Photo IC for optical switch S11049 series Analog output photo IC for optical switch The S11049 series photo ICs are designed for optical switches and provides an analog waveform output proportional to the intensity of incident pulsed light. Features Applications Large allowable background light level: 4000 lx Min. Optical switch High linearity Optical receivers in various sensor devices Low noise: 1.8 mV rms Max. Absolute maximum ratings (Ta=25 °C) Parameter Symbol S11049-202SB S11049-203DT Unit Supply voltage Vcc -0.5 to +7 V Power dissipation*1 P 250 300 mW Output voltage Vout -0.5 to +7 V Operating temperature*2 Topr -25 to +85 °C Storage temperature*2 Tstg -40 to +100 -30 to +85 °C *1: Power dissipation decreases at a rate of 3.3 mW/°C on the S11049-202SB and 4 mW/°C on the S11049-203DT at Ta=25 °C and above. *2: No dew condensation When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. www.hamamatsu.com 1 Photo IC for optical switch S11049 series Electrical and optical characteristics (Ta=25 °C, Vcc=5.0 V) Parameter Supply voltage Current consumption Spectral response range Peak sensitivity wavelength Photo sensitivity Symbol Vcc Icc λ λp S11049-202SB S11049-203DT AC photoelectric sensitivity linearity Condition λ=950 nm*3 Input signal=100 kHz Including diffused reflection inside package Input pulse signal 0.01 μW to 4.0 μW*3 Input pulse signal 4.0 μW to 7.5 μW*3 A Alin Low band fcl High band fch Allowable background light level*5 Pdc Output noise voltage (with no input) VON *3: Measurement circuit (Waveform at terminal Cut-off frequency*4 *3 3 Min. 4.5 - Typ. 380 to 1120 760 Max. 5.5 2.2 - 120 200 300 160 200 300 -10 -50 1250 4000 - 1450 6000 - +10 +50 50 1650 2.8 Input pulse signal 2.5 μW* *3 Vo is measured.) *4: Cutoff frequency definition Unit V mA nm nm V/mW % kHz lx mV rms Vcc 0.1 μF 5V 0.01 μF Out 3.3 kΩ Output 5.1 kΩ GND 3 dB Vo KPICC0161EB fcl fch Frequency (logarithmic axis) KPICC0241EA *5: This is defined as the background light level in the active area at witch the photo IC sensitivity drops by 20% Spectral response (typical example) Block diagram (Ta=25 °C) 100 Vcc Preamp Photodiode Buffer GND KPICC0162EB 80 Relative sensitivity (%) OUT 60 40 20 0 300 400 500 600 700 800 900 1000 1100 1200 Wavelength (nm) KPICB0142EB 2 Photo IC for optical switch S11049 series Dimensional outlines (unit: mm) S11049-202SB 0.7 10° 5° 5.2 ± 0.2 (Including burr) 5.0 2.0 1.0 (0.8) (1.0) 5° 10° 5.0 5.2 ± 0.2 (Including burr) 2.5 ± 0.2 Photosensitive area 1.1 × 0.8 ϕ1.2 Depth 0.15 max. 16.5 ± 1.0 0.45 1.27 1.27 1.27 (Specified at the lead root) GND Vout Vcc GND +0.15 0.25-0.1 Tolerance unless otherwise noted: ±0.1, ±2° Shaded area indicates burr. Values in parentheses are not guaranteed, but for reference. Lead surface finish: silver plating Packing: polyethylene pack [anti-static type] (200 pcs/pack) KPICA0083EA 3 Photo IC for optical switch S11049 series 1.0 ± 0.4 3.0* 3.9 4.0* 3.4 Mirror surface area 3.8 0.8 1.1 Photosensitive surface Photosensitive area 4.2 ± 0.2 (Including burr) 4.0* 3.2 ± 0.2 (Including burr) 0.8 0.8 0.8 0.8 (10 ×) 0.4 (10 ×) 0.3 S11049-203DT 0.05 1.0 ± 0.4 0.45 5.0 ± 0.3 0.45 ± 0.3 0.75 3.0* 0.45 ± 0.3 2.8 Photosensitive surface 2.9 3.0* 0.1 ± 0.1 0.15 2.4 Mirror surface area 1.3 (GND) (GND) GND (GND) Vo Vo (GND) Vcc (GND) (GND) Connect the (GND) terminal to the GND terminal on the circuit board. Tolerance unless otherwise noted: ±0.1, ±2° Shaded area indicates burr. Chip position accuracy with respect to package dimensions marked * X, Y≤±0.2, θ≤±2° KPICA0092EA 4 Photo IC for optical switch S11049 series Standard packing specifications (S11049-203DT) Reel (conforms to JEITA ET-7200) Dimensions 254 mm Hub diameter 100 mm Tape width 12 mm Material PS Electrostatic characteristics Antistatic treatment 8.0 ± 0.1 4.0 ± 0.1 ϕ1.5 ± 0.1 2.0 ± 0.1 1.75 ± 0.1 Embossed tape (unit: mm, material: PS, electrically conductive) 0.3 ± 0.1 12.0 ± 0.3 4.5 ± 0.2 5.5 ± 0.1 2.3 ± 0.2 5.4 ± 0.2 Reel feed direction KPICC0238EB Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed) 5 Photo IC for optical switch S11049 series Measured example of temperature profile with our hot-air reflow oven for product testing (S11049-203DT) 300 °C 240 °C max. Temperature 220 °C 190 °C 170 °C Preheat 70 to 90 s Soldering 40 s max. Time KPICB0171EA ∙ These products support lead-free soldering. After unpacking, store them in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 24 hours. · The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When setting the reflow soldering conditions, check for any problems by testing out the reflow soldering methods in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer · Metal, ceramic, plastic package products · Surface mount type products Information described in this material is current as of June, 2016. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741 China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866 Cat. No. KPIC1087E02 Jun. 2016 DN 6