Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W4x4.16F
16 BALL WLCSP WITH 0.4mm PITCH (BSC) 4x4 ARRAY (1.740mm x 1.740mm)
Rev 0, 1/14
X
0.400
1.740±0.030
Y
D
1.740±0.030
16x 0.265±0.035
C
B
A
(4X)
0.270
0.10
1
0.200
2
3
4
0.270
PIN 1 (A1 CORNER
TOP VIEW
BOTTOM VIEW
Z
PACKAGE OUTLINE
0.05
Z
SEATING PLANE
3
0.040 BSC
(BACK SIDE COATING)
0.240
0.290
0.400
0.265±0.035
0.10
0.05
ZXY
Z
0.200±0.030
TYPICAL RECOMMENDED LAND PATTERN
0.540±0.050
SIDE VIEW
NOTES:
1.
Dimension and tolerance per ASMEY14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
1
3.
Primary datum Z and seating plane are defined by the spherical
crowns of the bump.
4.
Bump position designation per JESD 95-1, SPP-010.
5.
There shall be a minimum clearance of 0.10mm between
the edge of the bump and the body edge.