Plastic Packages for Integrated Circuits Package Outline Drawing Q44.10x10A 44 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP) Rev 2, 12/10 4 10.00 12.00 5 D 3 3 A 12.00 10.00 4 5 4.50±0.1 B 3 0.80 EXPOSED PAD 4X 0.20 C A-B D 4X 0.20 H A-B D 4.50±0.1 TOP VIEW BOTTOM VIEW 1.20 MAX 11/13° 7 0.05 0.20 M C A-B D / / 0.10 C WITH LEAD FINISH 0.37 +0.08/-0.07 C SIDE VIEW 0.10 SEE DETAIL "A" 0.09/0.20 0.09/0.16 0° MIN. 0.35 ±0.05 H BASE METAL 2 1.00 ±0.05 0.05/0.15 (10.00) 0.08 R. MIN. 0.20 MIN. DETAIL "A" (0.45) TYP SCALE: NONE 0.25 GAUGE PLANE 0.60 ±0.15 0-7° (1.00) NOTES: 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 10.00 (4.50) (1.50) TYP (4.50) TYPICAL RECOMMENDED LAND PATTERN 1 4. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254mm on D1 and E1 dimensions. 5. These dimensions to be determined at datum plane H. 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 7. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. 9. This outline conforms to JEDEC publication 95 registration MS-026, variation ACB. 10. Dimensions in ( ) are for reference only. 11. The corners of the exposed heatspreader may appear different due to the presence of the tiebars.