Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W4x5.20H
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
Rev 0, 05/14
1.200
X
Y
0.400
1.67±0.030
E
D
20x 0.265±0.035
C
2.07±0.030
1.600
B
0.235
A
(4X)
0.10
1
0.200
TOP VIEW
2
3
4
0.235
PIN 1
(A1 CORNER)
BOTTOM VIEW
PACKAGE
OUTLINE
Z
0.05 Z
0.240
SEATING PLANE
3
0.400
0.265±0.035 x20
0.290
0.10
0.05
ZXY
Z
0.200±0.030
0.500±0.050
RECOMMENDED LAND PATTERN
SIDE VIEW
NOTES:
1. Dimensions and tolerance per ASME Y 14.5M - 1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical
crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
5. There shall be a minimum clearance of 0.10mm between
the edge of the bump and the body edge.
1