Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27B 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) Rev 2, 10/10 0.20 (4X) 27.00 A1 BALL PAD CORNER A 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL B 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 4X 10.00 A B C D E F G H J K L M N P R T U V W Y 1.27 27.00 +0.35 24.00 -0.05 (1.44) 4X 45° CHAMFER TOP VIEW Ø16.8 AVAILABLE MARKING AREA (1.44) 1.27 3X R0.50 BOTTOM VIEW 0.35 C 0.25 C 0.15 C C 30° TYP +0.14 3. 0.76 -0.16 Ø0.30 M C A B Ø0.15 M C 1.27 1.27 4. SEATING PLANE NON SOLDERMASK DEFINED PADS. SOLDERMASK OPENING = 0.67MM (TYP x356) PAD DIAMATER = 0.55MM (TYP X356) 1.17±0.05 2.33 ±0.21 0.60±0.10 0.56 ±0.06 TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES: 1. All dimensions and tolerances conform to ASME Y14.5M-1994. 2. Dimensions are in millimeters. 3 . Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 1 4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. 5. A1 ball pad corner I.D. for plate mold: To be marked by ink. Auto mold: Dimple to be formed by mold cap. 6. Reference specifications: This drawing conforms to JEDEC registered outline MS-034/A variation BAL-2.