Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package (QFN) A 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) B N (N-1) (N-2) D 1 2 3 L20.5x5C MILLIMETERS SYMBOL PIN #1 I.D. MARK E (2X) 0.075 C TOP VIEW (2X) (N/2) 0.075 C SEATING PLANE MAX NOTES A 0.80 0.90 1.00 - 0.00 0.02 0.05 - b 0.28 0.30 0.32 - c 0.20 REF - D 5.00 BASIC - D2 3.70 REF 8 E 5.00 BASIC - E2 3.70 REF 8 e 0.10 C e NOMINAL A1 L C MIN 0.65 BASIC 0.35 0.40 0.45 - N 20 4 ND 5 REF 6 NE 5 REF 5 Rev. 0 6/06 0.08 C N LEADS AND EXPOSED PAD NOTES: SEE DETAIL “X” 1. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW 2. Tiebar view shown is a non-functional feature. 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. 4. N is the total number of terminals on the device. b L N LEADS (N-2) (N-1) N 0.01 M C A B PIN #1 I.D. 3 1 2 3 (N/2) NE 5 7 BOTTOM VIEW C A 2 (c) (L) N LEADS A1 DETAIL “X” 1 6. ND is the number of terminals on the “D” side of the package (or X-direction). ND = (N/2)-NE. 7. Inward end of terminal may be square or circular in shape with radius (b/2) as shown. (E2) (D2) 5. NE is the number of terminals on the “E” side of the package (or Y-direction). 8. If two values are listed, multiple exposed pad options are available. Refer to device-specific datasheet. 9. One of 10 packages in MDP0046