USBKW40ZUG

Freescale Semiconductor, Inc.
User’s Guide
Document Number: USBKW40ZUG
Rev. 0, 10/2015
Freescale USB Development Board
USB-KW40Z User's Guide
1
About this guide
This manual describes the Freescale USB-KW40Z
development platform. The USB-KW40Z board is a small,
cost-effective evaluation and development board for
application prototypes and demonstration of the
MKW40Z160 SoC family of devices. This evaluation board
offers an easy-to-use mass-storage device mode flash
programmer, a virtual serial port, classic programming, and
run-control capabilities.
The MKW40Z160 SoC is an ultra low-power, highly
integrated single-chip device that enables Bluetooth Low
Energy (BLE) and/or IEEE® Std. 802.15.4/RF connectivity
for portable, extremely low-power embedded systems. The
MKW40Z160 SoC family integrates a radio transceiver
operating in the 2.36 GHz to 2.48 GHz range supporting a
range of FSK/GFSK and O-QPSK modulations, and ARM®
Cortex®- M0+ MCU, 160 KB flash memory and 20 KB
SRAM, BLE Link Layer hardware, 802.15.4 packet
processor hardware, and peripherals optimized to meet the
requirements of the target applications.
1.1
Audience
This manual is intended for system designers.
© 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1. About this guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2.Regulatory approval for Canada (IC RSS 210) . . . 3
2.3.Electrostatic discharge considerations . . . . . . . . . . 3
2.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3
3. USB-KW40Z overview and description . . . . . . . . . . 4
3.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.Serial and debug adapter . . . . . . . . . . . . . . . . . . . . 6
4. USB-KW40Z development board . . . . . . . . . . . . . . . 7
4.1.USB-KW40Z board overview . . . . . . . . . . . . . . . . 7
4.2.Functional description . . . . . . . . . . . . . . . . . . . . . . 9
4.3.Schematic, board layout, and bill of material . . . 16
5. PCB manufacturing specifications . . . . . . . . . . . . . . 21
5.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 21
5.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 23
5.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.8.Hole specification/tool table . . . . . . . . . . . . . . . . 23
5.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Safety information
2
2.1
Safety information
FCC guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1
Labeling
FCC labels are physically located on the back of the board.
2.1.2
Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
2.1.3
Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20 cm) from all persons.
2.1.4
Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE Std. 802.15.4. This requirement does not apply to intentional radiators that must be
professionally installed, such as perimeter protection systems and some field disturbance sensors, or to
other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation
site. However, the installer is responsible for ensuring that the proper antenna is employed so that the limits
in this Part are not exceeded.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
2
Freescale Semiconductor, Inc.
Safety information
2.2
Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
1. This board may not cause interference, and
2. This board must accept any interference, including interference that may cause undesired operation
of the device.
2.2.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3
Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors, and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
2.4
Disposal instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
freescale.com/productdisposal.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
3
USB-KW40Z overview and description
3
3.1
USB-KW40Z overview and description
Introduction
The USB-KW40Z development platform is an evaluation environment based on the Freescale
MKW40Z160 SoC device. The MKW40Z160 SoC integrates a radio transceiver operating in the 2.36 GHz
to 2.48 GHz range, supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+
MCU into a single package.
Freescale supplements the MKW40Z160 SOC with tools and software that include hardware evaluation
and development boards, software development IDE, applications, drivers, custom PHY usable with IEEE
Std. 802.15.4 compatible MAC, BLE Link Layer, and enables the Bluetooth Low Energy protocol to be
used in the MBAN frequency range for proprietary applications.
3.2
3.2.1
Board features
USB-KW40Z board
The USB-KW40Z development board contains the MKW40Z160 device it is one of the simplest reference
design utilizing the on chip USB block for power and communication. The USB-KW40Z is a small form
factor self-contained board for evaluation of wireless application and can be used as a packet sniffer. The
USB type-A connection is used with USB enabled hardware such as a computer.
Figure 1 shows the USB-KW40Z development platform.
Figure 1. USB-KW40Z development board
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
4
Freescale Semiconductor, Inc.
USB-KW40Z overview and description
The USB-KW40Z development board includes the following features:
• Based on the Freescale ultra low-power MKW40Z160 SoC BLE device
• Fully compliant IEEE Std. 802.15.4, 2006, transceiver supporting 250 kbit/s O-QPSK data in
5.0 MHz channels and full spread-spectrum encode and decode
• Fully compliant Bluetooth v4.1 Low Energy (BLE)
• Full IEEE 802.15.4 compliant wireless node with KSDK enable software
• Reference design area with small footprint, low-cost RF node
— Differential input/output port used with external balun for single port operation
— Low external component count
— Programmable output power from –20 dBm to +5 dBm at the MMCX connector, no harmonic
trap using bypass mode of operation
— Receiver sensitivity: –102 dBm, typical (@1% PER for 20 byte payload packet), for 802.15.4
at the MMCX connector
— Receiver sensitivity: -91 dBm for BLE applications at the MMCX connector
• Integrated PCB inverted meander type antenna and MMCX (Micro-Miniature Coaxial) RF port
• Bypass operation mode
• 32 MHz reference oscillator
• 32 kHz reference oscillator
• 2.4 GHz frequency operation (ISM and MBAN)
• Reset switch drive to MKW40Z160.
• Reset switch drive to debug interface (OpenSDA)
• Cortex 10-pin (0.05 inch) SWD debug port for target MCU
• Cortex 10-pin (0.05 inch) JTAG port for OpenSDA updates
• Integrated open-standard serial and debug interface (OpenSDA)
• 2 Blue LED indicators primary drive thought MKW40Z160 MCU, also connected to MK22FN512
• 1 Push button switch drive to MKW40Z160 MCU, also connected to MK22FN512
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
5
USB-KW40Z overview and description
Figure 2 shows the main board features and I/O headers for the Freescale USB-KW40Z board.
Figure 2. USB-KW40Z component placement
3.3
Serial and debug adapter
The USB-KW40Z development board can be enabled with OpenSDA v2.1, a serial and debug adapter
circuit that includes an open-source hardware design, an open-source bootloader, and debug interface
software. It bridges serial and debug communications between a USB host and an embedded target
processor. The hardware circuit is based on a Freescale Kinetis K22F family microcontroller (MCU).
OpenSDAv2.1 enables the CMSIS-DAP bootloader, an open-source mass storage device (MSD)
bootloader, and the CMSIS-DAP Interface firmware (also known as the mbed interface), that provides a
MSD flash programming interface, a virtual serial port interface, and a CMSIS-DAP debug protocol
interface. For more information on the OpenSDAv2.1 software, see mbed.org and
https://github.com/mbedmicro/CMSIS-DAP.
NOTE
Driver considerations, you must install a windows driver that can be
downloaded from the following link:
https://developer.mbed.org/handbook/Windows-serial-configuration
USB-KW40Z comes pre-programed with a sniffer application. In order to enable this board with
OpenSDA feature and as a development board, refer to the following:
freescale.com/USB-KW40Z/startnow
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
6
Freescale Semiconductor, Inc.
USB-KW40Z development board
4
4.1
USB-KW40Z development board
USB-KW40Z board overview
The USB-KW40Z board is an evaluation board based on the Freescale MKW40Z160 SoC. The
USB-KW40Z provides a platform to evaluate the MKW40Z160 SoC device and to develop software and
applications. The core device is accompanied by a the 32 MHz reference oscillator crystal, RF circuitry
including antenna, and supporting circuitry.
The USB-KW40Z board is intended as the core PCB for MKW40Z160 device evaluation and application
development, and can be used as a simple standalone valuation solution or as packet sniffer.
4.1.1
PCB features
The USB-KW40Z board provides the following features:
• USB small form factor
• 4-Layer metal, 0.062 inch thick FR4 board
• LGA footprint and power supply bypass mode
• Printed Meander Antenna and footprint for installing a (user supplied) MMCX connector
• 32 MHz reference oscillator crystal
• 32 kHz crystal provided for optional timing oscillator
• Secondary (MK22FN512) device to use as voltage regulator and MCU processor for BLE sniffer.
4.1.2
Form factor
Figure 3 shows the USB-KW40Z development board layout and footprint.
Figure 3. USB-KW40Z top side (component side) footprint
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
7
USB-KW40Z development board
Figure 4 shows a footprint of the USB-KW40Z with the location of the headers.
Figure 4. USB-KW40Z I/O headers location
4.1.3
Board level specifications
Table 1. USB-KW40Z specifications
Parameter
Min
Typ
Max
Units
Notes/Conditions
Size (PCB: X, Y)
—
—
18.5 x 61.4
0.73 x 2.42
mm
inches
Layer build (PCB)
—
1.57
0.062
—
Dielectric material (PCB)
—
—
—
—
FR4
—
—
—
mA
Varies with operational mode, Refer to
datasheet.
Operating temperature (see note)
-40
+25
+70
°C
Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Storage temperature
-30
+25
+70
°C
802.15.4 Frequency range
2405
—
2480
MHz
All 16 channels in the 2450 MHz band
BLE Frequency range
2400
—
2483
MHz
All 40 channels in the 2450 MHz band
ISM and MBAN Frequency range
2360
—
2483
MHz
Saturation (maximum input level)
—
+0
—
dBm
Refer to datasheet
Sensitivity for 1% packet error rate
(PER) (+25 °C) 802.15.4
—
-102
—
dBm
Refer to datasheet
General
mm 4-Layer
inches
Power
Current consumption
Temperature
RF
RF Receiver
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
8
Freescale Semiconductor, Inc.
USB-KW40Z development board
Table 1. USB-KW40Z specifications (continued)
Parameter
Min
Typ
Max
Units
—
-94
—
dB
RF Power Output
-20
—
+5
dBm Programmable in steps.
At the MMCX connector with no trap. 1
2nd harmonic
—
≤50
≤40
dBm —
3rd harmonic
—
≤50
≤40
dBm —
FCC
—
—
—
—
Product is approved according to the FCC
part 15 standard
CE (ETSI)
—
—
—
—
Product is approved according to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC)
—
—
—
—
Product is approved according to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
—
—
—
—
Product is approved according to the IEC
60950-1 and EN 60950-1, First Edition
standards
RoHS
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
Sensitivity for 1% packet error rate
(PER) (+25 °C) BLE
Notes/Conditions
Refer to datasheet
RF Transmitter
Regulatory Approval
Safety
UL
Environment
1]
Trap will add 1 to 2 dB of loss.
4.2
Functional description
The USB-KW40Z is built around the Freescale MKW40Z160 SoC in a 48-pin LGA package. The
USB-KW40Z features a IEEE Std. 802.15.4 and BLE 2.4 GHz radio frequency transceiver and a Kinetis
family ultra low-power, mixed-signal ARM Cortex-M0+ microcontroller in a single package. This board
is intended as a simple evaluation platform and as a building block for application development. The
four-layer board provides the MKW40Z160 with its required RF circuitry and a 32 MHz reference
oscillator crystal. The layout for this base level functionality can be used as a reference layout for your
target board. Figure 5 shows a simple block diagram.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
9
USB-KW40Z development board
Figure 5. USB-KW40Z block diagram
4.2.1
RF performance and considerations
The USB-KW40Z board’s integrated transceiver includes a 1 mW nominal output power PA with internal
voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation,
and full spread-spectrum encoding and decoding. Key specifications for the MKW40Z160 SoC are:
• Nominal output power is set to 0 dBm
• Programmable output power from -20 dBm to +5 dBm at the MMCX, no harmonic trap
• Typical sensitivity is -102 dBm (@1% PER for 25 °C) at the MMCX (802.15.4)
• Typical sensitivity is -91 dBm (@1% PER for 25 °C) at the MMCX (BLE)
• Frequency range is 2360 to 2480 MHz
• Differential bidirectional RF I/O port with integrated transmit/receive switch
• Meander printed metal antenna for a small footprint, low cost design
• Uses a minimum number of RF marching components and external 50:100 balun
An external 50 (bal): 100 (unbal) balun connects a single-ended 50 ohm port to the differential RF port of
the MKW40Z160 SoC’s transceiver. The layout has provision for out-of-band signal suppression
(components L3 and C20) if required. Figure 6 shows the typical topology for the RF circuitry. The RF
connector J4 has been included in the design for measurement purposes and is used as a DNP.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
10
Freescale Semiconductor, Inc.
USB-KW40Z development board
Figure 6. USB-KW40Z RF circuitry
4.2.2
Clocks
The USB-KW40Z provides two clock sources to the MKW40Z160:
• 32 MHz Reference Oscillator - Figure 7 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE
Std. 802.15.4 requires that the frequency be accurate to less than ±40 ppm.
— Capacitors C4 and C5 provide the bulk of the crystal load capacitance. At 25 °C, it is desired
to have the frequency accurate to ±10 ppm or less to allow for temperature variation.
• Optional 32.768 kHz Crystal Oscillator: Provision is also made for a secondary 32.768 kHz crystal
Y2 (see Figure 8). This oscillator can be used for a low power accurate time base.
— The module comes provided with this Y2 crystal and its load capacitors C6 and C7.
— Load capacitors C6 and C7 provide the entire crystal load capacitance; there is no onboard trim
capacitance.
Figure 7. USB-KW40Z board’s 32 MHz reference oscillator circuit
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
11
USB-KW40Z development board
Figure 8. USB-KW40Z board’s optional 32.768 kHz oscillator circuit
4.2.3
Power management
There is one way to power on the USB-KW40Z board, a J5 type-A connector to supply 5 V(V_USB)
directly to the secondary MCU, that includes an internal regulator, 3.3 V output to enable theMKW40Z160
device. The USB-KW40Z power management circuit is shown in Figure 9.
Figure 9. USB-KW40Z power management circuit
Additionally, a green LED marked as D1 is available as a power indicator. For current measurements, users
can isolate the MKW40Z160 device, through SH13 cut-trace, this will disable the VCC path (including
LED).
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
12
Freescale Semiconductor, Inc.
USB-KW40Z development board
4.2.4
USB-KW40Z peripheral functions
The board includes two different MCUs, one dedicated to RF (MKW40Z160) acquisition and the second
features an OpenSDA debugger and processor for BLE sniffer application (MK22FN512).
4.2.4.1
MKW40Z160 peripheral functions
The USB-KW40Z development board includes two push buttons: one for a general purpose peripheral
function to assist in implementing targeted applications and the other dedicated to MKW40Z160 hardware
reset.
The board also include three LEDs, two for general purposes and the other as a Power-On indicator.
Figure 10 shows the push buttons and LEDs for MKW40Z160.
The application LEDs (D2 and D3) are connected not only with MKW40Z, they also share this connection
with the MK22FN512 MCU. You can isolate LEDs to remove or cut the trace over SH5 and SH6.
Figure 10. USB-KW40Z MKW40Z160 push button & LED
4.2.4.2
•
MK22FN512/Open SDA Interface
The USB-KW40Z includes an OpenSDA circuitry based on the MK22FN512, that includes all the
necessary components to enable communication and debugging, it also provides power output to
all MKW40Z160 peripherals. Figure 11 shows the OpenSDA circuitry based on the MK22FN512
MCU, and all the necessary connections to interface with MKW40Z160.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
13
USB-KW40Z development board
Figure 11. USB-KW40Z OpenSDA circuitry
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
14
Freescale Semiconductor, Inc.
USB-KW40Z development board
4.2.4.2.1
OpenSDA interface clock
The USB-KW40Z provides one clock source for the OpenSDA MK22FN512 MCU.
• 8 MHz Reference Oscillator - Figure 12 shows the external 8 MHz external crystal X1. This
mounted crystal must meet MK22FN512 specifications. It also provides C44 and C45 to the bulk
of the crystal load capacitance.
Figure 12. USB-KW40Z MK22FN512 8 MHz clock source
4.2.4.2.2
MK22FN512 peripheral functions
The USB-KW40Z OpenSDA interface circuit also includes one switch button, to assist in MK22FN512
MCU hardware reset. Figure 13 shows the push button for MK22FN512
Figure 13. USB-KW40Z MK22FN512 push button & LED
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
15
A
B
C
C4
11pF
2
1
SH12
32MHZ
Y1
5
3
4
0
0
9
11
12
C5
11pF
VDCDC_IN
DCDC_CFG
DCDC_LP
DCDC_LN
XTAL_32M
EXTAL_32M
C6
12PF
Y2
2
32.768KHZ
1
C7
12PF
EXTAL_32K
32kHz XTAL
XTAL_32K
PTB0/I2C0_SCL/CMP0_OUT/TPM0_CH1/CLKOUT
PTB1/ADC0_SE1/CMP0_IN5/I2C0_SDA/LPTMR0_ALT1/TPM0_CH2/CMT_IRO
PTB2/ADC0_SE3/CMP0_IN3/TPM1_CH0
PTB3/ADC0_SE2/CMP0_IN4/CLKOUT/TPM1_CH1/RTC_CLKOUT/ERCLK32K
PTB16/EXTAL32K/I2C1_SCL/TPM2_CH0
PTB17/XTAL32K/I2C1_SDA/TPM2_CH1
PTB18/DAC0_OUT/ADC0_SE4/CMP0_IN2/I2C1_SCL/TPM_CLKIN0/TPM0_CH0/NMI
PTA0/SWD_DIO/TSI0_CH8/SPI0_PCS1/TPM1_CH0
PTA1/SWD_CLK/TSI0_CH9/TPM1_CH1
PTA2/RESET/TMP0_CH3
PTA16/TSI0_CH10/SPI1_SOUT/TPM0_CH0
PTA17/TSI0_CH11/SPI1_SIN/TPM_CLKIN1
PTA18/TSI0_CH12/SPI1_SCK/TPM2_CH0
PTA19/TSI0_CH13/SPI1_PCS0/TPM2_CH1
PSWITCH
XTAL_32M
0
30
29
16
17
18
19
21
22
23
1
2
3
4
5
6
7
8
U1
0
P3V3_KW40
4
0.1UF
C27
0.1UF
C28
C23
12PF
C24
12PF
C25
12PF
VDD_RF1, VDD_RF2 and VDD_XTAL
Place caps close to DUT
RST_TGTMCU_B
C8
1000pF
R11
10.0K
DNP
P3V3_KW40
SW2
2
RESET
TL1015AF160QG
1
34
33
24
25
36
37
38
39
40
41
42
43
45
46
47
48
C29
0.1UF
RF_P
RF_N
3
POWER ON
R14
330
TP15
D1
GREEN
P3V3_KW40
PTB2_KW40
TP4
BSM_FRAME
BSM_DATA
BSM_SCK
{3}
{3}
{3}
{3}
2
I2C1_SCL
I2C1_SDA
SWITCH
TL1015AF160QG
1
SW1
0
R2
0
R3
R5
10.0K
P3V3_K22F
P3V3_K22F
R4
10.0K
UART_RTS
UART_CTS
UART_RXD
UART_TXD
PTC0_KW40
PTC1_KW40
100 Ohm controlled
impedance from DUT
to balun.
K22_SS
K22_SIN
K22_SCK
UART0_CTS
UART0_RTS
UART0_RX
UART0_TX
MKW40 48-pin MCU
MKW40Z160VHT4
RF_P
RF_N
ADC0_DP0/CMP0_IN0
ADC0_DM0/CMP0_IN1
PTC0/ANT_A/I2C0_SCL/UART0_CTS/TPM0_CH1
PTC1/ANT_B/I2C0_SDA/UART0_RTS/TPM0_CH2/BLE_ACTIVE
PTC2/TSI0_CH14/TX_SWITCH/I2C1_SCL/UART0_RX/CMT_IRO/DTM_RX
PTC3/TSI0_CH15/RX_SWITCH/I2C1_SDA/UART0_TX/DTM_TX
PTC4/TSI0_CH0/EXTRG_IN/UART0_CTS/TPM1_CH0
PTC5/TSI0_CH1/LPTMR0_ALT2/UART0_RTS/TPM1_CH1
PTC6/TSI0_CH2/I2C1_SCL/UART0_RX/TPM2_CH0
PTC7/TSI0_CH3/SPI0_PCS2/I2C1_SDA/UART0_TX/TPM2_CH1
PTC16/TSI0_CH4/SPI0_SCK/I2C0_SDA/UART0_RTS/TPM0_CH3
PTC17/TSI0_CH5/SPI0_SOUT/UART0_RX/DTM_RX
PTC18/TSI0_CH6/SPI0_SIN/UART0_TX/DTM_TX
PTC19/TSI0_CH7/SPI0_PCS0/I2C0_SCL/UART0_CTS/BLE_ACTIVE
P3V3_KW40
0.1UF
C26
P3V3_KW40
C17
0.6PF
4
2
2
PTC0_KW40
330
R9
D2
RED
TP7
330
R10
D3
RED
P3V3_KW40
6
TP8
LEDS
PTC1_KW40
Z1
5
1
2400MHz 50OHM
3
P3V3_KW40
Z_RF_N
BAL_C
Z_RF_P
2
L3
2.2nH
DNP
1
IN
J4
DNP
PROBE
2
OUT
MM8030-2600B
10PF
C19
1
3
5
7
9
HDR 2X5
J1
2
4
6
8
10
R6
10.0K
P3V3_KW40
FCP: ___
FIUO: X
Wednesday, May 13, 2015
1
Document Number
SCH-xxxxx PDF: SPF-xxxxx
Date:
Sheet
MAIN SCHEMATIC
X-USB-KW40Z
3
of
PUBI: ___
pg(3)
pg(3)
pg(3,4)
4
RF
RST_TGTMCU_b
Size
C
Page Title:
ICAP Classification:
Drawing Title:
ANT1
Rev
X1
MEANDER_ANT_HORZ
2
1
TP16
DNP
TP14
KW40_SWD_DIO
KW40_SWD_CLK
SWD CONNECTOR KW40
P3V3_KW40
RF_ANT
IN CIRCUIT
TEST GND
PROBING
GND
MH4
MH_80mil
MH3
MH_80mil
MH2
MH_80mil
1
50 ohm controlled
impedence line from
Balun to SMA and F_Antenna
HARMONIC TRAP
DNP
1.8pF
C20
RF_50
CAD NOTE:
Embed pads into
50 Ohm line.
MH1
MH_80mil
TP1
TP2
TP3
CAD NOTE: XTAL close to KW40
32MHz XTAL
EXTAL_32M
SH10
SH11
P3V3_KW40
XTAL_32M
EXTAL_32M
EXTAL_32K
XTAL_32K
PTB0_KW40
PTB1_KW40
PTB2_KW40
{3} KW40_SWD_DIO
{3} KW40_SWD_CLK
{3,4} RST_TGTMCU_b
SPI_SOUT
SPI_SIN
SPI_CLK
SPI_SS
Place both
resistors
with the same orientation
and provide same airgap
between MISO to MOSI resistors
terminals in a square fashion.
CAD NOTE:
MISO/MOSI POKA-YOKE:
SH14
P3V3_KW40
31
VDD_XTAL
10
VDCDC_IN
20
VDD_0
28
VDDA
27
VREFH
44
VDD_1/VDD
35
VDD_RF1
14
VDD_1P8
15
VDD_1P45
32
VDD_RF2
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
VSSA
26
D
A
C
DCDC_GND
13
3
A
C
3
4
A
C
1
2
1
1
1
1
1
1
1
16
1
A
B
C
D
4.3
4
5
USB-KW40Z development board
Schematic, board layout, and bill of material
Figure 14. USB-KW40Z schematic rev. X1
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc.
A
B
C
D
2
L5
330 OHM
S2
POWER
ENABLE
KW40
D+
D-
PTB0_KW40
PTB1_KW40
PTB2_KW40
USB_DN
USB_DP
R7
C37
2.2UF
R8
2 1
33
0
DNP
R19
33
SH1
SH2
SH3
TP9
USBDM
USBDP
MINISMDC050F-2
RT1
R22
27K
R12
0
DNP
r_SWD_DIO_TGTMCU
P3V3_K22F
SDA_SWD_EN
SDA_I2S_SCK
TC_74125_SPARE_I_TP
R23
SDA_SWD_OE_B
SDA_I2S_SOUT
1.0K
SDA_SWD_EN
P3V3_K22F
{3} RST_TGTMCU_b
1
2
4
5
10
9
13
12
V_USB
1OE
1A
2OE
2A
3OE
3A
4Y
GND
1Y
2Y
3Y
4
P3V3_K22F
TC_74125_SPARE_O_TP
r_SWD_DIO_TGTMCU
3
SWD_CLK_TGTMCU
RESET
ADC0_DP0/ADC1_DP3
ADC0_DM0/ADC1_DM3
ADC1_DP0/ADC0_DP3
ADC1_DM0/ADC0_DM3
VREGIN
VOUT33
USB0_DP
USB0_DM
R25
27K
DNP
R24
1.0K
SDA_I2S_SIN
KW40_SWD_CLK
pg(3)
PTB0/LLWU_P5/ADC0_SE8/ADC1_SE8/I2C0_SCL/FTM1_CH0/FTM1_QD_PHA
PTB1/ADC0_SE9/ADC1_SE9/I2C0_SDA/FTM1_CH1/FTM1_QD_PHB
PTB2/ADC0_SE12/I2C0_SCL/UART0_RTS/FTM0_FLT3
PTB3/ADC0_SE13/I2C0_SDA/UART0_CTS/FTM0_FLT0
PTB16/SPI1_SOUT/UART0_RX/FTM_CLKIN0/FB_AD17/EWM_IN
PTB17/SPI1_SIN/UART0_TX/FTM_CLKIN1/FB_AD16/EWM_OUT
PTB18/FTM2_CH0/I2S0_TX_BCLK/FB_AD15/FTM2_QD_PHA
PTB19/FTM2_CH1/I2S0_TX_FS/FB_OE/FTM2_QD_PHB
PTA0/JTAG_TCLK/SWD_CLK/EZP_CLK/UART0_CTS/FTM0_CH5
PTA1/JTAG_TDI/EZP_DI/UART0_RX/FTM0_CH6
PTA2/JTAG_TDO/TRACE_SWO/EZP_DO/UART0_TX/FTM0_CH7
PTA3/JTAG_TMS/SWD_DIO/UART0_RTS/FTM0_CH0
PTA4/LLWU_P3/NMI/EZP_CS/FTM0_CH1
PTA5/USB_CLKIN/FTM0_CH2/I2S0_TX_BCLK/JTAG_TRST
PTA12/FTM1_CH0/I2S0_TXD0/FTM1_QD_PHA
PTA13/LLWU_P4/FTM1_CH1/I2S0_TX_FS/FTM1_QD_PHB
PTA18/EXTAL0/FTM0_FLT2/FTM_CLKIN0
PTA19/XTAL0/FTM1_FLT0/FTM_CLKIN1/LPTMR0_ALT1
EXTAL32
XTAL32
U5
6
8
11
F8
G1
F1
G2
F2
D2
E2
E1
D1
74LVC125
P3V3_K22F
RST_K22F
4OE
4A
U8
C16
0.1UF
USBDP
USBDM
SDA_I2S_SCK
SDA_SWD_OE_B
EXTAL0
XTAL0
SDA_I2S_SOUT
F7
F6
E7
E8
E6
D7
D6
C7
H4
H3
PTB0_K22
0
0
PTB1_K22
PTA12_K22
0
RST_TGTMCU_b_K22F
TP6
V_USB
D3
D4
E5
D5
G5
F5
H6
G6
H8
G8
2
JTAG_TCLK_K22F
JTAG_TDI_K22F
JTAG_TDO_K22F
JTAG_TMS_K22F
SDA_SWD_EN
TP10
330 OHM
L4
CAD NOTE: These capacitors must be placed
as close to MCU as possible
0.1UF
C36
P3V3_K22F
0
Switch
GPIOs
A1
A2
A3
A4
S1
1
C33
0.1UF
C32
0.1UF
C31
0.1UF
C34
0.01UF
2
3
1
3
5
7
9
HDR 2X5
J6
2
4
6
8
10
R20
10.0K
P3V3_K22F
JTAG_TMS/SWD_DIO
JTAG_TCLK/SWD_CLK/EZP_CLK
JTAG_TDO/TRACE_SWO/EZP_DO
JTAG_TDI/EZP_DI
PIN FUNCTIONS USED
C35
1000pF
R13
10.0K
DNP
1
SW3
2
JTAG_TMS_K22F
JTAG_TCLK_K22F
JTAG_TDO_K22F
JTAG_TDI_K22F
RST_K22F
NET NAMES
RESET
TL1015AF160QG
2
JTAG/SWD CONNECTOR K22FN512VMP12
P3V3_K22F
RST_K22F
P3V3_K22F
H1
H2
A1
B1
C3
A4
C2
B3
A3
C1
B2
A2
D8
C6
B7
C8
B8
A8
A7
B6
A6
B5
B4
A5
MK22FN512VMP12
VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18
DAC0_OUT/CMP1_IN3/ADC0_SE23
PTE0/CLKOUT32K/ADC1_SE4a/SPI1_PCS1/UART1_TX/I2C1_SDA/RTC_CLKOUT
PTE1/LLWU_P0/ADC1_SE5a/SPI1_SOUT/UART1_RX/I2C1_SCL/SPI1_SIN
PTD0/LLWU_P12/SPI0_PCS0/UART2_RTS/FTM3_CH0/FB_ALE/FB_CS1/FB_TS/LPUART0_RTS
PTD1/ADC0_SE5b/SPI0_SCK/UART2_CTS/FTM3_CH1/FB_CS0/LPUART0_CTS
PTD2/LLWU_P13/SPI0_SOUT/UART2_RX/FTM3_CH2/FB_AD4/LPUART0_RX/I2C0_SCL
PTD3/SPI0_SIN/UART2_TX/FTM3_CH3/FB_AD3/LPUART0_TX/I2C0_SDA
PTD4/LLWU_P14/SPI0_PCS1/UART0_RTS/FTM0_CH4/FB_AD2/EWM_IN/SPI1_PCS0
PTD5/ADC0_SE6b/SPI0_PCS2/UART0_CTS/FTM0_CH5/FB_AD1/EWM_OUT/SPI1_SCK
PTD6/LLWU_P15/ADC0_SE7b/SPI0_PCS3/UART0_RX/FTM0_CH6/FB_AD0/FTM0_FLT0/SPI1_SOUT
PTD7/UART0_TX/FTM0_CH7/FTM0_FLT1/SPI1_SIN
PTC0/ADC0_SE14/SPI0_PCS4/PDB0_EXTRG/USB_SOF_OUT/FB_AD14
PTC1/LLWU_P6/ADC0_SE15/SPI0_PCS3/UART1_RTS/FTM0_CH0/FB_AD13/I2S0_TXD0/LPUART0_RTS
PTC2/ADC0_SE4b/CMP1_IN0/SPI0_PCS2/UART1_CTS/FTM0_CH1/FB_AD12/I2S0_TX_FS/LPUART0_CTS
PTC3/LLWU_P7/CMP1_IN1/SPI0_PCS1/UART1_RX/FTM0_CH2/CLKOUT/I2S0_TX_BCLK/LPUART0_RX
PTC4/LLWU_P8/SPI0_PCS0/UART1_TX/FTM0_CH3/FB_AD11/CMP1_OUT/LPUART0_TX
PTC5/LLWU_P9/SPI0_SCK/LPTMR0_ALT2/I2S0_RXD0/FB_AD10/CMP0_OUT/FTM0_CH2
PTC6/LLWU_P10/CMP0_IN0/SPI0_SOUT/PDB0_EXTRG/I2S0_RX_BCLK/FB_AD9/I2S0_MCLK
PTC7/CMP0_IN1/SPI0_SIN/USB_SOF_OUT/I2S0_RX_FS/FB_AD8
PTC8/ADC1_SE4b/CMP0_IN2/FTM3_CH4/I2S0_MCLK/FB_AD7
PTC9/ADC1_SE5b/CMP0_IN3/FTM3_CH5/I2S0_RX_BCLK/FB_AD6/FTM2_FLT0
PTC10/ADC1_SE6b/I2C1_SCL/FTM3_CH6/I2S0_RX_FS/FB_AD5
PTC11/LLWU_P11/ADC1_SE7b/I2C1_SDA/FTM3_CH7/FB_RW
0.1UF
C30
P3V3_K22F
TP18
TP19
TP17
TP20
TP21
5
OpenSDA
0
V
R21
10.0K
P3V3_K22F
pg(3) KW40_SWD_DIO
SH4
USB_TYPE_A
G
SH13
C21
0.1UF
P3V3_KW40
{3} RST_TGTMCU_b
1
V_USB_CONN
H5
J5
PORT C
3
PORT D
USB
4
F3
VSS1
VSS2
VSS3
C4
H7
E3
PORT E
VSSA
VBAT
C5
G7
E4
VDD1
VDD2
VDD3
F4
VDDA
G4
VREFH
VREFL
G3
K40_USB_SHLD
VCC
14
GND
7
EP
15
0
0
SH5
SH6
SH7
SH8
SH9
K22_SIN
C44
C45
18PF
U6
NC
A
GND
X1
8.00MHZ
NC7SZ14M5X
Y
1
2
3
FIUO: X
Wednesday, May 13, 2015
Date:
1
Document Number
SCH-xxxxx PDF: SPF-xxxxx
Sheet
USB INTERFACE
X-USB-KW40Z
FCP: ___
EXTAL0
XTAL0
4
of
PUBI: ___
BSM_FRAME
UART1_TGTMCU
Size
C
Page Title:
BSM
8MHz XTAL
ICAP Classification:
Drawing Title:
DNP
2
DNP
18PF
4
5
LEDs
{3}
{3}
{3}
{3}
SPI1_TGTMCU
VCC
PTC0_KW40
PTC1_KW40
BSM_DATA
1
TGTMCU
UART_RTS
UART_CTS
UART_TXD
UART_RXD
SPI_SS
SPI_CLK
SPI_SIN
SPI_SOUT
BSM_FRAME_b
BSM_SCK
P3V3_KW40
BSM_FRAME_b
0
0
0
I2C1_TGTMCU
1.0K
1.0K
1.0K
1.0K
R15
R16
R17
R18
I2C1_SCL
I2C1_SDA
K22_SS
K22_SCK
UART1_CTS_K22F
UART1_RTS_K22F
UART1_RX_K22F
UART1_TX_K22F
SDA_I2S_SIN
PTC6_K22
PTC7_K22
Place both
resistors
with the same orientation
and provide same airgap
between TX to RX resistors
terminals in a square fashion.
CAD NOTE:
TX/RX POKA-YOKE:
1
Freescale Semiconductor, Inc
PORT A
PORT B
3
5
4
Rev
X1
A
B
C
D
USB-KW40Z development board
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
17
USB-KW40Z development board
Figure 15. USB-KW40Z development board component location (top view)
Figure 16. USB-KW40Z development board test points
Figure 17. USB-KW40Z development board layout (top view)
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
18
Freescale Semiconductor, Inc.
USB-KW40Z development board
Figure 18. USB-KW40Z development board layout (bottom view)
4.3.1
Bill of materials
Table 2 details the common parts for all frequency bands.
Table 2. Bill of materials (common parts for all frequency bands) (Sheet 1 of 2)
Item
Qty
Reference
Value
Description
Mfg. Name
1
1
ANT1
MEANDER_ANT_
HORZ
PCB MEANDER ANTENNA
NO PART TO ORDER
HORIZONTAL, NO PART TO ORDER
NO PART TO ORDER
2
1
C17
0.6PF
CAP CER 0.6PF 50V +/-0.05PF C0G
0402
MURATA
GRM1555C1HR60WA01
D
3
1
C20 DNP
1.8PF
CAP CER 1.8PF 50V 0.25PF C0G
0402
MURATA
GRM1555C1H1R8CA01
D
4
1
C19
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
5
2
C4,C5
11PF
CAP CER 11PF 50V 1% C0G 0402
AVX
04025U110FAT2A
6
5
C6,C7,C23,C24,C25
12PF
CAP CER 12PF 50V 5% C0G 0402
MURATA
GRM1555C1H120JZ01D
7
2
C44,C45 DNP
18PF
CAP CER 18PF 50V 5% C0G 0402
KEMET
C0402C180J5GAC
8
2
C8,C35
1000PF
CAP CER 1000PF 50V 5% C0G 0402 MURATA
GRM1555C1H102JA01D
9
1
C34
0.01UF
CAP CER 0.01UF 16V 20% X7R 0402 AVX
0402YC103MAT2A
10
11
C16,C21,C26,C27,C28,
C29,C30,C31,C32,C33,
C36
0.1UF
CAP CER 0.1UF 10V 10% X5R 0402
C0402C104K8PAC
11
1
C37
2.2UF
CAP CER 2.2UF 6.3V 20% X5R 0402 KEMET
C0402C225M9PACTU
12
1
D1
GREEN
LED GRN SGL 30MA SMT 0805
LITE ON
LTST-C171KGKT
13
2
D2, D3
RED
LED RED CLEAR SGL 30MA SMT
0805
LITE ON
LTST-C171KRKT
14
2
J1,J6
HDR 2X5
HDR 2X5 TH 50MIL CTR 254H AU
91L
SAMTEC
FTSH-105-04-F-D
15
1
J4 DNP
MM8030-2600B
CON COAX SMT 1.9MM SP 40H AU
MURATA
MM8030-2610B
16
1
J5
USB_TYPE_A
CON 1X4 USB_TYPE_A_MALE RA
SMT -- 178H AU
SAMTEC
USB-AM-S-S-B-SM1
17
1
L3
2.2NH
IND -- 2.2NH@500MHZ 220MA 4%
0402
MURATA
LQP15MN2N2B02
18
2
L4,L5
330 OHM
IND FER BEAD 330OHM@100MHZ
2.5A -- SMT
TDK
MPZ2012S331A
KEMET
Mfg. Part Number
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
19
USB-KW40Z development board
Table 2. Bill of materials (common parts for all frequency bands) (Sheet 2 of 2)
Item
Qty
Reference
Value
Description
Mfg. Name
19
4
MH1,MH2,MH3,MH4
MH_80MIL
REWORK HOLE NON-PLATED
50MIL DRILL SIZE 65MIL
SOLDERMASK TH, NO PART TO
ORDER
20
2
R2,R3
0
RES MF ZERO OHM 1/16W 5% 0402 ROHM
MCR01MZPJ000
21
1
R12 DNP
0
RES MF ZERO OHM 1/16W 5% 0402 ROHM
MCR01MZPJ000
22
1
R19
0
RES TF ZERO OHM 1/16W
AEC-Q200 RC0402
VISHAY
INTERTECHNOLOGY
CRCW04020000ZS
23
2
R7,R8
33
RES MF 33 OHM 1/16W 5% 0402
SMEC
RC73L2Z330JTF
24
3
R9,R10,R14
330
RES MF 330 OHM 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW0402330RJNED
25
6
R15,R16,R17,R18,R23,
R25
1.0K
RES MF 1.0K 1/16W 1% 0402
YAGEO AMERICA
RC0402FR-071KL
26
5
R4,R5,R6,R20,R21
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
27
2
R11,R13 DNP
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
28
1
R22
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
29
1
R24 DNP
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
30
1
RT1
MINISMDC050F-2
FUSE PLYSW 0.5A 24V SMT
TYCO ELECTRONICS MINISMDC050F-2
31
14
SH1,SH2,SH3,SH4,
SH5,SH6,SH7,SH8,
SH9,SH10,SH11,SH12,
SH13,SH14
0
ZERO OHM CUT TRACE 0402 PADS;
NO PART TO ORDER
LAYOUT ELEMENT
ONLY
LAYOUT ELEMENT
ONLY
32
3
SW1,SW2,SW3
TL1015AF160QG
SW SPST PB 50MA 12V SMT
E SWITCH
TL1015AF160QG
33
14
TP1,TP2,TP3,TP6,TP7, TPAD_040
TP8,TP9,TP10,TP15,
TP17,TP18,TP19,TP20,
TP21
TEST POINT PAD 40MIL DIA SMT,
NO PART TO ORDER
NOTACOMPONENT
NOTACOMPONENT
34
2
TP4,TP14
TPAD_030
TEST POINT PAD 30MIL DIA SMT,
NO PART TO ORDER
NOTACOMPONENT
NOTACOMPONENT
35
1
TP16 DNP
TEST POINT
WHITE
TEST POINT WHITE 40 MIL DRILL
180 MIL TH 109L
COMPONENTS
CORPORATION
TP-105-01-09
36
1
U1
MKW40Z160VHT4
IC MCU XCVR 2.4GHZ BLUETOOTH
LOW ENERGY MAPLGA64
FREESCALE
SEMICONDUCTOR
MKW40Z160VHT4
37
1
U5
MK22FN512VMP1
2
IC MCU 32BIT 512KB FLASH 128KB FREESCALE
RAM 1.71-3.6V 120MHZ MAPBGA 64 SEMICONDUCTOR
MK22FN512VMP12
38
1
U6
NC7SZ14M5X
IC INV SGL 1.65-5.5V SOT23-5
FAIRCHILD
NC7SZ14M5X
39
1
U8
74LVC125
IC QUAD BUF LINE DRV TS 1.2-3.6V
DHVQFN14
NXP
SEMICONDUCTORS
74LVC125ABQ,115
40
1
X1
8.00MHZ
XTAL 8.00MHZ RSN CERAMIC -SMT
MURATA
CSTCE8M00G55-R0
41
1
Y1
32MHZ
XTAL 32MHZ 9PF -- SMT 3.2X2.5MM NDK
EXS00A-CS02368
42
1
Y2
32.768KHZ
XTAL 32.768KHZ SMT ROHS
COMPLIANT
FC-135 32.7680KA-A3
43
1
Z1
2400MHZ 50OHM
XFMR BALUN 2400 +/-100MHZ SMT MURATA
NO PART TO ORDER
EPSON
ELECTRONICS
Mfg. Part Number
NO PART TO ORDER
LDB212G4005C-001
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
20
Freescale Semiconductor, Inc.
PCB manufacturing specifications
•
•
•
•
5
NOTES
USB-KW40Z includes neither J4 (the MMCX connector) nor the
external antenna.
For external measurements and/or external antenna usage, J4 should be
installed and soldered in place.
A 50 ohm MMCX connector is required; recommended part number
MM8030-2600B from Murata.
When selecting an external antenna to connect to the MMCX connector,
choose an antenna designed for the desired frequency band. Operation
with an external antenna may require a separate certification of your
product.
PCB manufacturing specifications
This section provides the specifications used to manufacture the USB-KW40Z development printed circuit
board (PCB) described in this guide.
The USB-KW40Z development platform PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 ((http://ulstandards.ul.com/standard/?id=94)
— The UL information must be stamped on the back of the PCB solder mask
•
•
5.1
NOTE
A complete set of design files for the MKW40Z160 development boards
is available at the Freescale website (www.freescale.com/KW40Z)
under “Software and Tools.” These reference designs should be used as
a starting point for a custom application.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
Single PCB construction
This section describes individual PCB construction details.
• The USB-KW40Z PCBs are four-layer, multi-layer designs
• The PCBs contain no blind, buried, or micro vias
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
21
PCB manufacturing specifications
•
PCB data:
— USB-KW40Z size: Approximately 18.5x 61.4 mm (0.73 x 2.42 inches)
— USB-KW40Z final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder mask)
Table 3 defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
Table 3. USB-KW40Z layer by layer overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Ground Layer
L2_GND.art
4
Signal Layer
L3_INT_1.art
5
Bottom Layer Metal
L4_SS.art
6
Silkscreen Bottom
SSS.art
IMPORTANT: The USB-KW40Z development board contains high frequency 2.4 GHz RF circuitry. As
a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical
parameters. Therefore, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper
thicknesses and spacing must not be changed; follow the stackup information provided with the reference
design (see Figure 19) information provided with the reference design.
Figure 19. USB-KW40Z PCB stackup cross-section (four layer)
•
•
5.2
Solder mask is required
Silk screen is required
Panelization
The panel size can be negotiated depending on production volume.
5.3
Materials
The PCB composite materials must meet the following requirements:
• Laminate—the base material (laminate) must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade RF performance.
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
22
Freescale Semiconductor, Inc.
PCB manufacturing specifications
•
•
5.4
Copper foil
— Top and bottom copper layers must be 1 oz. copper
— Interior layers must be 1 oz. copper
Plating—All pad plating must be Hot Air Levelling (HAL)
Solder mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent
• Solder mask thickness: 10–30 µm
5.5
Silk screen
The silk screen must meet the following requirements:
• Silk screen color: White
• Silk screen must be applied after application of solder mask if solder mask is required
• The silk screen ink must not extend into any plated-thru-holes
• The silk screen must be clipped back to the line of resistance
5.6
•
•
5.7
Electrical PCB testing
All PCBs must be 100 percent tested for opens and shorts
Impedance measurement - An impedance measurement report is not mandatory
Packaging
Packaging for the PCBs must meet the following requirements:
• Finished PCBs must remain in panel
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability
5.8
Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28441.pdf file.
5.9
File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-28441.pdf—USB- Board fabrication drawing
• GRB-28441.zip—USB- Metal layers, solder mask, solder paste and silk screen
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
23
Revision history
•
SPF-28441.pdf—USB- Schematic
Design files are in Allegro format with OrCAD schematic capture.
6
Revision history
Rev.
number
Date
Substantive change(s)
0
10/2015
Initial release
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
24
Freescale Semiconductor, Inc.
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and software implementers
to use Freescale products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits based on the information in this
document.
Freescale reserves the right to make changes without further notice to any products herein.
Freescale makes no warranty, representation, or guarantee regarding the suitability of its
products for any particular purpose, nor does Freescale assume any liability arising out of
the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation consequential or incidental damages.
“Typical” parameters that may be provided in Freescale data sheets and/or specifications can
and do vary in different applications, and actual performance may vary over time. All
operating parameters, including “typicals,” must be validated for each customer application
by customer’s technical experts. Freescale does not convey any license under its patent rights
nor the rights of others. Freescale sells products pursuant to standard terms and conditions of
sale, which can be found at the following address: freescale.com/SalesTermsandConditions.
Freescale, the Freescale logo and Kinetis are trademarks of Freescale Seminconductor, Inc.
Reg. U.S. Pat. & Tm. Off All other products or service names are the property of their
respective owners. ARM, the ARM Powered logo, and Cortex are registered trademarks of
ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
IEEE 802.15.4 is the registered trademark of the Institute of Electrical and Electronic
Engineers. This product is not endorsed or approved by the IEEE.
© 2015 Freescale Semiconductor, Inc. All rights reserved.
Document Number: USBKW40ZUG Rev. 0
10/2015