Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x4J
24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 5/14
2.50
4.00
20X 0.50
A
B
19
6
4.00
R 0.09
Exp. DAP
2.70 ± 0.10
2.50
6
13
(4X)
PIN #1
INDEX AREA
C0.30
1
18
PIN 1
INDEX AREA
6
24
0.15
0.10 M C A B
TOP VIEW
7
12
4
24X 0.25 +0.05
+0.07
24X 0.40 ± 0.10
0.25 (4 SIDES)
BOTTOM VIEW
SEE DETAIL “X”
C
0.10 C
0.75 ± 0.05
0.20 REF
5
C
SEATING PLANE
0.08 C
0.00 MIN
.05 MAX
SIDE VIEW
DETAIL "X"
(3.80)
(2.70)
NOTES:
1.
(20X 0.50)
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
(3.80)
(2.70)
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
(24X 0.25)
5. Tiebar shown (if present) is a non-functional feature.
6.
(24X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
1
The configuration of the pin #1 identifier is optional, but must
be located within the zone indicated. The pin #1 identifier may
be either a mold or mark feature.
7. Compliant to JEDEC MO-220 WGGD-6