isl71841seh see test report

Test Report 007
Single Event Effects (SEE) Testing of the ISL71841SEH
32:1 30V Multiplexer
Introduction
SEE Test Facility
The intense proton and heavy ion environment encountered in
space applications can cause a variety of Single Event Effects
(SEE) in electronic circuitry, including Single Event Upset (SEU),
Single Event Transient (SET), Single Event Functional Interrupt
(SEFI), Single Event Gate Rupture (SEGR), and Single Event
Burnout (SEB). SEE can lead to system-level performance
issues including disruption, degradation and destruction. For
predictable and reliable space system operation, individual
electronic components should be characterized to determine
their SEE response. This report discusses the results of SEE
testing performed on the Intersil ISL71841SEH 32:1 analog
multiplexer (MUX) designed for space applications.
Testing was performed at the Texas A&M University (TAMU)
Cyclotron Institute heavy ion facility. This facility is coupled to a
K500 super-conducting cyclotron, which is capable of
generating a wide range of test particles with the various
energy, flux and fluence levels needed for advanced radiation
testing. Details on the test facility can be found on the TAMU
Cyclotron website. Testing was carried out on March 20, 2015
and May 30, 2015.
Product Description
The ISL71841SEHVF is a 32:1 analog multiplexer (MUX) that
operates with supply voltages from ±10.8V to ±16.5V and
input overvoltage capability to ±35V. The part is also “cold
spare” capable; i.e., inputs of an unpowered part do not leak
more than 1µA to ±35V. The ISL71841SEHVF is fabricated in a
proprietary Intersil bonded wafer SOI BiCMOS process. The
ISL71841SEHVF is a 32-Channel version of the
ISL71840SEHVF, 16:1 analog MUX.
Product Documentation
For more information about the ISL71841SEH, refer to the
following documentation.
• Datasheets:
- ISL71840SEH, “Radiation Hardened 30V 16-Channel
Analog Multiplexer”
- ISL71841SEH, “Radiation Hardened 30V 32-Channel
Analog Multiplexer”
• Standard Microcircuit Drawing (SMD):
SEE Test Setup
SEE testing is carried out with the sample in an active
configuration. A schematic of the ISL71841SEH SEE test
fixture is shown in Figure 1 on page 2. The test circuit is
configured to accept variable supply voltages and two
groupings of input voltages. The addressing of input IN22 is
accomplished with VD1 low and VD2 high. With both VD1 and
VD2 high the switches are all disabled. The output is set to half
of VIN22-GND by a resistor divider formed from VIN22 to GND
through VOUT. Of the remaining inputs, the odd numbered
ones are connected to VINO and the even numbered ones are
connected to VINE.
ISL71841SEH samples in standard ceramic flatpack packages
without lids were assembled on boards that allowed two parts
to be irradiated at one time. A 20-foot coaxial cable was used
to connect the test fixture to a switch box in the control room
which contained all of the monitoring equipment. The switch
box allowed the two test circuits to be controlled and
monitored remotely.
Digital multimeters were used to monitor pertinent voltages
and currents. LeCroy waveRunner 4-Channel digital
oscilloscopes were used to capture and store SET traces at
VOUT that exceeded the oscilloscope’s ±20mV AC trigger
setting.
- 5962-15219 - (ISL71840SEH)
- 5962-15220 - (ISL72841SEH)
• Test Reports:
- TR004, “ISL71840SEH Single Event Effects (SEE) Testing
of the ISL71840SEH 16:1 30V Mux”
SEE Test Objectives
The ISL71841SEH was tested to determine its susceptibility to
destructive single event effects (SEGR and SEB, collectively
referred to by SEB herein) and to characterize its Single Event
Transient (SET) behavior over various conditions and ion Linear
Energy Transfer (LET) levels. The ISL71841SEH parts tested
came from lot J67669.1, wafer #5 manufactured on Intersil's
proprietary P6SOI process.
June 12, 2015
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Test Report 007
VOUT
VOUT
10k
10k
IN13
IN14
IN15
IN16
NC
OUT
NC
NC
IN32
IN31
IN30
IN29
6
5
4
3
2
1
48
47
46
45
44
43
IN12 7
42 IN28
IN11 8
41 IN27
IN10 9
40 IN26
IN9 10
39 IN25
IN8 11
38 IN24
IN7 12
37 IN23
IN6 13
36 IN22
IN5 14
35 IN21
IN4 15
34 IN20
IN3 16
33 IN19
IN2 17
32 IN18
VINE
VINE
31 IN17
VINO
VINO
V+
V+ VREF
VREF VD2 VD2
23
24
25
26
VREF
A0
A1
A2
A3
A4
NC
27
28
29
30
V‐
22
GND
21
NC
20
ENb
19
V+
IN1 18
10k
10k VIN22
VIN22
VV‐ GND
GND All but VOUT with 0.1µF bypass
All but VOUT with 0.1µF bypass
ceramic capacitors to GND
ceramic capacitors to GND.
VD1
VD1 FIGURE 1. SCHEMATIC OF THE ISL71841SEHVF SEE TESTING CONFIGURATION
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Test Report 007
SEE Damage (SEB) Testing
For the destructive SEE (SEB) tests, conditions were selected to
maximize the electrical and thermal stresses on the Device
Under Test (DUT), thus insuring worst-case conditions. Two SEB
tests were run with the conditions listed in Table 1. The supply
voltages were set to the part's absolute maximum rating of
±20V. The input voltages were varied between ±17V, and ±35V to
stress the switches at relevant conditions. Case temperature was
maintained at +125°C ±10°C by controlling the current flowing
into a resistive heater bonded to the underside of the board. Four
DUTs were irradiated with 2.954GeV Au ions at normal incidence
resulting in a surface LET = 86.4MeV•cm2/mg. The normal
range into silicon for these Au ions after 30mm of air is about
118µm with a Bragg peak range of 53µm. More details can be
found on the TAMU Cyclotron website. These conditions
guaranteed ions transited all active device volume in this SOI
process (about 10µm depth). Each irradiation was to a fluence of
5x106ions/cm2. The currents into each of the voltage supplies
was measured before and after each irradiation to look for
changes indicative of permanent damage to the part.
As none of the supply currents reported in Table 2 changed by
more than measurement repeatability it is inferred that they
indicate no damage occurred due to the exposure to the ions.
Based on this, it is concluded that the part is immune to
destructive SEE effects under the conditions tested in Table 1.
TABLE 1. SEB CONDITIONS FOR TESTING THE ISL71841SEH. IRRADIATION WAS WITH 2.954 GeV Au AT 0º INCIDENCE FOR LET =
86.4MeV•cm2/mg TO A FLUENCE OF 5x106 ions/cm2.
EFFECTIVE LET
(MeV-cm2/mg)
TCASE
(°C)
V±
(V)
VINO
(V)
VINE
(V)
VIN22
(V)
VREF
(V)
VD1
(V)
VD2
(V)
Test 1
86.4 at 0º
+125
±20
+17
-17
0
20
0
20
Test 2
86.4 at 0º
+125
±20
+35
-35
0
20
0
20
TABLE 2. SEB MONITOR PARAMETERS FOR TESTING AT LET 0º = 86.4MeV•cm2/mg AND TCASE = +125ºC. EACH IRRADIATION WAS TO A FLUENCE
OF 5x106ions/cm2.
I+
(µA)
I(µA)
IINO
(nA)
IINE
(nA)
IREF
(µA)
ID2
(nA)
Pre
336
336
17
21
170
12
Post
320
320
18
21
171
12
Pre
281
281
67
72
171
12
Post
281
281
63
74
171
12
Pre
310
310
10
20
168
14
Post
310
310
11
22
168
14
Pre
280
280
64
59
169
14
Post
280
280
64
64
169
14
Pre
299
303
91
170
164
43
Post
301
300
90
180
165
41
Pre
281
282
81
119
169
12
Post
282
282
80
120
169
12
Pre
303
302
75
51
165
61
Post
303
303
88
48
165
65
Pre
290
290
18
141
171
11
Post
291
291
18
122
172
11
MONITORED PARAMETER
DUT1
Test 1
Test 2
DUT2
Test 1
Test 2
DUT3
Test 1 (Note 1)
Test 2
DUT4
Test 1 (Note 1)
Test 2
NOTE:
1. Units tested in march 2015; other units tested in May 2015.
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Test Report 007
SET Testing of ISL71841SEH 32:1
Analog MUX
SET testing was done on four samples of the ISL71841SEH.
Testing started with normal incidence gold (Au) at
LET = 86.4MeV•cm2/mg and with the SET detection threshold
set to ±20mV deviation on VOUT. Three separate conditions, as
shown in Table 3, were applied to each of the four parts tested.
Tests 1 and 2 looked for SET on VOUT with IN22 selected, while
Test 3 looked at VOUT with all switches disabled. Addressing
inputs were put at the respective VIL and VIH levels to test for
addressing upsets.
The first test, Test 1, tests the part operating at the bottom of the
recommended supply voltage range, ±10.8V. The second test
exercises the part at the maximum of the supply voltage range,
±16.5V. In both cases the VREF is set to the minimum of the
recommended operating range of 4.5V to minimize the noise
margin in the addressing circuits. The lower noise margins
makes the addressing most susceptible to a SEE leading to an
address change SET.
Table 4 summarizes the SET counts for each test by DUT and
then reports the nominal SET cross section for the complement
of all four DUTs. The cross sections reported are the nominal
found by dividing the event counts by the total fluence generating
those counts.
Post processing of the captured SET oscilloscope traces
generated the composite plots in Figures 2, 3, and 4 for the
LET = 86.4MeV•cm2/mg case. These plots show the composite
of the 20 largest and 20 longest for each sense (positive and
negative) of the extreme deviation so they reflect the worst 80
SET’s observed in the run. Figures 2 and 3 show the SET with
IN22 selected and connected to GND through both ends with
10kΩ resistors. Figure 4 shows the VOUT SET with all switches
disabled.
In Figure 2 the vast bulk of the SET are less than 100mV, but for
DUT2, 3, and 4 a handful of SET approaching 1V were recorded.
In all cases the SET decayed away in about 15µs. These larger
SET were not repeated under the conditions of Test 2 and Test 3
represented in Figures 3 and 4.
TABLE 3. THE ISL71841SEH SET TESTING CONDITIONS
V±
(V)
VREF
(V)
VD1
(V)
VD2
(V)
VINO
(V)
VINE
(V)
VIN22
(V)
Test 1
±10.8
4.5
0.8
2.0
+10.8
-10.8
0
Test 2
±16.5
4.5
0.8
2.0
+16.5
-16.5
0
Test 3
±16.5
4.5
2.0
2.0
+16.5
-16.5
0
TABLE 4. ±20mV SET COUNTS ON VOUT FOR TESTING OF THE ISL71841SEH. LET WAS 86.4MeV•cm2/mg AND FLUENCE OF
4x106ions/cm2 PER RUN
TEST
CONFIGURATIONS
DUT1
±20mV
EVENT COUNTS
DUT2
±20mV
EVENT COUNTS
DUT3
±20mV
EVENT COUNTS
DUT4
±20mV
EVENT COUNTS
TOTAL ±20mV
SET CROSS SECTION
(cm2)
Test 1
1584
1564
1865
1712
4.2E-04
Test 2
1739
1606
1913
1738
4.4E-04
Test 3
1643
1801
1915
1681
4.4E-04
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Test Report 007
0.10
1.0
0.05
0.5
SET DEVIATION (V)
SET DEVIATION (V)
Composite Plots
0
-0.05
-0.10
0
5
TIME (µs)
10
0
-0.5
-1.0
15
0
1.0
1.0
0.5
0.5
0
-0.5
-1.0
0
5
TIME (µs)
FIGURE 2C. DUT 3
10
15
10
15
FIGURE 2B. DUT 2
SET DEVIATION (V)
SET DEVIATION (V)
FIGURE 2A. DUT 1
5
TIME (µs)
10
15
0
-0.5
-1.0
0
5
TIME (µs)
FIGURE 2D. DUT 4
FIGURE 2. Composite plots of extreme SET for LET = 86.4MeV•cm2/mg for DUT 1 through 4 and Test 1, ±10.8V supplies and IN22 selected. Each
run was to 4.0x106ions/cm2. Post processing selected the 20 largest and longest SET with both positive and negative deviations; not
all of 80 such plots were unique.
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Test Report 007
0.10
0.10
0.05
0.05
SET DEVIATION (V)
SET DEVIATION (V)
Composite Plots (Continued)
0
-0.05
-0.10
0
5
TIME (µs)
10
0
-0.05
-0.10
15
0
0.10
0.10
0.05
0.05
0
-0.05
-0.10
0
5
TIME (µs)
10
15
10
15
FIGURE 3B. DUT 2
SET DEVIATION (V)
SET DEVIATION (V)
FIGURE 3A. DUT 1
5
TIME (µs)
10
15
0
-0.05
-0.10
0
5
TIME (µs)
FIGURE 3C. DUT 3
FIGURE 3D. DUT 4
2
FIGURE 3. Composite plot of SET for LET = 86.4MeV•cm /mg for DUT 1 through 4 and Test 2, ±16.5V supplies with IN22 selected. Each run was
to 4.0x106ions/cm2. Post processing selected the 20 largest and longest SET in both positive and negative deviations; not all of the
80 such plots were unique.
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Test Report 007
0.10
0.10
0.05
0.05
SET DEVIATION (V)
SET DEVIATION (V)
Composite Plots (Continued)
0
-0.05
-0.10
0
5
TIME (µs)
10
0
-0.05
-0.10
15
0
0.10
0.10
0.05
0.05
0
-0.05
-0.10
0
5
TIME (µs)
10
15
10
15
FIGURE 4B. DUT 2
SET DEVIATION (V)
SET DEVIATION (V)
FIGURE 4A. DUT 1
5
TIME (µs)
10
15
0
-0.05
-0.10
0
5
TIME (µs)
FIGURE 4C. DUT 3
FIGURE 4D. DUT 4
2
FIGURE 4. Composite plot of SET for LET = 86.4MeV•cm /mg for DUT 1 through 4 and Test 3, ±16.5V supplies and switches disabled. Each run
was to 4.0x106ions/cm2. Post processing selected the 20 largest and longest SET in both positive and negative deviations; not all of
the 80 such plots were unique.
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Test Report 007
Discussion and Conclusions
SEL and SEB
Testing with normal incidence Au at LET = 86.4MeV•cm2/mg did
not result in any indications of SEB or SEGR at applied voltages
up to the absolute maximum rating of ±20V for supplies and
±35V for inputs. The 2.954GeV Au had a range into silicon of
117µm and a Bragg range of 53µm putting the Bragg peak well
into the inactive handle wafer of the SOI part. Functionality and
operational currents monitored did not change as a result of the
irradiations carried out at a case temperature of +125°C ±10°C.
A minimal interpretation of the possible SEB/SEGR cross section
is less than 1.5x10-7cm2 to a 95% confidence at
LET = 86.4MeV•cm2/mg at normal incidence for the input
voltage conditions of ±17V and ±35V. In the total testing the
SEB/SEGR possible cross section is less than 7.5x10-8cm2 at
95% confidence. This is all tantamount to saying that under
normal operating conditions the ISL71841SEH is not susceptible
to SEB or SEGR failures at up to normal incidence of
LET = 86.4MeV•cm2/mg.
SET Results
In SET testing no indication of an addressing upset was noted.
However, SET testing did result in events exceeding the ±20mV
detection threshold. The total cross section indicated by the SET
capture counts topped out at 4.4x10-4cm2 at
LET = 86.4MeV•cm2/mg. The number of SET ±20mV captures
was weakly dependent on supply voltage with ±10.8V yielding
slightly fewer captured SET than with ±16.5V. It appears the SET
result from instantaneous coupling of the output to the supply
rails. With a few exception at ±10.8V supplies all the SET
captured were within ±100mV deviation.
The observed output SET had decay times of about 15µs. This is
likely set by the capacitive loading on VOUT (about 700pF from
the cabling) and the resistance setting the nominal voltage
(5kΩ). Thus, the predicted 3.5µs time constant is consistent with
that observed. This is important since the application will
determine this decay constant and hence the SET duration.
The SET study described here utilized a nominal VOUT of 0V so
that the rails were equally far from the nominal output voltage. It
should be expected that as the nominal VOUT moves toward a
supply rail the SET toward that rail voltage would diminish in
magnitude while those toward the opposite rail would increase in
magnitude. Thus, the worst case SET for a nominal output near a
supply rail could be 2x the magnitudes recorded here.
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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