Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W4x4.16B
4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 2, 8/13
PIN 1
(A1 CORNER)
X
1.200
0.400
1.655±0.03
Y
D
0.400
16X 0.265±0.035
C
1.200
1.655±0.03
B
0.228
A
(4X)
4
0.10
TOP VIEW
3
2
1
0.295
0.200
0.228
BOTTOM VIEW
Z
PACKAGE
OUTLINE
0.10 Z
SEATING PLANE
3
0.290
2
0.265±0.035
Ø0.10 M Z X Y
Ø0.05 M Z
4
0.400
0.240
6 NSMD
TYPICAL RECOMMENDED LAND PATTERN
0.200±0.030
0.500±0.050
SIDE VIEW
NOTES:
1. Dimensions and tolerance and tolerance per ASMEY 14.5 - 1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the
spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
5. All dimensions are in millimeters.
6. NSMD refers to non-solder mask defined pad design per Intersil
Techbrief www.intersil.com/data/tb/tb451.pdf
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