Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L44.7x7B
44 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 10/09
7.00
5.00 TYP
40X 0.50
A
B
6
PIN 1
INDEX
AREA
6
PIN #1
INDEX
1 AREA
44
34
7.00
33
5.20 ±0.1
EXP. DAP
23
(4X)
11
44X 0.25 4
0.10 M C A B
0.15
TOP VIEW
22
SIDE VIEW
12
5.20 ±0.1 EXP. DAP
44X 0.55 ±0.1
BOTTOM VIEW
( 6.65 )
SEE DETAIL "X"
( 5.20)
0.10 C
1.00 MAX
C
0.08 C
SIDE VIEW
( 6.65 )
( 5.20 )
( 40X 0.50)
C
(44X .25)
0.2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 44 X 0.75)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
7.
Complies to JEDEC MO220 VKKD-1.
either a mold or mark feature.
1