Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.5x1.6 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 1, 4/15 1.50 0.55 PIN #1 INDEX AREA 6 PIN 1 0.50 1.60 (2X) 0.10 0.10 M C A B 4 0.25 TOP VIEW 0.40 0.70 BOTTOM VIEW 2.00 0.18 SEE DETAIL "X" 0.80 0.10 C 0.70 ± 0.05 C BASE PLANE SEATING PLANE 0.08 C 0.50 SIDE VIEW 0.25 PACKAGE OUTLINE 0.25 C 0.70 0.65 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL “X” NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.