Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.3x4
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 3/15
3.00
B
6
PIN 1
INDEX AREA
1
12
4.00
(4X)
6
PIN #1
INDEX AREA
SEE DETAIL "X"
A
3.30 ±0.10
0.10
2X 2.50
6
7
12X 0.25 ±0.05
0.10 M C A B
TOP VIEW
0.90 MAX
4
C
SIDE VIEW
1.70
±0.10
10X 0.50
12X 0.40 ± 0.05
BOTTOM VIEW
(12X 0.60)
( 12 X 0.25)
( 3.30 )
( 2.50)
0.10 C
(10x 0.50)
C
0 . 203 REF
SEATING PLANE
(1.70)
0.08 C
0 . 00 MIN.
0 . 05 MAX.
( 2.80 )
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
Reference document JEDEC MO-229.