Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W4x4.16E
4X4 ARRAY 16 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
Rev 0, 2/13
X
1.200
1.780±0.030
Y
D
C
16x 0.265±0.035
1.780±0.030
0.200
B
0.400
A
0.290
1
0.10
TOP VIEW
(4X)
3
4
BOTTOM VIEW
PIN 1
(A1 CORNER)
0.240
2
0.290
PACKAGE
OUTLINE
0.400
0.040 BSC
(BACK SIDE COATING)
0.290
0.540±0.050
0.05
3 NSMD
0.200±0.030
0.265±0.035
Z
Z SEATING
PLANE
TYPICAL RECOMMENDED LAND PATTERN
0.10
0.05
ZXY
Z
SIDE VIEW
NOTES:
1
1.
All dimensions are in millimeters.
2.
Dimension and tolerance conform to ASMEY14.5-1994,
and JESD 95-1 SPP-010.
3.
NSMD refers to non-solder mask defined pad design per
Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf