Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16E 4X4 ARRAY 16 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 2/13 X 1.200 1.780±0.030 Y D C 16x 0.265±0.035 1.780±0.030 0.200 B 0.400 A 0.290 1 0.10 TOP VIEW (4X) 3 4 BOTTOM VIEW PIN 1 (A1 CORNER) 0.240 2 0.290 PACKAGE OUTLINE 0.400 0.040 BSC (BACK SIDE COATING) 0.290 0.540±0.050 0.05 3 NSMD 0.200±0.030 0.265±0.035 Z Z SEATING PLANE TYPICAL RECOMMENDED LAND PATTERN 0.10 0.05 ZXY Z SIDE VIEW NOTES: 1 1. All dimensions are in millimeters. 2. Dimension and tolerance conform to ASMEY14.5-1994, and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf