Plastic Packages for Integrated Circuits Dual Flat No-Lead Plastic Package (DFN) L9.3x3 2X 9 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D MILLIMETERS 2X 0.15 C B E SYMBOL MIN 0.80 0.90 1.00 - - - 0.05 - 0.20 REF 0.20 D D2 B A C SEATING PLANE 0.08 C A3 SIDE VIEW D2 1 6 2.10 6, 7 - 3.00 BSC 0.80 e 0.95 1.05 6, 7 0.50 BSC - k 0.60 - - - L 0.25 0.35 0.45 7 9 2 D2/2 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. E2/2 3. All dimensions are in millimeters. Angles are in degrees. 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N-1 6. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. NX b e (Nd-1)Xe REF. BOTTOM VIEW 4 0.10 M C A B (A1) 8 L 4 e SECTION "C-C" C C TERMINAL TIP FOR ODD TERMINAL/SIDE 1 7. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 8. Compliant to JEDEC MO-229-WEED-3 except for dimensions E2 & D2. 9. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). CL NX (b) 4, 7 NOTES: NX k N 0.30 Rev. 1 3/15 7 (DATUM A) 7 E2 2.00 N (DATUM B) 5 INDEX AREA 0.10 C 0.25 - 3.00 BSC 1.85 E // NOTES A b TOP VIEW MAX A1 A3 5 INDEX AREA NOMINAL