Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121 121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm Pitch) Rev 2, 9/13 5.455±0.030 5.000 X 0.500 Y 121x 0.320±0.030 L K J H G 5.535±0.030 5.000 F E D C B A (4x) 0.10 1 PIN 1 2 3 4 5 6 7 9 8 10 11 0.2675 0.2275 0.500 TOP VIEW BOTTOM VIEW 0.05 Z Z SEATING PLANE PACKAGE OUTLINE 0.330 0.500 0.320±0.030 121x 0.10 M Z X Y 0.05 M Z 0.280 3 NSMD TYPICAL RECOMMENDED LAND PATTERN 0.240±0.030 0.600±0.060 SIDE VIEW NOTES: 1. All dimensions are in millimeters. 2. Dimensions and tolerance per ASMEY 14.5M - 1994 and JESD 95-1, SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451 1