Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.3x3K
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 5/15
2X 1.95
3.00
6X 0.65
A
B
1
PIN #1
INDEX AREA
3.00
6
6
PIN 1
INDEX AREA
(4X)
1.50 ±0.10
0.15
8
TOP VIEW
8X 0.25 ±0.05
0.40 ± 0.05
4
0.10 M C A B
2.30 ±0.10
BOTTOM VIEW
SEE DETAIL "X"
C
0.10 C
0.75 ±0.05
0 . 203 REF
5
C
0 . 02 NOM.
0 . 05 MAX.
0.08 C
SIDE VIEW
DETAIL "X"
( 2.30)
( 1.95)
NOTES:
( 8X 0.50)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
(1.50)
( 2.90 )
between 0.15mm and 0.20mm from the terminal tip.
PIN 1
5.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
(6x 0.65)
( 8 X 0.25)
either a mold or mark feature.
TYPICAL RECOMMENDED LAND PATTERN
7.
1
Compliant to JEDEC MO-229 WEEC-2 except for the foot length.