Plastic Packages for Integrated Circuits Package Outline Drawing L56.8x8F 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 4/10 2X A 8.00 BSC 6.30±0.10 0.10 C A 0.23 7.75 BSC 4X 0.42 2X N 5 PIN #1 INDEX AREA SEE DETAIL "A" FOR PIN #1 ID AND TIE BAR MARK OPTION PIN #1 5 INDEX AREA 4 0.10 C B 1 2 3 0.10 M C A B 0.05 M C N 4X 0.42 1 2 3 8.00 BSC (6.5) 7.75 BSC 6.30±0.10 (MIN. 0.35) 0.10 C B 2X B 2X 0.10 C A 56X 0.40 0.50 BSC (MIN. 0.35) TOP VIEW (6.5) REF. BOTTOM VIEW 0.85 0-12° 0.65 0.10 C C PACKAGE OUTLINE 1 2 3 SEATING PLANE 0.08 C 6 (0.20) SIDE VIEW (6.5 TYP) (6.30 TYP) (52X 0.50) CC (0.40) 4 TERMINAL TIP (56X 0.60) TYPICAL RECOMMENDED LAND PATTERN (0.23) 0.25 0.50 0.05 MAX SECTION "C-C" SCALE: NONE DETAIL "A" - PIN #1 ID AND LEAD FIGURES NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1 6. Bilateral coplanarity zone applies to the exposed pad as well as the terminals. 7. JEDEC reference drawing: MO-220WLLD.