Plastic Packages for Integrated Circuits Package Outline Drawing Q80.12x12A 80 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP) Rev 1, 3/11 14.00 12.00 D A 3 4 14.00 12.00 3 4 B 4X 0.20 C A-B D 4X BOTTOM VIEW 0.20 H A-B D 0.50 TOP VIEW 1.20 MAX 11/13° 0° MIN 0.05 2 H 1.00 ±0.05 C 0.09-0.20 0.20 -0.03/+0.07 0.08 M C A - B D 0.08 C SEE DETAIL "A" 6 0.05/0.15 0.08 R. MIN. 0.20 MIN. SIDE VIEW 0.25 0-7° GAUGE PLANE 0.60 ±0.15 (1.00) DETAIL "A" SCALE: NONE (14.60) (0.28) TYP NOTES: 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.25mm per side. 4. These dimensions to be determined at datum plane H. (14.60) 5. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. (0.50) (1.20) TYP TYPICAL RECOMMENDED LAND PATTERN 1 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. 7. Controlling dimension: millimeter. 8. This outline conforms to JEDEC publication 95 registration MS-026, variation ADD. 9. Dimensions in ( ) are for reference only.