Plastic Packages for Integrated Circuits Package Outline Drawing L24.4x5D 24 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 3/15 (0.711) 4.00 A 1.678 (0.461) B 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 1 20x 0.40 24 0.10 1.25 5.00 5.00 4.40 3.15 24x 0.20 (4X) 12 13 0.10 24X 0.45 2.60 4.00 0.30 TOP VIEW 0.10 M C A B PACKAGE OUTLINE (1.678) 0.65 SEE DETAIL "X" 0.711 0.461 0.10 C C BASE PLANE SEATING PLANE 0.08 C BOTTOM VIEW (20x 0.40) 0.10 (1.25) 0.60 C 0.20 0 . 203 REF (5.00) 0 . 00 MIN. 0 . 05 MAX. (4.40) 0.40 (3.15) DETAIL "X" 2.60 0.40 0.30 5 0.20 2.60 0.25 (24x 0.65) TYPICAL RECOMMENDED LAND PATTERN 0.70 0.90 0.035 0.203 SIDE VIEW NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. 1 JEDEC reference drawing: MO-229