Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.3x3F
8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 5/15
6
PIN #1 INDEX AREA
3.00
A
B
6
PIN 1
INDEX AREA
1
8
0.65
2
7
(2.29)
3.00
(2X)
0.10
6
3
0.30±0.05 5
4
(1.95)
0.10 M C A B
8X 0 . 40 ± 0 . 05
(1.40)
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
(2.80 TYP)
0.70±0.05
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
(6x0.65)
(2.29)
C
0 . 2 REF
5
(8x0.30)
0 . 00 MIN.
0 . 05 MAX.
(1.40)
(8x0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.35mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1