Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
V356.27x27C
356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA)
Rev 1, 6/10
0.20 (4X)
27.00
A1 BALL
PAD CORNER
24.00 +0.35
-0.05
4X 10.00
5.
A1 BALL PAD
INDICATOR, 1.0
DIA., OPTIONAL
A
B
4X 10.00
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1.27
27.00
+0.35
24.00 -0.05
(1.44)
4X 45°
CHAMFER
TOP VIEW
EXPOSED HEAT SPREADER
Ø16.8 AVAILABLE MARKING AREA
(1.44)
1.27
3X R0.50
BOTTOM VIEW
0.35 C
0.25 C
0.15 C
C
30° TYP
+0.14
3. 0.76 -0.16
Ø0.30 M C A B
Ø0.15 M C
1.27
1.27
4. SEATING PLANE
NON SOLDERMASK DEFINED PADS.
SOLDERMASK OPENING = 0.67MM (TYP x356)
PAD DIAMATER = 0.55MM (TYP X356)
1.17±0.05
2.33 ±0.21
0.60±0.10
0.56 ±0.06
TYPICAL RECOMMENDED LAND PATTERN
SIDE VIEW
NOTES:
1.
All dimensions and tolerances conform to ASME Y14.5m-1994.
2.
Dimensions are in millimeters.
3 . Dimension is measured at the maximum solder ball diameter,
parallel to primary datum C.
1
4.
Primary datum C and seating plane are defined by the spherical
crowns of the solder balls.
5.
A1 ball pad corner I.D. for plate mold: To be marked by ink.
Auto mold: Dimple to be formed by mold cap.
6.
Reference specifications: This drawing conforms to JEDEC
registered outline MS-034/A variation BAL-2.