Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.65x1.65 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 2, 4/15 1.65 0.55 0.70 PIN #1 INDEX AREA 6 PIN 1 1.65 0.50 0.25 4 (4X) 0.20 0.10 0.10 M CAB 0.85 TOP VIEW 0.40 BOTTOM VIEW PACKAGE OUTLINE 0.75 SEE DETAIL "X" 0.70 0.10 C 0.70 ± 0.05 C BASE PLANE SEATING PLANE 0.08 C 0.25 0.62 SIDE VIEW 0.50 1.02 C 0.60 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL “X” NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.