Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2x2C
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) WITH E-PAD
Rev 1, 5/15
2.00
6
PIN #1 INDEX AREA
A
B
6
PIN 1
INDEX AREA
8
1
0.50
2.00
1.45±0.050
Exp.DAP
(4X)
0.15
0.25
0.10 M C A B
( 8x0.30 )
TOP VIEW
0.80±0.050
Exp.DAP
BOTTOM VIEW
( 8x0.20 )
Package Outline
( 8x0.30 )
SEE DETAIL "X"
( 6x0.50 )
1.45
2.00
0.10 C
0 . 75 ( 0 . 80 max)
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
( 8x0.25 )
0.80
2.00
TYPICAL RECOMMENDED LAND PATTERN
C
0 . 2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1