SO T2 3 NCR401T 10 mA LED driver in SOT23 16 October 2015 Product data sheet 1. General description LED driver consisting of a resistor-equipped PNP transistor with two diodes on one chip in a small SOT23 plastic package. 2. Features and benefits • • • • Stabilized output current of 10 mA High currrent accuracy at supply voltage variation Reduces component count and board space Qualified according to AEC-Q101 3. Applications • • • Constant current LED driver Generic constant current source Automotive applications 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IO output current VSUP = 10 V; VO = 8.6 V; Tamb = 25 °C; 8.5 10 11.5 mA - - 18 V pulsed; tp ≤ 300 µs; δ ≤ 0.02 VSUP supply voltage Scan or click this QR code to view the latest information for this product NCR401T NXP Semiconductors 10 mA LED driver in SOT23 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 GND ground 2 VSUP supply voltage 3 IO/VO output current/output voltage Graphic symbol 3 1 VSUP 2 IO/VO TO-236AB (SOT23) IO LED GND aaa-019596 6. Ordering information Table 3. Ordering information Type number NCR401T Package Name Description Version TO-236AB plastic surface-mounted package; 3 leads SOT23 7. Marking Table 4. Marking codes Type number Marking code NCR401T BE NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 2 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VSUP supply voltage VO output voltage VR reverse voltage Ptot total power dissipation Min Max Unit - 18 V - 16 V [1] - 0.5 V [2] - 270 mW [3] - 400 mW VSUP = 18 V Tamb ≤ 25 °C Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C [1] [2] [3] Between all terminals. Device mounted on an FR4 Printed-Circuit Board (PCB); single-sided copper; tin-plated and standard footprint. 2 Device mounted on an FR4 PCB; single-sided copper; tin-plated and mounting pad for output 1 cm . mle128 500 Ptot (mW) 400 (1) 300 (2) 200 100 0 0 40 80 (1) FR4 PCB mounting pad for collector 1 cm (2) FR4 PCB, standard footprint Fig. 1. 120 160 Tamb (°C) 2 Power derating curves NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 3 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1] [2] Min Typ Max Unit [1] - - 465 K/W [2] - - 312 K/W Device mounted on an FR4 PCB; single-sided copper; tin-plated and standard footprint. mle127 103 Zth (K/W) 102 2 Device mounted on an FR4 PCB; single-sided copper; tin-plated and mounting pad for collector 1 cm . δ=1 0.75 0.5 0.33 0.2 0.1 0.05 10 1 10- 5 0.02 0.01 0 10- 4 10- 3 10- 2 10- 1 1 10 102 tp (s) 103 FR4 PCB, single sided copper, standard footprint Fig. 2. Transient thermal impedance as a function of pulse time; typical values NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 4 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit IO output current VSUP = 10 V; VO = 8.6 V; Tamb = 25 °C; 8.5 10 11.5 mA 340 420 500 µA - 1.4 - V - -0.3 - %/K - 0.8 - %/V pulsed; tp ≤ 300 µs; δ ≤ 0.02 IGND ground current VSUP = 10 V; IO = 0 A; Tamb = 25 °C; pulsed; tp ≤ 300 µs; δ ≤ 0.02 V(VSUP-VO)min ΔIO/ (IO×ΔTamb) ΔIO/ (IO×ΔVSUP) minimum voltage between supply voltage and output voltage IO > 8.5 mA; Tamb = 25 °C; pulsed; relative output current variation with ambient temperature VSUP = 10 V; VO = 8.6 V; Tamb = 25 °C; relative output current variation with supply voltage VSUP = 10 V; VSUP - VO = 1.4 V; tp ≤ 300 µs; δ ≤ 0.02 pulsed; tp ≤ 300 µs; δ ≤ 0.02 Tamb = 25 °C; pulsed; tp ≤ 300 µs; δ ≤ 0.02 aaa-019589 15 aaa-019590 15 IO (mA) IO (mA) 10 Tamb = -40 °C 10 Tamb = 25 °C Tamb = 85 °C 5 5 VSUP - VO = 2 V VSUP - VO = 1.4 V VSUP - VO = 1 V 0 0 5 10 15 VSUP (V) 0 20 Tamb = 25 °C Fig. 3. Product data sheet 5 10 15 VSUP (V) 20 VSUP - VO = 1.4 V Output current as a function of supply voltage; typical values NCR401T 0 Fig. 4. Output current as a function of supply voltage; typical values All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 5 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 aaa-019591 1.2 IGND (mA) Tamb = 85 °C 0.8 Tamb = 25 °C 0.4 Tamb = -40 °C 0 0 5 10 15 VSUP (V) 20 IO = 0 A Fig. 5. Ground current as a function of supply voltage; typical values 11. Application information Fig. 6 shows a typical application circuit for an LED driver. The constant current ensures a constant LED brightness. The output current slightly decreases when the power load at the LED driver increases. This effect is due to self heating of the device and the negative thermal coefficient of the output current. VSUP VO IO LED GND aaa-019594 Fig. 6. LED driver application diagram The output can be switched ON and OFF by connecting a Resistor-Equipped Transistor (RET), e.g. PDTC124XU; see Fig. 7 NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 6 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 VSUP VO GND IO OUT IN / OUT LED GND Fig. 7. aaa-019595 Switching current ON/OFF; application diagram 12. Test information 12.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 13. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig. 8. 0.15 0.09 04-11-04 Package outline TO-236AB (SOT23) NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 7 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 14. Soldering 3.3 2.9 1.9 solder lands 3 solder resist 2 1.7 solder paste occupied area 0.6 (3×) 0.7 (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 Fig. 9. sot023_fr Reflow soldering footprint for TO-236AB (SOT23) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig. 10. Wave soldering footprint for TO-236AB (SOT23) NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 8 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 15. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes NCR401T v.1 20151016 Product data sheet - - NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 9 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 16. Legal information 16.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". 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NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. NCR401T Product data sheet Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 10 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, MIFARE, MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP Semiconductors N.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 11 / 12 NCR401T NXP Semiconductors 10 mA LED driver in SOT23 17. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Marking ................................................................... 2 8 Limiting values .......................................................3 9 Thermal characteristics .........................................4 10 Characteristics ....................................................... 5 11 Application information .........................................6 12 12.1 Test information ..................................................... 7 Quality information ............................................... 7 13 Package outline ..................................................... 7 14 Soldering ................................................................ 8 15 Revision history ..................................................... 9 16 16.1 16.2 16.3 16.4 Legal information .................................................10 Data sheet status ............................................... 10 Definitions ...........................................................10 Disclaimers .........................................................10 Trademarks ........................................................ 11 © NXP Semiconductors N.V. 2015. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 October 2015 NCR401T Product data sheet All information provided in this document is subject to legal disclaimers. 16 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved 12 / 12