Plastic Packages for Integrated Circuits Package Outline Drawing Q64.10x10A 64 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE (LQFP) Rev 3, 10/11 12.00 4 5 10.00 D 3 12.00 A 3 10.00 4 5 B 3 0.50 4X 0.20 C A-B D 4X 0.20 H A-B D TOP VIEW BOTTOM VIEW 1.60 MAX 11/13° / / 0.10 C 0.05 C 0.08 0° MIN. SEE DETAIL "A" SIDE VIEW 2 H 1.40 ±0.05 7 0.05/0.15 0.08 M C A-B D WITH LEAD FINISH 0.22 ±0.05 0.08 R. MIN. 0.20 MIN. 0.25 GAUGE PLANE 0.60 ±0.15 0-7° (1.00) 0.09/0.20 0.09/0.16 0.20 ±0.03 DETAIL "A" SCALE: NONE BASE METAL NOTES: (10.00) 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. (0.28) TYP 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 4. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254mm. 10.00 5. These dimensions to be determined at datum plane H. 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. (1.50) TYP TYPICAL RECOMMENDED LAND PATTERN 1 7. Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. 9. This outline conforms to JEDEC publication 95 registration MS-026, variation ACD. 10. Dimensions in ( ) are for reference only.