Plastic Packages for Integrated Circuits Package Outline Drawing M8.118B 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 1, 3/12 3.0±0.10mm 5 A D 8 4.9±0.20mm DETAIL "X" 3.0±0.10mm 5 1.10 MAX 0.15±0.05mm PIN# 1 ID SIDE VIEW 2 1 2 B 0.65mm BSC TOP VIEW 0.95 REF 0.86±0.05mm H GAUGE PLANE C 0.25 SEATING PLANE 0.23 - 0.36mm 0.08 M C A-B D 0.10 ± 0.05mm 3°±3° 0.10 C 0.53 ± 0.10mm SIDE VIEW 1 DETAIL "X" (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN 1 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only.