Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2D 8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN) WITH EXPOSED PAD Rev 1, 3/15 2.00 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA A B 8 1 2.00 6x 0.50 (4X) 1.55±0.10 0.15 0.10M C A B 0.22 4 TOP VIEW ( 8x0.30 ) 0.90±0.10 BOTTOM VIEW SEE DETAIL "X" C 0.10 C 0.90±0.10 BASE PLANE 0 . 00 MIN. 0 . 05 MAX. SEATING PLANE 0.08 C SIDE VIEW 0 . 2 REF C DETAIL "X" ( 8x0.20 ) PACKAGE OUTLINE ( 8x0.30 ) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured ( 6x0.50 ) 1.55 2.00 between 0.15mm and 0.30mm from the terminal tip. ( 8x0.22 ) 0.90 2.00 TYPICAL RECOMMENDED LAND PATTERN 1 5. 6. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.