Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
M10.118
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
5
3.0±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.18 - 0.27
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.50)
(0.29)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
1
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.