Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2x2D
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN) WITH EXPOSED PAD
Rev 1, 3/15
2.00
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
A
B
8
1
2.00
6x 0.50
(4X)
1.55±0.10
0.15
0.10M C A B 0.22
4
TOP VIEW
( 8x0.30 )
0.90±0.10
BOTTOM VIEW
SEE DETAIL "X"
C
0.10 C
0.90±0.10
BASE PLANE
0 . 00 MIN.
0 . 05 MAX.
SEATING PLANE
0.08 C
SIDE VIEW
0 . 2 REF
C
DETAIL "X"
( 8x0.20 )
PACKAGE
OUTLINE
( 8x0.30 )
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
( 6x0.50 )
1.55
2.00
between 0.15mm and 0.30mm from the terminal tip.
( 8x0.22 )
0.90
2.00
TYPICAL RECOMMENDED LAND PATTERN
1
5.
6.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.