Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220)
B
N
(N-1)
(N-2)
D
1
2
3
L20.5x5C
MILLIMETERS
SYMBOL
PIN #1
I.D. MARK
E
(2X)
0.075 C
TOP VIEW
(2X)
(N/2)
0.075 C
SEATING
PLANE
MAX
NOTES
A
0.80
0.90
1.00
-
0.00
0.02
0.05
-
b
0.28
0.30
0.32
-
c
0.20 REF
-
D
5.00 BASIC
-
D2
3.70 REF
8
E
5.00 BASIC
-
E2
3.70 REF
8
e
0.10 C
e
NOMINAL
A1
L
C
MIN
0.65 BASIC
0.35
0.40
0.45
-
N
20
4
ND
5 REF
6
NE
5 REF
5
Rev. 0 6/06
0.08 C
N LEADS AND
EXPOSED PAD
NOTES:
SEE DETAIL “X”
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
SIDE VIEW
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
b
L
N LEADS
(N-2)
(N-1)
N
0.01 M C A B
PIN #1 I.D.
3
1
2
3
(N/2)
NE 5
7
BOTTOM VIEW
C
A
2
(c)
(L)
N LEADS
A1
DETAIL “X”
1
6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE.
7. Inward end of terminal may be square or circular in shape with
radius (b/2) as shown.
(E2)
(D2)
5. NE is the number of terminals on the “E” side of the package
(or Y-direction).
8. If two values are listed, multiple exposed pad options are
available. Refer to device-specific datasheet.
9. One of 10 packages in MDP0046