Status of Document is: RELEASED Effective from: 2011-01-14 18:48:54 EST to Controlled Document Package Outline Drawing V144.7X7A 144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA) Rev 0, 1/11 TOP VIEW BOTTOM VIEW ∅0.05 ∅0.15 A1 CORNER M M C C AB A1 CORNER ∅0.27~0.37 1 2 3 4 5 6 7 8 9 10 11 12 A B C E D E1 E F G A e b M // 0.10 C D1 D B 0.10 C A SEATING PLANE S C A1 0.08 C Title: Specification Type: POD 144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA) Specification Number : V144.7X7A Issue : 0 Page : 1 of 2 These Drawings and Specifications are the Property of Intersil Corporation and shall not be used, reproduced or copied without Written Permission Status of Document is: RELEASED Effective from: 2011-01-14 18:48:54 EST to Controlled Document Millimeter Symbol Min. Nom. Max. A ‐‐‐ ‐‐‐ 1.20 A1 0.16 ‐‐‐ 0.26 M 0.53 Ref. S 0.26 Ref. b 0.27 e 0.30 0.37 0.50 Basic D 6.90 7.00 7.10 D1 ‐‐‐ 5.50 ‐‐‐ E 6.90 7.00 7.10 E1 ‐‐‐ 5.50 ‐‐‐ Note: 1. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. 2. Dimension b is measured at the maximum solder ball diameter, parallel to primary datum C. 3. Controlling dimension : Millimeter. Title: Specification Type: POD 144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA) Specification Number : V144.7X7A Issue : 0 Page : 2 of 2 These Drawings and Specifications are the Property of Intersil Corporation and shall not be used, reproduced or copied without Written Permission