Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Dual Flat No-Lead Plastic Package (DFN)
L9.3x3
2X
9 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
0.15 C A
A
D
MILLIMETERS
2X
0.15 C B
E
SYMBOL
MIN
0.80
0.90
1.00
-
-
-
0.05
-
0.20 REF
0.20
D
D2
B
A
C
SEATING
PLANE
0.08 C
A3
SIDE VIEW
D2
1
6
2.10
6, 7
-
3.00 BSC
0.80
e
0.95
1.05
6, 7
0.50 BSC
-
k
0.60
-
-
-
L
0.25
0.35
0.45
7
9
2
D2/2
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2
2. N is the number of terminals.
E2/2
3. All dimensions are in millimeters. Angles are in degrees.
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2
5. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N-1
6. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
NX b
e
(Nd-1)Xe
REF.
BOTTOM VIEW
4
0.10 M C A B
(A1)
8 L
4
e
SECTION "C-C"
C C
TERMINAL TIP
FOR ODD TERMINAL/SIDE
1
7. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
8. Compliant to JEDEC MO-229-WEED-3 except for dimensions E2
& D2.
9. Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
CL
NX (b)
4, 7
NOTES:
NX k
N
0.30
Rev. 1 3/15
7
(DATUM A)
7
E2
2.00
N
(DATUM B)
5
INDEX
AREA
0.10 C
0.25
-
3.00 BSC
1.85
E
//
NOTES
A
b
TOP VIEW
MAX
A1
A3
5
INDEX
AREA
NOMINAL