Plastic Packages for Integrated Circuits Package Outline Drawing L24.4x5 24 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 3/15 (0.711) 4.00 A 1.678 (0.461) B 6 PIN #1 INDEX AREA 1 20x 0.40 24 6 PIN 1 INDEX AREA 0.20 5.00 1.25 4.40 3.15 24x 0.20 (4X) 12 13 0.10 24x 0.45 2.60 TOP VIEW 0.10 C SEE DETAIL "X" PACKAGE OUTLINE (1.678) 0.65 C BASE PLANE SEATING PLANE 0.08 C BOTTOM VIEW 0.711 0.461 0.10 M C A B (20x 0.40) 0.20 (1.25) C 0.60 0 . 203 REF 5 0.20 (5.00) 0 . 00 MIN. 0 . 05 MAX. (4.40) DETAIL "X" 0.40 (3.15) 2.60 0.40 0.20 2.60 0.25 (24x 0.65) TYPICAL RECOMMENDED LAND PATTERN 0.70 0.90 0.035 0.203 SIDE VIEW NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. 1 Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. JEDEC reference drawing MO-229.