Plastic Packages for Integrated Circuits Package Outline Drawing L12.4x3 12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 3, 3/15 3.30 +0.10/-0.15 4.00 2X 2.50 A 6 PIN 1 INDEX AREA 10X 0.50 PIN #1 INDEX AREA B 6 1 12 X 0.40 ±0.10 6 1.70 +0.10/-0.15 3.00 (4X) 0.15 7 12 TOP VIEW 0.10M C A B 4 12 x 0.23 +0.07/-0.05 BOTTOM VIEW SEE DETAIL "X" (3.30) 6 0.10 C 1 C 1.00 MAX SEATING PLANE 0.08 C SIDE VIEW 2.80 (1.70) C 0.2 REF 5 12 X 0.60 7 12 0. 00 MIN. 0. 05 MAX. (12 X 0.23) (10X 0.5) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Compliant to JEDEC MO-229 V4030D-4 issue E. 1