Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L6.1.5x1.6
6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)
Rev 1, 4/15
1.50
0.55
PIN #1 INDEX AREA
6
PIN 1
0.50
1.60
(2X)
0.10
0.10 M C A B
4 0.25
TOP VIEW
0.40
0.70
BOTTOM VIEW
2.00
0.18
SEE DETAIL "X"
0.80
0.10 C
0.70 ± 0.05
C
BASE PLANE
SEATING PLANE
0.08 C
0.50
SIDE VIEW
0.25
PACKAGE
OUTLINE
0.25
C
0.70
0.65
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL “X”
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends)..
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.