Plastic Packages for Integrated Circuits Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 4, 5/15 2.10 A 6 PIN 1 INDEX AREA 0.15 B 0.25 6 PIN 1 INDEX AREA 0.50 1.50 2.00 1.50 0.20±0.05 4 (2X) 0.10 M C A B 0.10 8X 0 . 35 ± 0 . 05 TOP VIEW 0.75 BOTTOM VIEW SEE DETAIL "X" 2.50 0.10 C 2.10 0.70±0.05 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW (6x0.50) (1.50) (8x0.20) C (8x0.20) 5 0 . 00 MIN. 0 . 05 MAX. (8x0.55) DETAIL "X" (0.75) TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.25mm and 0.35mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1