Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.5x5C
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 12/13
5.00
12X 0.80
A
B
13
6
PIN #1
INDEX AREA
16
6
PIN 1
INDEX AREA
12
5.00
1
2.80 ± 0.10
9
(4X)
4
0.1
8
5
0.10 M C A B
TOP VIEW
16 X
0.40 ± 0.05
4
0.30 ± 0.05
BOTTOM VIEW
SEE DETAIL “X”
//
0.10 C
0.85 ± 0.05
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
(4.80 TYP)
(
2.80)
(12X 0.80)
C
5
0.00 MIN
0.05 MAX
(16X 0.30)
DETAIL “X”
(16X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
0.203 REF
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Lead width applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1