isl71841seh eldrs test report

Test Report 011
Total Dose Testing of the ISL71841SEH 32-Channel
Analog Multiplexer
Introduction
This report provides results of a low and high dose rate total
dose test of the ISL71841SEH 32-channel analog multiplexer.
The test was conducted in order to determine the sensitivity of
the part to the total dose environment and to determine if any
dose rate sensitivity exists. High and low dose rate testing
under bias and with all pins grounded is complete through
150krad(Si) and a subsequent high temperature biased
anneal for 168 hours at +100°C.
Reference Documents
• MIL-STD-883 test method 1019
• ISL71841SEH datasheet.
• Standard Microcircuit Drawing (SMD) 5962-15220
Part Description
The ISL71841SEH is a radiation hardened 32-channel analog
multiplexer that is fabricated using Intersil's proprietary P6SOI
Silicon on Insulator (SOI) process to mitigate single-event
effects and improve total ionizing dose performance. The part
operates from a dual supply voltage ranging from ±10.8V to
±16.5V and has five address inputs and an ENABLE pin that
can be driven with adjustable logic thresholds to select 1 of 32
available channels. An inactive channel is separated from an
active channel by high impedance, which inhibits any
interaction between them. The ISL71841SEH's low switch
ON-resistance (rON) allows improved signal integrity and
reduced power losses. The ISL71841SEH is also designed for
cold sparing, making it suitable for high reliability applications
that have redundancy requirements. The part is designed to
provide a high impedance to the analog source while in a
powered OFF condition, making it easy to add additional
backup devices without loading signal sources. The
ISL71841SEH also incorporates input analog overvoltage
protection up to ±35V, which will disable the switch to protect
downstream devices. All inputs are Electrostatic Discharge
(ESD) protected to 8kV Human Body Model (HBM). The
ISL71841SEH is available in a 48 Ld package ceramic quad
flatpack or in die form and operates across the extended
temperature range of -55°C to +125°C.
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1
As the 32-channel ISL71841SEH analog multiplexer is an
evolution of several earlier 16-channel devices, a brief
historical note may be in order. The first Intersil 16-channel
analog multiplexer was the HS-1840RH. This part was built in
an early dielectrically isolated metal gate CMOS process and
was obsoleted in the 1995 time frame.
The HS-1840RH was followed by the HS-1840ARH, which was
designed in the later dielectrically isolated RSG process and
was developed in order to continue supplying this very popular
part, which performs a key function in many space systems. As
part of the redesign the HS-1840ARH gained some
functionality made possible by the bipolar devices available in
RSG, which the metal gate process did not support. Bipolar
circuit blocks in the HS-1840ARH included the on-chip voltage
reference, the digital input ESD network and the VDD and VSS
ESD nets.
The ISL71841SEH is the subject of the present report and was
designed as a 32-channel version of the ISL71840SEH,
sharing improvements in the switch ON-resistance and in cold
sparing capabilities with that part. A block diagram is shown in
Figure 1 on page 2.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015, 2016. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
Test Report 011
VDD
A0
IN1
1
OUT
A1
A2
A3
A4
IN32
32
EN
VSS
ADDRESS INPUT BUFFER
AND LEVEL SHIFTER
DECODERS
MULTIPLEX SWITCHES
FIGURE 1. ISL71841SEH BLOCK DIAGRAM
Test Description
Irradiation Facilities
High dose rate testing was performed at 69.7rad(Si)/s using a
Gamma cell 22060Co irradiator located in the Palm Bay, Florida
Intersil facility. Low dose rate testing was performed at
0.0089rad(Si)/s using a Hopewell Designs N40 panoramic low
dose rate 60Co irradiator located in the same facility. The
irradiations were performed in accordance with MIL-STD-883
Method 1019. The low dose rate exposures used a PbAl box to
shield the test board and devices under test against low energy
secondary gamma radiation as required by TM1019. The biased
anneals were carried out in a small temperature chamber.
Test Fixturing
Figure 2 on page 3 shows the configuration and power supply
sequencing used for biased irradiation.
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Test Report 011
233032-005-665
ISL71841 (HDR/LDR) Mask # 54253A01
R1
6
(S13)
5
(S14)
3
(S16)
2
1
N/C
(Out)
48
47
N/C
N/C
46
45
44
43
(S32)
(S31)
(S30)
(S29)
GND
7 (S12)
(S28) 42
8 (S11)
(S27) 41
9 (S10)
(S26) 40
1.)
2.)
3.)
4.)
5.)
V1 = +16.5v, +/- 0.1v
V2 = -16.5v, +/-0.1v
V3 = +5.5v, +/-0.1v
R1 = 1kOhm, +/-5%, ¼ Watt (Per socket)
Socket is 48 pin flatpack (Sensata 6290482315-001)
6.) Power up sequence is V1, V2, V3.
7.) Reverse order for power down(V3, V2, V1).
10 (S9)
11 (S8)
12 (S7)
13 (S6)
14 (S5)
V1
4
(S15)
(S25) 39
(S24) 38
(S23) 37
(S22) 36
(S21) 35
15 (S4)
(S20) 34
16 (S3)
(S19) 33
17 (S2)
(S18) 32
18 (S1)
(S17) 31
(Vdd)
19
V3
(Vref)
20
(A0)
21
(A1)
22
(A2)
23
(A3)
24
(A4)
25
N/C
26
N/C
27
(En_B)
28
f1
(Gnd)
29
(Vss)
30
V2
GND
FIGURE 2. IRRADIATION BIAS CONFIGURATION AND POWER SUPPLY SEQUENCING FOR THE ISL71841SEH
Characterization Equipment and Procedures
Downpoints
All electrical testing was performed outside the irradiator using
production Automated Test Equipment (ATE) with datalogging of
all parameters at each downpoint. All downpoint electrical
testing was performed at room temperature.
Downpoints for the low dose rate tests were zero, 10krad(Si),
30krad(Si), 50krad(Si), 100krad(Si) and 150krad(Si).
Downpoints for the high dose rate test were zero, 30krad(Si),
50krad(Si), 100krad(Si) and 150krad(Si). All samples were
subjected to a high temperature biased anneal for 168 hours at
+100°C following irradiation, using the Figure 2 bias
configuration.
Experimental Matrix
Testing proceeded in accordance with the guidelines of
MIL-STD-883 TM1019. The experimental matrix consisted of four
samples irradiated at high dose rate under bias, four samples
irradiated at high dose rate with all pins grounded, five samples
irradiated at low dose rate under bias and five samples irradiated
at low dose rate with all pins grounded. Three control units were
used to insure repeatable data (See Table 1).
Results
Attributes Data
Table 1 on page 4 summarizes the results of total dose testing of
the ISL71841SEH.
Samples of the ISL71841SEH were drawn from wafers, 2 (high
dose rate samples) and wafers 1, 2 and 5 (low dose rate
samples) from development lot J67669 and were packaged in
the production hermetic quad flatpack package outline K48.A.
The samples were processed through the standard burn-in cycle
and were screened to the SMD 5962-15220 electrical limits at
room, low and high temperatures before irradiation.
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Test Report 011
TABLE 1. ISL71841SEH TOTAL DOSE TEST ATTRIBUTES DATA
DOSE RATE
BIAS
SAMPLE SIZE
DOWNPOINT
BIN 1
0.0085rad(Si)/s
Figure 2
13
Preirradiation
13
10krad(Si)
13
0
30krad(Si)
13
0
50krad(Si)
13
0
100krad(Si)
13
0
150krad(Si)
13
0
Anneal, 168 hours at +100°C
10
3
Preirradiation
13
10krad(Si)
13
0
30krad(Si)
13
0
50krad(Si)
13
0
100krad(Si)
13
0
150krad(Si)
12
1
Anneal, 168 hours at +100°C
11
2
Preirradiation
4
30krad(Si)
4
0
50krad(Si)
4
0
100krad(Si)
4
0
150krad(Si)
4
0
Anneal, 168 hours at +100°C
4
0
Preirradiation
4
30krad(Si)
4
0
50krad(Si)
4
0
100krad(Si)
4
0
150krad(Si)
4
0
Anneal, 168 hours at +100°C
4
0
0.0085rad(Si)/s
69.7rad(Si)/s
69.7rad(Si)/s
Grounded
Figure 2
Grounded
13
4
4
REJECTS
NOTES:
1. Bin 1 indicates a device that passes all preirradiation specification limits.
2. The 168 hours anneal was performed at +100°C using the bias configuration shown in Figure 2.
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Test Report 011
Variables Data
(Figure 13) and the median and minimum/maximum error bars
for the high dose rate case (Figure 14).
The plots in Figures 3 through 44 show data at all downpoints.
The plots show the population median of key parameters as a
function of total dose for each of the four irradiation conditions.
We chose to plot the median because of the small sample sizes
involved and also because the very tight distributions for all
parameters. The exceptions to this approach are the plots for the
ON-resistance flatness; this parameter showed failures at the
150krad(Si) low dose rate level and after anneal. We show the
population median (Figure 12) for both dose rates, the median
and minimum/maximum error bars for the low dose rate case
Most of the plots show the total dose response of the average of
the medians of each of the 32 channels of parameters such as
ON-resistance, the digital input parameters and the various
leakage parameters for each of the 32 channels in order to
facilitate the interpretation of the results as well as managing
the length of this report. See conclusion on page 47 for further
discussion.
Variables Data Plots
450
400
POSITIVE SUPPLY CURRENT (µA)
350
300
250
200
150
LDR Biased
LDR GND
100
HDR Biased
HDR GND
50
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 3. Median ISL71841SEH positive supply current as a function of total dose irradiation at high and low dose rate for the biased (per
Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limit is 400µA maximum.
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Variables Data Plots (Continued)
0
LDR Biased
LDR GND
-50
HDR Biased
HDR GND
NEGATIVE SUPPLY CURRENT (µA)
-100
Spec limit
-150
-200
-250
-300
-350
-400
-450
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 4. Median ISL71841SEH negative supply current as a function of total dose irradiation at high and low dose rate for the biased
(per Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is -400µA minimum.
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Variables Data Plots (Continued)
450
400
POSITIVE STANDBY CURRENT (µA)
350
300
250
200
150
LDR Biased
100
LDR GND
HDR Biased
50
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 5. Median ISL71841SEH positive standby current as a function of total dose irradiation at high and low dose rate for the biased (per
Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limit is 400µA maximum.
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Variables Data Plots (Continued)
0
LDR Biased
LDR GND
-50
HDR Biased
HDR GND
NEGATIVE STANDBY CURRENT (µA)
-100
Spec limit
-150
-200
-250
-300
-350
-400
-450
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 6. Median ISL71841SEH negative standby current as a function of total dose irradiation at high and low dose rate for the biased
(per Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is -400µA minimum.
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Variables Data Plots (Continued)
40
35
REFERENCE CURRENT (µA)
30
25
20
15
LDR Biased
10
LDR GND
HDR Biased
5
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 7. Median ISL71841SEH reference current as a function of total dose irradiation at high and low dose rate for the biased (per Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limit is 35µA maximum.
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Variables Data Plots (Continued)
800
700
ON-RESISTANCE (Ω)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 8. ISL71841SEH ON-resistance, average of the medians of all 32 channels, ±15 V supplies, 1.0mA output current, 15.0V input voltage,
as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The
low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal
at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation
SMD limit is 700Ω maximum.
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Variables Data Plots (Continued)
600
LDR Biased
LDR GND
HDR Biased
500
HDR GND
Spec limit
ON-RESISTANCE (Ω)
400
300
200
100
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 9. ISL71841SEH ON-resistance, average of the medians of all 32 channels, ±15 V supplies, 1.0mA output current, 5.0V input voltage, as
a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low
dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at
+100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD
limit is 500Ω maximum.
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Variables Data Plots (Continued)
800
LDR Biased
LDR GND
700
HDR Biased
HDR GND
600
Spec limit
ON-RESISTANCE (Ω)
500
400
300
200
100
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 10. ISL71841SEH ON-resistance, average of the medians of all 32 channels, ±15V supplies, 1.0mA output current, -15.0V input voltage,
as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The
low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal
at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation
SMD limit is 700Ω maximum.
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Variables Data Plots (Continued)
600
LDR Biased
LDR GND
HDR Biased
500
HDR GND
Spec limit
ON-RESISTANCE (Ω)
400
300
200
100
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 11. ISL71841SEH ON resistance, average of the medians of all 32 channels, ±15V supplies, 1.0mA output current, -5.0V input voltage, as
a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low
dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at
+100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD
limit is 500Ω maximum.
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Variables Data Plots (Continued)
25
LDR Biased
LDR GND
HDR Biased
20
HDR GND
ON-RESISTANCE (Ω)
Spec limit
15
10
5
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 12. ISL71841SEH ON resistance match, average of the medians of all 32 channels, ±15V supplies, -1.0mA output current, +5.0V input
voltage, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded)
cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour
biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The
post-irradiation SMD limit is 20Ω maximum.
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Variables Data Plots (Continued)
30
Biased
LOW DOSE RATE
Grounded
25
Spec limit
ON-RESISTANCE (Ω)
20
15
10
5
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si)) AT LOW DOSE RATE
FIGURE 13. ISL71841SEH ON resistance match, average of the medians of all 32 channels and plotting min/max error bars as well, ±15V
supplies, -1.0mA output current, +5.0V input voltage, as a function of total dose irradiation at low dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limit is 20Ω maximum.
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Variables Data Plots (Continued)
25
Biased
HIGH DOSE RATE
Grounded
Spec limit
ON-RESISTANCE (Ω)
20
15
10
5
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si)) AT HIGH DOSE RATE
FIGURE 14. ISL71841SEH ON-resistance match, average of the medians of all 32 channels and plotting min/max error bars as well, ±15V
supplies, -1.0mA output current, +5.0V input voltage, as a function of total dose irradiation at high dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limit is 20Ω maximum.
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Variables Data Plots (Continued)
25
LDR Biased
LDR GND
HDR Biased
20
HDR GND
ON-RESISTANCE (Ω)
Spec limit
15
10
5
0
0
50
100
150
200
ANNEAL
TOTAL DOSE (krad(Si))
FIGURE 15. ISL71841SEH ON-resistance match, average of the medians of all 32 channels, ±15V supplies, -1.0mA output current, -5.0V input
voltage, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded)
cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour
biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The
post-irradiation SMD limit is 20Ω maximum.
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Variables Data Plots (Continued)
30
LDR Biased
LDR GND
HDR Biased
25
HDR GND
Spec limit
ON-RESISTANCE (Ω)
20
15
10
5
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 16. ISL71841SEH ON-resistance flatness, average of the medians of all 32 channels, ±15V supplies, -1.0mA output current, -5.0V input
voltage, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and unbiased (all pins grounded)
cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour
biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high dose rate cells was 4. The
post-irradiation SMD limit is 25Ω maximum.
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Variables Data Plots (Continued)
150
100
SWITCH OFF LEAKAGE (nA)
50
0
-50
LDR Biased
LDR GND
HDR Biased
-100
HDR GND
Spec limit
Spec limit
-150
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 17. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input voltage +11.5V, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -100nA to 100nA.
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Variables Data Plots (Continued)
150
100
SWITCH OFF LEAKAGE (nA)
50
0
-50
LDR Biased
LDR GND
HDR Biased
-100
HDR GND
Spec limit
Spec limit
-150
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 18. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input voltage -11.5V as a function of total dose irradiation at high and low dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -100nA to 100nA.
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Variables Data Plots (Continued)
1000
800
600
SWITCH OFF LEAKAGE (nA)
400
200
0
-200
-400
LDR Biased
LDR GND
-600
HDR Biased
HDR GND
-800
Spec limit
Spec limit
-1000
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 19. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input overvoltage +35.0V, as a function of total dose irradiation at high and low dose rate for the biased
(Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limits are -750nA to +750nA.
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21
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
1000
800
600
SWITCH OFF LEAKAGE (nA)
400
200
0
-200
-400
LDR Biased
LDR GND
-600
HDR Biased
HDR GND
Spec limit
-800
Spec limit
-1000
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 20. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input overvoltage -35.0V, as a function of total dose irradiation at high and low dose rate for the biased
(Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limits are -750nA to +750nA.
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22
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
600
400
SWITCH OFF LEAKAGE (nA)
200
0
-200
LDR Biased
LDR GND
HDR Biased
-400
HDR GND
Spec limit
Spec limit
-600
0
50
100
150
200
ANNEAL
TOTAL DOSE (krad(Si))
FIGURE 21. ISL71841SEH switch OFF leakage (ID(OFF)) into the drain of an unselected channel, average of the medians of all 32 channels, supply
voltage ±15.0V, input overvoltage +35.0V, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -500nA to +500nA.
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23
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
600
400
SWITCH OFF LEAKAGE (nA)
200
0
-200
LDR Biased
LDR GND
HDR Biased
-400
HDR GND
Spec limit
Spec limit
-600
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 22. ISL71841SEH switch OFF leakage (ID(OFF)) into the drain of an unselected channel, average of the medians of all 32 channels, supply
voltage ±15.0V, input overvoltage -35.0V, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and
unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -500nA to +500nA.
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24
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
600
400
SWITCH ON LEAKAGE (nA)
200
0
-200
LDR Biased
LDR GND
HDR Biased
-400
HDR GND
Spec limit
Spec limit
-600
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 23. ISL71841SEH switch ON leakage (IS(ON)) into the source of a selected channel, average of the medians of all 32 channels, supply
voltage ±15.0V, input overvoltage +35.0V, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2)
and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -500nA to +500nA.
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25
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
600
400
SWITCH ON LEAKAGE (nA)
200
0
-200
LDR Biased
LDR GND
HDR Biased
-400
HDR GND
Spec limit
Spec limit
-600
0
50
100
150
200
ANNEAL
TOTAL DOSE (krad(Si))
FIGURE 24. ISL71841SEH switch ON leakage (IS(ON)) into the source of a selected channel, average of the medians of all 32 channels, supply
voltage ±15.0V, input overvoltage -35.0V, as a function of total dose irradiation at high and low dose rate for the biased (Figure 2) and
unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s. Irradiations
were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for the high
dose rate cells was 4. The post-irradiation SMD limits are -500nA to +500nA.
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26
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
150
100
SWITCH OFF LEAKAGE (nA)
50
0
-50
LDR Biased
LDR GND
HDR Biased
-100
HDR GND
Spec limit
Spec limit
-150
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 25. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels, with
supply, address and ENABLE pins open, input voltage +25.0V, as a function of total dose irradiation at high and low dose rate for the
biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -100nA to +100nA.
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27
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
150
100
SWITCH OFF LEAKAGE (nA)
50
0
-50
LDR Biased
LDR GND
HDR Biased
-100
HDR GND
Spec limit
Spec limit
-150
0
50
100
150
200
ANNEAL
TOTAL DOSE (krad(Si))
FIGURE 26. ISL71841SEH switch OFF leakage (IS(OFF)) into the source of an unselected channel, average of the medians of all 32 channels, with
supply, address and ENABLE pins open, input voltage -25.0V, as a function of total dose irradiation at high and low dose rate for the
biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -100nA to +100nA.
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28
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
600
400
SWITCH ON LEAKAGE (nA)
200
0
-200
LDR Biased
LDR GND
HDR Biased
-400
HDR GND
Spec limit
Spec limit
-600
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 27. ISL71841SEH switch ON leakage (ID(ON)) into the source and drain of a selected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input and output voltage 11.6V, as a function of total dose irradiation at high and low dose rate for the biased
(Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limits are -500nA to +500nA.
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29
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
150
100
SWITCH ON LEAKAGE (nA)
50
0
-50
LDR Biased
LDR GND
HDR Biased
-100
HDR GND
Spec limit
Spec limit
-150
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 28. ISL71841SEH switch ON leakage (ID(ON)) into the source and drain of a selected channel, average of the medians of all 32 channels,
supply voltage ±15.0V, input and output voltage -11.6V, as a function of total dose irradiation at high and low dose rate for the biased
(Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and sample size for
the high dose rate cells was 4. The post-irradiation SMD limits are -100nA to +100nA.
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30
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
100
80
60
SWITCH OFF LEAKAGE (nA)
40
20
0
-20
-40
LDR Biased
LDR GND
-60
HDR Biased
HDR GND
-80
Spec limit
Spec limit
-100
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 29. ISL71841SEH switch OFF leakage (ID(OFF)) into the drain with the part disabled, average of the medians of all 32 channels, supply
voltage ±15.0V, output voltage +10.0V, input voltage -10.0V, as a function of total dose irradiation at high and low dose rate for the
biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -80nA to +80nA.
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31
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
100
80
60
SWITCH OFF LEAKAGE (nA)
40
20
0
-20
-40
LDR Biased
LDR GND
-60
HDR Biased
HDR GND
-80
Spec limit
Spec limit
-100
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 30. ISL71841SEH switch OFF leakage (ID(OFF)) into the drain with the part disabled, average of the medians of all 32 channels, supply
voltage ±15.0V, output voltage -10.0V, input voltage +10.0V, as a function of total dose irradiation at high and low dose rate for the
biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -80nA to +80nA.
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32
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tALH (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 31. ISL71841SEH address to output access time, LOW to HIGH, supply voltage ±15.0V, as a function of total dose irradiation at high and
low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high
dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate
cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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33
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tALH (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 32. ISL71841SEH address to output access time, HIGH to LOW, supply voltage ±15.0V, as a function of total dose irradiation at high and
low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high
dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate
cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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34
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
450
LDR Biased
LDR GND
400
HDR Biased
HDR GND
Spec limit
350
Spec limit
tBBM (ns)
300
250
200
150
100
50
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 33. ISL71841SEH break-before-make time delay, supply voltage ±15.0V, as a function of total dose irradiation at high and low dose rate
for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are 5ns to 400ns.
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35
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tON(EN) (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 34. ISL71841SEH enable to output ON delay, supply voltage ±15.0V, as a function of total dose irradiation at high and low dose rate for
the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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36
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
LDR Biased
LDR GND
800
HDR Biased
HDR GND
700
Spec limit
tOFF(EN) (ns)
600
500
400
300
200
100
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 35. ISL71841SEH enable to output OFF delay, supply voltage ±15.0V, as a function of total dose irradiation at high and low dose rate for
the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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37
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tALH (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 36. ISL71841SEH address to output access time, LOW to HIGH, supply voltage ±12.0V, as a function of total dose irradiation at high and
low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high
dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate
cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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38
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tAHL (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 37. ISL71841SEH address to output access time, HIGH-to-LOW, supply voltage ±12.0V, as a function of total dose irradiation at high and
low dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high
dose rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate
cells was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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39
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
450
LDR Biased
LDR GND
400
HDR Biased
HDR GND
Spec limit
350
Spec limit
tBBM (ns)
300
250
200
150
100
50
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 38. ISL71841SEH break-before-make time delay, supply voltage ±12.0V, as a function of total dose irradiation at high and low dose rate
for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limits are 5ns to 400ns.
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40
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tON(EN) (ns)
600
500
400
300
LDR Biased
200
LDR GND
HDR Biased
100
HDR GND
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 39. ISL71841SEH enable to output ON delay, supply voltage ±12.0V, as a function of total dose irradiation at high and low dose rate for
the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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41
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
900
800
700
tOFF(EN) (ns)
600
500
400
300
LDR Biased
LDR GND
200
HDR Biased
HDR GND
100
Spec limit
0
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 40. ISL71841SEH enable to output OFF delay, supply voltage ±12.0V, as a function of total dose irradiation at high and low dose rate for
the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose rate was
69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells was 13 and
sample size for the high dose rate cells was 4. The post-irradiation SMD limit is 800ns maximum.
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42
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
0.15
0.1
INPUT HIGH CURRENT (µA)
0.05
0
-0.05
LDR Biased
LDR GND
HDR Biased
-0.1
HDR GND
Spec limit
Spec limit
-0.15
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 41. ISL71841SEH input HIGH current, average of all five addresses and ENABLE, as a function of total dose irradiation at high and low
dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose
rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells
was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -0.1µA to 1.0µA.
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43
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
0.15
0.1
INPUT HIGH CURRENT (µA)
0.05
0
-0.05
LDR Biased
LDR GND
HDR Biased
-0.1
HDR GND
Spec limit
Spec limit
-0.15
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 42. ISL71841SEH input LOW current, average of all five addresses and ENABLE, as a function of total dose irradiation at high and low
dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose
rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells
was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limits are -0.1µA to 1.0µA.
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44
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
1.8
INPUT LOW VOLTAGE (V)
1.6
1.4
LDR Biased
1.2
LDR GND
HDR Biased
HDR GND
Spec limit
Spec limit
1
0
50
100
150
ANNEAL
200
TOTAL DOSE (krad(Si))
FIGURE 43. ISL71841SEH input LOW voltage, average of all five addresses and ENABLE, as a function of total dose irradiation at high and low
dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose
rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells
was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limits are 1.2V to 1.6V.
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45
TR011.1
February 25, 2016
Test Report 011
Variables Data Plots (Continued)
1.8
INPUT HIGH VOLTAGE (V)
1.6
1.4
LDR Biased
1.2
LDR GND
HDR Biased
HDR GND
Spec limit
Spec limit
1
0
50
100
150
200
ANNEAL
TOTAL DOSE (krad(Si))
FIGURE 44. ISL71841SEH input HIGH voltage, average of all five addresses and ENABLE, as a function of total dose irradiation at high and low
dose rate for the biased (Figure 2) and unbiased (all pins grounded) cases. The low dose rate was 0.0085rad(Si)/s and the high dose
rate was 69.7rad(Si)/s. Irradiations were followed by a 168-hour biased anneal at +100°C. Sample size for the low dose rate cells
was 13 and sample size for the high dose rate cells was 4. The post-irradiation SMD limits are 1.2V to 1.6V.
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46
TR011.1
February 25, 2016
Test Report 011
Conclusion
This document reports results of 60Co total dose testing of the
ISL71841SEH 32-channel analog multiplexer. Parts were tested
at low and high dose rate-under biased and unbiased conditions
as outlined in MIL-STD-883 Test Method 1019. All irradiations
were followed by a 168-hour biased anneal at +100°C.
The attributes data is presented in Table 1, while variables data
for selected parameters is presented in Figures 3 through 44.
Several rejects were encountered after the 150krad(Si) low dose
rate irradiation and subsequent anneal, for both the biased and
unbiased cases. These rejects were for the ON-resistance
flatness parameter at 5V input voltage and were marginal
failures. We plot the parameter's median in Figure 12 and have
provided additional detail in Figures 13 and 14, which show the
ON-resistance match as a function of total dose irradiation at low
dose rate only (Figure 13) and at high dose rate only (Figure 14).
The low dose rate results are clearly worst case. The postirradiation SMD limit is 20Ω maximum. The ON-resistance
flatness parameter for the -5V input voltage case showed good
stability.
There were no rejects against the Group A limits at the SMD
rating of 100krad(Si) at either dose rate, and the part is
considered low dose rate insensitive up to its SMD total dose
limits. Similarly, no differences between biased and unbiased
irradiation were noted, and the part is not considered bias
sensitive.
TABLE 2. REPORTED PARAMETER
FIGURE
PARAMETER
LIMIT LOW
LIMIT HIGH
UNIT
NOTES
3
Positive Supply Current
-
400
µA
±15V supplies
4
Negative Supply Current
-400
-
µA
±15V supplies
5
Positive Standby Supply Current
-
400
µA
±15V supplies
6
Negative Standby Supply Current
-400
-
µA
±15V supplies
7
Supply Current Into VREF
-
35
µA
±15V supplies
8
Switch ON-resistance, Average
-
500
Ω
VIN = 5V
9
Switch ON-resistance, Average
-
700
Ω
VIN = 15V
10
Switch ON-resistance, Average
-
700
Ω
VIN = -15V
11
Switch ON-resistance, Average
-
500
Ω
VIN = -5V
12
ON-resistance Match, Average
-
20
Ω
VIN = 5V
15
ON-resistance Match, Average
-
20
Ω
VIN = -5V
16
OFF Source Leakage, Average
-100
100
nA
VIN = 11.5V
17
OFF Source Leakage, Average
-100
100
nA
VIN = -11.5V
18
OFF Source Leakage, Average
-750
750
nA
35V overvoltage
19
OFF Source Leakage, Average
-750
750
nA
-35V overvoltage
20
OFF drain leakage, average
-500
500
nA
Power OFF, 35V overvoltage
21
OFF Drain Leakage, Average
-500
500
nA
Power OFF, -35V overvoltage
22
ON Source Leakage, Average
-500
500
nA
35V overvoltage
23
ON Source Leakage, Average
-500
500
nA
-35V overvoltage
24
OFF Source Leakage, Average
-100
100
nA
Power OFF
25
OFF Source Leakage, Average
-100
100
nA
Power OFF
26
ON Drain Leakage, Average
-100
100
nA
Source and drain at 10V
27
ON Drain Leakage, Average
-100
100
nA
Source and drain at -10V
28
ON Drain Leakage
-80
80
nA
Part disabled
29
ON Drain Leakage
-80
80
nA
Part disabled
31
Access Time, LOW to HIGH
-
800
ns
±15V supplies
32
Access Time, HIGH to LOW
-
800
ns
±15V supplies
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Test Report 011
TABLE 2. REPORTED PARAMETER (Continued)
33
Break-before-make Time
5
400
ns
±15V supplies
34
Enable ON to Output Delay
-
800
ns
±15V supplies
35
Enable OFF to Output Delay
-
800
ns
±15V supplies
36
Access Time, LOW-to-HIGH
-
800
ns
±12V supplies
37
Access Time, HIGH-to-LOW
-
800
ns
±12V supplies
38
Break-before-make time
5
400
ns
±12V supplies
39
Enable ON to Output Delay
-
800
ns
±12V supplies
40
Enable OFF to Output Delay
-
800
ns
±12V supplies
41
Input HIGH Current, Average
-100
100
nA
A0 – A4 and ENABLE
42
Input LOW Current, Average
-100
100
nA
A0 – A4 and ENABLE
43
Input LOW Voltage, Average
1.2
1.6
V
A0 – A4 and ENABLE
44
Input HIGH Voltage, Average
1.2
1.6
V
A0 – A4 and ENABLE
NOTE: Limits are taken from Standard Microcircuit Drawing (SMD) 5962-15220.
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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48
TR011.1
February 25, 2016