FRDMKW24DUG

NXP Semiconductors
User’s Guide
Document Number: FRDMKW24DUG
Rev. 1, 05/2016
FRDM-KW24D512 Freedom
Development Platform User’s Guide
1
Introduction
This manual describes the development platform,
FRDM-KW24D512. It has a diverse reference design with
all necessary I/O connections to use as a self-contained
platform or for connection to an external application.
The MKW24D512 is a 2.4 GHz Industrial, Scientific, and
Medical (ISM) single-chip device intended for the IEEE®
Std. 802.15.4, including Thread, ZigBee® Pro stack, ZigBee
RF4CE standards, and IPv6/6loWPAN protocols.
The FRDM-KW24D512 contains the MKW24D512
transceiver that is typically combined with a software stack
to implement an IEEE Std. 802.15.4 platform solutions.
1.1
Audience
This document is intended for system designers.
2
2.1
Safety Information
FCC guidelines
This equipment is used by developers for evaluation
purposes only and must not be incorporated into any other
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2.Regulatory approval for Canada (IC RSS 210) . . . 2
2.3.Electrostatic discharge considerations . . . . . . . . . . 3
2.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3
3. FRDM-KW24D512 Overview and Description . . . . . 3
3.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.Platform features . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.Software and driver considerations . . . . . . . . . . . . 6
4. FRDM-KW24D512 Development Platform . . . . . . . 6
4.1.FRDM-KW24D512 platform overview . . . . . . . . 6
4.2.Functional description . . . . . . . . . . . . . . . . . . . . . . 9
4.3.Schematic, platform layout, and bill of material . 17
5. PCB Manufacturing Specifications . . . . . . . . . . . . . 26
5.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 27
5.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 29
5.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.8.Hole specification/tool table . . . . . . . . . . . . . . . . 29
5.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Safety Information
devices or systems. Integrators are responsible for reevaluating the end product (including the transmitter)
and obtaining a separate FCC authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this document, may violate the rules of the
Federal Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1
Labeling
FCC labels are physically located on the back of the platform.
2.1.2
Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
2.1.3
Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20 cm) from all persons.
2.1.4
Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE Std. 802.15.4. In addition, this requirement does not apply to intentional radiators that
must be professionally installed, such as perimeter protection systems and some field disturbance sensors,
or to other intentional radiators which, in accordance with Section 15.31(d) of the IEEE Std. 802.15.4,
must be measured at the installation site. However, the installer is responsible for ensuring that the proper
antenna is employed so that the limits in this Part are not exceeded.
2.2
Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
•
•
This platform may not cause interference.
This platform must accept any interference, including interference that may cause undesired
operation of the device.
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FRDM-KW24D512 Overview and Description
2.2.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3
Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification, ESD stresses are performed for the human body model
(HBM), the machine model (MM), and the charge device model (CDM).
All latch-up tests are in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development platforms or components, it is strongly recommended to use
at least the grounding wrist straps plus any, or all, of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors, and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
2.4
Disposal instructions
The NXP development platforms must be disposed of in compliance with current local waste disposal
regulations. Appliances disposal should be done by a qualified company.
3
3.1
FRDM-KW24D512 Overview and Description
Introduction
The FRDM-KW24D512 development platform is an evaluation environment based on the NXP
MKW24D512 transceiver (MKW24).
The MKW24D512 device incorporates a complete low power IEEE Std. 802.15.4 2.4 GHz radio
frequency transceiver and a Kinetis family low-power, mixed-signal ARM® Cortex®-M4 MCU into a
single package.
NXP supplements the MKW24D512 with tools and software that include hardware evaluation and
development platforms, software development IDE, and applications, drivers, custom PHY usable with the
NXP IEEE Std. 802.15.4 compatible MAC.
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FRDM-KW24D512 Overview and Description
The FRDM-KW24D512 development platform contains the MKW24D512 device with 32 MHz reference
oscillator crystal, RF circuitry including antenna, 16 Mbit external serial flash, and supporting circuitry in
the popular Freedom form factor. The platform is standalone and supports application development with
NXP IEEE Std. 802.15.4 protocol stacks and supports full-speed USB 2.0.
3.2
3.2.1
Platform features
FRDM-KW24D512 platform
The FRDM-KW24D512 development platform is part of the Freedom development (FRDM) platform. It
has a diverse reference design containing the MKW24D512 device and all necessary I/O connections to
use as a self-contained platform or for connection to an external application, and also has the capability to
connect with the Freedom development platforms.
Figure 1 shows the FRDM-KW24D512 development platform.
Figure 1. FRDM-KW24D512 development platform
The FRDM-KW24D512 development platform includes the following features:
• The low-power Kinetis MKW24D512 transceiver
• Full IEEE Std. 802.15.4-compliant wireless node; ZigBee and Thread capable
• Reference design area with small footprint, low-cost RF node
— RF circuitry includes a Balun to convert the differential input/output pin of the MKW24D512
transciever to single-ended for onboard signal routing
— Low off-chip component count
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•
•
•
•
•
•
•
•
•
•
•
•
•
— Programmable output power from -35 dBm to +8 dBm at the SMA connector, no trap
— Receiver sensitivity: -102 dBm, typical (@1% PER for 20 byte payload packet)
Integrated PCB inverted F-type antenna and SMA RF port
Selectable power sources
32 MHz reference oscillator
32 kHz clock oscillator
2.4 GHz frequency operation (ISM Band)
External serial flash for over-the-air programming (OTAP) support
Integrated open-standard serial and debug interface (OpenSDA)
Cortex 10-pin (0.05 inches) SWD debug port for target MCU
Cortex 10-pin (0.05 inches) JTAG port for OpenSDA updates
1 RGB LED indicator
1 Blue LED indicator
4 Push button switches
FXOS8700 Combo Sensor
Figure 2 shows the main platform features and I/O headers for the FRDM-KW24D512 platform.
Figure 2. FRDM-KW24D512 components and I/O headers
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3.3
Software and driver considerations
The FRDM-KW24D512 platform includes an OpenSDAv2.1, a serial and debug adapter circuit that
includes an open-source bootloader, and debug interface software. It bridges serial and debug
communications between a USB host and an embedded target processor. The hardware circuit is based on
the Kinetis K20 family.
For additional information about our 2.4 GHz Kinetis family platforms, see the following:
• Wireless on nxp.com
• Kinetis KW2xD on nxp.com
4
4.1
FRDM-KW24D512 Development Platform
FRDM-KW24D512 platform overview
The FRDM-KW24D512 is an evaluation platform based on the MKW24D512 transceiver. The
FRDM-KW24D512 platform provides a platform to evaluate the MKW24D512 transceiver, develop
software and applications. The core device is accompanied by a 32 MHz reference oscillator crystal, RF
circuitry including antenna, and supporting circuitry.
The FRDM-KW24D512 platform is intended as the core PCB for MKW24D512 transceiver evaluation
and application development, and can be used in the following modes:
• Simple standalone evaluation platform
• Daughter card to other development platforms (Freedom development platform)
• Mother card to an application-specific daughter card, such as a shield card
4.1.1
PCB features
The FRDM-KW24D512 platform provides the following features:
• The Freedom development platform form factor
• 4-Layer metal, 0.062 inch thick FR4 platform
• LGA footprint and power supply bypass
• Printed metal F-Antenna and footprint for installing a (user supplied) SMA connector
• 32 MHz reference oscillator crystal
• 32.768 kHz crystal provided for optional timing oscillator
• Standard FRDM card mounting interface
• External serial flash for OTAP support
• Combo sensor, 6-axis sensor with integrated linear accelerometer and magnetometer
4.1.2
Form factor
Figure 3 shows the FRDM-KW24D512 platform’s connector and header locations.
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Figure 3. FRDM-KW24D512 platform’s connector and header location
Figure 4 shows a footprint of the FRDM-KW24D512 platform with the location of the I/O headers. The
parameters of these headers are as follows:
• J1, J2, J3 and J4:
— Headers have standard 0.1 inch / 2.54 mm pin spacing
— J1 and J3 are 16-pin
— J2 is 20-pin
— J4 is 12-pin
— Pin headers are mounted on the top side of the FRDM-KW24D512 and are intended to plug
into matching receptacles on the Freedom Platform
• J36, J37, J38, J39, J41, and J42:
— Headers have standard 0.1 in / 2.54 mm pin spacing
— All headers are 2x2 pin
— J41 and J42 are adjacent to allow UART0 data direction to be reversed by altering the
orientation of the shunt
— J38 and J39 are adjacent to allow SPI0 data direction to be reversed by altering the orientation
of the shunt
— J36 and J37 are adjacent to allow UART1 data direction to be reversed by altering the
orientation of the shunt
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FRDM-KW24D512 Development Platform
Figure 4. FRDM-KW24D512 platform top side (component side) footprint
4.1.3
Platform level specifications
Table 1. FRDM-KW24D512 platform specifications
Parameter
Min
Typ
Max
Units
Notes/Conditions
General
Size (PCB: X, Y)
—
—
81.2 x 53.3
3.20 x 2.10
Layer build (PCB)
—
1.57
0.062
—
Dielectric material (PCB)
—
—
—
mm —
inches
mm 4-Layer
inches
—
FR4
mA
Varies with operational mode, see
datasheet.
Power
Current consumption
—
—
—
Temperature
Operating temperature (see note)
-40
+25
+70
°C
Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Storage temperature
-30
+25
+70
°C
—
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Table 1. FRDM-KW24D512 platform specifications (continued)
Parameter
Min
Typ
Max
Units
Notes/Conditions
RF
IEEE 802.15.4 frequency range
2405
—
2480
MHz
Operation frequency
2360
—
2480
MHz
All 16 channels in the 2450 MHz band
—
RF Receiver
Saturation (maximum input level)
—
+0
—
dBm
See data sheet
Sensitivity for 1% packet error rate
(PER) (+25 °C) 802.15.4
—
-102
—
dBm
See data sheet
RF Transmitter
RF Power Output
-35
—
+8
dBm
Programmable in steps. At the antenna feed
with no harmonic trap. 1
2nd harmonic
—
40
35
dBm
See data sheet
3rd harmonic
—
40
35
dBm
See data sheet
Regulatory Approval
FCC
—
—
—
—
Product is approved according to the FCC
part 15 standard
CE (ETSI)
—
—
—
—
Product is approved according to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC)
—
—
—
—
Product is approved according to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
—
Product is approved according to the IEC
60950-1 and EN 60950-1, First Edition
standards
Safety
UL
—
—
—
Environment
RoHS
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
1
Harmonic trap adds 1 to 2 dB of loss.
4.2
Functional description
The FRDM-KW24D512 platform is built around the MKW24D512 transceiver in a 63-pin (56-pin usable)
LGA package. The MKW24D512 device features a IEEE Std. 802.15.4 radio frequency transceiver and a
Kinetis family low-power, mixed-signal ARM Cortex-M4 MCU in a single package. The
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FRDM-KW24D512 Development Platform
FRDM-KW24D512 platform is intended as an evaluation platform and as a building block for application
development. The four-layer platform provides the MKW24D512 transceiver with the required RF
circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level
functionality can be used as a reference layout for your target platform. Figure 5 shows a simple block
diagram.
Figure 5. FRDM-KW24D512 block diagram
4.2.1
RF performance and considerations
The FRDM-KW24D512 development platform includes a 1 mW nominal output PA with internal voltage
controlled oscillator (VCO), integrated transmit/receive switch, onboard power supply regulation, and full
spread-spectrum encoding and decoding. Key specifications for the MKW24D512 transceiver are:
• Programmable output power from -35 dBm to +8 dBm at the SMA, no trap.
• Typical sensitivity is -102 dBm (@1% PER for 20 byte payload packet).
• Frequency range is 2360 to 2480 MHz.
• Differential bidirectional RF input/output port with integrated transmit/receive switch.
• “F” printed metal antenna for a small footprint, low cost design.
• Platform features a low component count RF matching network with off-chip 1:1 Balun.
The layout has provision for out-of-band signal suppression (components L5 and C19) if required.
Figure 6 shows the typical topology for the RF circuitry. A footprint is available to install the RF connector
J48 for measurement purposes. When using J48, install C17 and remove C18.
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Figure 6. FRDM-KW24D512 RF circuitry
4.2.2
Clocks
The FRDM-KW24D512 provides two clocks:
• 32 MHz Reference Oscillator: Figure 7 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the specifications outlined in the AN3251 application note (AN3251).
The IEEE Std. 802.15.4 requires that the frequency be accurate to less that ±40 ppm.
— Capacitors C21 and C22 provide the bulk of the crystal load capacitance. At 25°C, it is desired
to have the frequency accurate to ±10 ppm or less to allow for temperature variation.
— To measure the 32 MHz oscillator frequency, signal CLKOUT (PTA18/CLK_OUT) can
optionally be programmed to provide a buffered output clock signal.
• Optional 32.768 kHz Crystal Oscillator: Provision is also made for a secondary 32.768 kHz crystal
Y2 (see Figure 8). This oscillator can be used for a low-power accurate time base.
— The module comes provided with this Y2 crystal and its load capacitors C23 and C24.
— Load capacitors C23 and C24 provide the entire crystal load capacitance. There is no onboard
trim capacitance.
— The 32 kHz oscillator components are supplied, but not enabled. Zero-ohm resistors R82 and
R83 to disable 32 kHz.
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Figure 7. FRDM-KW24D512 platform’s 32 MHz reference oscillator circuit
Figure 8. FRDM-KW24D512 platform’s 32.768 kHz optional oscillator circuit
4.2.3
Power management
There are several different ways to power and measure current on the FRDM-KW24D512 platform. The
FRDM-KW24D512 power management circuit is shown in Figure 9.
Figure 9. FRDM-KW24D512 platform’s power management circuit
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The FRDM-KW24D512 platform has the flexibility to be powered in several configurations:
• The platform can be supplied through the micro USB type B connector (J16), which provides
P5V_USB to LDO 3V3.
• The platform can be supplied through the development platform’s headers, which provide either
P3.3V or P5-9V_VIN on header J3 pin 16 to LDO 3V3.
• The platform can be supplied from an external DC supply in the following way:
— Connect an adaptor capable of suppling more than 3.3 VDC (15 V maximum) to J28 header.
Additionally, J40, a two-pin 1x2 cut-trace header, provides current to the MCU and the transceiver. A red
LED marked as LED D4 is available as a power indicator.
Power headers provide the means to supply either the LED, MCU, or peripheral circuits. Current
measurements can be made by inserting a current meter in place of a designated jumper. Connection
configurations are described in Table 2.
Table 2. Power distribution headers
Supply
designation
Header
pins
V_MCU
J40
1-2
Description
Supply voltage to MCU, transceiver, and peripherals
• Jumper is shorted by a cut-trace on the bottom layer
• Usage: Measure MCU current
P3V3
SH18
—
Supply voltage to header
• Normally traced
P3V3_BRD
SH19
—
Supply voltage to LEDs, switches, and some modules
• Normally traced
4.2.4
FRDM-KW24D512 peripheral functions
The FRDM-KW24D512 development platform includes the NXP Freedom platform headers to interface
with the general purpose functions and to assist in implementing targeted applications. The
FRDM-KW24D512 platform also has alternate port functions routed to those interface headers where
off-board FRDM development platform peripherals can be used.
4.2.4.1
Serial flash (SPI interface)
Component U13 is an AT45DB161E 16 Mbit (2 Mbyte) serial flash memory with SPI interface. The
memory is useful for over-the-air programming (OTAP) and for storage of non-volatile system data or
parameters. Figure 10 shows the memory circuit.
• The memory power supply is P3V3_BRD.
• Place J38 and J39 Jumpers to perform SPI communication with the serial flash module.
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•
The SPI Write Protect and Reset has discrete pullup resistors
Figure 10. AT45DB161E (2 Mbyte) serial flash memory
4.2.4.2
Combo sensor (I2C interface)
The component U16 is an NXP FXOS8700CQ 6-axis sensor with integrated linear accelerometer and
magnetometer, very low-power consumption, and I2C selectable. Figure 11 shows the sensor circuit.
• The sensor power supply is P3V3_BRD.
• Discrete pullup resistors for the I2C port are provided.
• One interrupt signal.
Figure 11. FXOS8700CQ combo sensor
4.2.4.3
Interface connectors J1, J2, J3 and J4
The four connectors J1, J2, J3, and J4 are 100 mil pitch, pin headers mounted on the front (component side)
supporting the Freedom standard connector.
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•
P3V3, 5V_USB, and P5-9V_VIN provide the headers connector with its supply voltage
— Peripheral I/O to the FRDM-KW24D512 platform and the Freedom development platform
supply must use this same voltage supply to avoid potential damage.
The pin definitions for the headers are shown in Table 3 and Table 4.
Table 3. J2 and J1 connector
J1
J2
Header
pin No
MKW24D512 pin
name
Description
Header
pin No
Description
MKW24D512 pin name
1
NC
NC
1
PTE0_TX
UART1_TX
2
PTA19
PTA19 (D8/int)
2
PTD7_TX
UART0 (D0/RX/INT)
3
NC
NC
3
PTE1_RX
UART1_RX
4
PTA18/EXTAL0
PTA18 (D9/int)
4
PTD6_RX
UART0 (D1/TX/INT)
5
NC
NC
5
PTE2_CTS
UART1_CTS
6
PTC4_SPI_SS
PTC4 (D10/SPI_SS)
6
PTD5_CTS
UART0 (D2/INT)
7
NC
NC
7
PTE3_RST
UART1_RST
8
PTC6_SPI_SOUT
PTC6 (D11/MOSI)
8
PTD4_RST
UART0 (D3/PWM/INT)
9
NC
NC
9
NC
NC
10
PTC7_SPI_SIN
PTC7 (D12/MISO)
10
GPIO2
GPIO2 (D4/INT)
11
NC
NC
11
NC
NC
12
PTC5_SPI_CLK
PTC5 (D13/SCK)
12
GPIO1
GPIO1 (D5/PWM/INT)
13
NC
NC
13
NC
NC
14
GND
GND
14
PTE4
PTE4
15
NC
NC
15
NC
NC
16
P3V3_BRD
P3V3_BRD
16
PTD1
PTD1 (D7/CMP/INT)
17
NC
NC
—
—
—
18
PTD3_I2C_SDA
PTD3 (D14/Ana/Int)
—
—
—
19
NC
NC
—
—
—
20
PTD2_I2C_SCL
PTD2 (D15/Ana/Int)
—
—
—
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Table 4. J3 and J4 connector
J4
J3
Header
pin No
Description
Header
pin No
MKW24D512 pin name
MKW24D512 pin
name
Description
1
NC
NC
1
NC
NC
2
NC
NC
2
ANT_A
A0/INT
3
NC
NC
3
PTA0
JTAG_TCLK
4
P3V3
P3V3
4
ANT_B
A1/INT
5
NC
NC
5
PTA1
JTAG_TDI
6
RST_B
RST_TGTMCU_B
6
RX_SWITCH
A2/INT
7
NC
NC
7
PTA2
JTAG_TDO
8
P3V3
P3V3
8
TX_SWITCH
A3_INT
9
NC
NC
9
PTA3 and
RST_TGTMCU_B
JTAG_TMS
10
P5V
P5V
10
NC
NC
11
NC
NC
11
PTA4
NMI_B
12
GND
GND
12
NC
NC
13
NC
NC
—
—
—
14
GND
GND
—
—
—
15
NC
NC
—
—
—
16
P5-9V_VIN
Unregulated Voltage
—
—
—
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NXP Semiconductors
FRDM-KW24D512 Development Platform
4.3
Schematic, platform layout, and bill of material
Figure 12. FRDM-KW24D512 platform schematic rev. A (1/4)
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
NXP Semiconductors
17
FRDM-KW24D512 Development Platform
Figure 13. FRDM-KW24D512 platform schematic rev. A (2/4)
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
18
NXP Semiconductors
TT
T
TT
T
TT
T
T
FRDM-KW24D512 Development Platform
Figure 14. FRDM-KW24D512 platform schematic rev. A (3/4)
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
NXP Semiconductors
19
20
TTTTTTT
TTT
TTTTTTT
TTT
TTTTTT
TTT
TTTTTT
TTTTTTT
TTT
T
TTTTTTTTT
TTT
T
TTTTT
TT
T
TT
TTTTTT
TT
T
T
TTT
TT
TTT
T
TTTT
TT
TT
T
T
T
TT
T
TTTTT
T
TTT
TT
TT
TTTTT
TTT
T
TTTTTTT
TT
TTT
TT
TT
TTT
TTTT
TT
T
TT
TTT
TTTTT
TTTT
T
TT
T
TTTTTT
TTTTT
T
TT
TTT
TTTTTTTTTT
TTTTTTTT
FRDM-KW24D512 Development Platform
Figure 15. FRDM-KW24D512 platform schematic rev. A (4/4)
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
NXP Semiconductors
FRDM-KW24D512 Development Platform
Figure 16. FRDM-KW24D512 platform PCB component location (top view)
Figure 17. FRDM-KW24D512 platform PCB test points
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
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21
FRDM-KW24D512 Development Platform
Figure 18. FRDM-KW24D512 platform PCB layout (top view)
Figure 19. FRDM-KW24D512 platform PCB layout (bottom view)
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NXP Semiconductors
FRDM-KW24D512 Development Platform
4.3.1
Bill of materials
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 1 of 4)
Item Qty
Reference
Value
Description
Mfg. name
Mfg. part number
1
1
ANT1
F_ANTENNA
PCB F ANTENNA, NO PART ORDER
NOT A PART
NOT A PART
2
1
C25
1PF
CAP CER 1PF 50V ±0.05PF C0G 0402
MURATA
GRM1555C1H1R0WA01D
3
1
C19
1.2PF
CAP CER 1.2PF 50V ±0.PF NP0 0402
MURATA
GRM1555C1H1R2WA01D
4
3
C8,C10,C47
5PF
CAP CER 5PF 50V 5% C0G 0402
MURATA
GJM1555C1H5R0CB01D
5
2
C18,C45
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
6
1
C17 DNP
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
7
2
C21,C22
11PF
CAP CER 11PF 50V 5% C0G 0402
KEMET
CBR04C110F5GAC
8
2
C23,C24
12PF
CAP CER 12PF 50V 5% C0G 0402
MURATA
GRM1555C1H120JZ01D
9
1
C34 DNP
18PF
CAP CER 18PF 50V 5% C0G 0603
YAGEO AMERICA
CC0603JRNPO9BN180
10
2
C30,C31 DNP
22PF
CAP CER 22PF 50V 5% C0G 0402
AVX
04025A220JAT2A
11
2
C15,C44
33PF
CAP CER 33PF 50V 5% C0G 0402
KEMET
C0402C330J5GACTU
12
2
C35,C48 DNP
47PF
CAP CER 47PF 16V 5% C0G 0402
AVX
0402YA470JAT2A
13
1
C56
470PF
CAP CER 470PF 16V 10% X7R 0402
KEMET
C0402C471K4RACTU
14
4
C9,C11,C46,C70
1000PF
CAP CER 1000PF 50V 5% C0G 0402
MURATA
GRM1555C1H102JA01D
15
4
C51,C52,C53,C54
DNP
1000PF
CAP CER 1000PF 50V 5% C0G 0402
MURATA
GRM1555C1H102JA01D
16
11
C12,C13,C14,C33,
C41,C59,C60,C61,
C62,C66,C68
0.1UF
CAP CER 0.1UF 16V 10% X7R 0402
KEMET
C0402C104K4RAC
17
2
C36,C69 DNP
0.1UF
CAP CER 0.1UF 16V 10% X7R 0402
KEMET
C0402C104K4RAC
18
2
C7,C16
0.33UF
CAP CER 0.33UF 6.3V 10% X5R 0402
MURATA
GRM155R60J334KE01D
19
1
C42
0.47UF
CAP CER 0.47UF 6.3V 10% X5R 0402
KEMET
C0402C474K9PACTU
20
3
C26,C49,C50
1.0UF
CAP CER 1.0UF 10V 10% X5R 0402
YAGEO AMERICA
CC0402KRX5R6BB105
21
1
C55
1UF
CAP CER 1UF 10V 10% X7R 0805
MURATA
GRM21BR71A105KA01L
22
5
C32,C37,C57,C64,
C65
2.2UF
CAP CER 2.2UF 10V 10% X7R 0603
TAIYO YUDEN
LMK107B7225KA-T
23
2
C58,C67
4.7UF
CAP CER 4.7UF 6.3V 20% X5R 0402
MURATA
GRM155R60J475ME47D
24
1
C63
4.7UF
CAP CER 4.7UF 10V 10% X7R 0603
KEMET
C0603C475K8PACTU
25
1
C5
10UF
CAP CER 10UF 10V 10% X7R 0805
MURATA
GRM21BR71A106KE51L
26
4
C6,C38,C39,C40
DNP
10UF
CAP CER 10UF 10V 10% X7R 0805
MURATA
GRM21BR71A106KE51L
27
10
D1,D2,D3,D5,D6,D7,
D9,D10,D15,D18
MSS1P3L
DIODE SCH 1A 20V MICROSMP SMT
VISHAY
INTERTECHNOLOGY
MSS1P3L-M3/89A
28
2
D4,D12
RED
LED RED SGL 20MA SMT 0805
LITE ON
LTST-C171KRKT
29
1
D8
BLUE
LED BLUE SGL 20MA SMT 0805
LITE ON
LTST-C171TBKT
30
1
D11
LED GREEN
LED GRN SGL 20MA 0603
OSRAM
LG L29K-G2J1-24-Z
31
1
D17
CLV1A-FKB-CJ1
M1F1BB7R4S3
LED - RGB,
CLV1A-FKB-CJ1M1F1BB7R4S3,
675/527/470MCD(TYP.), SMD
CREE
CLV1A-FKB-CJ1M1F1BB
7R4S3
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FRDM-KW24D512 Development Platform
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 2 of 4)
Item Qty
Reference
Value
Description
Mfg. name
Mfg. part number
32
2
J1,J3
CON_2X8_0.1"
CON 2X8 FEMALE 100MIL SP 394H AU
SAMTEC
SSW-108-03-G-D
33
1
J2
CON_2X10_0.1"
CON 2X10 FEMALE 100MIL SP 394H AU SAMTEC
SSW-110-03-G-D
34
1
J4
CON_2X6_0.1"
CON 2X6 FEMALE 100MIL SP 394H AU
SAMTEC
SSW-106-03-G-D
35
1
J7 DNP
HDR TH 1X3
HDR 1X3 TH 100MIL SP 339H AU 100L
SAMTEC
TSW-103-07-G-S
36
1
J10
HDR TH 1X3
HDR 1X3 TH 100MIL SP 339H AU 100L
SAMTEC
TSW-103-07-G-S
37
3
J11,J35,J40 DNP
SH HDR 1X2
HDR 1X2 TH 100MIL SP 330H SN 115L
(BOTTOM SIDE SHORT)
SAMTEC
TSW-102-23-T-S
38
2
J13,J14
HDR 2X5
CONN,HEAD,2X5,STR,50/50
CON-2RH-10-50
SAMTEC
FTS-105-01-F-D
39
2
J15,J16
CONN USB
MINI-B
CON 5 USB_MINI_B_RECEPTACLE RA
SMT 0.8MM 168H AU
TE CONNECTIVITY LTD 1734035-2
40
7
J28,J36,J37,J38,J39, HDR 1X2
J41,J42
HDR 1X2 TH 100MIL SP 330H SN 115L
SAMTEC
TSW-102-23-T-S
41
1
J48 DNP
SMA
CON, SMA, EDGE 0.062IN, 50 OHM
FEMALE 18GHZ
JOHNSON
COMPONENTS INC
142-0701-851
42
4
L4,L6,L7,L8
330 OHM
IND FER BEAD 330OHM@100MHZ 2.5A
-- SMT
TDK
MPZ2012S331A
43
1
L5
2.2NH
IND -- 0.0022UH@100MHZ 300MA
0.0003UH 0402
MURATA
LQG15HS2N2S02D
44
9
R3,R13,R14,R78,
R79,R82,R95,R111,
R117
0
RES MF ZERO OHM 1/16W 5% 0402
VISHAY
CRCW04020000Z0ED
45
14
R17,R83,R96,R113,
R114,R115,R116,
R118,R119,R120,
R121,R122,R123,
R124 DNP
0
RES MF ZERO OHM 1/16W 5% 0402
VISHAY
CRCW04020000Z0ED
46
1
R1 DNP
0
RES MF ZERO OHM 1/10W -- 0603
VISHAY
INTERTECHNOLOGY
CRCW06030000Z0EA
47
4
R33,R34,R50,R51
33
RES MF 33.0 OHM 1/16W 1% 0402
VISHAY
CRCW040233R0FKED
48
7
R10,R11,R18,R28,
R29,R30,R104
220
RES MF 220 OHM 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW0402220RJNED
49
5
R88,R89,R92,R93,
R551
1.0K
RES MF 1.0K 1/16W 1% 0402
YAGEO AMERICA
RC0402FR-071KL
50
2
R90,R91 DNP
1.0K
RES MF 1.0K 1/16W 1% 0402
YAGEO AMERICA
RC0402FR-071KL
51
1
R52
4.7K
RES MF 4.7K 1/10W 5% 0603
VISHAY
INTERTECHNOLOGY
CRCW06034K70JNEA
52
10
R19,R20,R25,R35,
R36,R37,R38,R39,
R110,R563
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
53
9
R31,R32,R40,R41,
R108,R556,R557,
R558,R559 DNP
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
54
3
R100,R105,R107
10K
RES MF 10K 1/10W 5% 0603
KOA SPEER
RK73B1JTTD103J
55
1
R109
15K
RES MF 15.0K 1/16W 1% 0402
BOURNS
CR0402-FX-1502GLF
56
1
R125 DNP
15K
RES MF 15.0K 1/16W 1% 0402
BOURNS
CR0402-FX-1502GLF
57
1
R106
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
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NXP Semiconductors
FRDM-KW24D512 Development Platform
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 3 of 4)
Item Qty
Reference
Value
Description
Mfg. name
Mfg. part number
58
1
R112 DNP
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
59
1
R15
180K
RES MF 180K 1/16W 1% 0402
VISHAY
CRCW0402180KFKED
60
1
R12
1.0M
RES MF 1.0M 1/10W 5% 0603
BOURNS
CR0603-JW-105ELF
61
1
SHUNT3
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
62
1
SHUNT4
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
63
1
SHUNT5
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
64
1
SHUNT6
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
65
1
SHUNT7
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
66
1
SHUNT8
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
67
1
SHUNT9
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
68
24
SH1,SH3,SH4,SH5,
SH6,SH7,SH8,SH9,
SH10,SH11,SH12,
SH13,SH14,SH15,
SH16,SH17,SH24,
SH30,SH31,SH32,
SH36,SH37,SH38,
SH39
0
CUT TRACE RESISTOR
NOT A COMPONENT
NOT A COMPONENT
69
5
SH18,SH19,SH33,
SH34,SH35
0
CUT TRACE RESISTOR
NOT A COMPONENT
NOT A COMPONENT
70
5
SW1,SW2,SW3,
SW4,SW5
TL1015AF160Q
G
SW SPST-NO 0.05A, 12V, SMT
E-SWITCH
TL1015AF160QG
71
2
TL1,TL2
TESTLOOP
TEST POINT PAD SIZE 3.4MM X 1.8MM
SMT
KEYSTONE
ELECTRONICS
5015
72
48
TP2,TP3,TP4,TP6,
TPAD_040
TP7,TP8,TP9,TP10,
TP11,TP12,TP17,
TP18,TP19,TP20,
TP21,TP22,TP23,
TP24,TP25,TP26,
TP28,TP29,TP30,
TP31,TP32,TP33,
TP34,TP35,TP36,
TP104,TP109,
TP110,TP111,TP112,
TP113,TP114,TP115,
TP116,TP119,TP500,
TP501,TP502,
TP504,TP505,
TP506,TP513,
TP514,TP515
TEST POINT PAD 40MIL DIA SMT, NO
PART TO ORDER
NOT A COMPONENT
NOT A COMPONENT
73
15
TP13,TP14,TP100,
TP101,TP102,
TP103,TP105,
TP106,TP107,
TP108,TP508,
TP509,TP510,
TP511,TP512
TPAD_030
TEST POINT PAD 30MIL DIA SMT, NO
PART TO ORDER
NOT A COMPONENT
NOT A COMPONENT
74
1
TP507
TESTLOOP_BL
ACK
TEST POINT PC MULTI PURPOSE BLK
TH
KEYSTONE
ELECTRONICS
5011
75
1
U3
MKW24D512V
IC MCU XCVR 2.4GHZ 64KB RAM 512KB
FLASH - USB 1.8-3.6V LGA63
FREESCALE
SEMICONDUCTOR
MKW24D512VHA5
76
1
U4
74LVC125ADB
IC BUF QUAD TS 1.2-3.6V SSOP14
NXP
SEMICONDUCTORS
74LVC125ADB
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25
PCB Manufacturing Specifications
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 4 of 4)
Item Qty
5
Reference
Value
Description
Mfg. name
Mfg. part number
77
1
U6
MK20DX128VF
M5
IC MCU FLASH 128KB 50MHZ 1.71-3.6V
QFN32
FREESCALE
SEMICONDUCTOR
MK20DX128VFM5
78
1
U7
MIC2005-0.8YM
6
IC LIN SW PWR 0.8A 2.5-5.5V SOT23-6
MICREL
MIC2005-0.8YM6
79
1
U8
NTSX2102GU8H IC DUAL SUPPLY XCVR 50 MBPS 5.5V
XQFN8
NXP
SEMICONDUCTORS
NTSX2102GU8H
80
6
U10,U11,U12,U17,
U18,U19
0402ESDA-MLP
COOPER BUSSMANN
0402ESDA-MLP1
81
1
U13
AT45DB161E-SS IC FLASH 16MBIT 85MHZ 2.5-3.6V
HD
SOIC8
ATMEL
AT45DB161E-SSHD-T
82
1
U15
MIC5205-3.3
LDO 150MA 16V SOT23-5
MICREL
MIC5205-3.3YM5
83
1
U16
FXOS8700CQ
IC FXOS8700CQ 6-AXIS SENSOR
1.95V-3.6V, QFN-16
FREESCALE
SEMICONDUCTOR
FXOS8700CQR1
84
1
Y1
32MHZ
XTAL 32MHZ 9PF -- SMT 3.2X2.5MM
NDK
EXS00A-CS02368
85
1
Y2
32.768KHZ
XTAL 32.768KHZ SMT ROHS
COMPLIANT
EPSON ELECTRONICS
FC-135 32.7680KA-A3
86
1
Y3
8MHZ
XTAL 8MHZ 20PPM PAR 18PF ESR
200OHM SMT
ABRACON
CORPORATION
ABM3B-8.000MHZ-B2-T
87
1
Z1
2400MHZ
50OHM
XFMR BALUN 2400 ±100MHZ SMT
MURATA
LDB212G4005C-001
DIODE TVS BIDIR -- 30V 0402
PCB Manufacturing Specifications
This section provides the specifications used to manufacture the FRDM-KW24D512 development printed
circuit board (PCB) described in this document.
The FRDM-KW24D512 PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/).
• The PCB manufacturer’s logo is required.
• The PCB production week and year code is required.
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask.
— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating:
— The level is 94V-0 (Standard for Tests for Flammability of Plastic Materials for Parts in Devices
and Appliancesl).
— The UL information must be stamped on the back of the PCB solder mask
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NXP Semiconductors
PCB Manufacturing Specifications
•
•
5.1
NOTE
A complete set of design files is available for the FRDM-KW24D512
transceiver at the NXP website under “Software and Tools.” These
reference designs should be used as a starting point for a custom
application. (TWR-KW2x: Kinetis KW2x Tower System Modules)
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual (ZHDCRM) is also available at the
same website to provide additional design guidance.
Single PCB construction
This section describes individual PCB construction details.
• The FRDM-KW24D512 PCBs are four-layer, multilayer designs.
• The PCBs contain no blind, buried, or micro vias.
• PCB data:
— FRDM-KW24D512 platform’s size: Approximately 81 mm x 53 mm (3.20 inches x 2.10
inches).
— FRDM-KW24D512 platform’s final thickness (Cu/Cu): 1.57 mm (0.62 inches) ±10%
(excluding solder mask).
Table 6 defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
Table 6. FRDM-KW24D512 layer by layer overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Ground Layer
L2_GND.art
4
Signal Layer
L3_INT_1.art
5
Bottom Layer Metal
L4_SS.art
6
Silkscreen Bottom
SSS.art
CAUTION:
The FRDM-KW24D512 development platform contains high-frequency
2.4 GHz RF circuitry. As a result, RF component placement, line geometries
and layout, and spacing to the ground plane are critical parameters. As a
result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and
copper thicknesses and spacing must not be changed. Follow the stackup
(see Figure 20) information provided with the reference design.
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
NXP Semiconductors
27
PCB Manufacturing Specifications
Figure 20. FRDM-KW24D512 PCB stackup cross-section (four layer)
•
•
5.2
A solder mask is required.
A silk screen is required.
Panelization
The panel size can be negotiated depending on production volume.
5.3
Materials
The PCB composite materials must meet the following requirements:
• Laminate: The base material (laminate) must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade the RF performance.
• Copper foil:
— Top and Bottom copper layers must be 1 oz. copper.
— Interior layers must be 1 oz. copper.
• Plating: All pad plating must be Hot Air Levelling (HAL).
5.4
Solder mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent.
• Solder mask thickness: 10–30 µm.
5.5
Silk screen
The silk screen must meet the following requirements:
• Silk screen color: White.
• Silk screen must be applied after application of solder mask if solder mask is required.
• The silk screen ink must not extend into any plated-through-holes.
• The silk screen must be clipped back to the line of resistance.
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NXP Semiconductors
Revision History
5.6
•
•
5.7
Electrical PCB testing
All PCBs must be 100% tested for opens and shorts.
Impedance measurement: An impedance measurement report is not mandatory.
Packaging
Packaging for the PCBs must meet the following requirements:
• Finished PCBs must remain in panel.
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
5.8
Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28684.pdf file.
5.9
File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-28684.pdf—FRDM-KW24D512 platform fabrication drawing
• GRB-28684.zip—FRDM-KW24D512 Metal layers, solder mask, solder paste and silk screen
• SPF-28684.pdf—FRDM-KW24D512 Schematic
You can download those files from the Design Files package on the web page: FRDM-KW24D512: NXP
Freedom Development Platform for Kinetis KW2x MCUs.
Design files are in Allegro format with OrCAD® schematic capture.
6
Revision History
Revision number
Date
Substantive changes
0
05/2016
Initial release
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
NXP Semiconductors
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Document Number: FRDMKW24DUG
Rev. 1
05/2016