Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7B 48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE Rev 2, 7/10 9.0±0.20 4 5 7.0±0.10 D 3 A 3 7.0±0.10 9.0±0.20 4 5 4.00±0.1 0.50 B 3 TOP VIEW EXPOSED PAD 4.00±0.1 1.20 MAX 11/13° C BOTTOM VIEW 0.08 0° MIN. SEE DETAIL "A" 0.08 M C A-B D H 0.17/0.27 WITH LEAD FINISH 7 0.09/0.20 0.09/0.16 2 1.00 ±0.05 0.05/0.15 0.25 GAUGE PLANE 0.60 ±0.15 0-7° 0.20 MIN. 0.17/0.23 (1.00) BASE METAL DETAIL "A" (10.00) (0.28) TYP NOTES: 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. (10.00) (4.00) 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 4. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254mm on D1 and E1 dimensions. 5. These dimensions to be determined at datum plane H. (1.50) TYP 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 7. Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. (4.00) TYPICAL RECOMMENDED LAND PATTERN 1 9. This outline conforms to JEDEC publication 95 registration MS-026, variation ABC-HD. 10. Dimensions in ( ) are for reference only.