Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L56.8x8D
56 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 04/07
4X 6.5
8.00
52X 0.50
A
B
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
56
43
1
42
8.00
6 . 50 ± 0 . 15
29
(4X)
14
0.15
28
15
0.10 M C A B
56X 0 . 4 ± 0 . 1
b
TOP VIEW
4 0.25 +0.05 / -0.07
BOTTOM VIEW
SEE DETAIL "X"
PACKAGE OUTLINE
0.10 C
0 . 75
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
( 7 . 8 TYP )
(
6.5)
( 52X 0 . 5 )
C
0 . 2 REF
5
( 56X 0 . 25 )
0 . 00 MIN.
0 . 05 MAX.
( 56X 0 . 6 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.18mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1