 V
NOTE
When configuring the Buck mode, SWD connector does not support J-Link
Lite. J-Link BASE is required. It is due to the 1.8 V operating mode.
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FRDM-KW40Z development board
Figure 11. Bypass headers
Figure 12. Buck headers
Figure 13. Buck Auto-Start headers
Figure 14. Boost headers
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
4.2.4
FRDM-KW40Z board peripheral functions
The FRDM-KW40Z development board includes the Freedom development board headers to interface
with the general-purpose functions, and to assist in the implementation of target applications.
The FRDM-KW40Z board has alternate port functions routed to those interface headers where you can use
the off-board Freedom development platform peripherals.
4.2.4.1
Serial flash memory (SPI interface)
Component U4 is the AT45DB021E 2-Mbit (256 KB) serial flash memory with SPI interface. Use the
memory for Over-the-Air Programming (OTAP) for storing the non-volatile system data or parameters.
The figure below shows the memory circuit.
• Memory power supply is P3V3_BRD.
• Discrete pullup resistors for the SPI port are included.
• You can share the SPI with other peripherals using the J2 SPI connectors. The normal SPI_SS and
the second chip-select must not be active at the same time.
• The SPI Write Protect and Reset have a discrete pullup resistor.
Figure 15. AT45DB021E 2-Mbit (256 KB) serial flash memory circuit
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
4.2.4.2
Combo sensor (I2C interface)
Component U9 is Freescale FXOS8700CQ sensor, a six-axis sensor with integrated linear accelerometer
and magnetometer, very low power consumption, and selectable I2C. Figure 16 shows the sensor circuit.
• The sensor power supply is P3V3_BRD.
• Discrete pullup resistors for the I2C port are provided.
• There is one interruption signal.
• The I2C can be shared with other peripherals through the J4 pin 10 and pin 12 (I2C1 connectors).
Figure 16. FXOS8700CQ combo sensor circuit
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
4.2.4.3
Buzzer
Component BZ500 is is a piezoelectric transducer (MPN: AST1109MLTRQ). Use the buzzer for sound
applications. Figure 17 shows the buzzer circuit. PWM signal is required to enable the buzzer.
• The buzzer power supply is P3V3_BRD.
• The resonant frequency is 4.0 kHz.
• Buzzer is driven by Q1 and MCU output PTB3 signal.
• The driven signal can be shared with other peripherals through the J1 pin 16.
Figure 17. Buzzer circuit
4.2.4.4
Potentiometer (ADC interface)
Use the 5 k potentiometer (R67) for ADC verification and applications. Figure 18 shows the
potentiometer circuit.
• The POT power supply can be either the P3V3 or V_BATT for the input source.
• A single-turn potentiometer is provided.
• Signal is routed through ADC0_SE.
• The ADC trace can be shared with other peripherals through the J4 pin 3.
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
Figure 18. Potentiometer circuit
NOTE
To measure the POT value, program the ADC in differential mode.
The V_BATT is taken as the differential input.
4.2.4.5
IR transmitter (CMT interface)
An infrared transmitter or blaster is provided to control the IR. Figure 19 shows the IR circuit.
• The IR power supply is P3V3_LED.
• The IR has a range of approximately 10 meters.
• The current draw is approximately 100 mA when active.
• When using the blaster as an application, assure the proper orientation.
Figure 19. IR transmitter circuit
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
4.2.4.6
Interface connectors J1, J2, J3, and J4
The four connectors (J1, J2, J3, and J4) are 100-mil pin headers mounted on the front (component side),
supporting the standard Freedom connector.
• P3V3, P5V_USB, and P5-9V_VIN provide the supply voltage for the headers connector.
— The I/O power supply for the FRDM-KW40Z board and the power supply for the MKW40Z
SoC must use the same voltage to avoid potential damage.
The pin definitions for the headers are shown in Table 4 and Table 5, respectively.
Table 4. J1 and J2 connectors
Header
pin no.
J1
Description
MKW40Z pin name
Header
pin no.
J2
Description
MKW40Z pin name
1
NC
NC
1
NC
NC
2
UART0_RX_TGTMCU
PTC6 (D0/Rx/int)
2
SWD_DIO_TGTMCU
PTA0 (D8/Int)
3
NC
NC
3
NC
NC
4
UART0_TX_TGTMCU
PTC7 (D1/Tx/int)
4
KW40_SWD_CLK
PTA1 (D9/Int)
5
NC
NC
5
NC
NC
6
ELEC_IN1
PTA16 (D2/int)
6
SPI_SS
PTC19 (D10/SPI_SS)
7
NC
NC
7
NC
NC
8
ELEC_IN2
PTA17 (D3/PWM/int)
8
SPI_SIN
PTC18 (D11/MOSI)
9
NC
NC
9
NC
NC
10
SW4
PTA19 (D4/int)
10
SPI_SOUT
PTC17 (D12/MISO)
11
NC
NC
11
NC
NC
12
SW3
PTA18 (D5/PWM/int)
12
SPI_CLK
PTC16 (D13/SCK)
13
NC
NC
13
NC
NC
14
INT1_COMBO
PTB2 (D6/PWM/Int)
14
GND
VSS (GND) board ground
15
NC
NC
15
NC
NC
16
BUZZER
PTB3 (D7/CMP/int)
16
P3V3
VREF
—
—
—
17
NC
NC
—
—
—
18
PTC1
PTC1 (D14/Ana/Int)
—
—
—
19
NC
NC
—
—
—
20
PTC0
PTC0 (D15/Ana/Int)
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
Table 5. J3 and J4 connectors
Header
pin no.
J3
Description
MKW40Z pin name
Header
pin no.
J4
Description
MKW40Z pin name
1
NC
NC
1
ADC_SE0/BATTERY_
MONITORING
ADC0_SE0
2
PTC4
EXTRG_IN
2
PTB17
PTB17/XTAL32k/I2C_SDA
3
NC
NC
3
ADC0_SE1/POT
ADC0_DM0/CMPO_IN1
4
P3V3
IO_REF
4
PTB16
PTB16/EXTAL32k/I2C_SCL
5
NC
NC
5
NC
NC
6
RST_TGTMCU_b
RESET
6
CMT
PTB1/TSI_CH15/CMT_IRO
7
NC
NC
7
NC
NC
8
P3V3
V_OUT
8
PTC5
PTC5/TSI_CH1
9
NC
NC
9
COM
PTB0/CLKOUT
10
P5V_USB
5V
10
I2C1_SDA
PTC3/I2C1_SDA
11
NC
NC
11
PTB18
PTB18/CMP0_IN2
12
GND
GND
12
I2C1_SCL
PTC2/I2C1_SCL
13
NC
NC
—
—
—
14
GND
GND
—
—
—
15
NC
NC
—
—
—
16
P5-9V_VIN
Unregulated Voltage
—
—
—
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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A
B
C
D
2
L3
10uH
1
DFLS130L-7
D6
GND
3
3003
BT500
2
1
10uF
C43
P3V3_BATT
DFLS130L-7
P5-9V_VIN_VR
D3
P5-9V_VIN P5V_SDA_PSW
COIN CELL
HOLDER
DFLS130L-7
XTAL_32M
EXTAL_32M
PSWITCH
J27
HDR_2X1
TP530
D8
C
C531
1uF
VDCDC_IN
J_VDD_1P8F
V_MCU
1
V_BATT
C25
10uF
J19
VIN
U17
HDR 1X2 TH
3
DCDC_CFG
DCDC_LP
DCDC_LN
EXTAL_32M
XTAL_32M
4
1
2
A
C
D7
R75
0
DFLS130L-7
A
V_BATT
TP30
C
1
L6
2
10nH
(1.45-3.6V)
VDD_1P45F
C54
10uF
DNP
J18
HDR 2X2
TP534
J_VDD_1P8F
4
2
P3V3
34
33
24
25
J8
HDR_2X1
HDR_2X1
J20
R78
C525
12PF
R83
R84
100 Ohm controlled
impedance from DUT
to balun.
TP533
TP544
ADC0_SE0/BATTERY_MONITORING
V_MCU
P3V3_LED
TP536
P3V3_LED_PWR
TP518
POWER MANAGMENT
P3V3_BRD
0 DNP
0 DNP
PTC0
PTC1
I2C1_SCL
I2C1_SDA
PTC4
PTC5
UART0_RX_TGTMCU
UART0_TX_TGTMCU
SPI_CLK
SPI_SOUT
SPI_SIN
SPI_SS
R56
R52
UART FlowControl
C528
0.1UF
{4,5}
{4,5}
R70
R69
0
C42
0.6PF
0
1
C44
11pF 2
32MHz XTAL
EXTAL_32M
P3V3
HDR 2X5
J9
32MHZ
Y1
1
3
5
7
9
2
4
6
8
10
3
4
1
5
HARMONIC TRAP
C41
11pF
XTAL_32M
2
1
Jumper is shorted by a cut-trace
on bottom layer. Cutting the trace
will effectively isolate the on-board
MCU from the OpenSDA
debug interface.
J12
HDR 1X2
DNP
C33
1.8pF
DNP
L4
2.4nH
DNP
CAD NOTE:
Embed pads into
50 Ohm line.
3-4
3-4
5-6
1-2
RF_50
KW40_SWD_CLK
SWD_DIO_TGTMCU
pg(4,5)
pg(3,4,5)
FIUO: ___
Thursday, July 30, 2015
Sheet
3
ANT1
F_Antenna
of
5
Rev
C
CAD NOTE:
Open Solder Mask
Bottom below
F-Antenna on
"feedpoint" via
RF
RF_ANT
PUBI: X
SCH-28379 | PDF: SPF-28379
Document Number
Date:
KW40x MCU
X-FRDM-KW40Z
FCP: ___
C40
10PF
C34
10PF
DNP
RF_SMA
Place both
capacitor
sharing pin 1
pg(3,4)
pg(3)
Size
C
Page Title:
ICAP Classification:
Drawing Title:
RST_TGTMCU_b
SWD_CLK_TGTMCU
DNP
CAD NOTE:
SMA - F-Antenna:
1
3-5
J5
SMA
3-5
1-2
5-6
3-5
1-3
2-4
3-4
3-4
3-4
50 ohm controlled
impedence line from
Balun to SMA and F_Antenna
SHORTING HEADER ON BOTTOM LAYER
6
2
4
3
Z1
50/100 OHMS
2-4
UART0_CTS_TGTMCU {4}
UART0_RTS_TGTMCU {4}
2-4
Boost (0.9V - 1.8V)
- Single battery
2-4
1-2
Boost Auto Mode
(1.8V - 4.2V)
Buck (1.8V - 4.2V)
- Coin Cell
1
PWR_CFG PSW_CFG DCDC_CFG REG_CFG
J16
J18
J17
J22
Power Configuration
Bypass (1.8V - 3.6V)
SWD CONNECTOR
RF_P
RF_N
ADC0_SE0/BATTERY_MONITORING
ADC0_SE1/POT
0
0
C526
12PF
R508
10.0K
P3V3 P3V3
UART0_RX
UART0_TX
R509
10.0K
C527
12PF
BATTERY_MONITOTING
0
J21
HDR_2X1
0
SH503
0.1UF
C530
Place caps close to DUT
0.1UF
C529
MKW40Z160 MCU
MKW40Z160VHT4
RF_P
RF_N
ADC0_DP0/CMP0_IN0
ADC0_DM0/CMP0_IN1
36
37
38
39
40
41
42
43
45
46
47
48
VDD_1P45F
0.1UF
C524
J_VDD_1P8F
PTC0/ANT_A/I2C0_SCL/UART0_CTS/TPM0_CH1
PTC1/ANT_B/I2C0_SDA/UART0_RTS/TPM0_CH2/BLE_ACTIVE
PTC2/TSI0_CH14/TX_SWITCH/I2C1_SCL/UART0_RX/CMT_IRO/DTM_RX
PTC3/TSI0_CH15/RX_SWITCH/I2C1_SDA/UART0_TX/DTM_TX
PTC4/TSI0_CH0/EXTRG_IN/UART0_CTS/TPM1_CH0
PTC5/TSI0_CH1/LPTMR0_ALT2/UART0_RTS/TPM1_CH1
PTC6/TSI0_CH2/I2C1_SCL/UART0_RX/TPM2_CH0
PTC7/TSI0_CH3/SPI0_PCS2/I2C1_SDA/UART0_TX/TPM2_CH1
PTC16/TSI0_CH4/SPI0_SCK/I2C0_SDA/UART0_RTS/TPM0_CH3
PTC17/TSI0_CH5/SPI0_SOUT/UART0_RX/DTM_RX
PTC18/TSI0_CH6/SPI0_SIN/UART0_TX/DTM_TX
PTC19/TSI0_CH7/SPI0_PCS0/I2C0_SCL/UART0_CTS/BLE_ACTIVE
(1.71-3.6V)
VDD_1P8
C45
10uF
VDD_1P45
PWR_CFG
3
1
2
4
6
VDD_1P45F
HDR 2X3
J22
* For External PS, If 3.6V - 20V shunt J23 1-2,
else if PS 1.8 - 3.6V shunt J23 2-3.
DFLS130L-7
D9
J23
HDR_1X3
C27
10uF
P3V3_VREG
NCP1117ST33T3G
TAB
VOUT
2
PTB2/ADC0_SE3/CMP0_IN3/TPM1_CH0
PTB3/ADC0_SE2/CMP0_IN4/CLKOUT/TPM1_CH1/RTC_CLKOUT/ERCLK32K
PTB16/EXTAL32K/I2C1_SCL/TPM2_CH0
PTB17/XTAL32K/I2C1_SDA/TPM2_CH1
PTB18/DAC0_OUT/ADC0_SE4/CMP0_IN2/I2C1_SCL/TPM_CLKIN0/TPM0_CH0/NMI
1
3
5
REG_CFG
L5
2 VDD_1P8F
100nH
C55
C39
10uF
1uF
PTB0/I2C0_SCL/CMP0_OUT/TPM0_CH1/CLKOUT
PTB1/ADC0_SE1/CMP0_IN5/I2C0_SDA/LPTMR0_ALT1/TPM0_CH2/CMT_IRO
PTA0/SWD_DIO/TSI0_CH8/SPI0_PCS1/TPM1_CH0
PTA1/SW D_CLK/TSI0_CH9/TPM1_CH1
PTA2/RESET/TMP0_CH3
PTA16/TSI0_CH10/SPI1_SOUT/TPM0_CH0
PTA17/TSI0_CH11/SPI1_SIN/TPM_CLKIN1
PTA18/TSI0_CH12/SPI1_SCK/TPM2_CH0
PTA19/TSI0_CH13/SPI1_PCS0/TPM2_CH1
PSWITCH
U18
R85
102K
EXTERNAL PS
R73
0
DNP
DFLS130L-7
A
9
30
29
DCDC_LP
0
16
17
18
19
21
22
23
1
2
3
4
5
6
7
8
DCDC_CFG
J33
HDR_2X1
TP29
2
11
12
R68
SW5
HDR 2X3
2
4
6
TL1015AF160QG
1
1
3
5
J16
6
HDR 2X3
5
0
DCDC_LP
J17
2
4
PSW_CFG
R72
COM
CMT
INT1_COMBO
BUZZER
PTB16/XTAL_32K
PTB17/EXTAL_32K
PTB18
Place ind close to DUT
D5
P5V_USB
V_BATT
{3,4} SWD_DIO_TGTMCU
{3} KW40_SWD_CLK
{3,4,5}
RST_TGTMCU_b
ELEC_IN1
ELEC_IN2
SW4
SW3
A
C
A
C
A
C
1
3
GND
1
2
1
2
1
10
VDCDC_IN
31
VDD_XTAL
20
VDD_0
44
VDD_1/VDD
28
VDDA
27
VREFH
35
VDD_RF1
14
VDD_1P8
32
VDD_RF2
15
VDD_1P45
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
VSSA
26
DCDC_GND
13
DCDC_CFG
1
2
3
1
2
1
2
1
2
DCDC_CFG
TP519
2
TP523
3
TP506
4
TP505
24
1
A
B
C
D
4.3
2
5
FRDM-KW40Z development board
Schematic, board layout, and bill of materials
Figure 20. FRDM-KW40Z board schematic rev. C (sheet 1 of 3)
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
Freescale Semiconductor, Inc.
SHELL5
1
2
3
4
5
VBUS
DD+
ID
GND
1
330 OHM
L2
2
0
R36 DNP
UART1_CTS_TGTMCU_R
6
8
10
5
7
9
SDA_JTAG_TMS
SDA_JTAG_TCLK
SDA_JTAG_TDO
SDA_JTAG_TDI
SDA_RST
R63
10.0K
P3V3_SDA
SDA_SWD_OE
SDA_SWD_EN
HDR 2X5
2
4
J11
1
3
5
{For enablement purposes only}
DNP
0
R50
UART1_RTS_TGTMCU_R
0.1UF
C31
P3V3_SDA
TP4
TP513
P5V0_SDA_USB_CONN_VBUS
OpenSDA INTERFACE JTAG CONNECTOR
10
SHELL4
8
SHELL3
SHELL2
7
SHELL1
6
USB_MICRO_AB
TP3
1
330 OHM
L1
U6 U1
P5V_SDA
P3V3_SDA
R25
R21
2
PU/PD LOGIC:
SERIAL INTERFACE
IS ALWAYS RESET
WHEN USB PORT
IS DISCONNECTED
R47
10.0K
SDA_RST
R46
4.7K
P5V_SDA
U2
1
J6
1
2
1
2
9
TP524
TP520
TC_XTAL_TP
C506
2.2uF
P5V_SDA
P3V3_SDA
0.1UF
C504
SDA_VOUT33
C509
1uF
33 SDA_USB_DN
33 SDA_USB_DP
10uF
C3
C502
10uF
MK20DX128VFM5
EPAD
VSS1
RESET
EXTAL32
XTAL32
VREGIN
VOUT33
USB0_DM
USB0_DP
VBAT
VSSA
VDDA
VDD1
20
ADC0_SE8/TSI0_CH0/PTB0/I2C0_SCL/FTM1_CH0/FTM1_QD_PHA/LLWU_P5 21
ADC0_SE9/TSI0_CH6/PTB1/I2C0_SDA/FTM1_CH1/FTM1_QD_PHB
17
EXTAL0/PTA18/FTM0_FLT2/FTM_CLKIN0 18
XTAL0/PTA19/FTM1_FLT0/FTM_CLKIN1/LPTMR0_ALT1
12
13
JTAG_TDI/EZP_DI/TSI0_CH2/PTA1/UART0_RX/FTM0_CH6 14
JTAG_TDO/TRACE_SWO/EZP_DO/TSI0_CH3/PTA2/UART0_TX/FTM0_CH7 15
JTAG_TMS/SWD_DIO/TSI0_CH4/PTA3/UART0_RTS/FTM0_CH0 16
NMI/EZP_CS/TSI0_CH5/PTA4/FTM0_CH1/LLWU_P3
JTAG_TCLK/SWD_CLK/EZP_CLK/TSI0_CH1/PTA0/UART0_CTS/UART0_COL/FTM0_CH5
POWER_EN
4
R41
DNP
R40
R44
1K
15K
10.0K
P5V_SDA
0.1UF
C21
P5V_SDA
1
VTRG_EN
ENABLE
CSLEW
VIN
U10
ACTIVE HIGH
3
MIC2005_CSLEW
5
C13
18PF
DNP
2
4
6
D2
P3V3_SDA
TP507
R505
10.0K
DNP
VTRG_FAULT_B
10.0K
R33
P3V3_SDA
SDA_USB_P5V_SENSE
X1
2
R504
4.7K
DNP
TP510
P5V_SDA
POWER_EN
VTRG_FAULT_B
1
R10
220
UART1_RTS_TGTMCU_R
UART1_CTS_TGTMCU_R
UART1_TX_TGTMCU_R
UART1_RX_TGTMCU_R
SDA_SPI0_SCK
SDA_SPI0_SOUT
SDA_SPI0_SIN
SDA_LED
TP511
MIC2005-0.8YM6
GND
FAULT
VOUT
29
PTD4/SPI0_PCS1/UART0_RTS/FTM0_CH4/EWM_IN/LLWU_P14 30
ADC0_SE6B/PTD5/SPI0_PCS2/UART0_CTS/UART0_COL/FTM0_CH5/EWM_OUT 31
ADC0_SE7B/PTD6/SPI0_PCS3/UART0_RX/FTM0_CH6/FTM0_FLT0/LLWU_P15 32
PTD7/CMT_IRO/UART0_TX/FTM0_CH7/FTM0_FLT1
C10
22PF
DNP
SDA_SWD_OE_B
SDA_EXTAL
SDA_XTAL
SDA_JTAG_TCLK
SDA_JTAG_TDI
SDA_JTAG_TDO
SDA_JTAG_TMS
SDA_SWD_EN_B
LED GREEN
22
ADC0_SE15/TSI0_CH14/PTC1/SPI0_PCS3/UART1_RTS/FTM0_CH0/I2S0_TXD0/LLWU_P6 23
ADC0_SE4B/CMP1_IN0/TSI0_CH15/PTC2/SPI0_PCS2/UART1_CTS/FTM0_CH1/I2S0_TX_FS 24
CMP1_IN1/PTC3/SPI0_PCS1/UART1_RX/FTM0_CH2/I2S0_TX_BCLK/LLWU_P7 25
PTC4/SPI0_PCS0/UART1_TX/FTM0_CH3/CMP1_OUT/LLWU_P8 26
PTC5/SPI0_SCK/LPTMR0_ALT2/I2S0_RXD0/CMP0_OUT/LLWU_P9 27
CMP0_IN0/PTC6/SPI0_SOUT/PDB0_EXTRG/I2S0_RX_BCLK/I2S0_MCLK/LLWU_P10
28
CMP0_IN1/PTC7/SPI0_SIN/USB_SOF_OUT/I2S0_RX_FS
(To enable 5v from
USB connector)
PWR SWITCH
33
2
19
10
9
6
5
4
3
11
8
7
1
U7
OpenSDA Interface
A
C
4
3
8.00MHZ
0
SDA_SWD_EN_B_R
TP517
R23
0.1UF
R39
0.1UF
C518
10.0K
R51
10.0K
3
3
P3V3_SDA
R49
4.7K
3
1
SDA_RTS_EN5
P3V3_SDA
P3V3_SDA
R37
4.7K
3
1
SDA_CTS_EN5
P3V3_SDA
R64
4.7K
1
5
P3V3_SDA
R59
4.7K
3
5
1
P3V3_SDA
7
6
5
4
P3V3_SDA
0.1UF
C514
P3V3_SDA
R19
4.7K
3
SDA_RX_EN 5
Isolation and level shift stage
(for 1.8 to 5V compatibility)
TP525
UART1_RTS_TGTMCU_R
TP522
10.0K
A1
A2
VCCB
1B
2B
DIR
VCCA
DIR
4
6
2
C522
0.1UF
C515
0.1UF
2
4
6
0.1UF
C517
V_TGTMCU
2
4
6
C511
0.1UF
0.1UF
C520
V_TGTMCU
2
4
6
V_TGTMCU
8
1
2
3
PU/PD LOGIC (DIR PIN):
BUFFER IS TRISTATED WHEN
P3V3_SDA IS UNPOWERED
GND
B
VCCB
74LVCH1T45
A
VCCA
DIR
U14
74LVCH1T45
GND
B
VCCB
0.1UF
V_TGTMCU
2
4
C503
TP_2102_A
0.1UF
C501
P3V3_SDA
1
2
UART1_RTS_TGTMCU_BUF
UART1_CTS_TGTMCU_BUF
SWD_CLK_TGTMCU_BUF
SWD_DIO_TGTMCU_BUF
UART1_TX_TGTMCU_BUF
UART1_RX_TGTMCU_BUF
1K
1K
SHORTING HEADER
ON BOTTOM LAYER
J13
HDR 1X2
DNP
R28
Isolation
Resistors
R27
C1
1000pF
SW1_RST_B
DNP
R5020
TL1015AF160QG
SW6
1-2: Default.
2-3: Reset signal direct to the MCU,
to use when OpenSDA is not powered.
TP501
R503
10.0K
P3V3_SDA
SDA_RST_TGTMCU_J_B
RESET
SDA_RST_TGTMCU_J_B
V_TGTMCU
GND
B
VCCB
74LVCH1T45
A
VCCA
DIR
U16
U13
A
GND
B
VCCB
U15
74LVCH1T45
A
VCCA
DIR
74LVC2T45GM,125
VCCA
1A
2A
GND
SDA_SWD_EN
SDA_SWD_OE
V_TGTMCU
U8
GND
B
VCCB
74LVCH1T45
A
VCCA
DIR
U5
1
2
6
Y2
4
Y1
GND
NLX2G14
2
VCC
5
P3V3_SDA
J25
HDR 1X2
P3V3_SDA
0 SDA_SWD_EN_R
0.1UF
C523
10.0K
C516
R65
R66
R60
0.1UF
C521
TP515
1
3
U11
0.1UF
C513
DNP
SDA_RST_TGTMCU_B
0 SDA_SWD_OE_R
UART1_CTS_TGTMCU_R
SDA_SPI0_SCK
TP529
SDA_SWD_EN
SDA_SPI0_SOUT
TP528
SDA_SWD_OE R61
UART1_TX_TGTMCU_R
SDA_SPI0_SIN
TP514
10.0K
R35
0
SDA_SWD_OE_B_R
R34
10.0K
P3V3_SDA
UART1_RX_TGTMCU_R
22PF
DNP
C15
R31
R38
10.0K
P3V3_SDA
3
1
2
Freescale Semiconductor, Inc.
SDA_LED_R
R55
R43
1K
1K
J14
HDR 1X2
SHORTING HEADER DNP
ON BOTTOM LAYER
1
2
U500
OE
B1
B2
VCCB
R501
Output to system
from Level shifter
100
V_TGTMCU
TP500
3.3VDC, 10mA should be provided
to this rail (P3V3_SDA)
in order to power openSDA
module
OPEN SDA
INPUT POWER
i path
P3V3_SDA
Output to system
from Level shifter
Output to system
from Level shifter
Output to system
from Level shifter
resistors
with the same orientation
and provide same airgap
between RX to TX resistors
terminals in a square fashion.
2
R1
A SDA_RST_LED
4.7K
R500
180K
V_TGTMCU
LVLRST_EN
P3V3_SDA
TP_2102_B
0.1UF
C500
V_TGTMCU
Output to system
from Level shifter
RED
D1
Place both
5
Bypass
CAD NOTE:
RX/TX POKA-YOKE:
C
8
7
6
RST Push Button
NTSX2102GU8H
GND
A1
A2
VCCA
J24 HDR_1X3
4
2
3
1
2
1
2
3
5
SH501
i path
SH500
0
DNP
SH502
SDA_VOUT33
V_TGTMCU
0
0
pg(3)
pg(3)
pg(3)
pg(3)
i path
i path
P3V3
Power should be provided
to this rail for the logic
related to your platform I/O
FIUO: ___
Thursday, Jullly 30, 2015
Sheet
4
of
PUBI: X
SCH-28379 | PDF: SPF-28379
Document Number
Date:
1
FCP: ___
OpenSDA interface
X-FRDM-KW40Z
Siiize
D
Page Tiiitllle:
ICAP Clllassiiifiiicatiiion:
Drawiiing Tiiitllle:
P3V3
This power rail is supported
from 1.8V to 5V
I/O POWER
INPUT
P5V_TRG_SDA can provide up to 450mA
(per USB spec) of power at 5VDC
to your system
SDA_VOUT33 can provide up to 120mA
of power at 3.3VDC to your system
P5V_SDA_PSW
Note: You can power openSDA
with your own power supplies
by replacing this rail
(SDA_VOUT33)
with your 3.3V power supply rail
SDA_VOUT33
OPEN SDA
POWER OUTPUTS
UART0_RTS_TGTMCU
UART0_CTS_TGTMCU
SWD_CLK_TGTMCU
pg(3)
pg(3)
pg(3,5)
SWD_DIO_TGTMCU
UART0_TX_TGTMCU
UART0_RX_TGTMCU
RST_TGTMCU_b
TARGET MCU
INTERFACE
SIGNALS
1
5
Rev
C
A
B
C
D
FRDM-KW40Z development board
Figure 21. FRDM-KW40Z board schematic rev. C (sheet 2 of 3)
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
25
A
B
D
1
SPI_SS
15
2
10
7
6
4
2
1
SPI_CLK
U9
C22
NC_15
BYP
I2C_SCL_FXOS8700CQ
I2C_SDA_FXOS8700CQ
SA0_FXOS8700CQ
0.1UF
BUZZER
R12
4.7K
C519
0.1UF
DNP
DNP
TVS2
SW4
SW3
13
3
16
8
9
11
TP502
TP503
R42
R30
R14
47K
R512
1K
TP526
5
1
AST1109MLTRQ
BUZZER
Q1
MMBT3904LT1G
R507
0
P3V3_BRD
0
0
TP509
5
1
2
4
P3V3_BRD
C6
8
2
1
SW4
2
PB
TP537
COM
R511
330
LED5
BLUE
P3V3_LED
TP20
TP531
I2C1_SCL
I2C1_SDA
pg(3,4,5)
0 INT2_COMBO
R18
RST_TGTMCU_b
0 INT1_COMBO DNP
R7
R510
10.0K
0.1UF
C512
R13
10.0K
SH19
0
DNP
TP542
TP28
TP14
INT1_COMBO
330
LED4
RED
13
12
11
10
6
9
15
14
B1
B2
B3
B4
NC
NC1
EXP
C46
12PF
0
TP535
TP540
TP26
Y2
2
CMT
R79
27K
R80
1.5K
PTC4
330
LED2
RED
P3V3_LED
32.768KHZ
1
0 PTB17
U12
8
7
2
3
4
5
TXB0104
OE
GND
A1
A2
A3
A4
1
Q2
MMBT3904LT1G
TP539
P3V3
TP22
PTC5
PTC4
SWD_DIO_TGTMCU
BUZZER
TP2
TP36
3
FRDM-KW40 signals to DEMO which
require translation from 3.3 V to 5V.
Zero Ohm 0402 Cut Trace PCB Footprint.
SH23 0
SH20 0
SH21 0
SH22 0
0.1UF
C510 BZ500
P3V3
TP538
D11
VSMB2948SL
R82
18.2
TP541
TP21
INFRARED LED
1
PTC5
330
P3V3_LED
C49
0.1UF
DNP
TP543
TP25
LED1
RED
P3V3_LED
32kHz XTAL
C47
12PF
0
R77
R76
DNP
PTB17/EXTAL_32K
IN CIRCUIT TEST
GND PROBING
VCCA
PTC1
330
LED3
RED
0
R74
PTB16/XTAL_32K
P3V3_LED
R71
DNP
VCCB
SH18
0
DNP
P3V3_BRD
PTC0
P5V_USB
pg(5) D10
pg(5) D9
pg(5) D8
pg(5) D7
R29
10.0K
4
R513
10.0K
DNP
PTB16
P3V3_LED
P3V3_BRD
P3V3_BRD
P3V3_BRD
SPI_SIN
TL1015AF160QG
AT45DB021E
SO
SW3
TL1015AF160QG
1
TP508
0.1UF
R17
10.0K
DNP
P3V3
POWER ON/
COMMUNICATING
R81
330
LED6
GREEN
TP19
C11
0.1UF
WP
SI
SCK
CS
P3V3_LED_PWR
I2C1_SCL
I2C1_SDA
R506
10.0K
R32 0 DNP
RST_FXOS8700CQ
CRST_FXOS8700CQ
INT2_COMBO_R
C9
1000pF
DNP
C2
1000pF
DNP
U4
INT1_COMBO_R
TP504 SPI_SOUT
FXOS8700CQ
RSVD2
RSVD1
RST
CRST
SA0/MISO
SA1/CS
INT2
INT1
R16
10.0K
P3V3_BRD
SDA/MOSI
SCL/SCLK
0.1UF
C507
TP516
P3V3_BRD
SA1_FXOS8700CQ
4.7uF
C508
P3V3_BRD
10.0K
R22
PGB2010402KRHF
FXOS8700CQ COMBO SENSOR
P3V3_BRD
R20
10.0K
P3V3_BRD
ELEC_IN1
ELEC_IN2
DNP
2
1
TVS1
PGB2010402KRHF
INTERRUPT PUSH BUTTONS
R24
10.0K
3x3mm
1
SW1
ELECTRODES
ELEC_IN2
1
3x3mm
SW2
P3V3
A
C
R26
10.0K
DNP
A
C
1
5
A
C
ELEC_IN1
14
VDD
1
VDDIO
GND2
12
6
VCC
GND
EP
7
9
A
C
A
C
3
2
pg(3,4) UART0_RX_TGTMCU
PTC1
PTC0
ADC0_SE1/POT
pg(3) PTB18
pg(3,5)
COM
PTB18/DAC0_OUT/ADC0_SE4/CMP0_IN2/I2C_SCL
PTB0/TSIO_CH14/I2C0_SCL/CLKOUT
CMT
PTC5
I2C1_SDA
I2C1_SCL
pg(5)
pg(5)
pg(3,5)
pg(3,5)
pg(3,5)
pg(3,5)
PTB17
PTB16
P5V_USB
P3V3
C32
1000pF
R67
5K
2
J15
HDR_1X3
TP532
V_BATT
POT
ADC0_SE1/POT
2
R88
0
0
P5-9V_VIN
SH33
SH31
J2
CON_2x10_0.1
0
0
P3V3
P3V3
C48
2.2uF
SH24
SH27
SH26
0
0
0
0
0
TP31
DEBUG GROUND
HOOK
PTC3/TSI0_CH15/ATST4/RX_SWITCHT/I2C1_SDA/UART0_TX
PTC2/TSI0_CH14/ATST3/TX_SWITCHT/I2C1_SCL/UART0_RX
PTB17/XTAL32K/I2C_SDA
PTB16/EXTAL32K/I2C_SCL
PTB1/TSIO_CH15/I2C0_SDA/CMT_IRO
PTC5/TSI0_CH1/LPTMR0_ALT2/UART0_RTS_b
P5V_USB
pg(3,4,5) RST_TGTMCU_b
PTC4/TSI0_CH0/EXTRG_IN/UART0_CTS_b
ADC0_DM0/ADC0_SE1/ADC0_DP1/CMPO_IN1
ADC0_DP0/ADC0_SE0/CMPO_IN0
ARDUINO COMPATIBLE HEADERS
I2C1
Place both
resistors
with the same orientation
and provide same airgap
between SCL to SDA resistors
terminals in a square fashion.
CAD NOTE:
SCL/SDA POKA-YOKE:
DFLS130L-7
D4
P5V_SDA_PSW
R87
J29
HDR_2X1
J3
CON_2x8_0.1
FREEDOM PLATFORM
COMPATIBILITY HEADERS
PTC1/ANT_B/I2C0_SDA/UART0_RTS_b
PTC0/ANT_A/I2C0_SCL/UART0_CTS_b
PTC17/TSI0_CH5/SPI0_SOUT/UART0_RX
PTC16/TSI0_CH4/SPI0_SCK/I2C0_SDA/UART0_RTS_b
0
0 DNP
0
0 DNP
0
0 DNP
0
0 DNP
J28
HDR_2X1
SH3
SH7
R8
PTC19/TSI0_CH7/SPI0_PCS0/I2C0_SCL/UART0_CTS_b
0
0
0
0
0
J31
HDR_2X1
J30
HDR_2X1
SH4
SH8
R3
PTA1/SWD_CLK
PTC18/TSI0_CH6/SPI0_SIN/UART0_TX
SH10
R5
SH9
R4
PTB3/ADC0_SE2/ADC0_DP2/CMP0_IN4/RTC_CLKOUT
SH15
SH14
SH13
SH12
SH11
PTA0/SWD_DIO/TSI0_CH8
PTA16/TSIO_CH10/SPI1_SOUT
PTA17/TSIO_CH11/SPI1_SIN
PTA19/TSIO_CH13/SPI1_PCS0
PTA18/TSIO_CH12/SPI1_SCK
PTB2/ADC0_SE3/ADC0_DM2/CMP0_IN3
PTC7/TSI0_CH3/I2C_SDA/UART0_TX/SPI0_PS2
PTC6/TSI0_CH2/I2C_SCL/UART0_RX
USB HOST POWER
pg(3,5) PTC4
pg(3,5) ADC0_SE0/BATTERY_MONITORING
pg(3,5)
Place both
resistors
with the same orientation
and provide same airgap
between MISO to MOSI resistors
terminals in a square fashion.
CAD NOTE:
MISO/MOSI POKA-YOKE:
pg(3,5)
pg(3,5)
SPI_SOUT
SPI_CLK
SPI_SIN
pg(3,5)
pg(3,5)
pg(3,5)
SPI_SS
D10
KW40_SWD_CLK
D9
pg(3,5)
pg(5)
pg(3,4)
pg(5)
BUZZER
pg(3,5)
pg(5)
D7
pg(3,4) SWD_DIO_TGTMCU
pg(5)
D8
I2C0
P3V3
SPI0
ELEC_IN1
ELEC_IN2
SW4
SW3
pg(3,5) INT1_COMBO
pg(3,5)
pg(3,5)
pg(3,5)
pg(3,5)
pg(3,4) UART0_TX_TGTMCU
UART0
2
2
1
2
1
2
1
2
1
3
1
3
5
7
9
11
13
15
1
C52 C51 C50
R54
R45
FCP: ___
SH25
SH28
SH29
SH30
DFLS130L-7
0
0
A
C53
10uF
DNP
10uF 10uF 10uF
DNP DNP DNP
OUT
FIUO: ___
0
0
0
0
PUBI: X
Document Number
Thursday, July 30, 2015
Size
C
Date:
1
Sheet
5
SCH-28379 | PDF: SPF-28379
of
5
J4
CON_2x6_0.1
J1
CON_2x8_0.1
ARDUINO SHIELDS & PERIPHERALS
X-FRDM-KW40Z
ICAP Classification:
Drawing Title:
Page Title:
IN
5VDC VR
SUPPORT
J26
HDR_1X3
DNP
P5-9V_VIN
P5V_USB D10
C
2
4
6
8
10
12
14
16
GND1
1
2
3
2
A
C
1
2
3
4
1
2
3
1
A
C
A
20
18
16
14
12
10
8
6
4
2
19
17
15
13
11
9
7
5
3
1
P5V_LDO_OUT
3
BYP_FXOS8700CQ
C
16
14
12
10
8
6
4
2
15
13
11
9
7
5
3
1
1
3
5
7
9
11
26
2
4
6
8
10
12
5
Rev
C
A
B
C
D
FRDM-KW40Z development board
Figure 22. FRDM-KW40Z board schematic rev. C (sheet 3 of 3)
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
Freescale Semiconductor, Inc.
FRDM-KW40Z development board
Figure 23. FRDM-KW40Z development board component location (top view)
Figure 24. FRDM-KW40Z development board test points
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
Freescale Semiconductor, Inc.
27
FRDM-KW40Z development board
Figure 25. FRDM-KW40Z development board layout (top view)
Figure 26. FRDM-KW40Z development board layout (bottom view)
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
28
Freescale Semiconductor, Inc.
FRDM-KW40Z development board
4.3.1
Bill of materials
Table 6. Bill of materials (common parts for all frequency bands) (Sheet 1 of 5)
Item Qty
Reference
Value
1
1
ANT1
F_Antenna
2
1
BT500
3
1
BZ500
4
2
C1,C32
1000pF
5
2
C2,C9 DNP
1000pF
6
7
C3,C25,C27,
C39,C43,C45,C50
2
10uF
7
28 C6,C11,C21,
C22,C31,C500,C5
01,C503,
C504,C505,
C507,C510,
C511,C512,
C513,C514,
C515,C516,
C517,C518,
C520,C521,
C522,C523,
C524,C528,
C529,C530
8
2
3003
Description
Mfg. part number
—
—
PCB F ANTENNA, NO PART ORDER
HOLDER BATTERY 20MM DIA TH
Keystone Electronics
3003
MALLORY
AST1109MLTRQ
CAP CER 1000PF 50V 5% C0G 0402
MURATA
GRM1555C1H102JA01D
CAP CER 1000PF 50V 5% C0G 0402
MURATA
GRM1555C1H102JA01D
CAP CER 10uF 16V 20% X5R 0603
TAIYO YUDEN
EMK107BBJ106MA-T
0.1UF
CAP CER 0.1UF 10V 10% X5R 0402
KEMET
C0402C104K8PAC
22PF
CAP CER 22PF 50V 5% C0G 0402
AVX
04025A220JAT2A
YAGEO AMERICA
AST1109MLT AUDIO DEVICE BZR PIEZO 4.1 KHZ
RQ
73DB 1-20V SMT
C10,C15 DNP
Mfg. name
9
1
C13 DNP
18PF
CAP CER 18PF 50V 5% C0G 0603
10
1
C33 DNP
1.8pF
CAP CER 1.8PF 50V 0.25PF C0G 0402 MURATA
GRM1555C1H1R8CA01D
CC0603JRNPO9BN180
11
1
C34 DNP
10PF
CAP CER 10PF 50V 5% C0G
040210PF
AVX
04025A100JAT2A
12
1
C40
10PF
CAP CER 10PF 50V 5% C0G
040210PF
AVX
04025A100JAT2A
13
2
C41,C44
11pF
CAP CER 11pF 50V 1% C0G 0402
AVX
04025U110FAT2A
14
1
C42
0.6PF
CAP CER 0.6PF 50V +/-0.25PF C0G
0402
MURATA
GRM1555C1HR60CZ01
15
5
C46,C47,C525,
C526,C527
12PF
CAP CER 12PF 50V 5% C0G 0402
MURATA
GRM1555C1H120JZ01D
16
2
C48,C506
2.2UF
CAP CER 2.2uF 25V 10% X5R 0603
TDK
C1608X5R1E225K
17
2
C49,C519 DNP
0.1UF
CAP CER 0.1UF 10V 10% X5R 0402
KEMET
C0402C104K8PAC
18
5
C50,C51,C52,
C53, C54 DNP
10uF
CAP CER 10UF 10V 20% X5R 0603
TAIYO YUDEN
LMK107BJ106MALTD
19
1
C55
1uF
CAP CER 1uF 16V 10% X5R 0603
TAIYO YUDEN
EMK107BJ105KA-T
20
1
C508
4.7uF
CAP CER 4.7UF 6.3V 20% X5R 0402
VENKEL COMPANY
C0402X5R6R3-475MNP
21
2
C509, C531
1.0UF
CAP CER 1.0UF 10V 10% X5R 0402
YAGEO AMERICA
CC0402KRX5R6BB105
22
1
D1
23
1
D2
LED GREEN LED GRN SGL 20MA 0603
OSRAM
LG L29K-G2J1-24-Z
24
8
D3,D4,D5,D6,
D7,D8,D9,D10
DFLS130L-7 DIODE SCH 1A 30V PowerDI123
DIODES INC
DFLS130L-7
RED
LED ULTRA BRIGHT RED SGL 30MA LITE ON
0603
LTST-C190KRKT
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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29
FRDM-KW40Z development board
Table 6. Bill of materials (common parts for all frequency bands) (Sheet 2 of 5)
Item Qty
Reference
Value
Description
Mfg. name
Mfg. part number
25
1
D11
VSMB2948SL LED IR RA 100mA 1.35V 940NM SMD VISHAY
INTERTECHNOLOGY
26
1
J2
CON_2x10
CON 2x10 FEMALE 100MIL SP 335H
394LL AU
MTCONN
JT254F-D180-850-210-10
D
27
2
J1,J3
CON_2X8
CON 2x8 FEMALE 100MIL SP 335H
394LL AU
MTCONN
JT254F-D180-850-208-10
D
28
9
J8,J20,J21,J27,J2
8,J29,J30,J31,J33
HDR 1X2
HDR 1X2 TH 2MM SP 217H AU 110L
SAMTEC
TMM-102-02-G-S
29
1
J5 DNP
CON, SMA, EDGE 0.062IN, 50 
FEMALE 18 GHZ
EMERSON
CONNECTIVITY
142-0701-851
30
1
J6
MOLEX
475900001
31
2
J9, J11
32
1
J12 DNP
33
3
J13,J14,J25 DNP
34
3
J15,J23,J24
HDR_1X3
HDR 1X3 TH 2MM SP 217H AU 110L
SAMTEC
TMM-103-02-G-S
SMA
USB_MICRO_ CON 5
AB
USB_MICRO_AB_RECEPTACLE RA
SKT SMT 0.65MM SP 122H AU
HDR 2X5
VSMB2948SL
HDR 2X5 TH 50MIL CTR 167H AU 91L ANYTRONIC
0922S0205011N6T-2LF
HDR 1X2
HDR 1X2 TH 2MM SP 217H AU 110L
TMM-102-02-G-S
HDR 1X2
HDR 1X2 TH 2MM SP 217H AU 110L,
NO PART TO ORDER
SAMTEC
—
—
35
3
J16,J17,J22
HDR 2X3
HDR 2X3 TH 2MM CTR 217H AU 110L SAMTEC
TMM-103-02-G-D
36
1
J18
HDR 2X2
HDR 2X2 TH 2MM CTR 217H AU 110L SAMTEC
TMM-102-02-G-D
37
1
J19
HDR 1X2 TH HDR 1X2 TH 100MIL SP 339H AU 98L SAMTEC
TSW-102-07-G-S
38
1
J4
CON_2X6
CON 2x6 FEMALE 100MIL SP 335H
394LL AU
39
1
J26 DNP
HDR_1X3
HDR 1X3 TH 100MIL SP 330H AU 98L SAMTEC
HTSW-103-07-S-S
40
4
LED1,LED2,
LED3,LED4
LED RED CLEAR SGL 30MA SMT
0805
LITE ON
LTST-C171KRKT
41
1
LED5
BLUE
LED BLUE SGL 20MA SMT 0805
LITE ON
LTST-C171TBKT
42
1
LED6
GREEN
LED GRN SGL 30MA SMT 0805
LITE ON
LTST-C171KGKT
43
2
L1,L2
330 W
IND FER BEAD 330@100MHZ 1.7A
0603
TDK
MPZ1608S331A
44
1
L3
10uH
IND WW FER 10uH@1MHz 0.99A 20% TDK
4012
VLS4012ET-100M
45
1
L4 DNP
2.4nH
IND—0.0024UH@100MHZ 300MA
0.0003UH 0402
MURATA
LQG15HN2N4S02D
46
1
L5
100 nH
IND -- 0.1uH@100MHZ 200MA 5%
0402
TDK
MLG1005SR10JT000
47
1
L6
10nH
IND—0.010uH@100MHZ 350MA 5%
0402
TDK
MLK1005S10NJT000
48
2
Q1,Q2
ON SEMICONDUCTOR
MMBT3904LT1G
49
1
R1
RES MF 100  1/16W 5% 0402
VENKEL COMPANY
CR040216W101JT
50
11 R3,R4,R5,R8,
R36,R50,R73,
R502,SH18,
SH19,SH502 DNP
RES MF ZERO OHM 1/16W 5% 0402
ROHM
MCR01MZPJ000
RED
MMBT3904LT TRAN NPN GEN 200MA 40V SOT-23
1G
100
0
MTCONN
JT254F-D180-850-206-10
D
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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FRDM-KW40Z development board
Table 6. Bill of materials (common parts for all frequency bands) (Sheet 3 of 5)
Item Qty
Reference
Value
Mfg. name
Mfg. part number
RES MF ZERO OHM 1/16W 5% 0402
ROHM
MCR01MZPJ000
220
RES MF 220  1/10W 5% 0603
KOA SPEER
RK73B1JTTD221J
R12,R19,R37,
R46,R49,R59,
R64,R501
4.7K
RES MF 4.7K 1/16W 5% 0402
YAGEO AMERICA
RC0402JR-074K7L
R14
47K
RES MF 47K 1/16W 5% 0402
VENKEL COMPANY
CR0402-16W-473JT
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
33
RES MF 33.0  1/16W 1% 0402
THYE MING TECH CO
LTD
CR-02FL6---33R
R27,R28,R41,
R43,R55,R512
1K
RES MF 1.0K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW04021K00JNED
R32,R52,R56,
R71,R76 DNP
0
RES MF ZERO OHM 1/10W—0603
VISHAY
INTERTECHNOLOGY
CRCW06030000Z0EA
15K
RES MF 15K 1/16W 1% 0402
KOA SPEER
RK73H1ETTP1502F
0
RES MF ZERO OHM 1/10W -AEC-Q200 0603
VISHAY
INTERTECHNOLOGY
CRCW06030000Z0EA
VISHAY
INTERTECHNOLOGY
CRCW0402330RJNED
51
19 R7,R18,R30,
R31,R35,R42,
R61,R66,R68,
R69,R70,R72,
R74,R75,R77,
R78,R83,R84,
R507
52
1
R10
53
8
54
1
55
20 R13,R16,R20,
R22,R23,R24,
R29,R33,R34,
R38,R39,R47,
R51,R60,R63,
R65,R503,R506,
R508,R509
56
6
R17,R26,R40,
R505, R510, R513
DNP
57
2
R21,R25
58
6
59
5
0
Description
60
1
R44
61
4
R45,R54,R87,R88
62
6
R48,R53,R57,
R62,R81,R511
330
RES MF 330  1/16W 5% 0402
63
1
R67
5K
RES POT 5.0K 1/4W 20% SMT
64
1
R79
27k
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
65
1
R80
1.5K
RES MF 1.5K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW04021K50JNED
—
—
66
1
R82
18.2
RES MF 18.2  1/4W 1% 0805
ROHM
ESR10EZPF18R2
67
1
R500
180K
RES MF 180K 1/16W 1% 0402
KOA SPEER
RK73H1ETTP1803F
68
1
R504 DNP
4.7K
RES MF 4.7K 1/16W 5% 0402
YAGEO AMERICA
RC0402JR-074K7L
69
1
R85
102K
RES MF 102K 1/16W 1% 0402
KOA SPEER
RK73H1ETTP1023F
70
24 SH3,SH4,SH7,
SH8,SH9,SH10,
SH11,SH12,SH13,
SH14,SH15,
SH20,SH21,
SH22,SH23,
SH24,SH25,
SH26,SH27,
SH28,SH29,
SH30,SH31,SH33
0
ZERO OHM CUT TRACE 0402 PADS;
NO PART TO ORDER
—
—
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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31
FRDM-KW40Z development board
Table 6. Bill of materials (common parts for all frequency bands) (Sheet 4 of 5)
Item Qty
Reference
Value
Description
Mfg. name
Mfg. part number
0
ZERO OHM CUT TRACE 0603 PADS;
NO PART TO ORDER
—
—
71
3
SH500,SH501,
SH503
72
4
SW3,SW4,SW5,
SW6
73
2
SW1,SW2
3x3mm
74
36 TP2,TP3,TP4,
TP14,TP19,
TP20,TP22,
TP29,TP30,
TP36,
TP500-534,
TP536,
TP540-543
75
21 TP3,TP4,TP21,
TP25,TP26,TP28,
TP30,TP507,
TP513,TP518,
TP524,TP530,
TP531,TP533,
TP534,TP535,
TP536,TP537,
TP538,TP539,
TP544
76
1
TP31
TESTLOOP_ TEST POINT PC MULTI PURPOSE
BLACK
BLK TH
KEYSTONE
ELECTRONICS
5011
77
2
TVS1,TVS2 DNP
PGB2010402 DIODE ESD SUPPRESSOR
KRHF
BIDIR—12V 0402
LITTELFUSE
PGB2010402KRHF
78
3
U1,U2,U6
0402ESDA-M DIODE TVS BIDIR—30V 0402
LP
COOPER BUSSMANN
0402ESDA-MLP1
79
1
U4
AT45DB021E IC MEM SPI SERIAL 2MBIT FLASH
85MHZ 1.65-3.6V UDFN8
ADESTO
TECHNOLOGIES
AT45DB021E-MHN2B-T
80
5
U5,U13,U14,
U15,U16
74LVCH1T45 IC XCVR 1BIT 3-STATE DUAL
1.2–5.5V XSON6
NXP
SEMICONDUCTORS
74LVCH1T45GM,132
81
1
U7
MK20DX128V IC MCU FLASH 128KB 50MHZ
FM5
1.71–3.6V QFN32
FREESCALE
SEMICONDUCTOR
MK20DX128VFM5
82
1
U8
74LVC2T45G IC XCVR DUAL SUPPLY 1.2–5.5V
M,125
XQFN8
NXP
SEMICONDUCTORS
74LVC2T45GM,125
83
1
U9
FXOS8700CQ IC ACCELEROMETER AND
MAGNETOMETER SENSOR 3-AXIS
2.5V QFN16
FREESCALE
SEMICONDUCTOR
FXOS8700CQ
84
1
U10
MIC2005-0.8Y IC LIN SW PWR 0.8A 2.5-5.5V
M6
SOT23-6
MICREL
MIC2005-0.8YM6
85
1
U11
NLX2G14
IC INV DUAL SCHMITT TRIGGER
1.65-5.5V ULLGA6
On Semiconductor
NLX2G14AMX1TCG
86
1
U12
TXB0104
IC VXLTR 4BIT BIDIRECTIONAL
1.2-3.6V/1.65-5.5V QFN14
TEXAS INSTRUMENTS
TXB0104RGYRG4
87
1
U17
NCP1117ST3 IC VREG LDO 1A 3.3V SOT223
3T3G
ON Semiconductor
NCP1117ST33T3G
88
1
U18
MKW40Z160V IC MCU XCVR 2.4GHZ BLUETOOTH
HT4
LOW ENERGY MAPLGA64
FREESCALE
SEMICONDUCTOR
MKW40Z160VHT4
TL1015AF160 SW SPST PB 50MA 12V SMT
QG
E SWITCH
TL1015AF160QG
CAPACITIVE SINGLE ELECTRODE
3X3MM SQUARED ROUNDED
CORNERS (NOT A PART TO ORDER)
—
—
TPAD_030
TEST POINT PAD 30MIL DIA SMT,
NO PART TO ORDER
—
—
TPAD_040
TEST POINT PAD 40MIL DIA SMT,
NO PART TO ORDER
—
—
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
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Freescale Semiconductor, Inc.
PCB manufacturing specifications
Table 6. Bill of materials (common parts for all frequency bands) (Sheet 5 of 5)
Item Qty
Reference
Value
89
1
U500
90
1
X1
8.00MHZ
91
1
Y1
32MHZ
92
1
Y2
32.768KHZ
93
1
Z1
50/100 W
5
Description
NTSX2102GU IC DUAL SUPPLY XCVR 50 MBPS
8H
5.5V XQFN8
Mfg. name
NXP Semiconductors
Mfg. part number
NTSX2102GU8H
XTAL 8.00MHZ RSN CERAMIC—SMT MURATA
CSTCE8M00G55-R0
XTAL 32MHZ 9PF—SMT 3.2X2.5MM
NDK
EXS00A-CS02368
XTAL 32.768 KHZ SMT ROHS
COMPLIANT
EPSON ELECTRONICS
FC-135 32.7680KA-A3
XFMR BALUN 2.45GHZ 50MHZ
50/100  3W SMT
JOHANSON
TECHNOLOGY
2450BL15B100_
PCB manufacturing specifications
This section provides the specifications used to manufacture the FRDM-KW40Z development Printed
Circuit Board (PCB) described in this guide.
The FRDM-KW40Z development boards must comply with the following:
• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/).
• The PCB manufacturer’s logo is required.
• The PCB production week and year code is required.
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask.
— The PCB manufacturer must not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating:
— The level is 94V-0 (http://ulstandards.ul.com/standard/?id=94).
— The UL information must be stamped on the back of the PCB solder mask.
•
•
NOTE
A complete set of design files for the MKW40Z development boards is
available at the Freescale website (www.freescale.com/KW40Z) under
the “Software and Tools” tab. Use the reference designs as a starting
point for custom applications.
The Freescale IEEE 802.15.4/ZigBee Package and Hardware Layout
Considerations Reference Manual (document ZHDCRM) is also
available at the same website to provide additional design guidance.
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
Freescale Semiconductor, Inc.
33
PCB manufacturing specifications
5.1
Single PCB construction
This section describes individual PCB construction details.
• The FRDM-KW40Z PCBs are four-layer, multi-layer designs.
• The FRDM-KW40Z PCBs must contain no blind, buried, or micro vias.
• PCB data:
— FRDM-KW40Z board size must be approximately 81  53 mm (3.20  2.10 inches).
— FRDM-KW40Z board final thickness (Cu/Cu) must be 1.57 mm (0.62 inches) 10 %
(excluding solder mask).
The following table defines some of the layers of the complete PCB. The artwork identification refers to
the name of the layer in commonly used terms.
Table 7. FRDM-KW40Z layer by layer overview
Layer
Artwork identification
File name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Ground Layer
L2_GND.art
4
Signal Layer
L3_INT_1.art
5
Bottom Layer Metal
L4_SS.art
6
Silkscreen Bottom
SSS.art
CAUTION
The FRDM-KW40Z development board contains high-frequency 2.4 GHz
RF circuitry. As a result, RF component placement, line geometries and
layout, and spacing to the ground plane are critical parameters. Board
stackup geometry is critical. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup information provided in the
reference design (see the following figure).
Figure 27. FRDM-KW40Z PCB layer stackup cross-section (four-layer)
•
•
Solder mask is required
Silk screen is required
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
34
Freescale Semiconductor, Inc.
PCB manufacturing specifications
5.2
Panelization
The panel size can be negotiated according to production volume.
5.3
Materials
The PCB composite materials must meet these requirements:
• Laminate—the base material (laminate) must be FR4. If you use other laminate material, then the
RF electrical characteristics may change and degrade the RF performance.
• Copper foil:
— Top and bottom copper layers must be 1 oz. copper.
— Interior layers must be 1 oz. copper.
• Plating—all pad plating must be Hot Air Levelling (HAL).
5.4
Solder mask
The solder mask must meet these requirements:
• Solder mask type must be Liquid Film Electra EMP110 or equivalent.
• Solder mask thickness must be 10-30 µm.
5.5
Silk screen
The silk screen must meet these requirements:
• Silk screen color must be white.
• Silk screen must be applied after applying solder mask (if solder mask is required).
• The silk screen ink must not extend into any plated-thru-holes.
• The silk screen must be clipped back to the line of resistance.
5.6
•
•
5.7
Electrical PCB testing
All PCBs must be 100 % tested for opens and shorts.
Impedance measurement report is not mandatory.
Packaging
Packaging for the PCBs must meet these requirements:
• Finished PCBs must remain in panel.
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials
(those materials can degrade solderability).
5.8
Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28379.pdf file.
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
Freescale Semiconductor, Inc.
35
Revision history
5.9
File descriptions
Files provided with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are intended for PCB manufacturing.
The included PDF files are:
• FAB-28379.pdf—FRDM-KW40Z board fabrication drawing.
• GRB-28379.zip—FRDM-KW40Z board metal layers, solder mask, solder paste, and silk screen.
• SPF-28379.pdf—FRDM-KW40Z board schematic diagram.
Design files are in Allegro format with OrCAD schematic capture.
6
Revision history
Rev.
number
Date
Substantive change(s)
1
06/2015
Schematic, layout and block diagram update; initial release.
2
09/2015
Schematic, layout and figures.
FRDM-KW40Z Freescale Freedom Development Board User’s Guide, Rev. 2, 10/2015
36
Freescale Semiconductor, Inc.
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
www.freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address: www.freescale.com/SalesTermsandConditions.
Freescale, the Freescale logo, Kinetis, and Freescale Freedom are trademarks of
Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service
names are the property of their respective owners. ARM, the ARM Powered logo,
Cortex, and Cortex-M0+ are registered trademarks of ARM Limited (or its subsidiaries)
in the EU and/ or elsewhere. All rights reserved.
© 2015 Freescale Semiconductor, Inc.
Document Number: FRDMKW40ZUG
Rev. 2
10/2015