Motherboard Power Conversion Solutions Using the HIP6020 and HIP6021 Controller ICs Application Note Introduction The rapidly changing desktop motherboard architecture for core processor and Accelerated Graphics Port (AGP) voltages demand innovative power conversion solutions. The HIP6020 [1] and HIP6021 [2] controllers provide a bridge over these challenging power concerns. This document describes the HIP6020EVAL1 and HIP6021EVAL1 reference designs, features, and usage guidelines. April 1999 AN9836 For high performance AGP systems, the HIP6020EVAL1 monitors and controls a standard buck converter to regulate the 1.5V or 3.3V Universal AGP Card bus voltage (VCC_VDDQ). While the HIP6021EVAL1 addresses the lower performance AGP systems with a third integrated adjustable linear controller to regulate the 1.5V or 3.3V AGP core voltage. FROM ATX SUPPLY +5V +12V EMT TOOL VCC_CORE ADJUSTABLE SYNCHRONOUS BUCK CONTROLLER + DAC VID0 VID1 VID2 VID3 VID4 VCC_VDDQ + ADJUSTABLE STANDARD BUCK CONTROLLER THIS BLOCK INCLUDED IN HIP6020 ONLY ADJUSTABLE LINEAR CONTROLLER THIS BLOCK INCLUDED IN HIP6021 ONLY +3.3V + VCC_VTT ADJUSTABLE LINEAR CONTROLLER + VCC_MCH ADJUSTABLE LINEAR CONTROLLER + FIGURE 1. HIP6020/21EVAL1 BLOCK DIAGRAM Figure 1 presents a simple block diagram of the HIP6020/21 application circuit. The +3.3V, +5V, and +12V power inputs are provided by an ATX power supply. The HIP6020 [1] and HIP6021 [2] both monitor and regulate four output voltages. Both provide a synchronous-rectified buck converter controller which regulates the microprocessor core voltage (VCC_CORE) to a level programmed by a 5-bit digital code. As well as, two adjustable linear controllers which drive external MOSFETs to supply the 1.5V GTL bus voltage (VCC_VTT) and 1.8V North/South Bridge core voltage (VCC_MCH) and/or cache memory. The linear regulators use the 3.3V from the ATX for their input voltage to minimize the power dissipated. 1 J2 SLOT 1 TP HIP6020/21EVAL1 FIGURE 2. QUICK START EVALUATION CONNECTIONS The HIP6020/21 EVAL1 circuit board shows the layout and traces of the power supply portion of a computer motherboard. Included on the boards are the ATX input power connector and a Pentium II, SLOT 1 connector. Motherboard designers should reference the component placement and printed circuit routing of the specific circuit board. Both circuit boards contain jumpers and spare component placeholders to facilitate detailed evaluation of the HIP6020 or HIP6021. Quick Start Evaluation Both evaluation platforms support testing with standard power supplies or an ATX-style power supply. Simply connect the ATX supply to J2 connector, see Figure 2, or connect standard laboratory supplies to the related posts marked +12VIN, +5VIN, +3.3VIN and GND. No power-up sequence is required when using standard laboratory power supplies. The outputs can be exercised using either resistive loads, electronic loads, or the Intel Slot 1 EMT tool. Shielded scope probe test points (TP2, TP5, TP6 and TP8) on the outputs (VCC_VDDQ, VCC_CORE, VCC_VTT and VCC_MCH) allow for accurate inspection of the output power quality. Before proceeding, please consult Table 1 for the evaluation board’s design envelope characteristics. 1-888-INTERSIL or 1-888-468-3774 | Copyright © Intersil Corporation 1999 Pentium® is a registered trademark of Intel Corporation. Application Note 9836 TABLE 1. HIP6020/21EVAL1 OUTPUT LOAD CAPABILITIES OUTPUT NOMINAL VOLTAGE (V) STATIC TOLERANCE (±,%) DYNAMIC TOLERANCE (±,%) NOMINAL CURRENT (A) MAXIMUM CURRENT (A) MAXIMUM CURRENT STEP (A) MAXIMUM SLEW RATE (A/μs) DESIGN PLATFORM (EVAL1) VCC_CORE 2.0 3.0 6.5 10 17.4 9.5 20.0 Both VCC_VDDQ 1.5/3.3 3.0 9.0 1.0 3.0 2.0 1.0 HIP6021 VCC_VDDQ 1.5/3.3 3.0 9.0 2.0 6.0 4.0 1.0 HIP6020 VCC_VTT 1.5 3.0 9.0 1.0 3.0 2.0 1.0 Both VCC_MCH 1.8 3.0 5.0 1.0 3.0 2.0 1.0 Both HIP6020/21EVAL1 Reference Designs The evaluation board is designed to simultaneously meet all the applicable criteria outlined in Table 1. The following section highlights some of the most important features of this system power solution. ATX Power Supply Control Interface JP7 allows control of the ATX power supply. Placing the jumper in the 1-2 position, connects the PS-ON (output enable) input of the ATX supply to ground, thus unconditionally enabling the outputs. Placing the jumper in the 2-3 position enables automatic control of the ATX. When ATX supply turns on, the 5V stand-by output turns Q6A on to enable the main ATX outputs. When FAULT/RT pin goes high, Q6B latches on, thus turning off Q6A and disabling the ATX outputs. Cycling power off and then back on re-enables the ATX power supply. The sole purpose of this circuit is to exemplify a possible interface between the control circuit’s FAULT output and an ATX power supply. ATX CONNECTOR 9 R15 5.1K J2 14 3, 5, 7, 13 15, 16, 17 PS-ON JP7 GND 3 2 1 CR2 R16 5.1K 1N4148 Q6A 1/2 RF1K49154 Q6B 1/2 RF1K49154 FIGURE 3. ATX POWER SUPPLY CONTROL CIRCUIT 2 2.030V 2.000V WITHOUT DROOP 1.970V WITH DROOP OUTPUT CURRENT 17.4A FIGURE 4. OUTPUT VOLTAGE DROOP AT 2.0V DAC SETTING 51K 5VSB The synchronous switching regulator on the HIP6020/21EVAL1 board implements output voltage droop functions, where the output voltage sags proportionately with the output current. Although not necessary for proper circuit operation, this method takes advantage of the static regulation limits to improve the dynamic regulation by expanding the available headroom for transient edge output excursion. In such practical applications, compared to a nondroop implementation, this translates to fewer output capacitors or better regulation for the same type and number of capacitors. Figure 4 details the output voltage characteristics of a converter with 3.0% droop compared to a non-droop implementation. 0.5A R17 FAULT/RT Lossless Output Voltage Droop with Load OUTPUT VOLTAGE When using the Intel Slot 1 EMT Tool, note that the core regulator VID jumpers (JP0-JP4) located on the evaluation board are in parallel with the ones located on the EMT tool. Remember to de-populate one set of jumpers completely and use the other set to dial-in the desired output voltage. In contrast to droop implementation involving a resistive element placed in the output current path, this method does not involve the additional power loss introduced by the resistor. By moving the voltage regulation point ahead of the output inductor (at the PHASE node), droop becomes equal to the average voltage drop across the output inductor’s DC resistance as well as any distributed resistance. To insure symmetric output voltage excursions in response to load transients, the output voltage is offset above the nominal level by half the calculated droop. Application Note 9836 Over-Current Protection The switching regulators within the HIP6020 and HIP6021 employ a lossless current sensing technique based on the upper MOSFETs rDS(ON). During the ON-time of the upper MOSFET, its drain-to-source voltage is compared with a user-adjustable voltage created by an internal current source across ROCSET (i.e., R2, R3 in the HIP6020EVAL1 schematic). When the MOSFETs drain-to-source voltage exceeds the preset threshold, the regulator immediately shuts down all outputs and initiates a soft-start cycle. If the condition persists, the third shutdown latches the chip off and pulls the FAULT/RT pin high. Cycling the bias voltage OFF and ON resets the protection circuitry. The linear regulator outputs employ a different method of overcurrent detection. Given the relatively large rDS(ON) of the pass devices, a short-circuit condition usually translates into a dip in the output voltage. If the output voltage (as sensed at the feedback pin) dips below approximately 75% of the set point, this undervoltage is interpreted as an overcurrent event and the control IC reacts accordingly, shutting down all outputs and cycling the soft-start. The internal regulator is protected by an additional internal output current mirror. Output current exceeding the preset threshold (see data sheet) generates a similar response. Any over-current event on any output is reported by the toggle of the PGOOD output. Over-Voltage Protection blows due to the magnitude of the surge current being drawn from the 5V input supply. Proper operation of this protection feature is contingent, however, on the 12V bias voltage being sufficiently high to turn on the lower MOSFET. The circuit has been tested with several ATX supplies, and they all produced acceptable bias voltage for the operation of the protection circuitry and the on-board UltraFET MOSFETs. Figure 6 depicts the same start-up scenario, this time with the ATX supply control interface enabled. As seen in the oscilloscope capture, as soon as power-on reset (POR) thresholds are detected, the HIP6020/21 detects the overvoltage condition and reports it on the FAULT/RT pin. In turn, the control circuit shuts down the ATX supply by generating a logic high at the PS-ON input, before any expensive damage can occur. 10 FAULT/RT 0 10 +12VIN 0 2 1 +5VIN 0 2 1 VCC_CORE The microprocessor core regulator (synchronous buck) has a voltage-tracking over-voltage threshold set at 115% (typically) of the DAC setting. In the case of an over-voltage event, the microprocessor core regulator attempts to regulate the output voltage at the over-voltage threshold. It also reports the condition through a high output on the FAULT/RT pin. In addition to the normal over-voltage operation, the microprocessor core regulator has another very useful protection feature presented in Figures 5 and 6. In case of a power-up sequence with a shorted upper MOSFET, the microprocessor can be destroyed without the protective circuitry integrated into the HIP6020/21. An independent functional block acts upon the lower gate driver, regulating the core voltage to around 1.3V until the controller bias voltage reaches power-on threshold. At this point normal operation resumes, core voltage is regulated to 115% of the DAC setting (2.0V in this case), and fault condition is reported on the FAULT/RT pin. Figure 5 exemplifies operation of the evaluation board without the help of the ATX supply control circuit (Figure 3). Initially the core voltage is held around 1.3V until the poweron threshold is reached (15ms till 50ms). Then the output voltage is released to rise up to 115% of the DAC setting (DAC = 2.0V). FAULT/RT goes high at this time signaling an over-voltage condition. About 20ms later the 15A fuse (F1) 3 0 0 20 40 60 80 100 120 140 160 TIME (ms) FIGURE 5. START-UP SEQUENCE WITH SHORTED Q1 (ATX CONTROL CIRCUIT BY-PASSED) 10 FAULT/RT 0 5 +12VIN 0 2 1 +5VIN 0 2 1 VCC_CORE 0 0 10 20 30 40 50 TIME (ms) 60 70 80 FIGURE 6. START-UP SEQUENCE WITH SHORTED Q1 (ATX CONTROL CIRCUIT ACTIVE) UltraFET™ is a trademark of Intersil Corporation. Application Note 9836 The practical implementation of the circuit is done on a twoounce four-layer printed circuit board. The two internal layers are dedicated for ground and power planes. The layout is compact and several additional footprints are provided for increased evaluation flexibility. The component side of the board contains two embedded serpentine resistors. One in series with the drain of Q4 and Q5, approximately 220mΩ and 200mΩ respectively. These resistors is not necessary for the proper operation of the circuit; their role is simply to share the power dissipation which otherwise would be dissipated entirely by Q4 or Q5. Both serpentine resistors can be removed by shorted them via two separate footprints on the bottom of the EVAL boards. Contact Intersil for board layout Gerber files. only the core regulator efficiency, use Figure 7. The core regulator design of the HIP6020 is identical to that of the HIP6021. 92 Power MOSFETs 90 88 86 84 82 0 The power transistors utilized by HIP6020/21EVAL1 belong to Intersil’ newest line of 30V UltraFET MOSFETs. Featuring reduced rDS(ON) and low trr and Qrr, these transistors allow for elimination of the traditional lower MOSFET anti-parallel schottky. Efficiency Figure 7 displays the efficiency of the HIP6021EVAL1 core regulator reference design versus load current. Laboratory measurements were made with a 5V input and 100 linear feet per minute (LFM) of airflow across the evaluation board. The linear regulators are neglected since their efficiency is not a figure of merit for the application circuit. 93 10 20 30 40 50 COMBINED SWITCHING CONVERTERS OUTPUT POWER [W] FIGURE 8. HIP6021EVAL1 MEASURED CONVERTER EFFICIENCY Load Transient Response HIP6020/21EVAL1 Performance HIP6020EVAL1 response of the core voltage regulation to a 13.5A output step load transient is shown in Figure 9. An Intel Slot 1 Test Tool provided the load transient which was larger than the 9.5A design point. All other outputs are subjected to the maximum transient loading conditions and nominal output voltage settings as described in Table 1. 100 50 VCC_CORE 0 VCC_CORE = 2.0V VOLTAGE (ms) CONVERTER EFFICIENCY (%) VCC_CORE = 2.0V VCC_VDDQ = 1.5V CONVERTER EFFICIENCY [%] Printed Circuit Board 91 89 87 50 VCC_VDDQ 0 20 VCC_VTT 0 20 VCC_MCH 0 85 0 200 800 83 0 4 8 12 16 20 SWITCHING CONVERTER OUTPUT CURRENT (A) FIGURE 7. HIP6021EVAL1 MEASURED CONVERTER EFFICIENCY Similarly, Figure 8 displays the efficiency obtained in the HIP6020EVAL1 reference design. Since this evaluation platform contains two switching regulators, both switching regulator outputs were simultaneously loaded and measured. The efficiency curve in Figure 8 represents a composite result of the overall circuit efficiency plotted against total converter output power. For those interested in 4 1200 1600 2000 TIME (μs) FIGURE 9. HIP6020EVAL1 OUTPUT TRANSIENT RESPONSE HIP6020/21EVAL1 Modifications Input Capacitors Selection In a DC/DC converter employing an input inductor, the input RMS current is supplied entirely by the input capacitors. The number of input capacitors is usually determined by their maximum RMS current rating. The voltage rating at maximum ambient temperature of the input capacitors Application Note 9836 should be at least 1.25 to 1.5 times the maximum input voltage. High frequency decoupling (highly recommended) is implemented through the use of ceramic capacitors in parallel with the bulk aluminum capacitor filtering. The switching converter’s input RMS current is dependent on the input and output voltages as well as the output current. Figure 10 shows this approximate relationships for five different levels of current. Based on the linearity of the relationship, the graph results can be interpolated for additional levels of output current. For output voltages ranging from 2 to 3 volts, a good approximation of the input RMS current is 1/2 the output current. APPROXIMATE INPUT RMS CURRENT (A) 10 IOUT = 16A 8 IOUT = 14A IOUT = 10A 4 2 0 R8 V VCC – VTT = 1.5V Þ ⎛ 1 + --------⎞ ⎝ R9⎠ R10 V VCC – MCH = 1.8V Þ ⎛ 1 + -----------⎞ ⎝ R11⎠ The HIP6021 gives the user the option to override the internal resistors and adjust the output voltage based on the chip’s internal bandgap voltage reference. By grounding the FIX pin (pin 2), simple resistor value changes allow for outputs as low as 1.3V or as high as the input voltage. The steady-state DC output voltages can be set using the following equations: IOUT = 12A 6 The HIP6020 linear controller outputs (VCC_VTT and VCC_MCH) are set by internal resistor dividers to 1.5V and 1.8V respectively. The output levels can be increased by adding external resistors to the VSEN lines per the following equations: Note that the resistor values used should be no more than 5kΩ in total value. If this is not met, the internal resistor values will induce some degree of offset in the output voltages. VIN = 5V IOUT = 18A out JP5 will allow the internal pullup to hold the SELECT pin at a TTL high. R9 V VCC – VTT = V REF Þ ⎛ 1 + -----------⎞ ⎝ R10⎠ 0 1 2 3 4 5 OUTPUT VOLTAGE (V) FIGURE 10. SWITCHING CONVERTER RMS INPUT CURRENT Using the above graph and the capacitor RMS current rating, a minimum number of input capacitors can be easily determined. If the time-averaged load is different than the maximum load, the number of input capacitors may be cautiously scaled down. Output Voltages The synchronous buck converter supplying the microprocessor core voltage is controlled by the internal DAC. Output voltage can be adjusted by selecting the appropriate VID jumper combination. For more information please refer to the HIP6020 or HIP6021 data sheet which contains a very comprehensive table detailing all the VID combinations and the resultant output voltages. If droop implementation is desired, the no-load output voltage can be determined from the following equation: R11 V VCC – CLK = V REF Þ ⎛ 1 + -----------⎞ , where ⎝ R12⎠ Left open, the FIX pin is pulled high internally and the fixed 1.5V and 1.8V outputs are enabled. Conclusion The HIP6020/21EVAL1 board lends itself to a wide variety of high-power DC-DC microprocessor converter designs. The built-in flexibility allows the designer to quickly modify for applications with various requirements, the printed circuit board being laid out to accommodate the necessary components for operation at currents up to 19A. References For Intersil documents available on the web, see http://www.intersil.com/ [1] HIP6020 Data Sheet, Intersil Corporation, FN4683 R4 + R5 V VCC – CORE = V DAC Þ ⎛ 1 + ----------------------⎞ ⎝ R7 ⎠ HIP6020EVAL1 R5 + R6 V VCC – CORE = V DAC Þ ⎛ 1 + ----------------------⎞ ⎝ R8 ⎠ HIP6021EVAL1 where VDAC = DAC-set output voltage target. The AGP bus voltage is controlled by the SELECT pin. A TTL low inputs sets the internal resistor dividers for 1.5V output and a TTL high sets the AGP output to 3.3V. Leaving 5 VREF = HIP6021 internal reference voltage (typically 1.267V) [2] HIP6021 Data Sheet, Intersil Corporation, FN4684 [3] Slot 1 Test Kit, Intel # EUCDSLOTKIT1 Application Note 9836 HIP6020EVAL1 Schematic +12VIN F1 15A +5VIN L1 1μH + F2 SPARE C1-7 7X1000μF R1 750 C8 1μF C9 1μF GND GND VCC R2 GND OCSET2 28 9 R3 23 2.7K Q3 HUF76107D3S VCC_VDDQ TP2 (3.3V OR 1.5V) 8 R18 TP3 L2 68 6.2μH + C10-12 3x1000μF UGATE2 PHASE2 27 2 26 VSEN2 SELECT +3.3VIN 10 24 11 22 U1 21 HIP6020 JP5 C25 + 1000μF 3 2 JP6 VAUX DRIVE3 TP6 (1.5V) 0 + VSEN3 20 16 18 7 19 6 R9 SPARE C28,29 2x1000μF 5 4 3 TP8 Q5 HUF76107D3S DRIVE4 R10 VCC_MCH (1.8V) + Q1,2 HUF76143S3S UGATE1 TP4 LGATE1 VSEN4 0 R11 SPARE C30,31 2x1000μF 12 VCC5 FB1 COMP1 VID0 R5 1.62K C26 10pF C24 0.22μF C27 R6 R7 2.7nF 150K 499K JP1 VID2 JP2 VID3 JP3 VID4 JP4 VID[1] VID[3] VID[0] VID[2] VID[4] SS 14 C32 0.1μF 13 17 13 FAULT/RT R12 PB1 SHUTDOWN 100 R17 51K R13 SPARE CR2 R16 5.1K 1N4148 TP9 JP7 1 6 3 Q6A 2 1/2 RF1K49154 JP0 VID1 +5VSB R15 5.1K + VSEN1 GND TP9 C13-20 8x1000μF R4 10.2K PGND TP7 15 +5VIN PS-ON TP5 VCC_CORE (1.3V TO 3.5V) L3 PHASE1 1 Q4 HUF76107D3S R8 PWRGOOD PGOOD 4.2μH 25 VCC_VTT LP1 TP1 1K 1 CR1 MBRD835L +5VIN OCSET1 Q6B 1/2 RF1K49154 +12VIN R14 SPARE CONNECTIONS TO PROCESSOR SLOT1 AND ATX POWER CONNECTORS NOT SHOWN FOR CLARITY ALL ELECTRICAL CIRCUIT NODES DENOTED BY THE SAME NAME ARE, HOWEVER, GALVANICALLY CONNECTED Application Note 9836 HIP6021EVAL1 Schematic +12VIN F1 15A +5VIN L1 1μH PB1 F2 SPARE + SHUTDOWN R2 50K C7 1μF C8 +3.3VIN C1-6 6x1000μF R1 750 C9 1μF 10nF GND GND VCC SD GND 28 9 8 VCC_VDDQ (3.3V OR 1.5V) TP2 Q3 HUF76121D3S DRIVE2 FIX + 27 2 26 VSEN2 SELECT 10 24 11 22 U1 21 HIP6021 JP5 C24 + 1000μF 3 +5VIN JP6 2 (1.5V) 0 + VAUX DRIVE3 TP5 R9 VSEN3 20 16 18 7 19 6 R10 SPARE C27,28 2x1000μF 5 4 3 TP7 Q5 HUF76107D3S DRIVE4 R11 VCC_MCH (1.8V) + PWRGOOD PGOOD Q1,2 HUF76143S3S UGATE1 TP3 TP4 VCC_CORE (1.3V TO 3.5V) L3 PHASE1 LGATE1 VSEN4 0 VSEN1 FB1 COMP1 12 17 GND TP8 C23 0.22μF C26 R7 R8 2.7nF 150K 499K JP0 VID1 JP1 VID2 JP2 VID3 JP3 VID4 JP4 SS 14 +5VIN VCC5 VID0 R6 1.62K C25 10pF TP6 15 R12 SPARE C30,31 2x1000μF + C12-19 8x1000μF R5 10.2K PGND 1 Q4 HUF76107D3S VCC_VTT TP1 1K 4.2μH 25 +3.3VIN OCSET1 1 R4 SPARE C10,11 2x1000μF LP1 R3 23 R17 51K 13 VID[1] VID[3] C29 VID[0] VID[2] VID[4] 0.1μF FAULT/RT R13 R14 SPARE +12VIN SPARE +5VSB R15 5.1K R16 5.1K 1N4148 TP9 PS-ON CR1 JP7 1 7 3 Q6A 2 1/2 RF1K49154 Q6B 1/2 RF1K49154 CONNECTIONS TO PROCESSOR SLOT1 AND ATX POWER CONNECTORS NOT SHOWN FOR CLARITY ALL ELECTRICAL CIRCUIT NODES DENOTED BY THE SAME NAME ARE, HOWEVER, GALVANICALLY CONNECTED Application Note 9836 Bill of Materials for HIP6020EVAL1 REF PART # DESCRIPTION PACKAGE QTY VENDOR C1-7,10-20, 25, 28-31 EEUFA1A10 Aluminum Capacitor, 10V, 1000μF Radial 8x20 22 Panasonic C8, 9 1206YZ105MAT1A Ceramic Capacitor, X7S, 16V, 1.0μF 1206 2 AVX C24 0.22μF Ceramic Ceramic Capacitor, X7R, 16V 1206 1 AVX C26 10pF Ceramic Ceramic Capacitor, X7R, 25V 0805 1 Various C27 2.7nF Ceramic Ceramic Capacitor, X7R, 16V 0805 1 Various C32 0.1μF Ceramic Ceramic Capacitor, X7R, 16V 0805 1 Various C21-23 Spares CR1 MBRD835L Schottky Rectifier D-PAK 1 Motorola CR2 1N4148 Silicon Rectifier, 100mA, 75V DO-35 1 Motorola F1 251015A Miniature Fuse, 15A Axial 1 Littelfuse F2 spare J1 71796-0005 145251-1 Slot 1 Edge Connector 1 Molex AMP J2 39-29-9203 20-pin Mini-Fit, Jr. Header Connector 1 Molex JP0-4, 5, 7 68000-236 Jumper Header 0.1” spacing 15/36 Berg 71363-102 Jumper Shunt 0.1” spacing 7 Berg JP6 19AWG Jumper, Ni-Plated Copper Conductor populated 1-2 L1 PO720 1μH Inductor, 7T of 16AWG on T50-52 Core Wound Toroid 18x18x9 1 Pulse L2 PO561 6.2μH Inductor, 12T of 19AWG on T44-52 Core Wound Toroid 15x15x8 1 Pulse 4.2μH Inductor, 9T of 16AWG on T68-52A Core Wound Toroid 22x22x10 1 Radial 8x20 Axial L3 LP1 L63111CT-ND Miniature LED, Through-Board Indicator 1 Digikey Q1, Q2 HUF76143S3S UltraFET MOSFET, 30V, 5.5mΩ TO-263AB 2 Intersil Corporation Q3-5 HUF76107D3S UltraFET MOSFET, 30V, 52mΩ TO-252AA 3 Intersil Corporation Q6 RF1K49154 MegaFET MOSFET, 60V, VGS(MIN) = 2V, 130mΩ SO-8 1 Intersil Corporation PB1 P8007S-ND Push-Button, Miniature 1 Digikey R1 750Ω Resistor, 5%, 0.1W 0805 1 Various R2 2.7kΩ Resistor, 5%, 0.1W 0805 1 Various R3 1kΩ Resistor, 5%, 0.1W 0805 1 Various R4 10.2kΩ Resistor, 1%, 0.1W 0805 1 Various R5 1.62kΩ Resistor, 1%, 0.1W 0805 1 Various R6 150kΩ Resistor, 5%, 0.1W 0805 1 Various R7 499kΩ Resistor, 1%, 0.1W 0805 1 Various R8,10 0Ω Shorting Resistor, 0.1W 0805 2 Various R12 100Ω Resistor, 5%, 0.1W 0805 1 Various R15,16 5.1kΩ Resistor, 5%, 0.1W 0805 2 Various R17 51kΩ Resistor, 5%, 0.1W 0805 1 Various R18 68Ω Resistor, 5%, 0.1W 0805 1 Various 8 Application Note 9836 Bill of Materials for HIP6020EVAL1 REF (Continued) PART # DESCRIPTION PACKAGE QTY VENDOR R9,11,13,14 Spares TP1, 3, 4, 7, 9, 10 SPCJ-123-01 Test Point 6 Jolo TP2, 5, 6, 8 1314353-00 Test Point, Scope Probe 4 Tektronics U1 HIP6020CB Dual PWM and Dual Linear Controller 1 Intersil Corporation SJ-5003SP BLACK BUMPON 5 3M 1514-2 Terminal Post 14 Keystone +5V, +12V, +3.3V, GND, VCC_CORE, VCC_VDDQ, VCC_VTT, VCC_MCH 0805 SOIC-28 Bill of Materials for HIP6021EVAL1 REF PART # DESCRIPTION PACKAGE QTY VENDOR C1-6,10-19, 24, 27, 28, 30, 31 EEUFA1A10 Aluminum Capacitor, 10V, 1000μF Radial 8x20 20 Panasonic C7,9 1206YZ105MAT1A Ceramic Capacitor, X7S, 16V, 1.0μF 1206 2 AVX C8 10nF Ceramic Ceramic Capacitor, X7R, 25V 0805 1 Various C23 0.22μF Ceramic Ceramic Capacitor, X7R, 16V 1206 1 AVX C25 10pF Ceramic Ceramic Capacitor, X7R, 25V 0805 1 Various C26 2.7nF Ceramic Ceramic Capacitor, X7R, 16V 0805 1 Various C29 0.1μF Ceramic Ceramic Capacitor, X7R, 16V 0805 1 Various C20-22 spares CR1 1N4148 Silicon Rectifier, 100mA, 75V DO-35 1 Motorola F1 251015A Miniature Fuse, 15A Axial 1 Littelfuse F2 spare J1 71796-0005 145251-1 Slot 1 Edge Connector 1 Molex AMP J2 39-29-9203 20-pin Mini-Fit, Jr. Header Connector 1 Molex JP0-4, 5, 7 68000-236 Jumper Header 0.1” spacing 15/36 Berg 71363-102 Jumper Shunt 0.1” spacing 7 Berg JP6 19AWG Jumper, Ni-Plated Copper Conductor populated 1-2 L1 PO720 1μH Inductor, 7T of 16AWG on T50-52 Core Wound Toroid 18x18x9 1 Pulse 4.2μH Inductor, 9T of 16AWG on T68-52A Core Wound Toroid 22x22x10 1 Radial 8x20 Axial L3 LP1 L63111CT-ND LED, Through-Board Indicator 1 Digikey Q1, Q2 HUF76143S3S UltraFET MOSFET, 30V, 5.5mΩ TO-263AB 2 Intersil Corporation Q3 HUF76121D3S UltraFET MOSFET, 30V, 21mΩ TO-252AA 1 Intersil Corporation Q4, 5 HUF76107D3S UltraFET MOSFET, 30V, 52mΩ TO-252AA 2 Intersil Corporation Q6 RF1K49154 MegaFET MOSFET, 60V, VGS(MIN) = 2V, 130mΩ SO-8 1 Intersil Corporation PB1 P8007S-ND Push-Button, Miniature 1 Digikey 9 Application Note 9836 Bill of Materials for HIP6021EVAL1 REF (Continued) PART # DESCRIPTION PACKAGE QTY VENDOR R1 750Ω Resistor, 5%, 0.1W 0805 1 Various R2 51kΩ Resistor, 5%, 0.1W 0805 1 Various R3 1kΩ Resistor, 5%, 0.1W 0805 1 Various R5 10.2kΩ Resistor, 1%, 0.1W 0805 1 Various R6 1.62kΩ Resistor, 1%, 0.1W 0805 1 Various R7 150kΩ Resistor, 5%, 0.1W 0805 1 Various R8 499kΩ Resistor, 1%, 0.1W 0805 1 Various R9,11 0Ω Shorting Resistor, 0.1W 0805 2 Various R15,16 5.1kΩ Resistor, 5%, 0.1W 0805 2 Various R17 51kΩ Resistor, 5%, 0.1W 0805 1 Various R10,12-14 Spares TP1, 3, 6, 8, 9 SPCJ-123-01 Test Point 5 Jolo TP2, 4, 5, 7 1314353-00 Test Point, Scope Probe 4 Tektronics U1 HIP6021CB PWM and Triple Linear Controller 1 Intersil Corporation SJ-5003SP BLACK BUMPON 5 3M 1514-2 Terminal Post 14 Keystone +5V, +12V, +3.3V, GND, VCC_CORE, VCC_VDDQ, VCC_VTT, VCC_MCH 0805 SOIC-28 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 10