Plastic Packages for Integrated Circuits Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 4, 2/15 2.10 A B 6 PIN 1 INDEX AREA 1 6 PIN #1 INDEX AREA 0.65 1.35 2.00 1.30 REF 4 6x0.30 ±0.05 (4X) 0.10 0.10 M C A B 0.65 6x0.35 ±0.05 TOP VIEW BOTTOM VIEW 2.50 PACKAGE OUTLINE 2.10 SEE DETAIL "X" 0.65 (4x0.65) 0.10 C MAX 0.75 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW (1.35) 0.2 REF (6x0.30) 5 C (6x0.20) (6x0.55) 0.00 MIN. 0.05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and maybe located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1