Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16B 4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 2, 8/13 PIN 1 (A1 CORNER) X 1.200 0.400 1.655±0.03 Y D 0.400 16X 0.265±0.035 C 1.200 1.655±0.03 B 0.228 A (4X) 4 0.10 TOP VIEW 3 2 1 0.295 0.200 0.228 BOTTOM VIEW Z PACKAGE OUTLINE 0.10 Z SEATING PLANE 3 0.290 2 0.265±0.035 Ø0.10 M Z X Y Ø0.05 M Z 4 0.400 0.240 6 NSMD TYPICAL RECOMMENDED LAND PATTERN 0.200±0.030 0.500±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance and tolerance per ASMEY 14.5 - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. All dimensions are in millimeters. 6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief www.intersil.com/data/tb/tb451.pdf 1